CN108544090A - A kind of laser processing state recognition methods under spectrum ionic state - Google Patents

A kind of laser processing state recognition methods under spectrum ionic state Download PDF

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Publication number
CN108544090A
CN108544090A CN201810355735.4A CN201810355735A CN108544090A CN 108544090 A CN108544090 A CN 108544090A CN 201810355735 A CN201810355735 A CN 201810355735A CN 108544090 A CN108544090 A CN 108544090A
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state
photosignal
spectrum
light
laser
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CN108544090B (en
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何海聪
黎德源
许彦经
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Guangzhou De Qing Optical Technology Co Ltd
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Guangzhou De Qing Optical Technology Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Spectrometry And Color Measurement (AREA)

Abstract

The invention discloses the laser processing state recognition methods under a kind of spectrum ionic state, including step:The photosignal of ultraviolet band, visible light wave range, infrared band and laser reflection light in acquisition laser processing procedure, uses spectrometer collection ultraviolet band, the spectral signal of visible light wave range, infrared band and laser reflection light;Time-domain analysis is carried out to wherein collected photoelectricity, finds out the mutation in photosignal and variation tendency;Time-domain analysis is carried out to collected spectral signal;Laser processing procedure state recognition is carried out in conjunction with the time domain optical characteristics of photosignal and the temporal signatures spectrum of spectral signal.Compared with prior art, the present invention uses the laser processing procedure state recognition under spectrum ionic state, it may determine that the fine defects in process and multiple welded condition in process, the simultaneous welded condition such as the defects of recess, explosion, protrusion, improves the discrimination and accuracy rate of welded condition.

