CN108531713B - Multilayer laser shock peening method and device - Google Patents
Multilayer laser shock peening method and device Download PDFInfo
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- CN108531713B CN108531713B CN201810662095.1A CN201810662095A CN108531713B CN 108531713 B CN108531713 B CN 108531713B CN 201810662095 A CN201810662095 A CN 201810662095A CN 108531713 B CN108531713 B CN 108531713B
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Abstract
The invention discloses a multilayer laser shock peening method and a multilayer laser shock peening device, wherein second pulse energy is larger than first pulse energy, and second pulse width is smaller than the first pulse width. The laser shock is firstly carried out by the first pulse energy and the first pulse width, the penetration depth of the shock pressure is enhanced by prolonging the action time of the laser shock wave, the introduction depth of the residual compressive stress field of the laser shock induced workpiece is improved, and the processing hardening degree is lower because the first pulse energy is smaller than the second pulse energy, so that the obstruction to the later processing can be reduced. And then carrying out laser shock by using second pulse energy and second pulse width, and adjusting shock pressure in a mode of enhancing pulse energy, wherein the stronger shock pressure induces strong plastic deformation to enhance the surface residual compressive stress. The technical problems that in the current laser shock peening technology, a machining hardening layer is easily generated during early machining, internal deformation of a workpiece during subsequent laser shock machining is hindered, and the introduction depth of a residual compressive stress field is reduced are solved.
Description
Technical Field
The invention relates to the technical field of material surface treatment, in particular to a multilayer laser shock peening method and device.
Background
With the development of science and technology, lasers are increasingly being used in various fields of life and industry. Laser shock is a new technique for surface strengthening of metals by using shock waves induced by intense laser, and can greatly enhance the durability of metal materials. In accordance with the conventional surface strengthening technology, the laser shock treatment also achieves the strengthening effect by means of strong plastic deformation of the surface.
For thick-wall workpieces, a multilayer laser impact method is generally adopted to improve the plastic deformation amount and achieve the introduction of a high-strength residual stress field. In the traditional multilayer laser shock peening process, the same process parameters are selected for each laser shock, an obvious processing hardened layer is formed on the surface of a workpiece during early processing, the surface hardened layer with lower shaping and toughness can obstruct subsequent laser shock, the internal deformation of the workpiece is influenced, and the introduction depth of a residual compressive stress field is reduced.
Therefore, in the current laser shock peening process, a work hardening layer is easily generated during the previous machining, the internal deformation of the workpiece during the subsequent laser shock machining is prevented, and the introduction depth of the residual compressive stress field is reduced.
Disclosure of Invention
The invention provides a multilayer laser shock peening method and a multilayer laser shock peening device, and solves the technical problems that in the current laser shock peening process, a processing hardened layer is easily generated during early processing, the internal deformation of a workpiece during subsequent laser shock processing is blocked, and the introduction depth of a residual compressive stress field is reduced.
The invention provides a multilayer laser shock peening method, which comprises the following steps:
s1: performing laser shock on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
s2: and performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
Preferably, step S1 is preceded by: step S0;
s0: and determining the first pulse energy, the first pulse width, the first preset times, the second pulse energy, the second pulse width and the second preset times according to the target residual compressive stress field strength of the workpiece to be machined.
The invention provides a multilayer laser shock peening device, comprising:
the first processing unit is used for carrying out laser impact on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
and the second processing unit is used for performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
Preferably, the method further comprises the following steps: a parameter setting unit;
and the parameter setting unit is used for determining the first pulse energy, the first pulse width, the first preset times, the second pulse energy, the second pulse width and the second preset times according to the target residual compressive stress field strength of the workpiece to be processed.
According to the technical scheme, the invention has the following advantages:
the invention provides a multilayer laser shock peening method, wherein the second pulse energy is larger than the first pulse energy, and the second pulse width is smaller than the first pulse width. The laser shock is carried out by first pulse energy and first pulse width, the penetration depth of shock pressure is enhanced by prolonging the action time of laser shock waves, and the introduction depth of a residual compressive stress field of a laser shock induced workpiece is improved. And because the first pulse energy is less than the second pulse energy in the early processing, the work hardening degree is lower, and the obstruction to the later processing can be reduced. And then carrying out laser shock with second pulse energy and second pulse width, and adjusting shock pressure in a mode of enhancing pulse energy, wherein the strong plastic deformation induced by larger shock pressure leads to the enhancement of the surface residual compressive stress. The technical problems that in the current laser shock peening technology, a machining hardening layer is easily generated during early machining, internal deformation of a workpiece during subsequent laser shock machining is hindered, and the introduction depth of a residual compressive stress field is reduced are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic flow chart of an embodiment of a method for multilayer laser shock peening according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of another embodiment of a method for multilayer laser shock peening according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a multilayer laser shock peening apparatus according to an embodiment of the present invention;
FIG. 4 is a graph of the intensity of the residual compressive stress field as a function of the surface residual compressive stress and the depth of the residual compressive stress;
FIG. 5 is a diagram illustrating the effect of a conventional multi-layer laser shock peening method;
fig. 6 is an effect diagram of a multilayer laser shock peening method according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a multilayer laser shock peening method and device, and solves the technical problems that in the current laser shock peening process, a machining hardening layer is easily generated in the early machining, the internal deformation of a workpiece in the subsequent laser shock machining is blocked, and the introduction depth of a residual compressive stress field is reduced.
