CN108517522B - A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition and its strip method - Google Patents
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition and its strip method Download PDFInfo
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- CN108517522B CN108517522B CN201810240643.1A CN201810240643A CN108517522B CN 108517522 B CN108517522 B CN 108517522B CN 201810240643 A CN201810240643 A CN 201810240643A CN 108517522 B CN108517522 B CN 108517522B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
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Abstract
The present invention discloses a kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition and its strip method.The strip composition includes m-nitrobenzene sodium sulfonate 40-70 g/L, cyclohexanediamine tetraacetic acid 10-20 g/L, cyclodextrine 2.5-5 g/L, ammonium hydroxide 6-12 g/L, Yi Jishui, pH value 7.2-7.5.The strip method controls the pH value of decoating liquid in 7.2-7.5 range the following steps are included: (1) weighs m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine and be successively dissolved in water, obtain aqueous solution, then add ammonium hydroxide according to each component content.(2) PCB/Sn/NiCu structural circuit plate is soaked in the decoating liquid of step (1) preparation.(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.(4) step (3) described circuit board surface is dipped into aqueous formic acid.(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
Description
Technical field
The present invention relates to strip composition and its strip methods more particularly to a kind of PCB/Sn/NiCu structural circuit plate to use
Nickel-copper alloy layer chemistry strip composition and its strip method.
Background technique
Chemical plating metal is widely used with excellent wearability, corrosion resistance, solderability and electromagnetic shielding characteristic outstanding,
Especially thickness of coating is uniform, and imitative type is good, particularly suitable for the complex-shaped workpiece of plating.Although PCB technology is using advanced
Strict control in technology, technological operation, also due to various reasons and there are substandard products, such as surface oxidation, plating, if directly reporting
It is useless, it is of a high price；If doing over again, often because of the strong corrosion resistant of chemical plating metal coating, and it is difficult very big.Although general
Hardware plating producer has developed some methods for moving back chemical nickel plating, but often because substrate is different, technique object is different and is difficult to
It is applied directly in PCB production, such as higher requirement etc. of the limitation to rust inhibition of temperature.It is main in traditional decoating liquid
Will be using high concentration nitric acid as main component, when strip, is easy to cause heavy corrosion to matrix.In addition, due to strong oxidizing property
The presence of concentrated nitric acid, in strip, nitric acid meeting and metal reaction release a large amount of smog and seriously pollute atmosphere, to shopwork people
Member's body causes serious injury.
Simultaneously as pcb board surface and one layer of metal of non-deposited and/or alloy, and it is likely to be multiple layer metal and/or conjunction
Gold.When decoating liquid carries out strip processing to PCB surface nickel-copper alloy layer, the temperature of decoating liquid and strip immersion treatment time can
It optimizes and adjusts according to the specific thickness of nickel-copper alloy layer.However most of decoating liquids usually used strict control strip
Time strips nickel-copper alloy layer.Although nickel-copper alloy layer can be effectively removed, be also easy to appear strip not exclusively or
The phenomenon that excessively stripping, leads to the lower metal layer strip of nickel-copper alloy layer.
Summary of the invention
It is an object of the present invention to provide a kind of PCB/Sn/NiCu structural circuit plate with nickel-copper alloy layer chemistry strip composition with
And strip method, the technical issues of to solve existing strip composition excessive corrosion tin layers, while it is unstable to solve strip rate
The technical issues of.
The present invention solves its technical problem and adopts the following technical scheme that:
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including m-nitrobenzene sulfonic acid
Sodium 40-70 g/L, cyclohexanediamine tetraacetic acid 10-20 g/L, cyclodextrine 2.5-5 g/L, ammonium hydroxide 6-12 g/L and
Water, pH value 7.2-7.5.
Further, PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including nitre
Base benzene sulfonic acid sodium salt 50-60 g/L, cyclohexanediamine tetraacetic acid 12-18 g/L, cyclodextrine 3-4 g/L, ammonium hydroxide 8-10 g/
L, Yi Jishui, pH value 7.2-7.5.
Further, PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition further includes seeping
Saturating agent 0.5-1.5 g/L.
