CN108544739B - Thermoforming device and half-die pressing thermoforming processing method of hemispherical resonator - Google Patents
Thermoforming device and half-die pressing thermoforming processing method of hemispherical resonator Download PDFInfo
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- CN108544739B CN108544739B CN201810319845.5A CN201810319845A CN108544739B CN 108544739 B CN108544739 B CN 108544739B CN 201810319845 A CN201810319845 A CN 201810319845A CN 108544739 B CN108544739 B CN 108544739B
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- molding material
- thermoforming
- female die
- hemispherical resonator
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/10—Forming by pressure difference, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/18—Thermoforming apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/30—Moulds
- B29C51/303—Moulds with sealing means or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/30—Moulds
- B29C51/36—Moulds specially adapted for vacuum forming, Manufacture thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to a thermoforming device of a hemispherical resonator and a half-die compression thermoforming processing method, wherein the thermoforming device comprises the following components: the molding machine comprises a bearing table for bearing molding material sheets, a female die connected with the bearing table in a sealing way, and a sealing head connected with the bearing table in a sealing way and supported below the female die; the bottom center of the cavity of the female die is provided with a slot for fixing a molding material column, and the bottom of the cavity of the female die is also provided with a plurality of air pumping holes; the lower end of the sealing head is hermetically connected with an exhaust pipe, a lifting ejector rod is arranged in the exhaust pipe, the upper end of the ejector rod is fixedly connected with an ejector pin, the upper end of the ejector pin is arranged in an ejector pin hole formed in the bottom of the female die, and the ejector pin hole is communicated with the slot.
Description
Technical Field
The invention relates to a thermoforming device and a half-die compression thermoforming processing method of a hemispherical resonator.
Background
Hemispherical resonator gyroscopes are vibrating structure gyroscopes that detect rotation by sensing the change in vibration of a vibrating structure injected into a resonant cavity. Typically, the hemispherical resonator is caused to vibrate by some electrical mechanism to operate at a particular resonant frequency, where rotation of an external input may cause a change in the hemispherical resonator vibration (e.g., resonant axis angle, resonant axis movement velocity). These changes can be detected and used to determine the rotation of the hemispherical resonator. The hemispherical resonant gyroscope has the characteristics of wide measurement range, overload resistance, radiation resistance, interference resistance and the like, and has extremely high performance potential because the structure is insensitive to the outside (acceleration, vibration and temperature) due to the full symmetry of the structure. In general, in some examples, the uniformity of hemispherical resonators can affect the accuracy of rotation detection using the vibration of hemispherical resonators. Furthermore, the location of the support structure on the hemispherical resonator (e.g., if the stem is eccentric) can also affect the accuracy of the gyroscope. Therefore, the precision of manufacturing hemispherical resonators is an important and difficult factor to achieve.
Hemispherical resonators are the core component of hemispherical resonator gyroscopes. Fused silica materials with lower coefficients of thermal expansion are typically used to ensure a higher quality factor for hemispherical resonators. However, it is difficult to manufacture a full symmetrical hemispherical resonator of quartz material, a typical hemispherical resonator is manufactured using conventional high precision machining techniques, a hemispherical resonator having a stem secured thereto is manufactured, and the stem of the resonator is assembled to a base with a capacitive substrate. However, the hemispherical resonator machined with high precision has high machining difficulty, high cost and high price, and cannot be widely applied.
Disclosure of Invention
Aiming at the problems, the invention aims to provide a thermoforming device and a half-die pressing thermoforming processing method of a hemispherical resonator, the hemispherical resonator meeting the use requirements can be processed by using the processing method, and the method has the advantages of low difficulty and low cost compared with a high-precision machining method.
In order to achieve the above purpose, the present invention adopts the following technical scheme: a thermoforming apparatus for hemispherical resonators, comprising: the molding machine comprises a bearing table for bearing molding material sheets, a female die connected with the bearing table in a sealing way, and a sealing head connected with the bearing table in a sealing way and supported below the female die; the bottom center of the cavity of the female die is provided with a slot for fixing a molding material column, and the bottom of the cavity of the female die is also provided with a plurality of air pumping holes; the lower end of the sealing head is hermetically connected with an exhaust pipe, a lifting ejector rod is arranged in the exhaust pipe, the upper end of the ejector rod is fixedly connected with an ejector pin, the upper end of the ejector pin is arranged in an ejector pin hole formed in the bottom of the female die, and the ejector pin hole is communicated with the slot.
