CN108531713A - A kind of multilayer laser shock peening method and device - Google Patents
A kind of multilayer laser shock peening method and device Download PDFInfo
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- CN108531713A CN108531713A CN201810662095.1A CN201810662095A CN108531713A CN 108531713 A CN108531713 A CN 108531713A CN 201810662095 A CN201810662095 A CN 201810662095A CN 108531713 A CN108531713 A CN 108531713A
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
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Abstract
The invention discloses a kind of multilayer laser shock peening method and devices, wherein the second pulse energy is more than the first pulse energy, the second pulse width is less than the first pulse width.Laser-impact is first carried out with the first pulse energy and the first pulse width, action time by extending laser blast wave enhances the penetration depth of surge, improve the introducing depth of laser-impact induction workpiece residual compressive stress field, since the first pulse energy is less than the second pulse energy, work-hardening capacity is relatively low, can reduce the obstruction to post-production.Laser-impact is carried out with the second pulse energy and the second pulse width again, surge is adjusted in a manner of intensifier pulse energy, the intense plastic strain of larger surge induction causes surface compress residual stresses to enhance.The technical issues of solving in current laser impact intensified technique, be easy to generate work hardening layer when processing early period, hindering post laser to impact the internal modification of workpiece when processing, reduce the introducing depth of residual compressive stress field.
Description
Technical field
The present invention relates to technical field of material surface treatment more particularly to a kind of multilayer laser shock peening methods and dress
It sets.
Background technology
With the development of science and technology, laser is gradually used in the every field of life and industry.Laser-impact is a kind of profit
The new technology for carrying out surface peening to metal with strong laser induced shock wave, can be greatly enhanced the durable of metal material
Property.Consistent with traditional surface strengthening technology, laser-impact processing realizes reinforcing also by the mode of surface intense plastic strain
Effect.
For heavy wall workpiece, amount of plastic deformation is generally improved using multilayer laser shock method, it is residual to reach high intensity
The introducing of residue stress field.In the laser impact intensified technique of traditional multilayer, each laser-impact chooses identical technological parameter, preceding
Phase just makes workpiece surface form apparent work hardening layer when processing, the moulding and relatively low cementation zone of toughness can be to follow-up
Laser-impact causes to hinder, and influences inside workpiece deformation, reduces the introducing depth of residual compressive stress field.
Therefore, it results in current laser impact intensified technique, is easy to generate work hardening layer when processing early period, hinder
The technical issues of hindering post laser to impact the internal modification of workpiece when processing, reducing the introducing depth of residual compressive stress field.
Invention content
The present invention provides a kind of multilayer laser shock peening method and devices, solve current laser impact intensified work
It in skill, is easy to generate work hardening layer when processing early period, the internal modification of workpiece, reduces when post laser impact being hindered to process
The technical issues of introducing depth of residual compressive stress field.
The present invention provides a kind of multilayer laser shock peening methods, including：
S1：The laser for carrying out the first predetermined times to workpiece to be processed with the first pulse energy and the first pulse width rushes
It hits；
S2：The laser for carrying out the second predetermined times to workpiece to be processed with the second pulse energy and the second pulse width rushes
It hits, wherein the second pulse energy is more than the first pulse energy, and the second pulse width is less than the first pulse width.
Preferably, further include before step S1：Step S0；
S0：According to the target residual compression field intensity of workpiece to be processed determine the first pulse energy, the first pulse width,
First predetermined times, the second pulse energy, the second pulse width and the second predetermined times.
The present invention provides a kind of laser impact intensified devices of multilayer, including：
First processing unit, it is preset for carrying out first to workpiece to be processed with the first pulse energy and the first pulse width
The laser-impact of number；
Second processing unit, it is preset for carrying out second to workpiece to be processed with the second pulse energy and the second pulse width
The laser-impact of number, wherein the second pulse energy is more than the first pulse energy, and it is wide that the second pulse width is less than the first pulse
Degree.
Preferably, further include：Parameter set unit；
Parameter set unit, for determining the first pulse energy according to the target residual compression field intensity of workpiece to be processed
Amount, the first pulse width, the first predetermined times, the second pulse energy, the second pulse width and the second predetermined times.