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a multilayer laser shock peening method, including:
step 101: performing laser shock on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
it should be noted that, in the conventional laser shock peening process, since the same pulse energy and pulse width are used, the surface hardening layer is formed on the surface of the workpiece to be machined already at the early stage of machining (fewer machining times).
In the multilayer laser shock peening method provided in this embodiment, multilayer laser shock peening is performed in a manner of unequal pulse energy and unequal pulse width.
Firstly, a workpiece to be processed is subjected to laser shock for a first preset number of times by first pulse energy and first pulse width.
Step 102: and performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
It should be noted that, in step 101, the pre-processing is performed, and after the pre-processing, the workpiece to be processed is subjected to laser impact for a second preset number of times by using a second pulse energy and a second pulse width, where the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
In a general processing process, a laser spot is circular, and the processing mode adopted is point-by-point processing.
The present embodiment provides a multilayer laser shock peening method, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is less than the first pulse width. The laser shock is carried out by first pulse energy and first pulse width, the penetration depth of shock pressure is enhanced by prolonging the action time of laser shock waves, and the introduction depth of a residual compressive stress field of a laser shock induced workpiece is improved. And because the first pulse energy is less than the second pulse energy in the early processing, the work hardening degree is lower, and the obstruction to the later processing can be reduced. And then carrying out laser shock with second pulse energy and second pulse width, and adjusting shock pressure in a mode of enhancing pulse energy, wherein the strong plastic deformation induced by larger shock pressure leads to the enhancement of the surface residual compressive stress. The technical problems that in the current laser shock peening technology, a machining hardening layer is easily generated during early machining, internal deformation of a workpiece during subsequent laser shock machining is hindered, and the introduction depth of a residual compressive stress field is reduced are solved.
The foregoing is an embodiment of a multilayer laser shock peening method provided in the embodiments of the present invention, and the following is another embodiment of a multilayer laser shock peening method provided in the embodiments of the present invention.
Referring to fig. 2, 4, 5 and 6, another embodiment of a multilayer laser shock peening method according to the present invention includes:
step 201: determining first pulse energy, first pulse width, first preset times, second pulse energy, second pulse width and second preset times according to the target residual compressive stress field strength of the workpiece to be machined;
it should be noted that the early stage target and the later stage target of the early stage machining and the later stage machining can be formulated according to the strength of the target residual compressive stress field, so as to respectively determine the laser machining process parameters of the early stage machining and the later stage machining. Processing at the early stage by low pulse energy to reduce the thickness of a processing hardening layer; and in the later stage, the workpiece is processed by high pulse energy, and the residual compressive stress on the surface of the workpiece to be processed is increased to obtain first pulse energy, first pulse width, first preset times, second pulse energy, second pulse width and second preset times. The specific formulation method is a common technical means of those skilled in the art, and is not described herein again.
Step 202: performing laser shock on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
the early stage processing is performed by a small pulse energy and long pulse width mode, and the first pulse energy (small pulse energy) is used for processing, so that the generation of a processing hardening layer can be reduced, and the thickness of the processing hardening layer can be reduced; and the first pulse width (long pulse width) is used for processing, so that the penetration depth of the impact pressure can be increased, and the introduction depth of the residual compressive stress field of the laser impact induced workpiece is improved.
Step 203: and performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
It should be noted that the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
In the later processing, the second pulse energy (large pulse energy) is used for processing, so that the strong plastic deformation of the workpiece to be processed can be induced by using larger impact pressure to cause the surface residual compressive stress to be enhanced.
The present embodiment provides a multilayer laser shock peening method, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width, that is, in the early processing, the processing parameters of the small pulse energy and the long pulse width are used for processing, and in the later processing, the processing parameters of the large pulse energy and the short pulse width are used for processing.