Further, the bleeding agent is sodium butylnaphthalenesulfonate.
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition strip method comprising with
Lower step:
(1) according to each component content, it is successively molten that m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine are weighed
Yu Shui obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.2-7.5 range.
(2) PCB/Sn/NiCu structural circuit plate is soaked in the decoating liquid of step (1) preparation.
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.
(4) step (3) described circuit board surface is dipped into aqueous formic acid.
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
Further, soaking temperature is 35-60 DEG C in the step (2), soaking time 3-10min.
Further, the concentration of formic acid described in the step (4) is 5-10 g/L.
Further, soaking temperature is 20-40 DEG C in the step (4), soaking time 2-10min.
For a kind of PCB/Sn/NiCu structural circuit plate of the present invention in nickel-copper alloy layer chemistry strip composition, what is be related to is each
The effect of component, which is respectively as follows: in m-nitrobenzene sodium sulfonate molecule, contains an oxide group-" NO2", oxidisability ratio HNO3It is weak.
This feature, which makes it not only, can be oxidized to metal in ion, but also reason oxidisability is not too strong, thus can be too fast to avoid strip rate,
Also avoid the excessive corrosion of lower metal tin.
It chooses complexing agent appropriate and is very important to strip speed is accelerated.The effect of complexing agent is and the plating that is oxidized
Layer metal ion forms stable complex compound, declines plated metal ion activity in solution, and equilibrium potential is negative to move, and accelerates oxygen
Change.The present invention preferably has the cyclohexanediamine tetraacetic acid of special construction, can with nickelous in dynamic regulation decoating liquid, copper from
The concentration of son, can be seen as nickelous, copper ion concentration regulator.By control reaction process generate nickel, copper from
Son, can be to avoid the rate uniformity of strip.The process that cyclohexanediamine tetraacetic acid is complexed with nickelous, copper ion is reversible
, i.e., cyclohexanediamine tetraacetic acid can be with nickelous, copper ion concentration realization dynamic equilibrium in strip composition, such as divalent
When nickel, copper ion concentration are higher, cyclohexanediamine tetraacetic acid and nickelous, copper ion " complexing ", so that nickelous, copper ion are dense
Degree reduces, and when nickelous, copper ion concentration are relatively low, before cyclohexanediamine tetraacetic acid release by complexing nickelous, copper from
Son, so that nickelous, copper ion concentration increase in strip composition.In addition, the complex compound cyclohexane diamine with cyclic structure
Tetraacethyl can form a film in metallic tin adsorption, inhibit corrosion of the decoating liquid to tin.
Since ingredient can not only corrode ambrose alloy in most of decoating liquid, while also can be to other metals, such as tin, zinc etc.
Corrosion.Metallic tin is corroded after causing nickel-copper alloy layer strip complete in order to avoid bad due to time control, present invention benefit
Stannic hydroxide (Sn (OH) can be adsorbed on cyclodextrine2) surface, compact film is formed, to combine metallic tin with strip
Object isolation is opened, thus reaches the technical effect of not burn into strip metal tin layers.In order to.Contain weakly alkaline ammonium hydroxide in decoating liquid
Component can react with metallic tin, in one layer of stannic hydroxide of metallic tin Surface Creation (Sn (OH)2).Stannic hydroxide (Sn
(OH)2) unstable chemcial property, under strongly alkaline conditions be easy generate other substances, so the pH value control of strip composition
System is within the scope of 7.2-7.5.Ammonium hydroxide function as pH adjusting agent, simultaneously ammonium hydroxide can also be with nickel, copper in strip composition
Metal ion forms stable complex compound.
Since strip composition is when eroding nickel-copper alloy layer, inevitably corrodes metallic tin and generate tin ion, by
In the presence of strip composition cyclohexane ethylenediamine tetraacetic acid (EDTA), so that tin ion and its Absorptive complex wave be in metal tin surfaces, into one
Prevent further corroding for metallic tin to step.
Sodium butylnaphthalenesulfonate can significantly reduce the surface tension of water as alkali resistance bleeding agent, have excellent penetration
With wetability, promote the dissolution of nickel-copper alloy layer and its chelating of nickel, copper ion.