Description

A kind of laser processing state recognition methods under spectrum ionic state
Technical field
The present invention relates to the laser processings under laser processing procedure detection technique field more particularly to a kind of spectrum ionic state State identification method.
Background technology
Laser processing procedure is the process of light and material interaction, and the mainly laser beam using laser excitation is logical Optical fiber and lens transmission are crossed, it can be along with a variety of optical phenomenas such as in process:Metallic vapour, plasma, molten bath, spoon The light radiation such as hole and laser reflection phenomenon.Scholar both domestic and external is carrying out laser processing state identification and status monitoring research When, mostly from the optical signal angle of process, the optical signal in process is acquired using optical sensor.Photoelectric transfer Sensor is a kind of typical optical sensor, with the advantages such as small, at low cost, simple in structure, therefore is widely used In the acquisition of laser processing procedure optical signalling, the collocation of photoelectric sensor and corresponding filtering system has choosing realize optical signal The acquisition of selecting property, it is main including plasma optical emission signal, metallic vapour optical radiation signal, molten bath and keyhole infrared hot spoke Penetrate the optical radiation signal of signal and laser reflection.But the signal dimension that photoelectric sensor is acquired is low, each photoelectric sensor Collected is all one-dimensional signal, and machining state difficult to realize accurately identifies, and can be possible along with sightless misinterpretation. Secondly photoelectric sensor is under complicated laser processing environment and changeable processing conditions, and the signal fluctuation of acquisition is big, Mou Xiexi It is small and be difficult to the defect differentiated such as:Undercut, collapse, protrusion, explosion or splash etc. features optical signal by the big ups and downs of signal It interferes and even covers.The fluctuation of the collected signal of photoelectric sensor simultaneously may be the embodiment of a variety of welded conditions, therefore The variation of signal cannot accurately judge the particular state of processing.
Invention content
To overcome traditional photoelectric sensing to detect the defect of laser processing state, the present invention goes out from the angle of optical signal analysis Hair acquires the optical signalling for embodying molten bath and keyhole variation in laser processing procedure, and does time domain to above optical signalling Analysis, in order to overcome the restricted of traditional single kind photoelectric sensor state recognition, using spectrum analysis as auxiliary, in conjunction with The signal of photo-sensor signal and spectrum plasma state, it is proposed that the laser processing state recognition methods under spectrum ionic state.
Laser processing state recognition methods under a kind of spectrum ionic state of the present invention, including
Step 1:It is anti-using ultraviolet light photoelectric sensor, visible light photoelectric sensor, infrared light photoelectric sensor and laser Penetrate ultraviolet band in photoelectric sensor acquisition laser processing procedure, visible light wave range, infrared band and laser reflection light Photosignal uses spectrometer collection ultraviolet band, the spectral signal of visible light wave range, infrared band and laser reflection light;
Step 2:To collected ultraviolet light photosignal, visible light photosignal, infrared light photosignal in step 1 And laser reflection photosignal carries out time-domain analysis, the mutation in photosignal and variation tendency is found out, by ultraviolet light light Electric signal, visible light photosignal, infrared light photosignal and laser reflection photosignal are according to its time domain variation characteristic point For 1 photosignal of state, 2 photosignal ... state n photosignals of state, and obtain optical characteristics 1, photoelectricity under each state Feature 2 ... optical characteristics n;
Step 3:To collected ultraviolet band in step 1, visible light wave range, infrared band and laser reflection light Spectral signal carries out time-domain analysis, finds out spectral signal corresponding with photosignal mutation opposite position or variation tendency Spectral signal is divided into 1 continuous spectrum of state, state 2 by strength characteristic in conjunction with photosignal and the variation characteristic of spectral signal Continuous spectrum ... state n continuous spectrums, the state 1, state 2 ... state n spectrum time domain scale with state 1, state 2 ... state Photosignal under n corresponds, and then does average value processing and normalized to the spectral signal under each state, obtains Characteristic spectrum 1, characteristic spectrum 2 ... characteristic spectrum n;
Step 4:It is laser machined in conjunction with the time domain optical characteristics of photosignal and the temporal signatures spectrum of spectral signal Process status identifies.
Further, the acquisition of photosignal further includes step in step 1:Photosignal is input to signal adjustment electricity Road is adjusted, and the adjustment includes but not limited to signal amplification and signal filtering.
Further, laser reflection light described in step 1 is the laser beam for the 1030nm wave bands that laser generator generates Reflected light, if laser generator is different, wavelength value is also different.
Further, the frequency acquisition of spectrometer is 500MHZ in step 1.
The beneficial effects of the present invention are compared with prior art, the present invention uses the laser processing under spectrum ionic state Process status identifies, it can be determined that goes out the fine defects in process and multiple welded condition in process, such as The simultaneous welded condition of the defects of being recessed, burst, is raised, improves the discrimination and accuracy rate of welded condition.
Description of the drawings
Fig. 1 is the laser processing state recognition methods flow chart under a kind of spectrum ionic state of the present invention;
Fig. 2 is the apparatus signal used in the laser processing state recognition methods under a kind of spectrum ionic state of invention Figure;
Fig. 3 is photosignal and spectrum letter in the laser processing state recognition methods under a kind of spectrum ionic state of the present invention Number handling principle figure.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts Embodiment shall fall within the protection scope of the present invention.
