CN108525464A - A kind of level control method and device for system for desulfuration and denitration - Google Patents
A kind of level control method and device for system for desulfuration and denitration Download PDFInfo
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- CN108525464A CN108525464A CN201810576497.XA CN201810576497A CN108525464A CN 108525464 A CN108525464 A CN 108525464A CN 201810576497 A CN201810576497 A CN 201810576497A CN 108525464 A CN108525464 A CN 108525464A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
- B01D53/0454—Controlling adsorption
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/30—Sulfur compounds
- B01D2257/302—Sulfur oxides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01D2257/00—Components to be removed
- B01D2257/40—Nitrogen compounds
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Abstract
The invention discloses a kind of level control method and device for system for desulfuration and denitration, which includes:Obtain the actual average material position of adsorption tower;According to the actual average material position and predetermined control strategy, adjust the discharge velocity of Analytic Tower, so that the actual average material position of adsorption tower and target are averaged, the absolute value of the difference of material position is less than or equal to the absolute value of the difference of the first predetermined threshold value and the practical material position and target material position of Analytic Tower less than or equal to the second predetermined threshold value.Using the level control method, according to the actual average material position and predetermined control strategy of adsorption tower, by adjusting the practical discharge velocity of Analytic Tower, accurately efficiently the actual average material position of adsorption tower can be adjusted to target and be averaged within the scope of the allowable error of material position, the practical material position of Analytic Tower is adjusted to the allowable error of target material position, entire control process is more stablized, and applicability is more preferable.
Description
Technical field
The present invention relates to desulphurization denitration technical field more particularly to a kind of level control methods for system for desulfuration and denitration
And device.
Background technology
At present in iron and steel enterprise, sintering flue gas sulphur oxide (such as SO that sintering circuit generates2Deng) and nitrogen oxidation
Object (such as NO and NO2Deng) overwhelming majority that accounts for iron and steel enterprise's disposal of pollutants total amount, caused by sintering flue gas discharge to mitigate
Atmosphere pollution, it is necessary to sintering flue gas carry out the processing such as desulfurization and denitration.The special desulphurization denitration of iron and steel enterprise's generally use
System holds material (such as activated carbon) the absorption sintering flue gas with adsorption function, with realization pair in system for desulfuration and denitration
The processing such as the desulfurization and denitration of sintering flue gas.
A kind of structural schematic diagram of system for desulfuration and denitration in the prior art is shown referring to Fig. 1, Fig. 1.It can in conjunction with Fig. 1
Know, which includes:Multiple adsorption towers 1, Analytic Tower 2, the first conveyer 3 and second conveyor 4.Wherein, it is sintered
Flue gas is transported to after supercharging in each adsorption tower 1 respectively, and the sulfur dioxide in sintering flue gas is active in adsorption tower 1
Charcoal adsorbs, and is sulfuric acid by catalysis oxidation, while nitrogen oxides reacts in adsorption tower 1 with the ammonia of denitration and generates nitric acid
The sulfuric acid of ammonium salt, generation is tightly held by activated carbon with ammonium salt.The activated carbon of adsorption saturation is fed by the round roller of adsorption tower 1
Machine is emitted into the hopper of the first conveyer 3, is then delivered in Analytic Tower 2 by the first conveyer 3, and Analytic Tower 2 is full to adsorbing
The activated carbon of sum carries out heating parsing, and the activated carbon by heating parsing is emitted into the second conveying by the rotary valve of Analytic Tower 2
It on machine 4, is then delivered in adsorption tower 1 and recycles again by second conveyor 4, to carry out desulphurization denitration to sintering flue gas
Processing.
The accumulation height of material (such as activated carbon) is commonly referred to as the material position of adsorption tower 1, object in Analytic Tower 2 in adsorption tower 1
Expect that the accumulation height of (such as being adsorbed with the activated carbon of pollutant) is commonly referred to as the material position of Analytic Tower 2.Above-mentioned to sintering flue gas
Desulphurization denitration processing procedure in, the actual average material position (the actual average material position of follow-up abbreviation adsorption tower 1) of all adsorption towers 1
It is both needed within the scope of the allowable error for being controlled in respective objects value with the practical material position of Analytic Tower 2, the first conveyer 3 and second is defeated
Send the transmission of machine 4 to be also required to be controlled in the state of relative equilibrium so that in entire system for desulfuration and denitration material operating
State in relative equilibrium.
In the prior art, in order to make state of the operating in relative equilibrium of material in entire system for desulfuration and denitration, usually
First conveyer 3 and second conveyor 4 are remained into the state of traveling at the uniform speed, and keep the discharge velocity of adsorption tower 1 constant, later
The discharge velocity for adjusting Analytic Tower 2 manually by operating personnel, make the adsorption tower 1 of system for desulfuration and denitration actual average material position and
The practical material position of Analytic Tower 2 is controlled within the scope of the allowable error of respective objects value.
But above-mentioned existing control method is used, since the level of operating personnel is different, to the discharge velocity of Analytic Tower 2
Control there are prodigious difference, cause the Level control to adsorption tower 1 and Analytic Tower 2 unstable, and control efficiency is relatively low.Institute
With the existing level control method for system for desulfuration and denitration is unstable to the Level control of adsorption tower 1 and Analytic Tower 2, effect
Rate is relatively low, and applicability is poor.
Invention content
The present invention provides a kind of level control methods and device for system for desulfuration and denitration, to solve existing be used for
The level control method of system for desulfuration and denitration, it is unstable to the Level control of adsorption tower and Analytic Tower, it is less efficient, applicability compared with
The problem of difference.
