CN108525973A - The technological process of back drill aluminium flake plate and the back drill aluminium flake plate - Google Patents
The technological process of back drill aluminium flake plate and the back drill aluminium flake plate Download PDFInfo
- Publication number
- CN108525973A CN108525973A CN201810269754.5A CN201810269754A CN108525973A CN 108525973 A CN108525973 A CN 108525973A CN 201810269754 A CN201810269754 A CN 201810269754A CN 108525973 A CN108525973 A CN 108525973A
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- Prior art keywords
- aluminium flake
- back drill
- plate
- aluminium
- flake
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/20—Metallic substrate based on light metals
- B05D2202/25—Metallic substrate based on light metals based on Al
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2504/00—Epoxy polymers
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention discloses a kind of back drill aluminium flake plate, and the resin layer of aluminum flake surface is formed for pcb board back drill hole when institute consumptive material aspect, including aluminium flake and coating；Because resin layer is using epoxide resin material as main component, epoxy resin is the polymer for synthesizing hydroxyl with bisphenol-A by epoxychloropropane；The polymer is reacted with polyamine and curing agent, so that strand is crosslinked and is formed the high molecular compound film of build, which is formed in aluminum flake surface.High molecular compound film has very strong acidproof and alkaline resistance properties, has extremely strong bonding force to aluminium flake, and the performance of aluminium flake plate is drilled with the increase of extremely strong flexibility, reaches raising and is processed the inclined hole of hole position precision reduction or broken needle.By forming back drill aluminium flake plate by carrier combination insulating resin layer of aluminium flake, the upper and lower plates time in boring procedure can be saved, production cost, raising equipment efficiency of usage are reduced to reach.Back drill aluminium flake plate of the present invention also has effect simple to operate, easy to use.
Description
【Technical field】
The present invention relates to the techniques of a kind of back drill aluminium flake plate in terms of pcb board drilling processing consumptive material and back drill aluminium flake plate
Flow.
【Background technology】
As social constantly progress and development forward, the requirement of the adjoint high precision int to electronic product are higher and higher.Electricity
The high precision int development of sub- product directly proposes more high-precision requirement to wiring board processing, meanwhile, but also to wiring board
Quality requirements are higher and higher in the positioning accuracy of hole position and hole.However, existing traditional back drill aluminium flake plate includes for placing PCB
Aluminium flake above plate and the cold punching plate being set to above aluminium flake.When back drill operation, the aluminium flake and cold punching cover board are arranged in pairs or groups
Deep and hole quality requirements are controlled using drilling on pcb board, is solved.In this mode of production, the device efficiency utilizes
Larger waste is generated, production cost is relatively high.
【Invention content】
The technical purpose of the present invention is to provide a kind of reduce in order to solve the above-mentioned problems of the prior art and be produced into
Originally equipment efficiency of usage, is improved, improves and is processed the back drill aluminium flake plate that hole position precision reduces inclined hole or broken needle.
Another technical object of the present invention is to provide a kind of processing is simple and convenient, using easy to operate back drill aluminium flake plate
Technological process.
In order to realize above-mentioned technical problem, a kind of back drill aluminium flake plate provided by the present invention, for being consumed when pcb board back drill hole
In terms of material, including aluminium flake and coating form the resin layer of aluminum flake surface；The resin layer with epoxide resin material be mainly at
Point, the epoxy resin is the polymer for synthesizing hydroxyl with bisphenol-A by epoxychloropropane；The polymer is with polyamine and admittedly
Agent is reacted, and so that strand is crosslinked and is formed the high molecular compound film of build, which is formed in institute
State aluminum flake surface.
According to the technical characteristics, the resin layer is formed by heat cured resin.