As can be seen from the above technical solutions, the present invention has the following advantages：
The present invention provides a kind of multilayer laser shock peening methods, wherein the second pulse energy is more than the first pulse energy
Amount, the second pulse width are less than the first pulse width.Laser-impact is first carried out with the first pulse energy and the first pulse width, is led to
The penetration depth for crossing the action time enhancing surge for extending laser blast wave improves laser-impact induction workpiece residual pressure and answers
The introducing depth in the field of force.And the first pulse energy is less than the second pulse energy when being processed due to early period, so processing hardening journey
It spends relatively low, the obstruction to post-production can be reduced.Then laser-impact is carried out with the second pulse energy and the second pulse width again,
Surge is adjusted by way of intensifier pulse energy, the intense plastic strain of larger surge induction causes surface residual
Overbottom pressure stress enhances.It solves in current laser impact intensified technique, is easy to generate work hardening layer when processing early period, hinder
The technical issues of hindering post laser to impact the internal modification of workpiece when processing, reducing the introducing depth of residual compressive stress field.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of flow signal of one embodiment of multilayer laser shock peening method provided in an embodiment of the present invention
Figure；
Fig. 2 is that a kind of flow of another embodiment of multilayer laser shock peening method provided in an embodiment of the present invention is shown
It is intended to；
Fig. 3 is a kind of structural representation of one embodiment of the laser impact intensified device of multilayer provided in an embodiment of the present invention
Figure；
Fig. 4 is the relational graph of residual compressive stress field intensity and surface compress residual stresses and residual compressive stress depth；
Fig. 5 is the design sketch of conventional multilayer laser shock peening method；
Fig. 6 is the design sketch of multilayer laser shock peening method provided in an embodiment of the present invention.
Specific implementation mode
An embodiment of the present invention provides a kind of multilayer laser shock peening method and devices, solve current laser-impact
It in reinforcement process, is easy to generate work hardening layer when processing early period, the inside of workpiece when post laser impact processing is hindered to become
Shape, the technical issues of reducing the introducing depth of residual compressive stress field.
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Referring to Fig. 1, an embodiment of the present invention provides a kind of one embodiment of multilayer laser shock peening method, packet
It includes：
Step 101：The first predetermined times are carried out with the first pulse energy and the first pulse width to workpiece to be processed to swash
Light impacts；
It should be noted that in traditional laser impact intensified technique, because wide using identical pulse energy and pulse
Degree, so just having made workpiece to be processed surface form cementation zone in processing early period (less processing times).
In multilayer laser shock peening method provided in this embodiment, unequal impulse energy and unequal impulse width are taken
It is laser impact intensified that mode carries out multilayer.
First, the laser of the first predetermined times is first carried out to workpiece to be processed with the first pulse energy and the first pulse width
Impact.
Step 102：The second predetermined times are carried out with the second pulse energy and the second pulse width to workpiece to be processed to swash
Light impacts, wherein the second pulse energy is more than the first pulse energy, and the second pulse width is less than the first pulse width.
It should be noted that being processed for early period in step 101, with the second pulse energy and the second pulse after processing early period
Width carries out workpiece to be processed the laser-impact of the second predetermined times, wherein and the second pulse energy is more than the first pulse energy,
Second pulse width is less than the first pulse width.
In usual process, laser facula is circle, and the processing method taken is point-by-point processing.
A kind of multilayer laser shock peening method is present embodiments provided, wherein the second pulse energy is more than the first pulse energy
Amount, the second pulse width are less than the first pulse width.Laser-impact is first carried out with the first pulse energy and the first pulse width, is led to
The penetration depth for crossing the action time enhancing surge for extending laser blast wave improves laser-impact induction workpiece residual pressure and answers
The introducing depth in the field of force.And the first pulse energy is less than the second pulse energy when being processed due to early period, so processing hardening journey
It spends relatively low, the obstruction to post-production can be reduced.Then laser-impact is carried out with the second pulse energy and the second pulse width again,
Surge is adjusted by way of intensifier pulse energy, the intense plastic strain of larger surge induction causes surface residual
Overbottom pressure stress enhances.It solves in current laser impact intensified technique, is easy to generate work hardening layer when processing early period, hinder
The technical issues of hindering post laser to impact the internal modification of workpiece when processing, reducing the introducing depth of residual compressive stress field.