Further, the cavity of the female die is a cylindrical cavity.
Further, a hemispherical forming support body is arranged in the cavity of the female die.
Further, the upper end face of the female die is flush with the top face of the bearing table; the air exhaust holes are uniformly distributed on the periphery of the slot.
Further, contact sealing is adopted between the bearing table and the female die, between the bearing table and the sealing head, and screw thread sealing is adopted between the sealing head and the exhaust pipe.
Further, the protective cover is detachably arranged on the top of the bearing table; the protective cover is made of silicon carbide.
Further, the bearing table and the female die are made of silicon carbide, the ejector rod, the ejector pin and the exhaust tube are made of tungsten or molybdenum, and the sealing head is made of graphite.
A half-die press thermoforming processing method of a hemispherical resonator based on the thermoforming device of the hemispherical resonator, comprising the following steps: 1) Installing a prefabricated molding material sheet and a molding material column with polished two ends on a female die, specifically, fixing the lower end of the molding material column in a slot at the bottom of a cavity of the female die, paving the molding material sheet on a bearing table and covering the cavity of the female die, and contacting the upper end of the molding material column with the molding material sheet; 2) Placing the female die provided with the molding material column and the molding material sheet in a thermoforming heating furnace, carrying out gradient heating and heat preservation, and preserving heat for a period of time at the thermoforming temperature of the molding material; 3) At the thermoforming temperature of the molding material, the air suction pipe is utilized to suck air, the molding material column and the molding material sheet are firmly bonded at the temperature, and the molding material sheet is subjected to pressure thermoforming according to the shape of the cavity of the female die at the temperature; 4) Stopping heating after the forming process is finished, closing the exhaust pipe, controlling the ejector rod to ascend after the forming material is solidified, and performing thermal demoulding through the ejector pin; 5) And lowering the ejector pin, and taking out the molded sample after the molded material is cooled to room temperature.
Further, the molding material column and the molding material sheet are made of quartz glass.
Further, after the molded sample is obtained in step 5), the following steps are further performed: 6) Coating crystal glue on the inner and outer surfaces of the molded sample to form a protective glue layer; 7) And removing redundant structures of the molding material, and removing the protective layer to obtain the hemispherical resonator.
Due to the adoption of the technical scheme, the invention has the following advantages: the invention provides a special thermoforming device, and provides a half-die pressing thermoforming processing method of the hemispherical resonator based on the device, the hemispherical resonator meeting the use requirement can be processed by using the processing method, and the method has the advantages of low difficulty and low cost compared with a high-precision machining method.
Drawings
FIG. 1 is a schematic view of the overall structure of a thermoforming apparatus of the present invention;
FIG. 2 is a schematic view of the structure of the female die of the invention when a cylindrical cavity is used;
FIG. 3 is a schematic view of a structure of a near cylindrical resonator formed in accordance with the present invention;
FIG. 4 is a schematic view of the structure of a female die with hemispherical shaped support according to the present invention;
FIG. 5 is a schematic diagram of a resonator of approximately hemispherical shape formed in accordance with the present invention;