A kind of technological process of back drill aluminium flake plate is：The first step is detected the surface quality of aluminium volume, detection aluminium volume
Whether aluminum flake surface has flash or burr, then, the aluminium is rolled into descaling bath internal washing on feeder, aluminium flake to be removed
Dust, impurity and the oil stain on surface, you can become the aluminium flake of qualified semi-finished product；Epoxide resin material is put into appearance by second step
It inside device, is sufficiently stirred so that epoxide resin material is thoroughly mixed together, graininess coating to be become；Third walks, will
The graininess coating, which is poured into inside three-roll grinder, to be ground, and waits for that the epoxide resin material fusion of graininess coating becomes together
At powder type coating preparation；4th step, the powder type coating preparation are coated on by roller applications on aluminum flake surface, the roller applications
Coating layer thickness is mainly controlled by coating idler wheel；5th step, being coated with the aluminium flake of powder type coating preparation, to be sent to tunnel type roasting
Inside case, under conditions of 200 degrees Celsius of baking temperature and baking time are 120 seconds, to the powder type coating preparation of aluminum flake surface into
Row solidification waits for that aluminum flake surface forms one layer of plate body layer with thickness, as finished product back drill aluminium flake plate；6th step, finished product is carried on the back
The winding of aluminium flake plate is bored, is examined, warehousing finished products.
Beneficial effects of the present invention：Because the resin layer is using epoxide resin material as main component, the epoxy resin
It is the polymer for synthesizing hydroxyl with bisphenol-A by epoxychloropropane；The polymer is reacted with polyamine and curing agent, makes strand
The high molecular compound film of build is crosslinked and is formed, which is formed in the aluminum flake surface.Described
High molecular compound film has very strong acidproof and alkaline resistance properties, has extremely strong bonding force to aluminium flake so that form the back of the body
The thickness for boring aluminium flake plate is about a quarter of traditional aluminium flake and cold punching plate overall thickness, and there is extremely strong flexibility to increase back drill aluminium flake
The performance of plate effectively shortens the Drill-down paths of drill point, promotes penetration rate, reduces the abrasion of drill point, promotes back drill hole product
The stability of matter is processed the inclined hole of hole position precision reduction or broken needle to reach to improve.It is insulated by being combined as carrier using aluminium flake
Resin layer forms back drill aluminium flake plate, in all technical and quality for meeting traditional back drill upper cover plate, can also save and drill
The upper and lower plates time in journey, reaching reduces production cost, improves equipment efficiency of usage.With the processing work of existing aluminium flake and cold punching plate
Skill process CIMS, back drill aluminium flake plate of the present invention also have simple to operate, advantage easy to use.
With reference to the accompanying drawings and examples, technical scheme of the present invention will be described in further detail.
【Description of the drawings】
Fig. 1 is the schematic diagram of back drill aluminium flake plate in the present invention；
Fig. 2 is the schematic diagram of another embodiment of back drill aluminium flake plate in the present invention.
【Specific implementation mode】
Please refer to Fig.1 and Fig. 2 shown in, illustrate a kind of back drill aluminium flake plate with reference to embodiment, be used for pcb board back drill hole when
In terms of institute's consumptive material, including aluminium flake 1 and coating form the resin layer 2 on 1 surface of aluminium flake.
The resin layer 2 using epoxide resin material as main component, the epoxy resin be by epoxychloropropane with it is double
The polymer of phenol A synthesis hydroxyls；The polymer is reacted with polyamine and curing agent, and strand is made to crosslink and form build
High molecular compound film, which is formed in the aluminum flake surface.The resin layer 2 is by heat cured tree
Fat is formed.The aluminium flake 1 is wrapped in 2 inside of resin layer and forms the back drill aluminium flake plate.
A kind of technological process of back drill aluminium flake plate is：The first step is detected the surface quality of aluminium volume, detection aluminium volume
Whether 1 surface of aluminium flake has flash or burr, then, the aluminium is rolled into descaling bath internal washing on feeder, aluminium to be removed
Dust, impurity and the oil stain on piece surface, you can become the aluminium flake of qualified semi-finished product；Epoxide resin material is put by second step
It inside container, is sufficiently stirred so that epoxide resin material is thoroughly mixed together, graininess coating to be become；Third walks,
The graininess coating is poured into inside three-roll grinder and is ground, waits for the epoxide resin material fusion of graininess coating together
Become powder type coating preparation；4th step, the powder type coating preparation are coated on by roller applications on aluminum flake surface, the roller coating side
Formula mainly controls coating layer thickness by coating idler wheel；5th step, the aluminium flake 1 for being coated with powder type coating preparation are sent to tunnel type
Inside oven, under conditions of 200 degrees Celsius of baking temperature and baking time are 120 seconds, to the powder type coating preparation on 1 surface of aluminium flake
Cured, waits for that 1 surface of aluminium flake forms one layer of plate body layer with thickness, as finished product back drill aluminium flake plate；6th step, by finished product
Back drill aluminium flake plate is wound, and is examined, warehousing finished products.