In a first aspect, the present invention provides a kind of level control method for system for desulfuration and denitration, the Level control side
Method includes:Obtain the actual average material position of adsorption tower;According to the actual average material position and predetermined control strategy, Analytic Tower is adjusted
Discharge velocity so that the actual average material position of adsorption tower and target be averaged, the absolute value of the difference of material position is less than or equal to first
Predetermined threshold value and the practical material position of Analytic Tower and the absolute value of the difference of target material position are less than or equal to the second predetermined threshold value.
Further, according to the actual average material position and predetermined control strategy, the process of the discharge velocity of Analytic Tower is adjusted,
It specifically includes:If the actual average material position is more than the first preset upper limit material position, the first charging adjustment amount of adsorption tower is obtained;
The practical discharge velocity of Analytic Tower is adjusted to the first default discharge velocity;Adjustment amount, described first are fed according to described first
Default discharge velocity, the target discharge velocity of Analytic Tower and the first preset relation formula, when generating the first material position adjustment of adsorption tower
It is long;Duration and default conveying duration are adjusted according to first material position, generates the First Speed adjustment duration of Analytic Tower;By institute
After stating First Speed adjustment duration, if the actual average material position of the adsorption tower and the target are averaged, the difference of material position is exhausted
First predetermined threshold value is less than or equal to value, then the practical discharge velocity of the Analytic Tower is adjusted to the target discharge speed
Degree.
Further, which further includes:If the actual average material position is less than the first pre-determined lower limit material position,
Obtain the second charging adjustment amount of adsorption tower;The practical discharge velocity of Analytic Tower is adjusted to the second default discharge velocity;According to
The second charging adjustment amount, the second default discharge velocity, the target discharge velocity and the second preset relation formula, generate
Second material position of adsorption tower adjusts duration;Duration and default conveying duration are adjusted according to second material position, generates Analytic Tower
Second speed adjusts duration;After the second speed adjusts duration, if the actual average material position of the adsorption tower and institute
State target be averaged material position difference absolute value be less than or equal to the first predetermined threshold value, then by the practical discharge of the Analytic Tower speed
Degree is adjusted to the target discharge velocity.
Further, which further includes:If it is pre- that the actual average material position is greater than or equal to described first
Limit material position is set, and is less than or equal to the first preset upper limit material position, the practical discharge velocity of the Analytic Tower is kept
For the target discharge velocity.
Further, which further includes:Obtain the practical material position of Analytic Tower;If the practical material position is less than
Second pre-determined lower limit material position, material is supplemented into the Analytic Tower, until the difference of the practical material position and the target material position
Absolute value be less than or equal to the second predetermined threshold value, then stop supplementing material into the Analytic Tower;Or, if the practical material
Position is more than the second preset upper limit material position, stops feeding into the Analytic Tower, until the practical material position and the target material position
Difference absolute value be less than or equal to the second predetermined threshold value, then continue to feed into the Analytic Tower;Or, if the reality
Material position is greater than or equal to the second pre-determined lower limit material position, and is less than or equal to the second preset upper limit material position, then will parsing
It is constant that the feed state of tower remains current feed state.
Second aspect, the present invention also provides a kind of charge level control device for system for desulfuration and denitration, the Level controls
Device includes:Material position acquisition module, the actual average material position for obtaining adsorption tower;First control module, for according to
Actual average material position and predetermined control strategy adjust the discharge velocity of Analytic Tower, so that the actual average material position and mesh of adsorption tower
The absolute value of the difference of the average material position of mark is less than or equal to the first predetermined threshold value and the practical material position and target material position of Analytic Tower
Difference absolute value be less than or equal to the second predetermined threshold value.
Further, first control module includes:First control unit, is used for:If the actual average material position is big
In the first preset upper limit material position, the first charging adjustment amount of adsorption tower is obtained;The practical discharge velocity of Analytic Tower is adjusted to
One default discharge velocity;The target discharge speed for feeding adjustment amount, the first default discharge velocity, Analytic Tower according to described first
Degree and the first preset relation formula generate the first material position adjustment duration of adsorption tower;According to first material position adjustment duration and in advance
If conveying duration, the First Speed adjustment duration of Analytic Tower is generated;After the First Speed adjusts duration, if the suction
The be averaged absolute value of difference of material position of the actual average material position of attached tower and the target is less than or equal to the first predetermined threshold value, then general
The practical discharge velocity of the Analytic Tower is adjusted to the target discharge velocity.
Further, which further includes:Second control unit, is used for:If the actual average material position is small
In the first pre-determined lower limit material position, the second charging adjustment amount of adsorption tower is obtained;The practical discharge velocity of Analytic Tower is adjusted to
Two default discharge velocities;According to it is described second feed adjustment amount, the second default discharge velocity, the target discharge velocity and
Second preset relation formula generates the second material position adjustment duration of adsorption tower;Duration is adjusted according to second material position and is preset defeated
Duration is sent, the second speed adjustment duration of Analytic Tower is generated;After the second speed adjusts duration, if the adsorption tower
The be averaged absolute value of difference of material position of actual average material position and the target be less than or equal to the first predetermined threshold value, then will described in
The practical discharge velocity of Analytic Tower is adjusted to the target discharge velocity.
Further, which further includes:Third control unit, is used for:If the actual average material position is big
In or be equal to the first pre-determined lower limit material position, and be less than or equal to the first preset upper limit material position, by the Analytic Tower
Practical discharge velocity remain the target discharge velocity.