FIG. 6 is a schematic illustration of a press-and-hot forming process for a hemispherical resonator of the present invention; wherein figure (a) shows the die ready; figure (b) shows the mounting of the molding material column and the molding material sheet to the female mold; FIG. (c) shows the completion of the installation of the framing material column and the framing material sheet and the heating; drawing (d) shows pumping by means of a pumping tube; drawing (e) shows demolding with ejector pins; drawing (f) shows removing the molded sample from the female mold; FIG. (g) shows the application of a crystal cement to a molded sample to form a protective cement layer; FIG. h shows the removal of the excess structure of the molding material and the protective layer; fig. (i) shows the resulting hemispherical resonator;
FIG. 7 is a schematic illustration of the outer surface of a hemispherical resonator of the present invention assembled with a cylindrical electrode; wherein, figure (a) shows the assembly of the outer surface of the approximately hemispherical resonator with the cylindrical electrode; fig. (b) shows the assembly of the outer surface of the resonator of a nearly cylindrical shape with the cylindrical electrode;
FIG. 8 is a schematic view of the inner surface of the hemispherical resonator of the present invention assembled with a cylindrical electrode; wherein, figure (a) shows the inner surface of the approximately hemispherical resonator assembled with the cylindrical electrode; fig. (b) shows that the inner surface of the resonator having a nearly cylindrical shape is assembled with the cylindrical electrode;
FIG. 9 is a schematic illustration of the inner surface of a hemispherical resonator of the present invention assembled with a planar electrode; wherein, figure (a) shows an approximately hemispherical resonator assembled with a planar electrode; fig. (b) shows the assembly of a resonator of a nearly cylindrical shape with a planar electrode.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
As shown in fig. 1, the present invention proposes a thermoforming apparatus of a hemispherical resonator, comprising: a bearing table 1 for bearing the molding material sheet 100, a female die 2 in sealing connection with the bearing table 1, and a sealing head 3 in sealing connection with the bearing table 1 and supported below the female die 2. The bottom center of the cavity of the female die 2 is provided with a slot 21 for fixing the molding material column 200, and the bottom of the cavity of the female die 2 is also provided with a plurality of air pumping holes 22. The lower end of the sealing head 3 is connected with the exhaust pipe 4 in a sealing way, a lifting ejector rod 5 is arranged in the exhaust pipe 4, the upper end of the ejector rod 5 is fixedly connected with the ejector pin 6, the upper end of the ejector pin 6 is arranged in an ejector pin hole 23 arranged at the bottom of the female die 2, and the ejector pin hole 23 is communicated with the slot 21. The parts of the thermoforming device are made of high-temperature resistant materials.
Preferably, the cavity of the die 2 has two types, one is a cylindrical cavity (as shown in fig. 2) for processing the resonator 300 (as shown in fig. 3) having a nearly cylindrical shape, and the other is a hemispherical shaped support 25 (as shown in fig. 4) disposed in the cavity of the die 2 for processing the resonator 400 (as shown in fig. 5) having a nearly hemispherical shape.
Further, the upper end face of the female die 2 is flush with the top face of the bearing table 1.
Further, the air extraction holes 22 are uniformly distributed at the periphery of the slot 21.
Further, the bearing table 1 is in contact seal with the female die 2, the bearing table 1 is in contact seal with the sealing head 3, and the sealing head 3 is in thread seal with the exhaust pipe 4.
Further, the thermoforming apparatus further includes a protective cover 7 detachably provided on the top of the carrying table 1, having a function of preventing contamination of the molding material and positioning the sheet of molding material 100, and a connection hole (not shown) is provided on the protective cover 7 to ensure air pressure balance with the outside.
Furthermore, the bearing table 1, the female die 2 and the protective cover 7 can be made of silicon carbide materials, so that the die precision is protected; the ejector rod 5, the ejector pin 6 and the exhaust pipe 4 are made of tungsten or molybdenum so as to ensure high-temperature mechanical properties; the sealing head 3 is made of graphite so as to ensure tightness and self-lubricity.