It is a kind of one embodiment of multilayer laser shock peening method provided in an embodiment of the present invention above, is below this
A kind of another embodiment for multilayer laser shock peening method that inventive embodiments provide.
Fig. 2, Fig. 4, Fig. 5 and Fig. 6 are please referred to, an embodiment of the present invention provides a kind of the another of multilayer laser shock peening method
One embodiment, including：
Step 201：The first pulse energy, the first pulse are determined according to the target residual compression field intensity of workpiece to be processed
Width, the first predetermined times, the second pulse energy, the second pulse width and the second predetermined times；
It should be noted that the early period of early period processing and post-production can be formulated according to target residual compression field intensity
Target and later stage target, to determine the laser processing technology parameter of early period processing and post-production respectively.Early period is with low pulse
Energy is processed, and reduces the thickness of work hardening layer；Later stage is processed with high pulse energy, increases workpiece to be processed surface
It is wide to obtain the first pulse energy, the first pulse width, the first predetermined times, the second pulse energy, the second pulse for residual compressive stress
Degree and the second predetermined times.Specific formulating method is the common technology means of those skilled in the art, and details are not described herein.
Step 202：The first predetermined times are carried out with the first pulse energy and the first pulse width to workpiece to be processed to swash
Light impacts；
It should be noted that early period, processing was processed by the way of small-pulse effect energy long pulse width, using first
Pulse energy (small-pulse effect energy) is processed, it is possible to reduce the generation of work hardening layer reduces the thickness of work hardening layer；And
And be processed with the first pulse width (long pulse width), the penetration depth of surge can be increased, improve laser-impact
Induce the introducing depth of workpiece residual compressive stress field.
Step 203：The second predetermined times are carried out with the second pulse energy and the second pulse width to workpiece to be processed to swash
Light impacts, wherein the second pulse energy is more than the first pulse energy, and the second pulse width is less than the first pulse width.
It should be noted that the second pulse energy is more than the first pulse energy, it is wide that the second pulse width is less than the first pulse
Degree.
It is processed, can be induced with larger surge with the second pulse energy (high energy) in post-production
The intense plastic strain of workpiece to be processed causes surface compress residual stresses to enhance.
A kind of multilayer laser shock peening method is present embodiments provided, wherein the second pulse energy is more than the first pulse energy
Amount, the second pulse width is less than the first pulse width, i.e., using the processing of small-pulse effect energy and long pulse width when early period processes
Technological parameter is processed, and post-production is processed using the working process parameter of high energy and short pulse width.
As shown in figure 4, the surface compress residual stresses and residual compressive stress depth of workpiece to be processed directly determine residual pressure
The size of stress field intensity, residual compressive stress field intensity are the relation curve of surface compress residual stresses and residual compressive stress depth
The integrated value of (curve 1) in third quadrant.
Traditional multilayer is laser impact intensified as shown in figure 5, carrying out early period using identical pulse energy and pulse width
Processing and post-production.Early period processing after effect and post-production after effect as in Fig. 5 curve 2 and curve 3 shown in, it is preceding
Some strength residual compressive stress field is formed inside phase processing induction workpiece to be processed, due to the introducing of cementation zone, the later stage adds
The surge in working hour is difficult to penetrate inside workpiece bigger depth, and residual compressive stress depth is caused not to be effectively increased.
Multilayer laser shock peening method provided in this embodiment is first carried out with the first pulse energy and the first pulse width
Laser-impact, the action time by extending laser blast wave enhance the penetration depth of surge, improve laser-impact induction
The introducing depth of workpiece residual compressive stress field.And the first pulse energy is less than the second pulse energy, institute when being processed due to early period
It is relatively low with work-hardening capacity, reduce the obstruction to post-production, effect is as shown in the curve 4 of Fig. 6.
