CN108513462A - A kind of gong plate method of miniature PCB hardboards - Google Patents
A kind of gong plate method of miniature PCB hardboards Download PDFInfo
- Publication number
- CN108513462A CN108513462A CN201810413871.4A CN201810413871A CN108513462A CN 108513462 A CN108513462 A CN 108513462A CN 201810413871 A CN201810413871 A CN 201810413871A CN 108513462 A CN108513462 A CN 108513462A
- Authority
- CN
- China
- Prior art keywords
- gong
- pcb hardboards
- miniature pcb
- miniature
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of gong plate methods of miniature PCB hardboards, include the following steps：Rivet hole is onboard drilled out together in the manufacturing process of assist side；Making and an equal amount of auxiliary core plate of above-mentioned wiring board, auxiliary core plate is no copper base；Rivet hole is bored at riveted position on auxiliary core plate with wiring board；The upper and lower surface of assist side overlaps auxiliary core plate, and alignment stacks rear riveted rivet, forms superimposed sheet；After carrying out gong shape to superimposed sheet, miniature PCB hardboards are made.Solve the problems, such as that miniature PCB hardboards can not carry out gong shape because thickness and width is too small with old process using the method for the present invention.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of gong plate method of miniature PCB hardboards.
Background technology
The conventional manufacturing procedures of existing multilayer circuit board include following master operation：Sawing sheet → inner figure → internal layer erosion
Quarter → internal layer AOI → pressing → drilling → heavy copper → plate electricity → outer graphics → graphic plating → outer layer etching → outer layer AOI →
Welding resistance, character → surface treatment → molding → electrical testing → final inspection, sampling observation → packaging.
PCB, i.e. printed circuit board, in the production process, it will usually be arranged in multiple miniature PCB hardboards (SET) greatly
Production plate (PNL) on make together；Miniature PCB hardboards are cut into from production plate in molding procedure, when miniature PCB is hard
When the width of plate is less than 2mm and thickness and is less than 1mm, because the miniature PCB hardboards thickness is less than 1mm, and the width of miniature PCB hardboards
Degree, which is less than 2mm, can make the forming tank between two miniature PCB hardboards can be more elongated, miniature under the thickness and width in this way
Miniature PCB hardboards can not be made by existing moulding process (including conventional gong shape and laser cutting) in PCB hardboards, because adopting
When being made of traditional gong plate process, using the production plate of this gong board size (i.e. gong slot size) can not bear gong knife to pressure
Power is caused by gong production plate movement or springing (playing knife phenomenon)；When using laser cutting, since production inner cord has PP pieces to deposit
It can not cut, if increase energy is cut, pcb board side will appear carbonization phenomenon (i.e. edges of boards caused by cutting PP pieces
Black).
Invention content
There is drawbacks described above in the present invention, provide a kind of gong plate method of miniature PCB hardboards for the prior art, excellent
Changed fabrication processing, the method for the present invention solve miniature pcb board can not be used due to thickness and width is too small old process into
The problem of row gong shape.
In order to solve the above technical problem, the present invention provides a kind of gong plate methods of miniature PCB hardboards, including following step
Suddenly：
S1, assist side manufacturing process in onboard drill out rivet hole together；
S2, making and an equal amount of auxiliary core plate of above-mentioned wiring board, auxiliary core plate is no copper base；
Rivet hole is bored at S3, the riveted position on auxiliary core plate with wiring board；
S4, assist side upper and lower surface overlap auxiliary core plate, alignment stacks rear riveted rivet, forms superimposed sheet；
S5, after carrying out gong shape to superimposed sheet, miniature PCB hardboards are made.
Preferably, the wiring board includes several miniature PCB hardboards being stitched together integrally produced.
Preferably, the thickness of the miniature PCB hardboards is less than 1mm, width is less than 2mm.
Preferably, the gap between the miniature PCB hardboards is 7mm.