As shown in fig. 6, the invention further provides a compression molding thermal forming processing method of the hemispherical resonator, which comprises the following steps:
1) Mounting a prefabricated molding material sheet 100 and a molding material column 200 with polished ends on a female die 2, specifically, fixing the lower end of the molding material column 200 in a slot 21 at the bottom of a cavity of the female die 2, laying the molding material sheet 100 on a bearing table 1 and covering the cavity of the female die 2, wherein the upper end of the molding material column 200 is contacted with the molding material sheet 100 (as shown in fig. 6 (a) and 6 (b);
2) Placing the female die 2 with the molding material column 200 and the molding material sheet 100 mounted therein in a thermoforming heating furnace, performing gradient heating and heat preservation, and preserving heat for a period of time at the thermoforming temperature of the molding material (as shown in fig. 6 (c));
3) At the thermoforming temperature of the molding material, suction is applied by the suction pipe 4, the molding material column 200 and the molding material sheet 100 are firmly bonded at the temperature, and the molding material sheet 100 is subjected to half-compression thermoforming according to the shape of the cavity of the female die 2 at the temperature (as shown in fig. 6 (d));
4) After the forming process is finished, stopping heating, closing the exhaust pipe 4, controlling the ejector rod 5 to ascend after the forming material is solidified, and performing thermal demolding through the ejector rod 6 (as shown in fig. 6 (e));
5) The thimble 6 is lowered, and after the molding material is cooled to room temperature, the molding sample is taken out (as shown in fig. 6 (f));
6) Coating crystal glue on the inner and outer surfaces of the molded sample to form a protective glue layer 8 (shown in fig. 6 (g));
7) The excess structure of the molding material is removed by grinding, chemical mechanical polishing, chemical etching, or the like, and the protective layer 8 is removed to obtain a hemispherical resonator (as shown in fig. 6 (h) and 6 (i)).
Preferably, the molding material column 200 and the molding material sheet 100 are made of quartz glass.
In the invention, the molding material column 200 is tightly matched with the female die 2 in the initial stage of the molding process, the slot 21 of the female die 2 keeps extremely high processing concentricity, and the molding material column 200 still keeps the original shape precision after the press-hot molding process is finished, so that the hemispherical resonator center support column formed by the molding material column 200 can be ensured to be the structural center of the hemispherical resonator and can be used as a positioning reference. The hemispherical resonator after molding may be assembled with the cylindrical electrode 9 to form a uniform capacitance structure on the outer surface or the inner surface (as shown in fig. 7 and 8), or may be assembled with the planar electrode 10 to form a uniform capacitance structure on the bottom surface (as shown in fig. 9).
The invention is described in terms of the above embodiments only, the structure, arrangement and connection of the components can be varied, and on the basis of the technical solution of the invention, modifications and equivalent changes to the individual components according to the principles of the invention should not be excluded from the scope of the invention.
Claims (10)
1. A thermoforming apparatus for hemispherical resonators, comprising:
a carrying table for carrying the sheet of molding material,
female die in sealing connection with the bearing table
The sealing head is in sealing connection with the bearing table and is supported below the female die;
the bottom center of the cavity of the female die is provided with a slot for fixing a molding material column, and the bottom of the cavity of the female die is also provided with a plurality of air pumping holes; the lower end of the sealing head is hermetically connected with an exhaust pipe, a lifting ejector rod is arranged in the exhaust pipe, the upper end of the ejector rod is fixedly connected with an ejector pin, the upper end of the ejector pin is arranged in an ejector pin hole formed in the bottom of the female die, and the ejector pin hole is communicated with the slot.
2. The device for thermoforming a hemispherical resonator of claim 1, wherein the cavity of the female die is a cylindrical cavity.
3. A device for thermoforming a hemispherical resonator as claimed in claim 1, characterised in that a hemispherical shaped support is provided in the cavity of the female mould.
4. A device for thermoforming a hemispherical resonator as claimed in any of claims 1 to 3, characterised in that the upper end face of the female die is flush with the top face of the carrier; the air exhaust holes are uniformly distributed on the periphery of the slot.
5. A device for thermoforming a hemispherical resonator as claimed in any of claims 1 to 3, characterised in that contact sealing is provided between the carrier and the die and between the carrier and the sealing head, and that screw sealing is provided between the sealing head and the suction tube.
6. A device for thermoforming a hemispherical resonator as claimed in any of claims 1 to 3, further comprising a protective cover removably provided on top of the carrying platform; the protective cover is made of silicon carbide.
7. A device for thermoforming a hemispherical resonator as claimed in any of claims 1 to 3, wherein the carrier and the die are made of silicon carbide, the ejector, ejector pin and exhaust tube are made of tungsten or molybdenum, and the sealing head is made of graphite.