Then laser-impact is carried out with the second pulse energy and the second pulse width again, by way of intensifier pulse energy
Surge is adjusted, the intense plastic strain of larger surge induction causes surface compress residual stresses to enhance, effect such as Fig. 6
Curve 5 shown in.Resultant curve 4 and curve 5 are it is found that use the multilayer laser shock peening method of the present embodiment, due to preceding
Phase does not generate thicker work hardening layer when processing, so can still be effectively increased residual compressive stress depth when post-production
And surface compress residual stresses.
In usual process, laser facula is circle, and the processing method taken is point-by-point processing.
In conclusion multilayer laser shock peening method provided in this embodiment solves current laser impact intensified work
It in skill, is easy to generate work hardening layer when processing early period, the internal modification of workpiece, reduces when post laser impact being hindered to process
The technical issues of introducing depth of residual compressive stress field.
Above be a kind of another embodiment of multilayer laser shock peening method provided in an embodiment of the present invention, below for
A kind of one embodiment of the laser impact intensified device of multilayer provided in an embodiment of the present invention.
Referring to Fig. 3, an embodiment of the present invention provides a kind of one embodiment of the laser impact intensified device of multilayer, packet
It includes：
First processing unit 301, for carrying out first to workpiece to be processed with the first pulse energy and the first pulse width
The laser-impact of predetermined times；
Second processing unit 302, for carrying out second to workpiece to be processed with the second pulse energy and the second pulse width
The laser-impact of predetermined times, wherein the second pulse energy is more than the first pulse energy, and the second pulse width is less than the first pulse
Width.
Further, further include：Parameter set unit 300；
Parameter set unit 300, for determining the first pulse according to the target residual compression field intensity of workpiece to be processed
Energy, the first pulse width, the first predetermined times, the second pulse energy, the second pulse width and the second predetermined times.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of division of logic function, formula that in actual implementation, there may be another division manner, such as multiple units or component
It can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be the indirect coupling by some interfaces, device or unit
It closes or communicates to connect, can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, it can also
It is that each unit physically exists alone, it can also be during two or more units be integrated in one unit.Above-mentioned integrated list
The form that hardware had both may be used in member is realized, can also be realized in the form of SFU software functional unit.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product
When, it can be stored in a computer read/write memory medium.Based on this understanding, technical scheme of the present invention is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a storage medium, including some instructions are used so that a computer
Equipment (can be personal computer, server or the network equipment etc.) executes the complete of each embodiment the method for the present invention
Portion or part steps.And storage medium above-mentioned includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can store journey
The medium of sequence code.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (4)
1. a kind of multilayer laser shock peening method, which is characterized in that including：
S1：The laser-impact of the first predetermined times is carried out to workpiece to be processed with the first pulse energy and the first pulse width；
S2：The laser-impact of the second predetermined times is carried out to workpiece to be processed with the second pulse energy and the second pulse width,
In, the second pulse energy is more than the first pulse energy, and the second pulse width is less than the first pulse width.
2. a kind of multilayer laser shock peening method according to claim 1, which is characterized in that also wrapped before step S1
It includes：Step S0；
S0：The first pulse energy, the first pulse width, first are determined according to the target residual compression field intensity of workpiece to be processed
Predetermined times, the second pulse energy, the second pulse width and the second predetermined times.
3. a kind of laser impact intensified device of multilayer, which is characterized in that including：
First processing unit, for carrying out the first predetermined times to workpiece to be processed with the first pulse energy and the first pulse width
Laser-impact；
Second processing unit, for carrying out the second predetermined times to workpiece to be processed with the second pulse energy and the second pulse width
Laser-impact, wherein the second pulse energy be more than the first pulse energy, the second pulse width be less than the first pulse width.
4. the laser impact intensified device of a kind of multilayer according to claim 3, which is characterized in that further include：Parameter setting
Unit；
Parameter set unit, for determining the first pulse energy, according to the target residual compression field intensity of workpiece to be processed
One pulse width, the first predetermined times, the second pulse energy, the second pulse width and the second predetermined times.
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| CN115074519A (en) * | 2022-07-08 | 2022-09-20 | 山东大学 | Pulse parameter determination method for high-intensity multiple laser impacts and application |
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| CN108531713B (en) | 2020-03-27 |
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