As shown in fig. 4, the surface compressive residual stress and the depth of the compressive residual stress of the workpiece to be machined directly determine the magnitude of the field strength of the compressive residual stress, which is the integral value of the relationship curve (curve 1) between the surface compressive residual stress and the depth of the compressive residual stress in the third quadrant.
Conventional multilayer laser shock peening uses the same pulse energy and pulse width for pre-processing and post-processing as shown in fig. 5. The effect after the earlier stage processing and the effect after the later stage processing are as shown in curve 2 and curve 3 in fig. 5, and earlier stage processing is induced to wait to process the inside residual compressive stress field that forms of work piece certain intensity, because the introduction of case hardening layer, the impact pressure during later stage processing is difficult to pierce through the inside great degree of depth of work piece, leads to residual compressive stress degree of depth not effectively to increase.
The multilayer laser shock peening method provided by the embodiment firstly performs laser shock by using first pulse energy and first pulse width, enhances the penetration depth of shock pressure by prolonging the action time of laser shock waves, and improves the introduction depth of residual compressive stress fields of laser shock induced workpieces. Further, since the first pulse energy is smaller than the second pulse energy in the early stage processing, the degree of work hardening is low, and the hindrance to the late stage processing is reduced, and the effect is shown by curve 4 in fig. 6.
Then, the laser impact is performed with the second pulse energy and the second pulse width, and the impact pressure is adjusted by increasing the pulse energy, so that the stronger plastic deformation induced by the impact pressure leads to the increase of the residual compressive stress on the surface, and the effect is shown as curve 5 in fig. 6. It can be seen from the comprehensive curves 4 and 5 that, by using the multilayer laser shock peening method of the present embodiment, since a thick work hardened layer is not generated at the early processing, the depth of the residual compressive stress and the surface residual compressive stress can be effectively increased at the later processing.
In a general processing process, a laser spot is circular, and the processing mode adopted is point-by-point processing.
In summary, the multilayer laser shock peening method provided by the embodiment solves the technical problems that in the current laser shock peening process, a work hardening layer is easily generated during the previous machining, the internal deformation of a workpiece during the subsequent laser shock machining is blocked, and the introduction depth of a residual compressive stress field is reduced.
The foregoing is another embodiment of the multilayer laser shock peening method according to the embodiment of the present invention, and the following is an embodiment of a multilayer laser shock peening apparatus according to the embodiment of the present invention.
Referring to fig. 3, an embodiment of the present invention provides an embodiment of a multilayer laser shock peening apparatus, including:
the first processing unit 301 is configured to perform laser shock on a workpiece to be processed for a first preset number of times with a first pulse energy and a first pulse width;
the second processing unit 302 is configured to perform laser shock on the workpiece to be processed for a second preset number of times with a second pulse energy and a second pulse width, where the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
Further, still include: a parameter setting unit 300;
the parameter setting unit 300 is configured to determine a first pulse energy, a first pulse width, a first preset number of times, a second pulse energy, a second pulse width, and a second preset number of times according to the target residual compressive stress field strength of the workpiece to be processed.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. A method of multilayer laser shock peening, comprising:
s1: performing laser shock on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
s2: and performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
2. The multilayer laser shock peening method according to claim 1, further comprising, before step S1: step S0;
s0: and determining the first pulse energy, the first pulse width, the first preset times, the second pulse energy, the second pulse width and the second preset times according to the target residual compressive stress field strength of the workpiece to be machined.
3. A multilayer laser shock peening apparatus, comprising:
the first processing unit is used for carrying out laser impact on a workpiece to be processed for a first preset number of times by using first pulse energy and first pulse width;
and the second processing unit is used for performing laser impact on the workpiece to be processed for a second preset number of times by using second pulse energy and second pulse width, wherein the second pulse energy is greater than the first pulse energy, and the second pulse width is smaller than the first pulse width.
4. The multilayer laser shock peening apparatus of claim 3, further comprising: a parameter setting unit;
and the parameter setting unit is used for determining the first pulse energy, the first pulse width, the first preset times, the second pulse energy, the second pulse width and the second preset times according to the target residual compressive stress field strength of the workpiece to be processed.
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| CN110205477B (en) * | 2019-07-02 | 2021-03-30 | 哈尔滨工业大学 | Laser shock peening method for improving laser induced shock wave intensity by adopting time sequence double laser pulses |
| CN115074519A (en) * | 2022-07-08 | 2022-09-20 | 山东大学 | Pulse parameter determination method for high-intensity multiple laser impacts and application |
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