Formic acid, can be with stannic hydroxide (Sn (OH) as weak acid2) react, stannic chloride is generated, so that cyclic annular
Dextrin falls off.And under weakly acidic condition, tin does not react with formic acid, avoids the corrosion of tin.
The invention has the benefit that strip composition of the present invention is corroded using m-nitrobenzene sodium sulfonate as ambrose alloy
As ion, cyclohexanediamine tetraacetic acid and complexing of metal ion, mutually collaboration ensure that stable strip rate between the two.
Cyclohexanediamine tetraacetic acid is mutually cooperateed with cyclodextrine forms fine and close film layer in metal tin surfaces, avoids the mistake of metallic tin
Degree corrosion.Strip process does not generate pernicious gas, reduces environmental pollution, improves working environment；Cost, simple process are reduced,
Be conducive to actual production；Strip is clean, works well.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with implementation of the invention
Example, technical scheme in the embodiment of the invention is clearly and completely described.Based on the embodiments of the present invention, this field
Those of ordinary skill's every other embodiment obtained without creative efforts, belongs to protection of the present invention
Range.
Embodiment 1
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including m-nitrobenzene sulfonic acid
Sodium 40g/L, cyclohexanediamine tetraacetic acid 10g/L, cyclodextrine 2.5g/L, ammonium hydroxide 6g/L, Yi Jishui, pH value 7.2.
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition strip method comprising with
Lower step: (1) according to each component content, m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine is weighed and is successively dissolved in
Water obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.2 ranges.
(2) PCB/Sn/NiCu structural circuit plate being soaked in the decoating liquid of step (1) preparation, soaking temperature is 35 DEG C,
Soaking time is 3min.
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.
(4) step (3) described circuit board surface is dipped into aqueous formic acid, the concentration of formic acid is 5g/L.
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
Embodiment 2
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including m-nitrobenzene sulfonic acid
Sodium 50g/L, cyclohexanediamine tetraacetic acid 12g/L, cyclodextrine 3g/L, ammonium hydroxide 8g/L, 0.5 g/L of sodium butylnaphthalenesulfonate with
And water, pH value 7.5.
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition strip method comprising with
Lower step: (1) according to each component content, m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine, dibutyl naphthalene are weighed
Sodium sulfonate is successively dissolved in water, obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.5 ranges.
(2) PCB/Sn/NiCu structural circuit plate being soaked in the decoating liquid of step (1) preparation, soaking temperature is 40 DEG C,
Soaking time is 5min.
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.
(4) step (3) described circuit board surface is dipped into aqueous formic acid, the concentration of formic acid is 7g/L.
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
Embodiment 3
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including m-nitrobenzene sulfonic acid
Sodium 70g/L, cyclohexanediamine tetraacetic acid 20g/L, cyclodextrine 5g/L, ammonium hydroxide 12g/L, 1.5 g/L of sodium butylnaphthalenesulfonate
And water, pH value 7.3.
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition strip method comprising with
Lower step: (1) according to each component content, m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine, dibutyl naphthalene are weighed
Sodium sulfonate is successively dissolved in water, obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.3 ranges.
(2) PCB/Sn/NiCu structural circuit plate being soaked in the decoating liquid of step (1) preparation, soaking temperature is 50 DEG C,
Soaking time is 7min.
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.
(4) step (3) described circuit board surface is dipped into aqueous formic acid, the concentration of formic acid is 10g/L.
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
Embodiment 4
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, including m-nitrobenzene sulfonic acid
Sodium 60g/L, cyclohexanediamine tetraacetic acid 18g/L, cyclodextrine 4g/L, ammonium hydroxide 10g/L, 1.5 g/L of sodium butylnaphthalenesulfonate
And water, pH value 7.2.
A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition strip method comprising with
Lower step: (1) according to each component content, m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine, dibutyl naphthalene are weighed
Sodium sulfonate is successively dissolved in water, obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.2 ranges.
(2) PCB/Sn/NiCu structural circuit plate being soaked in the decoating liquid of step (1) preparation, soaking temperature is 60 DEG C,
Soaking time is 3min.
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried.