Optical radiation phenomenon in laser processing procedure includes:Ultraviolet band, visible light wave range, infrared band and laser The optical radiation of reflected waveband, wherein ultraviolet band optical radiation signal are mainly reflected in the variation of plasma, it is seen that light The optical radiation of wave band mainly reflects the variation of metallic vapour and the degree of ionization of part plasma, the light of infrared band Learn radiation is influenced by the geometric shape variation in keyhole, molten bath, the spectral intensity size of laser reflection wave band also with keyhole depth There is the larger degree of association.
Fig. 1 is referred to, multiple photoelectric sensors are utilized in step one of the invention and respectively by single photoelectric sensor It is combined with the filter system of corresponding different-waveband, is combined into photoelectric sensing module, is finally acquired during processing ultraviolet Wave band, visible light wave range, infrared band and laser reflection intensity radiation signal input a signal into signal adjustment circuit progress Adjustment, including:Amplification, filtering etc., is input to computer.Meanwhile it is red from ultraviolet band-visible light wave range-using that can acquire Spectral signal in the spectrometer collection process of wave section (200-1100nm) spectrum, and collected spectral signal is also Include the laser reflection signal of laser beam (1030nm) wave band of laser, the frequency acquisition of spectrometer is set as 500MHZ.Most Afterwards by spectrometer collection to spectral signal be input to computer.
In step 2, to being input to ultraviolet band, visible light wave range, infrared band and the laser reflection wave of computer The changing features that section photosignal makees time-domain analysis, but is different photosignal have corresponded to different welded conditions, this In the case of single photoelectric sensor be None- identified laser processing state.However spectrometer can be provided in process Ionic state spectral information, therefore time-domain analysis is made to spectral signal again in step 3.In step 4, photosignal when Domain analysis can identify the state of laser processing procedure plus the time-domain analysis of spectral signal.
In step 1, using the apparatus for being illustrated in figure 2 laser processing state identification, equipment includes laser 1, The laser beam 4 that laser inspires is transferred to by external fiber in laser head 3, laser beam 1 by the collimation in laser head 3 with And focusing lens focus on the surface of workpiece 5, realize laser processing.It will produce various and processing shape during laser processing The relevant optical signalling of state, such as ultraviolet radiation signal, visible optical radiation signal, infrared optical radiation signal, laser reflection signal Deng.These optical signallings are reflected by coaxial one-way mirror 6 in spectral module 7, the optical signalling quilt in spectral module 7 Spectroscope is divided into two-way, is transferred to spectral module 15 by optical fiber 8 all the way, using spectral module 15 connect spectral module 16, 17,18 by the light beam in spectral module 7 be divided into four tunnels be separately connected four photoelectric sensors and respectively match uv filter, Visible filter, infrared light optical filter and laser reflection wave band optical filter;Another way is transmitted directly to spectrometer by optical fiber 9 In 14.By ultraviolet light photoelectric sensor, visible light photoelectric sensor, infrared light photoelectric sensor and laser reflection photoelectric sensor The optical signal transmission received realizes the amplification and filtering of optical signal, is then communicated to computer 20 to signal conditioning circuit 19 It is middle to calculate and handle;The spectral signal that spectrometer 14 receives is transmitted directly to calculate and handle in computer 20.
In step 2, the Time Domain Processing to optical signal is referred to photosignal calculation processing, is found out prominent in photosignal Change and variation tendency.
The handling principle figure of the photosignal and spectral signal that are illustrated in figure 3 in process, to by photoelectric sensor Collected photosignal does time-domain analysis to it, by ultraviolet light photosignal, visible light photosignal, infrared light photosignal And laser reflection photosignal is divided into 1 photosignal of state, 2 photosignal ... state n photoelectricity of state according to its variation characteristic Signal, and the photosignal under each state includes ultraviolet, visible light, infrared and laser reflection photosignal.Simultaneously These four photosignals under each state are analyzed, obtain the optical characteristics under each state:Optical characteristics 1, optical characteristics 2 ... Optical characteristics n.
In step 3, the Time Domain Processing i.e. to spectral signal is handled the spectral signal involved in step 1 and calculated, is looked for Go out spectral signal strength characteristic corresponding with photosignal mutation opposite position or variation tendency.
The handling principle figure of spectral signal as shown in Figure 3, for spectral signal, in conjunction with photosignal and spectral signal Variation characteristic, spectral signal is divided into 1 continuous spectrum of state, 2 continuous spectrum ... state n continuous spectrums of state, the state 1, The time domain scale of state 2 ... state n spectrum is corresponded with the photosignal under state 1, state 2 ... state n.Then to each Spectral signal under state does average value processing and normalized.
Here average value processing refers to:Calculate the light intensity average value under each wavelength in the spectrum corresponding period.Normalization Processing refers to:Normalized is made as follows to the spectrum after each average value processing:
Wherein X(t)Represent the light intensity value after normalization, x(t)Represent the raw intensity values of each wave band, xminRepresent entire wave The light intensity minimum value of section (186-1100nm), xmaxRepresent the light intensity maximum value of entire wave band (186-1100nm), wherein t=1- 2048.X after normalization(t)Between 0-1.
Characteristic spectrum 1, characteristic spectrum 2 ... characteristic spectrum n have been obtained after average value processing and normalized.
It is realized in conjunction with the temporal signatures spectrum of the horizon state feature of photoelectric sensing signal and spectral signal in step 4 Laser processing procedure state recognition.Spectrum under ionic state assists photosignal, can effectively identify laser processing procedure State improves the discrimination of state, and basis is provided for the automation control of laser processing procedure.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as Protection scope of the present invention.