Preferably, in step S1, rivet hole, the rivet hole are drilled out together in the outer layer drilling operating for making wiring board
Among gap between the miniature PCB hardboards.
Preferably, in step S5, when gong shape, the outer side edges of gong knife cutting path are along vertical between the rivet hole
Distance is more than 0.5mm.
Preferably, in step S5, parameter when gong shape is set as：Feed velocity 0.3m/min.
Preferably, in step S3, the thickness of the auxiliary core plate is 2.5mm.
Preferably, the wiring board is to have been subjected to the plank that outer-layer circuit makes, solder mask makes and is surface-treated.
Compared with prior art, the present invention has the advantages that：
The present invention is used as auxiliary core plate by making no copper base identical with wiring board size, and then assist side is upper
The equal riveted in lower surface assists core plate, has thickeied the thickness of wiring board in this way, has improved the endurance of wiring board, then in gong shape
When, the overlapping plate thickness that wiring board riveted auxiliary core plate is formed bears the pressure of gong knife enough, is not in play knife phenomenon, can make
Gong shape is carried out with existing old process, old process can not be used because thickness and width is too small by solving miniature PCB hardboards
The problem of carrying out gong shape.
Description of the drawings
Fig. 1 is production plate and the schematic diagram for assisting core plate overlapping in embodiment.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
A kind of production method of miniature PCB hardboards shown in the present embodiment, the gong plate side of especially wherein miniature PCB hardboards
Method includes following treatment process successively：
(1), sawing sheet：Output core plate by jigsaw size 520mm × 620mm, the thickness 0.075mm of core plate, core plate two outside
Layer copper face thickness is 1OZ.
Among the above, core plate is equipped with the miniature PCB hardboards region that several are stitched together, adjacent miniature PCB hardboards area
Gap between domain is 7mm.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, photosensitive with the coating of vertical application machine on core plate
Film, 8 μm of the film thickness monitoring of light-sensitive surface complete interior layer line using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Road exposes；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, it is 3mil that internal layer line width, which measures,；Internal layer AOI,
Then the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit is checked, it is defective to scrap processing, flawless product
Go out to downstream.
Among the above, internal layer circuit is etched in each miniature PCB hardboards region.
(3), it presses：The excessively vertical brown flow of core plate, brown speed is according to bottom copper copper thickness brown, then admittedly by core plate, half
Change piece and outer copper foil overlaps successively as required, then selects lamination appropriate to press superimposed sheet according to plate Tg
It closes, forms production plate.
(4), outer layer drills：According to existing drilling technique, according to design requirement in production plate (each miniature PCB hardboards area
Domain) on carry out holes drilled through, bore rivet hole among the gap between miniature PCB hardboards region together；The wherein aperture of rivet hole
For 1-2mm.
(5), heavy copper：The through-hole on production plate and rivet hole metallization, backlight is set to test 10 grades, the heavy copper thickness in hole is
0.5μm。
(6), electric plating of whole board：According to the prior art with the current density electric plating of whole board 30min of 1.1ASF, plate face and hole are thickeied
Interior layers of copper, plate face copper layer thickness are less than 6 μm.
(7), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and when copper facing, which adds the thickness of face copper, is plated to 1OZ, tin plating
It is that 10min, 3-5 μm of tin thickness are electroplated with the current density of 1.2ASD；Then it moves back film successively again, etch and move back tin, on production plate
Outer-layer circuit is etched, and etches away the layers of copper in rivet hole；Then outer layer AOI checks that the short-circuit, circuit of opening of outer-layer circuit lacks
The defects of mouth, circuit pin hole, defective to scrap processing, flawless product goes out to downstream.
Among the above, on production plate outer-layer circuit is etched at corresponding each miniature PCB hardboards region.
(8), welding resistance, silk-screen character：Solder mask and silk-screen are made according to the prior art and by design requirement on production plate
Character；Using the white faces wire mark brush TOP solder mask, the faces TOP character adds " UL labels ".