Further, which further includes the second control module, is specifically used for:Obtain the practical material of Analytic Tower
Position;If the practical material position is less than the second pre-determined lower limit material position, material is supplemented into the Analytic Tower, until the practical material
Position and the absolute value of the difference of the target material position are less than or equal to the second predetermined threshold value, then stop supplementing into the Analytic Tower
Material;Or, if the practical material position is more than the second preset upper limit material position, stop feeding into the Analytic Tower, until described
The absolute value of practical material position and the difference of the target material position is less than or equal to the second predetermined threshold value, then continues to the Analytic Tower
Middle charging;Or, if the practical material position be greater than or equal to the second pre-determined lower limit material position, and be less than or equal to described second
It is constant then to be remained current feed state by preset upper limit material position for the feed state of Analytic Tower.
The technical solution that the embodiment of the present invention provides can include the following benefits:The present invention provides one kind to be used for
The level control method and device of system for desulfuration and denitration.The level control method, by the discharge velocity of adsorption tower, the first conveyer
The speed of service and the speed of service of second conveyor remain unchanged, by obtaining the actual average material position of adsorption tower, root in real time
It is higher in actual average material position according to the actual average material position and predetermined control strategy, when being higher than the first preset upper limit material position, pass through
The first default discharge velocity less than target discharge velocity will be adjusted under the practical discharge velocity of Analytic Tower, it is accurate efficiently to inhale
The actual average material position of attached tower is adjusted to target and is averaged within the scope of the allowable error of material position, and by the practical material position tune of Analytic Tower
Within the scope of the whole allowable error to target material position;It is relatively low in the actual average material position of adsorption tower, it is less than the first pre-determined lower limit material position
When, it is accurate high by being adjusted to the second default discharge velocity more than target discharge velocity on the practical discharge velocity by Analytic Tower
The actual average material position of adsorption tower is adjusted to target and is averaged within the scope of the allowable error of material position by effect, and by the reality of Analytic Tower
Border material position is adjusted to the allowable error of target material position so that in entire system for desulfuration and denitration, material is in relative equilibrium
State;And process is entirely controlled, is participated in without artificial, control is more stablized, and applicability is more preferable.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of structural schematic diagram of system for desulfuration and denitration in the prior art;
Fig. 2 is that a kind of flow of level control method for system for desulfuration and denitration provided in an embodiment of the present invention is illustrated
Figure;
Fig. 3 is a kind of structure diagram of charge level control device for system for desulfuration and denitration provided in an embodiment of the present invention.
Specific implementation mode
In conjunction with background technology it is found that in the prior art, in order to make the material of system for desulfuration and denitration be in the shape of relative equilibrium
First conveyer and second conveyor are usually remained the state of traveling at the uniform speed, and keep the discharge velocity of adsorption tower constant by state,
The discharge velocity for adjusting Analytic Tower manually by operating personnel later makes the actual average material position of the adsorption tower of system for desulfuration and denitration
It is controlled within the scope of the allowable error of respective objects value with the practical material position of Analytic Tower.But due to the level of operating personnel
Difference causes to the Level control of adsorption tower and Analytic Tower not to the control of the discharge velocity of Analytic Tower there are prodigious difference
Stablize, and control efficiency is relatively low.In order to solve this problem, the present invention provides a kind of material position controls for system for desulfuration and denitration
Method and device processed.
Below in conjunction with the accompanying drawings, the level control method and dress provided by the present invention for system for desulfuration and denitration is discussed in detail
It sets.
Referring to Fig. 2, Fig. 2 shows be a kind of Level control side for system for desulfuration and denitration provided in an embodiment of the present invention
The flow diagram of method.In conjunction with Fig. 2 it is found that the level control method includes:
Step 101, the actual average material position for obtaining adsorption tower.
Wherein, the actual average material position of adsorption tower is the practical material position for all adsorption towers for including in system for desulfuration and denitration
Average value.
When it is implemented, the practical material position of each adsorption tower in system for desulfuration and denitration can be obtained by level-sensing device, it
The practical material position of all adsorption towers and with the quantity of all adsorption towers ratio is calculated afterwards, and the reality that can generate adsorption tower is flat
Equal material position, the i.e. ratio are the actual average material position of adsorption tower.
Step 102, according to the actual average material position and predetermined control strategy, adjust the discharge velocity of Analytic Tower so that
The be averaged absolute value of difference of material position of the actual average material position of adsorption tower and target is less than or equal to the first predetermined threshold value, and solves
The absolute value for analysing the practical material position of tower and the difference of target material position is less than or equal to the second predetermined threshold value.
When it is implemented, according to the actual average material position and predetermined control strategy, the discharge velocity of Analytic Tower is adjusted
Process specifically includes:
(1) if the actual average material position is more than the first preset upper limit material position, the first charging adjustment of adsorption tower is obtained
Amount;The practical discharge velocity of Analytic Tower is adjusted to the first default discharge velocity;Adjustment amount, described the are fed according to described first
One default discharge velocity, the target discharge velocity of Analytic Tower and the first preset relation formula generate the first material position adjustment of adsorption tower
Duration;Duration and default conveying duration are adjusted according to first material position, generates the First Speed adjustment duration of Analytic Tower;By
After the First Speed adjustment duration, the difference of material position if the actual average material position of the adsorption tower and the target are averaged
Absolute value is less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the target discharge speed
Degree;Or, the absolute value of the difference of material position is more than the first default threshold if the actual average material position of adsorption tower and the target are averaged
Value, then remain the described first default discharge velocity by the practical discharge velocity of the Analytic Tower, until the reality of adsorption tower is flat
Equal material position and the target be averaged material position difference absolute value less than or equal to the first predetermined threshold value when, by the Analytic Tower
Practical discharge velocity is adjusted to the target discharge velocity.