Claims (4)

1. the laser processing state recognition methods under a kind of spectrum ionic state, which is characterized in that including
Step 1:Use ultraviolet light photoelectric sensor, visible light photoelectric sensor, infrared light photoelectric sensor and laser reflection light The photoelectricity of ultraviolet band, visible light wave range, infrared band and laser reflection light in electric transducer acquisition laser processing procedure Signal uses spectrometer collection ultraviolet band, the spectral signal of visible light wave range, infrared band and laser reflection light;
Step 2:To collected ultraviolet light photosignal in step 1, visible light photosignal, infrared light photosignal and Laser reflection photosignal carries out time-domain analysis, the mutation in photosignal and variation tendency is found out, by ultraviolet light optical telecommunications Number, visible light photosignal, infrared light photosignal and laser reflection photosignal shape is divided into according to its time domain variation characteristic 1 photosignal of state, 2 photosignal ... state n photosignals of state, and obtain optical characteristics 1, optical characteristics under each state 2 ... optical characteristics n;
Step 3:To the spectrum of collected ultraviolet band, visible light wave range, infrared band and laser reflection light in step 1 Signal carries out time-domain analysis, finds out spectral signal intensity corresponding with photosignal mutation opposite position or variation tendency It is continuous to be divided into 1 continuous spectrum of state, state 2 in conjunction with photosignal and the variation characteristic of spectral signal by feature for spectral signal Spectrum ... state n continuous spectrums, the state 1, state 2 ... state n spectrum time domain scale under state 1, state 2 ... state n Photosignal correspond, average value processing and normalized then are done to the spectral signal under each state, obtain spy Levy spectrum 1, characteristic spectrum 2 ... characteristic spectrum n;
Step 4:Laser processing procedure is carried out in conjunction with the time domain optical characteristics of photosignal and the temporal signatures spectrum of spectral signal State recognition.
2. the laser processing state recognition methods under spectrum ionic state as described in claim 1, which is characterized in that light in step 1 The acquisition of electric signal further includes step:Photosignal is input to signal adjustment circuit to be adjusted, the adjustment includes but not It is limited to signal amplification and signal filtering.
3. the laser processing state recognition methods under spectrum ionic state as described in claim 1, which is characterized in that institute in step 1 State the laser beam reflected light that laser reflection light is the 1030nm wave bands that laser generator generates.
4. the laser processing state recognition methods under spectrum ionic state as described in claim 1, which is characterized in that light in step 1 The frequency acquisition of spectrometer is 500MHZ.
CN201810355735.4A 2018-04-19 2018-04-19 Laser processing state identification method under spectral ion state Active CN108544090B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109507187A (en) * 2018-11-23 2019-03-22 哈尔滨工业大学(威海) A kind of laser gain material manufacturing defect diagnostic method and its device
CN111185681A (en) * 2020-03-05 2020-05-22 浙江嘉泰激光科技股份有限公司 Intelligent industrial laser cutting optimization system and intelligent laser cutting optimization method
CN111426639A (en) * 2020-04-30 2020-07-17 华中科技大学 Ultrafast laser dissimilar material welding quality judgment method and system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201052570Y (en) * 2007-06-29 2008-04-30 华中科技大学 Real time monitoring device for three-dimensional laser welding and cutting process
CN101655459A (en) * 2009-09-18 2010-02-24 中国科学院安徽光学精密机械研究所 Element spectral line reverse-extracting method of laser induced breakdown spectrum
CN104280362A (en) * 2014-09-22 2015-01-14 合肥工业大学 Online high-temperature water vapor laser spectrum detection system
CN106932382A (en) * 2017-04-20 2017-07-07 四川大学 A kind of method that laser cleaning effect judges

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201052570Y (en) * 2007-06-29 2008-04-30 华中科技大学 Real time monitoring device for three-dimensional laser welding and cutting process
CN101655459A (en) * 2009-09-18 2010-02-24 中国科学院安徽光学精密机械研究所 Element spectral line reverse-extracting method of laser induced breakdown spectrum
CN104280362A (en) * 2014-09-22 2015-01-14 合肥工业大学 Online high-temperature water vapor laser spectrum detection system
CN106932382A (en) * 2017-04-20 2017-07-07 四川大学 A kind of method that laser cleaning effect judges

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109507187A (en) * 2018-11-23 2019-03-22 哈尔滨工业大学(威海) A kind of laser gain material manufacturing defect diagnostic method and its device
CN111185681A (en) * 2020-03-05 2020-05-22 浙江嘉泰激光科技股份有限公司 Intelligent industrial laser cutting optimization system and intelligent laser cutting optimization method
CN111426639A (en) * 2020-04-30 2020-07-17 华中科技大学 Ultrafast laser dissimilar material welding quality judgment method and system
CN111426639B (en) * 2020-04-30 2021-02-09 华中科技大学 Ultrafast laser dissimilar material welding quality judgment method and system

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