(9), surface treatment (heavy nickel gold)：It is surface-treated, hinders according to the prior art and by design requirement on production plate
The copper face of weldering windowing position leads to the principles of chemistry, and uniform deposition centainly requires the nickel layer and layer gold of thickness in layers of copper.
Among the above, the production plate thickness after surface treatment is less than 1mm.
(10), sawing sheet：Auxiliary core plate is outputed by jigsaw size 520mm × 620mm, auxiliary core plate is 2.5mm thickness without copper
Substrate.
(11), rivet hole is bored：On auxiliary core plate (core plate and life are assisted with brill rivet hole at the riveted position of production plate
It produces the rivet hole one-to-one correspondence on plate and aperture is identical)；It when wherein needing to bore multiple rivet holes, drills out one by one, it is ensured that auxiliary core plate
It is consistent with the rivet hole position on production plate.
(12), riveted：As shown in Figure 1, the upper and lower surface in production plate 1 overlaps auxiliary core plate 2, it is aligned after stacking in riveting
Riveted rivet in nail hole 3 forms superimposed sheet.
(13), it is molded：According to the prior art and press design requirement gong shape, the +/- 0.075mm of contour tolerance, in miniature PCB
Rivet hole is cut and avoided in gap between hardboard region, and the rivet hole two side areas in the gaps 7mm is disposed as gong
The cutting path of knife, the wherein outer side edges of gong knife cutting path are prevented along should be greater than 0.5mm with the vertical range between rivet hole
Gong knife collides rivet and damages, and miniature PCB hardboards are automatically separated with auxiliary core plate after cutting, and miniature PCB is made；Wherein,
State modulator when molding is：Feed velocity 0.3m/min, and new gong knife is used, the life control of each gong knife is total at it
Of length no more than 1.5 meters of cutting.
(14), electric performance test：The electric property for detecting PCB detects qualified PCB and enters next processing link；
(15), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
(16), it packs：By customer requirement, packaging is sealed to PCB, and is allowed to dry drying prescription and humidity card, then shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (9)
1. a kind of gong plate method of miniature PCB hardboards, which is characterized in that include the following steps：
S1, assist side manufacturing process in onboard drill out rivet hole together；
S2, making and an equal amount of auxiliary core plate of above-mentioned wiring board, auxiliary core plate is no copper base；
Rivet hole is bored at S3, the riveted position on auxiliary core plate with wiring board；
S4, assist side upper and lower surface overlap auxiliary core plate, alignment stacks rear riveted rivet, forms superimposed sheet；
S5, after carrying out gong shape to superimposed sheet, miniature PCB hardboards are made.
2. the gong plate method of miniature PCB hardboards according to claim 1, which is characterized in that the wiring board includes whole
Several miniature PCB hardboards being stitched together of production.
3. the gong plate method of miniature PCB hardboards according to claim 2, which is characterized in that the thickness of the miniature PCB hardboards
Degree is less than 2mm less than 1mm, width.
4. the gong plate method of miniature PCB hardboards according to claim 3, which is characterized in that between the miniature PCB hardboards
Gap be 7mm.
5. the gong plate method of miniature PCB hardboards according to claim 4, which is characterized in that in step S1, making circuit
Rivet hole is drilled out in the outer layer drilling operating of plate together, the rivet hole is set among the gap between the miniature PCB hardboards.
6. the gong plate method of miniature PCB hardboards according to claim 5, which is characterized in that in step S5, when gong shape,
The outer side edges of gong knife cutting path are more than 0.5mm along with the vertical range between the rivet hole.
7. the gong plate method of miniature PCB hardboards according to claim 1, which is characterized in that in step S5, when gong shape
Parameter is set as：Feed velocity 0.3m/min.
8. the gong plate method of miniature PCB hardboards according to claim 1, which is characterized in that in step S3, the auxiliary wick
The thickness of plate is 2.5mm.