Wherein, the first preset upper limit material position is in system for desulfuration and denitration, what the actual average material position of adsorption tower can reach
Highest material position is more than the highest material position, and discharge valve blocking or even material at the top of adsorption tower may be caused to be overflowed to outside adsorption tower,
Lead to material waste.The first preset upper limit material position can be configured according to practical condition, be deposited after setting
It is stored in system, when use is directly transferred from system.
In level control method provided in an embodiment of the present invention, the operation of the discharge velocity of adsorption tower, the first conveyer
Speed and the speed of service of second conveyor remain unchanged, when the actual average material position of adsorption tower is more than the first preset upper limit material
When position, the practical discharge velocity of Analytic Tower is more than the target discharge velocity of Analytic Tower.Want the actual average material position of adsorption tower
It adjusts to target and is averaged within the scope of the allowable error of material position, need to obtain and the actual average material position of adsorption tower is adjusted to target puts down
When equal material position, adsorption tower should reduction inlet amount, be denoted as adsorption tower first charging adjustment amount.First charging of adsorption tower is adjusted
Whole amount includes two parts, and a part is that actual average material position and the target of adsorption tower are averaged the poor corresponding material of material position of material position
Amount, is denoted as first material adjustment amount, and another part is before the practical discharge velocity of Analytic Tower is adjusted to target discharge velocity,
Analytic Tower is emitted into the inventory of second conveyor, is denoted as second material adjustment amount.
Based on this, the process of the first charging adjustment amount of adsorption tower is obtained, can be realized in the following manner:
Obtain the actual average material position and the target be averaged material position the first material position it is poor, obtain the current row of Analytic Tower
Expect speed, is denoted as the first discharge velocity;Wherein, it calculates the actual average material position and the target to be averaged the difference of material position, just
Can get the actual average material position and the target be averaged material position the first material position it is poor, which is that the first material position is poor.Solution
The current discharge velocity of tower is analysed, i.e. the first discharge velocity can be obtained through actual measurement.The target is averaged material position according to reality
After the condition of production setting of border, it is pre-stored in system, is directly transferred from system.
According to the first material position difference and following relational expressions (1), the first material adjustment amount for generating adsorption tower is calculated;
W1=H1×S×ρ (1)
In relational expression (1):
W1Indicate that the first material adjustment amount of adsorption tower, unit are ton (t);
H1Indicate that first material position is poor, unit is rice (m);
S indicates that the cross-sectional area of the surge bunker of adsorption tower, unit are square metre (m2);
The density of material (activated carbon), unit are ton/cubic meter (t/m in the surge bunker of ρ expression adsorption towers3)。
Wherein, the value of S and ρ is pre-stored in system, and when use is directly transferred from system.
According to first discharge velocity and following relational expressions (2), the second material adjustment amount for generating adsorption tower is calculated;
W2=(V1-Vsv)×t0 (2)
In relational expression (2):
W2Indicate that the second material adjustment amount of adsorption tower, unit are ton (t);
V1Indicate that first discharge velocity, unit are ton hour (t/h);
VsvIndicate that the target discharge velocity of Analytic Tower, unit are ton hour (t/h);
t0Indicate that default conveying duration, unit are hour (h).
Wherein, the target discharge velocity V of Analytic TowersvReach target for the actual average material position of adsorption tower and be averaged material position, solution
The practical material position of analysis tower reaches target material position, and adsorption tower discharge total amount it is equal with the discharge total amount of Analytic Tower when, Analytic Tower
Discharge velocity, after value is arranged according to practical condition, be pre-stored in system, directly transferred from system.
Default conveying duration t0To be discharged in material analytically tower, it is delivered in adsorption tower by second conveyor, the duration of experience, value
It can be obtained according to the speed of service of second conveyor and the length computation of second conveyor, under normal circumstances, second conveyor
The speed of service it is constant, then t0Value also remain unchanged.
According to the first material adjustment amount, the second material adjustment amount and following relational expressions (3), calculates and generate absorption
First charging adjustment amount of tower;
W1'=W1+W2 (3)
In relational expression (3):
W1' indicating that the first of adsorption tower feeds adjustment amount, unit is ton (t);
W1Indicate that the first material adjustment amount of adsorption tower, unit are ton (t);
W2Indicate that the second material adjustment amount of adsorption tower, unit are ton (t).
After getting the first charging adjustment amount of adsorption tower, in order to adjust the actual average material position of adsorption tower to target
Within the scope of the allowable error of average material position, need to realize by reducing the current discharge velocity of Analytic Tower, if directly will parsing
The practical discharge velocity of tower is reduced to its target discharge velocity, since actual average material position is already higher than target and averagely expects in adsorption tower
Position, can not be reduced to target to be averaged within the scope of the allowable error of material position the actual average material position of adsorption tower, and therefore, the present invention is real
In the level control method that example offer is provided, allow to miss to adjust the actual average material position of adsorption tower to the target material position that is averaged
In poor range, the practical discharge velocity of Analytic Tower is adjusted to the first default discharge velocity, which is less than
The target discharge velocity of Analytic Tower, value can be according to W1' value be configured, W1' value it is larger when, first can be preset
The value of discharge velocity is set as the value with the target discharge velocity of Analytic Tower, differs some larger value;W1' value it is smaller when,
It can set the value of the first default discharge velocity to the value with the target discharge velocity of Analytic Tower, some smaller value of difference.