8. A half-die press thermoforming process of a hemispherical resonator based on the thermoforming apparatus of the hemispherical resonator of any of claims 1-7, comprising the steps of:
1) Installing a prefabricated molding material sheet and a molding material column with polished two ends on a female die, specifically, fixing the lower end of the molding material column in a slot at the bottom of a cavity of the female die, paving the molding material sheet on a bearing table and covering the cavity of the female die, and contacting the upper end of the molding material column with the molding material sheet;
2) Placing the female die provided with the molding material column and the molding material sheet in a thermoforming heating furnace, carrying out gradient heating and heat preservation, and preserving heat for a period of time at the thermoforming temperature of the molding material;
3) At the thermoforming temperature of the molding material, the air suction pipe is utilized to suck air, the molding material column and the molding material sheet are firmly bonded at the temperature, and the molding material sheet is subjected to half-compression thermoforming according to the shape of the cavity of the female die at the temperature;
4) Stopping heating after the forming process is finished, closing the exhaust pipe, controlling the ejector rod to ascend after the forming material is solidified, and performing thermal demoulding through the ejector pin;
5) And lowering the ejector pin, and taking out the molded sample after the molded material is cooled to room temperature.
9. A half-die press thermoforming process for hemispherical resonators as claimed in claim 8, wherein: the molding material column and the molding material sheet are made of quartz glass.
10. A half-die thermo-forming process for a hemispherical resonator as claimed in claim 8 or 9, characterized in that: after the molded sample is obtained in step 5), the following steps are further performed:
6) Coating crystal glue on the inner and outer surfaces of the molded sample to form a protective glue layer;
7) And removing redundant structures of the molding material, and removing the protective layer to obtain the hemispherical resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319845.5A CN108544739B (en) | 2018-04-11 | 2018-04-11 | Thermoforming device and half-die pressing thermoforming processing method of hemispherical resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319845.5A CN108544739B (en) | 2018-04-11 | 2018-04-11 | Thermoforming device and half-die pressing thermoforming processing method of hemispherical resonator |
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| Publication Number | Publication Date |
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| CN108544739A CN108544739A (en) | 2018-09-18 |
| CN108544739B true CN108544739B (en) | 2023-07-04 |
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Citations (5)
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| JPS63104512A (en) * | 1986-10-21 | 1988-05-10 | Toyo Commun Equip Co Ltd | Sealing structure for piezoelectric resonator |
| JPH06209221A (en) * | 1993-01-12 | 1994-07-26 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JP2011073250A (en) * | 2009-09-30 | 2011-04-14 | Aitec:Kk | Method for manufacturing vent pipe |
| CN202728890U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | Loading belt for miniaturization surface mounted device (SMD) quartz crystal resonator |
| CN106441258A (en) * | 2016-09-09 | 2017-02-22 | 东南大学 | Micro-shell resonator and harmonic oscillator preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMI20030027A1 (en) * | 2003-01-10 | 2004-07-11 | Cannon Spa | THERMOFORMING IN DOUBLE PLATE OF TANKS IN PLASTIC MATERIAL. |
| US7224099B2 (en) * | 2004-04-20 | 2007-05-29 | Elliptec Resonant Actuator Aktiengesellschaft | Molded piezoelectric apparatus |
| CN208232294U (en) * | 2018-04-11 | 2018-12-14 | 清华大学 | The thermal formation apparatus of hemispherical resonator device |
-
2018
- 2018-04-11 CN CN201810319845.5A patent/CN108544739B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63104512A (en) * | 1986-10-21 | 1988-05-10 | Toyo Commun Equip Co Ltd | Sealing structure for piezoelectric resonator |
| JPH06209221A (en) * | 1993-01-12 | 1994-07-26 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JP2011073250A (en) * | 2009-09-30 | 2011-04-14 | Aitec:Kk | Method for manufacturing vent pipe |
| CN202728890U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | Loading belt for miniaturization surface mounted device (SMD) quartz crystal resonator |
| CN106441258A (en) * | 2016-09-09 | 2017-02-22 | 东南大学 | Micro-shell resonator and harmonic oscillator preparation method thereof |
Non-Patent Citations (1)
| Title |
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| 纳米Al2O3对CaTiO3-（La,Nd）AlO3陶瓷的烧结温度和介电特性的影响;曹良足 等;中国陶瓷;第54卷(第1期);第40-44页 * |
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