CN108503383A - A kind of preparation method of the graphene composite film of high thermal conductivity - Google Patents
A kind of preparation method of the graphene composite film of high thermal conductivity Download PDFInfo
- Publication number
- CN108503383A CN108503383A CN201810352536.8A CN201810352536A CN108503383A CN 108503383 A CN108503383 A CN 108503383A CN 201810352536 A CN201810352536 A CN 201810352536A CN 108503383 A CN108503383 A CN 108503383A
- Authority
- CN
- China
- Prior art keywords
- thermal conductivity
- preparation
- composite film
- high thermal
- graphene composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/71—Ceramic products containing macroscopic reinforcing agents
- C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
- C04B35/80—Fibres, filaments, whiskers, platelets, or the like
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
- C04B2235/425—Graphite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5454—Particle size related information expressed by the size of the particles or aggregates thereof nanometer sized, i.e. below 100 nm
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/602—Making the green bodies or pre-forms by moulding
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/606—Drying
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/666—Applying a current during sintering, e.g. plasma sintering [SPS], electrical resistance heating or pulse electric current sintering [PECS]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
Abstract
Graphene is due to its excellent physicochemical characteristics, it is with a wide range of applications in every field, in heat conduction field, since it has the thermal coefficient of up to 3500 W/mK, heat conduction field is used to it to be also widely used, the technical program introduces plasma ablator during preparing high heat conduction graphite film and carries out ablation processes to the polyimide composite film of preparation for the first time, greatly shorten the carbonized graphite time, so that the carbonized graphite alkene in original technique is reduced to a step, improving one step of high temperature ablation realizes the carbonized graphite processing of Kapton and the reduction of graphene oxide, so that final product shows very excellent heat conductivility.
Description
Technical field
The invention belongs to high-heat-conductive composite material preparation fields, and in particular to a kind of graphene compound macromolecular polymer
High heat conduction technology of thin film material preparation field.
Background technology
With the continuous development of electronic industry, the integrated level of electronic product is higher and higher, at the same time, the heat that chip generates
Amount also increased dramatically, and due to the miniaturization of product so that the unit heat density of product inevitably increases sharply, and traditional
This is increasingly difficult to using the physics radiating mode such as copper pipe, aluminium flake to meet actual demand, such as copper pipe or aluminium commercial at present
Its thermal coefficient of piece is only respectively 380 W/mK and 200W/mK, and its density is 8.96g/cm respectively3And 2.7g/cm3, this
The rapid cooling that cannot not only solve the problems, such as electronic device also limits the lighting development of electronic device, and development is a kind of as a result,
Low-density, the copper pipe and aluminium flake that the material substitution of high thermal conductivity is traditional have the sustainable development of current entire electronic industry
Important meaning.
Graphite film has attracted the sight of large quantities of researchers due to having good thermal conductivity and lower density, and by
In the layer structure of graphite so that it has apparent anisotropy in heat conduction, this is greatly different from current traditional material
Material, if its thermal coefficient in the horizontal direction is up to 1500-3000W/mK, the thermal coefficient of vertical direction is only its horizontal direction
1 percent, and its density more can be down to 1-2g/cm3, these excellent performances so that graphite film is latent with huge application
Power.
In this regard, Chinese patent CN105235307A discloses a kind of heat conducting film graphite composite material, and disclose a kind of use
In the heat conducting film graphite composite material of various electronic equipment dissipating heat occasions;Its structure includes from top to bottom PET back-adhesive films, metal foil
Layer, heat-conducting silicone grease, graphite film, acrylic compounds glue and release film open up aperture and perforation simultaneously on metal foil layer and graphite film respectively
It corresponds, metal foil layer, which is affixed to merge with PET back-adhesive films, is provided with metal foil layer protrusion, first by PI films through carbon when preparation
Change and graphitization is made the laggard eleven punch 11 of graphite film, form graphite film perforation, then metal foil layer perforated and to form metal foil layer and passes through
Hole, then will be compound with the graphite film of smearing acrylic compounds glue after the coated with thermally conductive silicone grease of metal foil layer side, then is pasted with release film
It closes, is finally bonded the metal foil layer other side with PET back-adhesive films, composite material is made by rubber roller compacting.Chinese patent
CN103011141A discloses a kind of manufacturing method of high heat conduction graphite film, it is using Kapton as raw material, warp
Two processes of carbonization and graphitization are crossed, technical process is as follows:A. select Kapton as raw material, in each strata
Graphite paper is sandwiched between imide membrane;B. by be separated with graphite paper it is cross layered after Kapton be put into retort
It is carbonized in nitrogen or ar gas environment, 1000 DEG C -1400 DEG C of carburizing temperature, time control was at -6 hours 1 hour;C. it is carbonized laggard
Row graphitization, graphitization are also to be carried out in nitrogen or ar gas environment, and temperature is controlled at 2500 DEG C to 3000 DEG C or so, and control exists
Within 12 hours.Although above-mentioned heat conducting film is all to be graphite film, have very high thermal coefficient, due to it uses
Polyimides is film base material, this makes the process that polyimides is changed into graphite film complex, needs first to be carbonized
It is graphitized again afterwards, this continuous time consumption and energy consumption, and the product controllability prepared is worse, is unfavorable for large-scale production.