9. according to the gong plate method of the miniature PCB hardboards of claim 1-8 any one of them, which is characterized in that the wiring board
It is made to have been subjected to outer-layer circuit, solder mask makes and the plank of surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810413871.4A CN108513462A (en) | 2018-05-03 | 2018-05-03 | A kind of gong plate method of miniature PCB hardboards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810413871.4A CN108513462A (en) | 2018-05-03 | 2018-05-03 | A kind of gong plate method of miniature PCB hardboards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108513462A true CN108513462A (en) | 2018-09-07 |
Family
ID=63399710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810413871.4A Pending CN108513462A (en) | 2018-05-03 | 2018-05-03 | A kind of gong plate method of miniature PCB hardboards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108513462A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666021A (en) * | 2022-12-28 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Control method for layered foaming of circuit board and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2917472A1 (en) * | 1979-04-30 | 1980-11-13 | Telefonbau & Normalzeit Gmbh | Alignment system for multiple layer circuit board mfr. - using grid lines on inner layer and reference holes in outer layers |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN106793587A (en) * | 2016-12-21 | 2017-05-31 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board with blind slot and preparation method thereof |
-
2018
- 2018-05-03 CN CN201810413871.4A patent/CN108513462A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2917472A1 (en) * | 1979-04-30 | 1980-11-13 | Telefonbau & Normalzeit Gmbh | Alignment system for multiple layer circuit board mfr. - using grid lines on inner layer and reference holes in outer layers |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN106793587A (en) * | 2016-12-21 | 2017-05-31 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board with blind slot and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666021A (en) * | 2022-12-28 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Control method for layered foaming of circuit board and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108990317A (en) | A method of improving Rigid Flex level to level alignment degree | |
| CN108617114A (en) | A kind of production method of laser control depth covering type Rigid Flex | |
| CN108617113A (en) | A kind of PP adds the method for Protection glue band making Rigid Flex | |
| CN107949190A (en) | A kind of manufacture craft of high drop ladder wiring board | |
| CN108323037A (en) | A kind of PCB processing technologys of two-sided ladder position electricity gold | |
| CN107567191B (en) | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate | |
| CN110351955A (en) | A kind of production method of the PCB with local electric thick gold PAD | |
| CN108966532A (en) | A kind of production method of three rank HDI plates of the golden finger containing ladder | |
| CN109275268A (en) | A kind of PCB back drill production method being less than 0.15mm for medium thickness | |
| CN109275277A (en) | A kind of solder-resisting manufacturing methods for preventing PCB aperture from entering ink | |
| CN110248473A (en) | A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole | |
| CN110225660A (en) | A kind of production method of high thermal conductivity thickness copper base | |
| CN108430159A (en) | A kind of oversize printed board method for drilling holes | |
| CN107592735A (en) | Thick desired ladder board manufacturing method more than a kind of high accuracy | |
| CN108521723A (en) | A kind of production method of Rigid Flex | |
| CN108770238A (en) | A kind of inner figure design method for improving drilling and pulling copper | |
| CN110602890A (en) | Manufacturing method of negative film circuit board with step circuit | |
| CN109587977A (en) | A kind of improvement fusion undesirable method of position making sheet | |
| CN108289388A (en) | The undesirable PCB production methods of tin in a kind of prevention | |
| CN108556045A (en) | A kind of method in drill straight chamfered groove hole | |
| CN108449883A (en) | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold | |
| CN108124384A (en) | Small size wiring board method for processing forming without interior positioning | |
| CN110121239A (en) | A kind of production method of mechanical blind hole half bore | |
| CN109831874A (en) | A method of solving the upper PAD of the quick-fried oil of welding resistance | |
| CN106961795A (en) | A kind of PCB forming methods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180907 |
|
| RJ01 | Rejection of invention patent application after publication |