The resin layer 2 is directly coated on the upper surface of aluminium flake 1 or the resin layer 2 is directly coated on aluminium flake 1
Lower surface, aluminium flake 1 toast to form back drill aluminium flake plate by roller coating, which can reduce the broken needle caused by torsion,
It can also align in high precision, extend the drill point service life.This back drill aluminium flake plate reinforces lid by reducing the tolerance of aluminium inherence itself
The Repeatability of plate.This back drill aluminium flake plate, which is lain on pcb board, need not wear gloves and any special operation requirement so that
It can reach easy to operate.This back drill aluminium flake plate can enable drilling to keep going out into knife face and lamination by covering tube effect well
The hole position precision in mouth face.The resin layer 2 can hold drill point in drill point contact plate face moment, reduce deflection, cut by drill point
Dust is converted into after cutting to be sucked away.In boring procedure and later splendid visual effect can be presented so that can be that drilling carry
For best hole position precision.It is placed steadily in printed circuit laminate, is notheated softening, hand is not necessarily to when being operated to cover board
Set or any specialized processing techniques, it is easy to operate to reach.Since epoxide resin material has solidification convenient, adhesion strength is strong,
Shrinkage is low, stable mechanical property, and chemical stability is high, dimensional stability.So that resin layer surface adhesion strength is strong and surface is hard
Degree is less than aluminum flake surface hardness.When drilling, the resin can cling the position with fixed brill syringe needle, play when being bored under drill point
Locating effect, reach the hole position positioning accuracy for improving processed drilling holes on circuit board.Because 2 case hardness of resin layer is than aluminium flake table
It is thin-skinned, so that drill point is drilled through laminated body surface more easily, need not be very stiff and demanding as existing common aluminium flake 1, reduce drill point
Knife face is worn, and can more preferably ensure the sharpness of drill point knife face, and reduce in boring procedure leads to broken needle because surface is too hard, together
When can also make the clast generated when drilling in time discharge in outside so that drilled hole wall surface is more smooth, so reaching
Quality in the hole for improving processed drilling holes on circuit board.
In conclusion because the resin layer 2 is using epoxide resin material as main component, the epoxy resin is by epoxy
Chloropropane synthesizes the polymer of hydroxyl with bisphenol-A；The polymer is reacted with polyamine and curing agent, and strand is made to crosslink
And the high molecular compound film of build is formed, which is formed in the aluminum flake surface.The producing high-molecular
Compound film has very strong acidproof and alkaline resistance properties, has extremely strong bonding force to aluminium flake so that form the back drill aluminium flake plate
Thickness be about traditional aluminium flake and cold punching plate overall thickness a quarter, increase the use of back drill aluminium flake plate with extremely strong flexibility
Performance effectively shortens the Drill-down paths of drill point, promotes penetration rate, reduces the abrasion of drill point, promotes the stabilization of back drill hole quality
Property, reduce inclined hole or broken needle.By being that carrier combination insulating resin layer forms back drill aluminium flake plate with aluminium flake 1, the tradition back of the body can be met
The all technical and quality of upper cover plate are bored, while the upper and lower plates time in boring procedure can be saved, reaches reduction and is produced into
Originally equipment efficiency of usage, is improved.Compared with the processing process of existing aluminium flake and cold punching plate, back drill aluminium flake plate of the present invention also has
There is simple to operate, advantage easy to use.
To those skilled in the art, it can be modified or changed according to the above description, and all these
Modifications and variations should belong to the present invention and apply within the scope of protecting.
Claims (3)
1. a kind of back drill aluminium flake plate forms aluminum flake surface for pcb board back drill hole when institute consumptive material aspect, including aluminium flake and coating
Resin layer；It is characterized in that：For the resin layer using epoxide resin material as main component, the epoxy resin is by epoxy
Chloropropane synthesizes the polymer of hydroxyl with bisphenol-A；The polymer is reacted with polyamine and curing agent, and strand is made to crosslink
And the high molecular compound film of build is formed, which is formed in the aluminum flake surface.