Invention content
Based on the above issues, applicant is by for a long time in the further investigation of function nano Material Field, it is proposed that as follows
Technical solution proposes a kind of simple for process, repeatability height, and heat conducting film obtained is compared to existing to solve the technical problem
Heat conducting film have higher thermal coefficient film technology of preparing scheme.
In recent years, graphene is with a wide range of applications due to its excellent physicochemical characteristics in every field,
Heat conduction field, since it has the thermal coefficient of up to 3500 W/mK, heat conduction field is used for it also extensive research, Shen
It asks someone, according to from the correlative study in field of graphene, to be introduced into high molecular polymer, pass through a kind of simple side
Method prepares rapidly the graphene composite film of high thermal conductivity.
In order to enable those skilled in the art further to understand the technical solution of applicant, applicant is to the technology
Scheme is described in detail as follows:
A kind of preparation method of the graphene composite film of high thermal conductivity, includes the following steps:
Step 1, amine substance is added in organic solvent and anhydride substance is several, stir evenly, until being completely dissolved, obtain solution
A;
Step 2, several single-layer graphene oxides are taken, in dispersion in solution, the ultrasound 5-10min under 30-60 DEG C of ultrasound condition,
Obtain orange-yellow graphene oxide colloidal dispersion B;
Step 3, it is stirred continuously in 50-80 DEG C of water-bath, the dispersion liquid B in the solution A and step 2 in step 1 is mixed
Uniformly, stable block copolymer systems C is formed;
Step 4, the mold of the polytetrafluoroethylene (PTFE) Jing Guo pre-treatment is placed in an oven, into the Teflon mould
The block copolymer systems C being added in step 3 is several, and solidification drying is carried out at 50-300 DEG C;Obtain desciccate D;
Step 5, desciccate D in step 4 is subjected to ablation with plasma ablator, after 30-70S, you can obtain one kind
The graphene composite film of high thermal conductivity.
Further, the organic solvent described in step 1 includes in acetone, N,N-Dimethylformamide, dimethyl sulfoxide
It is one or more of.
Further, the amine substance described in step 1 includes p-phenylenediamine, m-phenylene diamine (MPD), dichloro benzidine
One or more of.
Further, the anhydride substance described in step 1 includes pyromellitic acid anhydride, diphenyl ether tetracarboxylic dianhydride, connection
One or more of benzene tertacarbonic acid's dianhydride.
Further, the molar ratio of the amine substance described in step 1 and anhydride substance is 1:1-2.
Further, the single-layer graphene oxide described in step 2, from pioneer's nano material, piece diameter is 0.5-5 for buying
Micron, thickness 0.8-1.2nm.
Further, the single-layer graphene oxide described in step 2, a concentration of 0.05-0.1mg/ml.
Further, the Teflon mould described in step 4 can have any shape, and the oven temperature is
80-100 degrees Celsius, drying time 0.5-1h.
Further, the pre-treatment described in step 4 refers to spraying Teflon mould using releasing agent.
Further, the volume of liquid in polytetrafluoroethylene (PTFE) can be determined in step 4 according to the thickness of required heat conducting film.
Further, the plasma ablator described in step 5 is that ablation, ablation process are carried out at 2100-3000 DEG C
In object to be ablated horizontally or vertically moved with the speed of 1-5mm/s.
Further, further include in step 5 by the film cooled to room temperature after ablation, then use hot pressing machine into
Row rolling, to improve the flexibility of product.
So-called plasma ablator is the machine for referring to generate plasma torch in the present invention.
Compared with prior art, the present invention has following advantageous effects:
1, the present invention introduces polyimides of the plasma ablator to preparation during preparing high heat conduction graphite film for the first time
Composite membrane carries out ablation processes, greatly shortens the carbonized graphite time.
2, due to the use of plasma ablator so that originally the carbonized graphite alkene in technique is reduced to a step, not only simple
Change preparation process, also saved energy consumption, improves the production efficiency of product.
3, graphene is introduced in the Kapton of preparation, due to being the very high mono-layer graphite oxide of quality
Alkene, with preferable dispersibility, improving one step of high temperature ablation realizes at the carbonized graphite of Kapton
The reduction of reason and graphene oxide so that final product shows very excellent heat conductivility.
Specific implementation mode
With reference to specific embodiment, the present invention is described in further detail, it is described be explanation of the invention simultaneously
It is not to limit, any without prejudice to present inventive concept, the simple deformation done belongs to claimed
Range.