Adjustment amount, the first default discharge velocity, the target discharge velocity of Analytic Tower and the are fed according to described first
One preset relation formula generates the process of the first material position adjustment duration of adsorption tower, specifically includes:According to the first charging adjustment
Amount, the first default discharge velocity, the target discharge velocity of Analytic Tower and following first preset relation formulas, i.e., following relational expressions
(4), the first material position adjustment duration for generating adsorption tower is calculated;
In relational expression (4):
t1Indicate that the first material position of adsorption tower adjusts duration, unit is hour (h);
W1' indicating that the first of adsorption tower feeds adjustment amount, unit is ton (t);
VsvIndicate that the target discharge velocity of Analytic Tower, unit are ton hour (t/h);
V1' indicate that the first default discharge velocity, unit are ton hour (t/h).
Wherein, the first default discharge velocity V1' it is less than the target discharge velocity of Analytic Tower, the setting of value can refer to upper
The content of embodiment is stated, and will not be described here in detail.
Duration and default conveying duration are adjusted according to first material position, generates the First Speed adjustment duration of Analytic Tower
Process specifically includes:Duration is adjusted according to first material position and default conveying duration calculates life using following relational expressions (5)
Duration is adjusted at the First Speed of Analytic Tower;
T1=t1+t0 (5)
In relational expression (5):
T1Indicate that the First Speed of Analytic Tower adjusts duration, unit is hour (h);
t1Indicate that the first material position of adsorption tower adjusts duration, unit is hour (h);
t0Indicate that default conveying duration, unit are hour (h).
(2) if the actual average material position is less than the first pre-determined lower limit material position, the second charging adjustment of adsorption tower is obtained
Amount;The practical discharge velocity of Analytic Tower is adjusted to the second default discharge velocity;Adjustment amount, described the are fed according to described second
Two default discharge velocities, the target discharge velocity and the second preset relation formula generate the second material position adjustment duration of adsorption tower;
Duration and default conveying duration are adjusted according to second material position, generates the second speed adjustment duration of Analytic Tower;By described
After second speed adjusts duration, if the actual average material position of the adsorption tower and the target are averaged, the difference of material position is absolute
Value is less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the target discharge velocity;
Or, the absolute value of the difference of material position is more than the first predetermined threshold value if the actual average material position of adsorption tower and the target are averaged,
The practical discharge velocity of the Analytic Tower is then remained into the described second default discharge velocity, until the actual average material of adsorption tower
Position with the target be averaged material position difference absolute value less than or equal to the first predetermined threshold value when, by the reality of the Analytic Tower
Discharge velocity is adjusted to the target discharge velocity.
Wherein, the first pre-determined lower limit material position is in system for desulfuration and denitration, what the actual average material position of adsorption tower can reach
Minimum material position is more than the minimum material position, can influence the denitrification efficiency of adsorption tower and the analyzing efficiency of Analytic Tower.This is first pre-
Setting limit material position can be configured according to practical condition, be stored in system after setting, when use is direct
It is transferred from system.
In level control method provided in an embodiment of the present invention, the operation of the discharge velocity of adsorption tower, the first conveyer
Speed and the speed of service of second conveyor remain unchanged, when the actual average material position of adsorption tower is less than the first pre-determined lower limit material
When position, the practical discharge velocity of Analytic Tower is less than the target discharge velocity of Analytic Tower.Want the actual average material position of adsorption tower
It adjusts to target and is averaged within the scope of the allowable error of material position, need to obtain and the actual average material position of adsorption tower is adjusted to target puts down
Equal material position, adsorption tower should increased inlet amount, be denoted as adsorption tower second charging adjustment amount.Second charging adjustment of adsorption tower
Amount includes two parts, and a part is that the target of adsorption tower is averaged the poor corresponding inventory of material position of material position and actual average material position,
It is denoted as third material adjustment amount, another part is solution before the practical discharge velocity of Analytic Tower is adjusted to target discharge velocity
Analysis tower is emitted into the inventory of second conveyor, is denoted as 4 materials adjustment amount.
Based on this, the process of the second charging adjustment amount of adsorption tower is obtained, can be realized in the following manner:
Obtain the target be averaged material position and the actual average material position the second material position it is poor, obtain the current row of Analytic Tower
Expect speed, is denoted as the second discharge velocity;Wherein, it calculates the target to be averaged the difference of material position and the actual average material position, just
Can get the target be averaged material position and the actual average material position the second material position it is poor, which is that the second material position is poor.Solution
The current discharge velocity of tower is analysed, i.e. the second discharge velocity can be obtained through actual measurement.The target is averaged material position according to reality
After the condition of production setting of border, it is pre-stored in system, is directly transferred from system.
According to the second material position difference and following relational expressions (6), the third material adjustment amount for generating adsorption tower is calculated;
W3=H2×S×ρ (6)
In relational expression (6):
W3Indicate that the third material adjustment amount of adsorption tower, unit are ton (t);
H2Indicate that second material position is poor, unit is rice (m);
S indicates that the cross-sectional area of the surge bunker of adsorption tower, unit are square metre (m2);
The density of material (activated carbon), unit are ton/cubic meter (t/m in the surge bunker of ρ expression adsorption towers3)。
Wherein, the value of S and ρ is pre-stored in system, and when use is directly transferred from system.
According to second discharge velocity and following relational expressions (7), the 4 materials adjustment amount for generating adsorption tower is calculated;
W4=(Vsv-V2)×t0 (7)
In relational expression (7):
W4Indicate that the 4 materials adjustment amount of adsorption tower, unit are ton (t);
V2Indicate that second discharge velocity, unit are ton hour (t/h);
VsvIndicate that the target discharge velocity of Analytic Tower, unit are ton hour (t/h);
t0Indicate that default conveying duration, unit are hour (h).
Wherein, VsvAnd t0The acquisition modes of value be same as above, and will not be described here in detail.