2. back drill aluminium flake plate according to claim 1, it is characterised in that：The resin layer is by heat cured resin shape
At.
3. a kind of technological process of back drill aluminium flake plate as described in claim 1 is：The first step carries out the surface quality of aluminium volume
Whether the aluminum flake surface of detection, detection aluminium volume has flash or burr, and then, the aluminium is rolled on feeder inside descaling bath
Cleaning, dust, impurity and the oil stain of aluminum flake surface to be removed, you can become the aluminium flake of qualified semi-finished product；Second step, by epoxy
Resin material is put into inside container, is sufficiently stirred so that epoxide resin material is thoroughly mixed together, graininess to be become
Coating；Third walks, which is poured into inside three-roll grinder and is ground, waits for the epoxy resin of graininess coating
Material fusion becomes powder type coating preparation together；4th step, the powder type coating preparation are coated on aluminium flake table by roller applications
On face, which mainly controls coating layer thickness by coating idler wheel；5th step is coated with the aluminium flake of powder type coating preparation
It is sent to inside tunnel type baking oven, under conditions of 200 degrees Celsius of baking temperature and baking time are 120 seconds, to aluminum flake surface
Powder type coating preparation cured, wait for that aluminum flake surface forms one layer of plate body layer with thickness, as finished product back drill aluminium flake plate；The
Six steps wind finished product back drill aluminium flake plate, examine, warehousing finished products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810269754.5A CN108525973A (en) | 2018-03-29 | 2018-03-29 | The technological process of back drill aluminium flake plate and the back drill aluminium flake plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810269754.5A CN108525973A (en) | 2018-03-29 | 2018-03-29 | The technological process of back drill aluminium flake plate and the back drill aluminium flake plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108525973A true CN108525973A (en) | 2018-09-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810269754.5A Pending CN108525973A (en) | 2018-03-29 | 2018-03-29 | The technological process of back drill aluminium flake plate and the back drill aluminium flake plate |
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| Country | Link |
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| CN (1) | CN108525973A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102911585A (en) * | 2012-09-28 | 2013-02-06 | 广州擎天实业有限公司 | Special primer paint for medium and high grade automobile aluminum hubs and preparation method of primer paint |
| CN103533761A (en) * | 2013-10-23 | 2014-01-22 | 广东依顿电子科技股份有限公司 | Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole |
| CN105537090A (en) * | 2016-02-01 | 2016-05-04 | 深圳市宏宇辉科技有限公司 | Coating aluminum sheet and technological process for manufacturing same |
| CN206072736U (en) * | 2016-07-22 | 2017-04-05 | 昆山优文贸易有限公司 | A kind of back drill aluminium flake |
-
2018
- 2018-03-29 CN CN201810269754.5A patent/CN108525973A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102911585A (en) * | 2012-09-28 | 2013-02-06 | 广州擎天实业有限公司 | Special primer paint for medium and high grade automobile aluminum hubs and preparation method of primer paint |
| CN103533761A (en) * | 2013-10-23 | 2014-01-22 | 广东依顿电子科技股份有限公司 | Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole |
| CN105537090A (en) * | 2016-02-01 | 2016-05-04 | 深圳市宏宇辉科技有限公司 | Coating aluminum sheet and technological process for manufacturing same |
| CN206072736U (en) * | 2016-07-22 | 2017-04-05 | 昆山优文贸易有限公司 | A kind of back drill aluminium flake |
Non-Patent Citations (1)
| Title |
|---|
| 翁祖祺等: "《中国玻璃钢工业大全》", 28 February 1992, 国防工业出版社 * |
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Effective date of registration: 20200717 Address after: 518000 Shajingjie Street Shatou Community Shajingxi Ring Road Democracy Jiujiu Industrial Zone 409, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN HONGYUHUI TECHNOLOGY Co.,Ltd. Address before: 422000 Shaoyang province Hunan city Daxiang District Tan Jiang Xiang Shuangjiang village 6 Group No. 255 of No. 2 Applicant before: Zhu Dasheng |
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Application publication date: 20180914 |