(4) step (3) described circuit board surface is dipped into aqueous formic acid, the concentration of formic acid is 10g/L.
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (6)
1. a kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition, which is characterized in that including nitre
Base benzene sulfonic acid sodium salt 40-70 g/L, cyclohexanediamine tetraacetic acid 10-20 g/L, cyclodextrine 2.5-5 g/L, ammonium hydroxide 6-12
G/L, bleeding agent 0.5-1.5 g/L and water, pH value 7.2-7.5；The bleeding agent is sodium butylnaphthalenesulfonate.
2. PCB/Sn/NiCu structural circuit plate according to claim 1 nickel-copper alloy layer chemistry strip composition, special
Sign is, including m-nitrobenzene sodium sulfonate 50-60 g/L, cyclohexanediamine tetraacetic acid 12-18 g/L, cyclodextrine 3-4
G/L, ammonium hydroxide 8-10 g/L, sodium butylnaphthalenesulfonate 0.5-1.5 g/L and water, pH value 7.2-7.5.
3. a kind of such as claim 1-2 described in any item PCB/Sn/NiCu structural circuit plates nickel-copper alloy layer chemistry strip
Composition strip method comprising following steps:
(1) according to each component content, m-nitrobenzene sodium sulfonate, cyclohexanediamine tetraacetic acid, cyclodextrine, butyl naphthalene sulfonic acids are weighed
Sodium is successively dissolved in water, obtains aqueous solution, then adds ammonium hydroxide, controls the pH value of decoating liquid in 7.2-7.5 range；
(2) PCB/Sn/NiCu structural circuit plate is soaked in the decoating liquid of step (1) preparation；
(3) circuit board described in step (2) is taken out, is cleaned by ultrasonic with water and is dried；
(4) step (3) described circuit board surface is dipped into aqueous formic acid；
(5) step (4) circuit board surface is taken out, is cleaned by ultrasonic with water and is dried.
4. PCB/Sn/NiCu structural circuit plate according to claim 3 nickel-copper alloy layer chemistry strip composition strip
Method, which is characterized in that soaking temperature is 35-60 DEG C in the step (2), soaking time 3-10min.
5. PCB/Sn/NiCu structural circuit plate according to claim 3 nickel-copper alloy layer chemistry strip composition strip
Method, which is characterized in that the concentration of formic acid is 5-10 g/L in the step (4).
6. PCB/Sn/NiCu structural circuit plate according to claim 3 nickel-copper alloy layer chemistry strip composition strip
Method, which is characterized in that soaking temperature is 20-40 DEG C in the step (4), soaking time 2-10min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810240643.1A CN108517522B (en) | 2018-03-22 | 2018-03-22 | A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition and its strip method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810240643.1A CN108517522B (en) | 2018-03-22 | 2018-03-22 | A kind of PCB/Sn/NiCu structural circuit plate nickel-copper alloy layer chemistry strip composition and its strip method |
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| CN108517522B true CN108517522B (en) | 2019-10-25 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268674A (en) * | 2011-08-05 | 2011-12-07 | 湘潭江南工业有限公司 | Non-cyanide chemical nickel-stripping solution |
| CN103160832A (en) * | 2013-04-10 | 2013-06-19 | 四川九洲电器集团有限责任公司 | Stripping solution for chemical nickel-plated coating of cast aluminum piece |
| CN107794530A (en) * | 2017-11-08 | 2018-03-13 | 繁昌县晶鑫贸易有限公司 | A kind of production method applied to copper facing, the environment protection chemical strip agent of nickel plating |
-
2018
- 2018-03-22 CN CN201810240643.1A patent/CN108517522B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268674A (en) * | 2011-08-05 | 2011-12-07 | 湘潭江南工业有限公司 | Non-cyanide chemical nickel-stripping solution |
| CN103160832A (en) * | 2013-04-10 | 2013-06-19 | 四川九洲电器集团有限责任公司 | Stripping solution for chemical nickel-plated coating of cast aluminum piece |
| CN107794530A (en) * | 2017-11-08 | 2018-03-13 | 繁昌县晶鑫贸易有限公司 | A kind of production method applied to copper facing, the environment protection chemical strip agent of nickel plating |
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