According to the third material adjustment amount, the 4 materials adjustment amount and following relational expressions (8), calculates and generate absorption
Second charging adjustment amount of tower;
W2'=W3+W4 (8)
In relational expression (8):
W2' indicating that the second of adsorption tower feeds adjustment amount, unit is ton (t);
W3Indicate that the third material adjustment amount of adsorption tower, unit are ton (t);
W4Indicate that the 4 materials adjustment amount of adsorption tower, unit are ton (t).
After getting the second charging adjustment amount of adsorption tower, in order to adjust the actual average material position of adsorption tower to target
Within the scope of the allowable error of average material position, need to realize by increasing the current discharge velocity of Analytic Tower, if directly will parsing
The practical discharge velocity of tower is increased to its target discharge velocity, since actual average material position is average already below target in adsorption tower
The actual average material position of adsorption tower can not be adjusted to target and is averaged within the scope of the allowable error of material position by material position, therefore, the present invention
In the level control method that embodiment provides, in order to which the actual average material position of adsorption tower to be adjusted to target to the permission for the material position that is averaged
In error range, the practical discharge velocity of Analytic Tower is adjusted to the second default discharge velocity, the second default discharge velocity is big
In the target discharge velocity of Analytic Tower, value can be according to W2' value be configured, W2' value it is larger when, can be pre- by second
If the value of discharge velocity, it is set as the value with the target discharge velocity of Analytic Tower, differs some larger value;W2' value it is smaller
When, the value of the second default discharge velocity can be set to the value with the target discharge velocity of Analytic Tower, differ some smaller
Value.
Adjustment amount, the second default discharge velocity, the target discharge velocity of Analytic Tower and the are fed according to described second
Two preset relation formulas generate the process of the second material position adjustment duration of adsorption tower, specifically include:According to the second charging adjustment
Amount, the second default discharge velocity, the target discharge velocity of Analytic Tower and following second preset relation formulas, i.e., following relational expressions
(9), the second material position adjustment duration for generating adsorption tower is calculated;
In relational expression (9):
t2Indicate that the second material position of adsorption tower adjusts duration, unit is hour (h);
W2' indicating that the second of adsorption tower feeds adjustment amount, unit is ton (t);
VsvIndicate that the target discharge velocity of Analytic Tower, unit are ton hour (t/h);
V2' indicate that the second default discharge velocity, unit are ton hour (t/h).
Wherein, the second default discharge velocity V2' value setting can refer to previous embodiment content, herein no longer in detail
It states.
Duration and default conveying duration are adjusted according to second material position, generates the second speed adjustment duration of Analytic Tower
Process specifically includes:Duration is adjusted according to second material position and default conveying duration is calculated using following relational expressions (10)
The second speed for generating Analytic Tower adjusts duration;
T2=t2+t0 (10)
In relational expression (10):
T2Indicate that the second speed of Analytic Tower adjusts duration, unit is hour (h);
t2Indicate that the second material position of adsorption tower adjusts duration, unit is hour (h);
t0Indicate that default conveying duration, unit are hour (h).
(3) if the actual average material position is greater than or equal to the first pre-determined lower limit material position, and it is less than or equal to
The practical discharge velocity of the Analytic Tower is remained the target discharge velocity by the first preset upper limit material position.
In some optional embodiments, which further includes:Obtain the practical material position of Analytic Tower;If institute
State practical material position be less than the second pre-determined lower limit material position, supplement material into the Analytic Tower, until the practical material position with it is described
The absolute value of the difference of target material position is less than or equal to the second predetermined threshold value, then stops supplementing material into the Analytic Tower;Or,
If the practical material position is more than the second preset upper limit material position, stop feeding into the Analytic Tower, until the practical material position
It is less than or equal to the second predetermined threshold value with the absolute value of the difference of the target material position, then continues to feed into the Analytic Tower;
Or, if the practical material position is preset more than or equal to the second pre-determined lower limit material position, and less than or equal to described second
Material position is limited, then it is constant the feed state of Analytic Tower to be remained into current feed state.
Level control method provided in an embodiment of the present invention for system for desulfuration and denitration, by the discharge velocity of adsorption tower,
The speed of service of first conveyer and the speed of service of second conveyor remain unchanged, flat by the reality for obtaining adsorption tower in real time
Equal material position, it is higher in actual average material position according to the actual average material position and predetermined control strategy, it is higher than the first preset upper limit material
When position, by being adjusted to the first default discharge velocity less than target discharge velocity under the practical discharge velocity by Analytic Tower, accurately
Efficiently the actual average material position of adsorption tower is adjusted to target and is averaged within the scope of the allowable error of material position, and by Analytic Tower
Practical material position is adjusted to the allowable error of target material position;It is relatively low in the actual average material position of adsorption tower, it is pre- less than first
When setting limit material position, by being adjusted to the second default discharge speed more than target discharge velocity on the practical discharge velocity by Analytic Tower
Degree, the actual average material position of adsorption tower is accurately efficiently adjusted to target be averaged within the scope of the allowable error of material position, and will
The practical material position of Analytic Tower is adjusted to the allowable error of target material position so that in entire system for desulfuration and denitration, at material
In the state of relative equilibrium;And process is entirely controlled, is participated in without artificial, control is more stablized, and applicability is more preferable.
Corresponding with the above-mentioned level control method for system for desulfuration and denitration, the embodiment of the invention also discloses a kind of use
In the charge level control device of system for desulfuration and denitration.
Show that a kind of Level control for system for desulfuration and denitration provided in an embodiment of the present invention fills referring to Fig. 3, Fig. 3
The structure diagram set.In conjunction with Fig. 3 it is found that the charge level control device includes:
Material position acquisition module 301, the actual average material position for obtaining adsorption tower;First control module 302 is used for basis
The actual average material position and predetermined control strategy, adjust the discharge velocity of Analytic Tower, so that the actual average material position of adsorption tower
It is less than or equal to the practical material position and target of the first predetermined threshold value and Analytic Tower with the be averaged absolute value of the difference of material position of target
The absolute value of the difference of material position is less than or equal to the second predetermined threshold value.
Further, first control module 302 includes:First control unit 3021, is used for:If the actual average
Material position is more than the first preset upper limit material position, obtains the first charging adjustment amount of adsorption tower;By the practical discharge velocity tune of Analytic Tower
Whole is the first default discharge velocity;The target for feeding adjustment amount, the first default discharge velocity, Analytic Tower according to described first
Discharge velocity and the first preset relation formula generate the first material position adjustment duration of adsorption tower;When being adjusted according to first material position
Long and default conveying duration generates the First Speed adjustment duration of Analytic Tower;After the First Speed adjusts duration, if
The actual average material position of the adsorption tower and the target be averaged material position difference absolute value less than or equal to the first default threshold
Value, then be adjusted to the target discharge velocity by the practical discharge velocity of the Analytic Tower.
Further, which further includes:Second control unit 3022, is used for:If the actual average material
Position is less than the first pre-determined lower limit material position, obtains the second charging adjustment amount of adsorption tower;The practical discharge velocity of Analytic Tower is adjusted
For the second default discharge velocity;Adjustment amount, the second default discharge velocity, target discharge speed are fed according to described second
Degree and the second preset relation formula generate the second material position adjustment duration of adsorption tower;According to second material position adjustment duration and in advance
If conveying duration, the second speed adjustment duration of Analytic Tower is generated;After the second speed adjusts duration, if the suction
The be averaged absolute value of difference of material position of the actual average material position of attached tower and the target is less than or equal to the first predetermined threshold value, then general
The practical discharge velocity of the Analytic Tower is adjusted to the target discharge velocity.
Further, which further includes:Third control unit 3023, is used for:If the actual average material
Position is greater than or equal to the first pre-determined lower limit material position, and is less than or equal to the first preset upper limit material position, by the solution
The practical discharge velocity of analysis tower remains the target discharge velocity.
Further, which further includes the second control module 303, is specifically used for:Obtain the reality of Analytic Tower
Material position;If the practical material position is less than the second pre-determined lower limit material position, material is supplemented into the Analytic Tower, until the reality
The absolute value of material position and the difference of the target material position is less than or equal to the second predetermined threshold value, then stops mending into the Analytic Tower
Fill material;Or, if the practical material position is more than the second preset upper limit material position, stop feeding into the Analytic Tower, until institute
The absolute value for stating practical material position and the difference of the target material position is less than or equal to the second predetermined threshold value, then continues to the parsing
It is fed in tower;Or, if the practical material position is greater than or equal to the second pre-determined lower limit material position, and less than or equal to described the
It is constant then to be remained current feed state by two preset upper limit material positions for the feed state of Analytic Tower.
Using the charge level control device provided in an embodiment of the present invention for system for desulfuration and denitration, it is possible to implement above-mentioned to be used for
Each step in the level control method of system for desulfuration and denitration, and obtain identical advantageous effect.Using the charge level control device
The practical material position of actual average material position and Analytic Tower to adsorption tower in system for desulfuration and denitration regulates and controls, can be accurately efficient
The actual average material position of adsorption tower in system for desulfuration and denitration is adjusted to target and is averaged within the scope of the allowable error of material position, and will
The practical material position of Analytic Tower is adjusted to the allowable error of target material position, and controls more stable, and applicability is more preferable.
In the specific implementation, the present invention also provides a kind of computer storage medias, wherein the computer storage media can store
There is program, which may include each embodiment of the level control method provided by the present invention for system for desulfuration and denitration when executing
In some or all of step.The storage medium can be magnetic disc, CD, read-only memory (English:read-only
Memory, referred to as:ROM) or random access memory is (English:Random access memory, referred to as:RAM) etc..
It is required that those skilled in the art can be understood that the technology in the embodiment of the present invention can add by software
The mode of general hardware platform realize.Based on this understanding, the technical solution in the embodiment of the present invention substantially or
Say that the part that contributes to existing technology can be expressed in the form of software products, which can deposit
Storage is in storage medium, such as ROM/RAM, magnetic disc, CD, including some instructions are used so that computer equipment (can be with
Be personal computer, server either network equipment etc.) execute certain part institutes of each embodiment of the present invention or embodiment
The method stated.
The same or similar parts between the embodiments can be referred to each other in this specification.Especially for for desulfurization
For the charge level control device embodiment of denitrating system, since it is substantially similar to the method embodiment, so the comparison of description is simple
Single, related place is referring to the explanation in embodiment of the method.
Invention described above embodiment is not intended to limit the scope of the present invention..
Claims (10)
1. a kind of level control method for system for desulfuration and denitration, which is characterized in that including:
Obtain the actual average material position of adsorption tower;
According to the actual average material position and predetermined control strategy, the discharge velocity of Analytic Tower is adjusted, so that the reality of adsorption tower
Average material position and target be averaged material position difference absolute value less than or equal to the first predetermined threshold value and the practical material of Analytic Tower
Position and the absolute value of the difference of target material position are less than or equal to the second predetermined threshold value.
2. level control method as described in claim 1, which is characterized in that according to the actual average material position and default control
Strategy adjusts the process of the discharge velocity of Analytic Tower, specifically includes:
If the actual average material position is more than the first preset upper limit material position, the first charging adjustment amount of adsorption tower is obtained;
The practical discharge velocity of Analytic Tower is adjusted to the first default discharge velocity;
It is pre- that adjustment amount, the first default discharge velocity, the target discharge velocity of Analytic Tower and first are fed according to described first
If relational expression, the first material position adjustment duration of adsorption tower is generated;
Duration and default conveying duration are adjusted according to first material position, generates the First Speed adjustment duration of Analytic Tower;
After the First Speed adjusts duration, the material position if the actual average material position of the adsorption tower and the target are averaged
Difference absolute value be less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the mesh
Mark discharge velocity.
3. level control method as claimed in claim 2, which is characterized in that further include:
If the actual average material position is less than the first pre-determined lower limit material position, the second charging adjustment amount of adsorption tower is obtained;
The practical discharge velocity of Analytic Tower is adjusted to the second default discharge velocity;
Adjustment amount, the second default discharge velocity, the target discharge velocity and the second default pass are fed according to described second
It is formula, generates the second material position adjustment duration of adsorption tower;
Duration and default conveying duration are adjusted according to second material position, generates the second speed adjustment duration of Analytic Tower;
After the second speed adjusts duration, the material position if the actual average material position of the adsorption tower and the target are averaged
Difference absolute value be less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the mesh
Mark discharge velocity.
4. level control method as claimed in claim 3, which is characterized in that further include:
If the actual average material position is greater than or equal to the first pre-determined lower limit material position, and is less than or equal to described first
The practical discharge velocity of the Analytic Tower is remained the target discharge velocity by preset upper limit material position.
5. level control method as claimed in claim 4, which is characterized in that further include:
Obtain the practical material position of Analytic Tower;
If the practical material position is less than the second pre-determined lower limit material position, material is supplemented into the Analytic Tower, until the reality
The absolute value of material position and the difference of the target material position is less than or equal to the second predetermined threshold value, then stops mending into the Analytic Tower
Fill material;Or,
If the practical material position is more than the second preset upper limit material position, stop feeding into the Analytic Tower, until the reality
The absolute value of the difference of material position and the target material position is less than or equal to the second predetermined threshold value, then continue into the Analytic Tower into
Material;Or,
If the practical material position is greater than or equal to the second pre-determined lower limit material position, and is preset less than or equal to described second
Material position is limited, then it is constant the feed state of Analytic Tower to be remained into current feed state.
6. a kind of charge level control device for system for desulfuration and denitration, which is characterized in that including:
Material position acquisition module, the actual average material position for obtaining adsorption tower;
First control module, for according to the actual average material position and predetermined control strategy, adjusting the discharge velocity of Analytic Tower,
So that the actual average material position of adsorption tower and target are averaged, the absolute value of the difference of material position is less than or equal to the first predetermined threshold value, with
And the practical material position of Analytic Tower and the absolute value of the difference of target material position are less than or equal to the second predetermined threshold value.
7. charge level control device as claimed in claim 6, which is characterized in that first control module includes:
First control unit, is used for:
If the actual average material position is more than the first preset upper limit material position, the first charging adjustment amount of adsorption tower is obtained;
The practical discharge velocity of Analytic Tower is adjusted to the first default discharge velocity;
It is pre- that adjustment amount, the first default discharge velocity, the target discharge velocity of Analytic Tower and first are fed according to described first
If relational expression, the first material position adjustment duration of adsorption tower is generated;
Duration and default conveying duration are adjusted according to first material position, generates the First Speed adjustment duration of Analytic Tower;
After the First Speed adjusts duration, the material position if the actual average material position of the adsorption tower and the target are averaged
Difference absolute value be less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the mesh
Mark discharge velocity.
8. charge level control device as claimed in claim 7, which is characterized in that further include:
Second control unit, is used for:
If the actual average material position is less than the first pre-determined lower limit material position, the second charging adjustment amount of adsorption tower is obtained;
The practical discharge velocity of Analytic Tower is adjusted to the second default discharge velocity;
Adjustment amount, the second default discharge velocity, the target discharge velocity and the second default pass are fed according to described second
It is formula, generates the second material position adjustment duration of adsorption tower;
Duration and default conveying duration are adjusted according to second material position, generates the second speed adjustment duration of Analytic Tower;
After the second speed adjusts duration, the material position if the actual average material position of the adsorption tower and the target are averaged
Difference absolute value be less than or equal to the first predetermined threshold value, then the practical discharge velocity of the Analytic Tower is adjusted to the mesh
Mark discharge velocity.
9. charge level control device as claimed in claim 8, which is characterized in that further include:
Third control unit, is used for:
If the actual average material position is greater than or equal to the first pre-determined lower limit material position, and is less than or equal to described first
The practical discharge velocity of the Analytic Tower is remained the target discharge velocity by preset upper limit material position.
10. charge level control device as claimed in claim 9, which is characterized in that further include the second control module, be specifically used for:
Obtain the practical material position of Analytic Tower;
If the practical material position is less than the second pre-determined lower limit material position, material is supplemented into the Analytic Tower, until the reality
The absolute value of material position and the difference of the target material position is less than or equal to the second predetermined threshold value, then stops mending into the Analytic Tower
Fill material;Or,
If the practical material position is more than the second preset upper limit material position, stop feeding into the Analytic Tower, until the reality
The absolute value of the difference of material position and the target material position is less than or equal to the second predetermined threshold value, then continue into the Analytic Tower into
Material;Or,
If the practical material position is greater than or equal to the second pre-determined lower limit material position, and is preset less than or equal to described second
Material position is limited, then it is constant the feed state of Analytic Tower to be remained into current feed state.
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