Embodiment 1
M-phenylene diamine (MPD) is added in n,N-Dimethylformamide and pyromellitic acid anhydride is several, stirs evenly, until be completely dissolved,
Obtain solution A;1g single-layer graphene oxides are taken, are dispersed in the solution of 10ml, the ultrasound 10min under 40 DEG C of ultrasound condition,
Obtain orange-yellow graphene oxide colloidal dispersion B;Be stirred continuously in 50 DEG C of water-bath, by step 1 solution A and
Dispersion liquid B in step 2 is uniformly mixed, and forms stable block copolymer systems C;The polytetrafluoro that will be crossed by releasing agent spray treatment
The mold of ethylene is placed in an oven, and the block copolymer systems C being added in step 3 into the Teflon mould is several,
It carries out curing dry 0.5h at 100 DEG C;Obtain desciccate D;Desciccate D in step 4 is burnt with plasma ablator
Erosion, at 2500 DEG C after 70S ablations, you can obtain a kind of graphene composite film of high thermal conductivity, wait for heat conducting film nature
After being cooled to room temperature, rolling process is carried out using hot pressing machine, obtains final products.
It is tested by universal tensile instrument, when bending radius is 2mm, by 20,000 uninterrupted follow-on tests, system of the present invention
Standby heat conducting film is not broken, and is had extraordinary flexibility, is carried out the test of thermal conductivity to it, find its horizontal direction
Thermal conductivity is up to 2300W/mK.
Embodiment 2
P-phenylenediamine is added in n,N-Dimethylformamide and pyromellitic acid anhydride is several, wherein p-phenylenediamine and equal benzene
The molar ratio of tetracarboxylic acid dianhydride is 10:11, it stirs evenly, until being completely dissolved, obtains solution A;0.1g single-layer graphene oxides are taken,
It is dispersed in the solution of 10ml, the ultrasound 10min under 40 DEG C of ultrasound condition obtains orange-yellow graphene oxide colloidal dispersions
Liquid B;It is stirred continuously in 50 DEG C of water-bath, the dispersion liquid B in the solution A and step 2 in step 1 is uniformly mixed, formed
Stable block copolymer systems C;In an oven by the mold placement for the polytetrafluoroethylene (PTFE) crossed by releasing agent spray treatment, to described
Teflon mould in be added step 3 in block copolymer systems C it is several, carry out curing dry 1h at 100 DEG C;Obtain drying
Product D;Desciccate D in step 4 is subjected to ablation with plasma ablator, at 2800 DEG C after 70S ablations, you can
It is rolled to a kind of graphene composite film of high thermal conductivity using hot pressing machine after the heat conducting film cooled to room temperature
Processing, obtains final products.
It is tested by universal tensile instrument, when bending radius is 2mm, by 20,000 uninterrupted follow-on tests, system of the present invention
Standby heat conducting film is not broken, and is had extraordinary flexibility, is carried out the test of thermal conductivity to it, find its horizontal direction
Thermal conductivity is up to 2150W/mK.
Embodiment 3
P-phenylenediamine is added in n,N-Dimethylformamide and pyromellitic acid anhydride is several, wherein m-phenylene diamine (MPD) and equal benzene
The molar ratio of tetracarboxylic acid dianhydride is 1:1, it stirs evenly, until being completely dissolved, obtains solution A;0.5g single-layer graphene oxides are taken, point
It is dispersed in the solution of 10ml, the ultrasound 10min under 40 DEG C of ultrasound condition obtains orange-yellow graphene oxide colloidal dispersion
B;It is stirred continuously in 50 DEG C of water-bath, the dispersion liquid B in the solution A and step 2 in step 1 is uniformly mixed, formed steady
Fixed block copolymer systems C;In an oven by the mold placement for the polytetrafluoroethylene (PTFE) crossed by releasing agent spray treatment, to described
The block copolymer systems C being added in step 3 in Teflon mould is several, carries out curing dry 1h at 100 DEG C;Obtain dry production
Object D;Desciccate D in step 4 is subjected to ablation with plasma ablator, at 2800 DEG C after 70S ablations, you can obtain
A kind of graphene composite film of high thermal conductivity carries out rolling after the heat conducting film cooled to room temperature using hot pressing machine
Reason, obtains final products.
It is tested by universal tensile instrument, when bending radius is 2mm, by 20,000 uninterrupted follow-on tests, system of the present invention
Standby heat conducting film is not broken, and is had extraordinary flexibility, is carried out the test of thermal conductivity to it, find its horizontal direction
Thermal conductivity is up to 2300W/mK.
Embodiment 4
P-phenylenediamine is added in dimethyl sulfoxide and pyromellitic acid anhydride is several, wherein m-phenylene diamine (MPD) and Pyromellitic Acid two
The molar ratio of acid anhydride is 10:12, it stirs evenly, until being completely dissolved, obtains solution A;0.1g single-layer graphene oxides are taken, are dispersed in
In the solution of 10ml, the ultrasound 10min under 40 DEG C of ultrasound condition obtains orange-yellow graphene oxide colloidal dispersion B;
It is stirred continuously in 50 DEG C of water-bath, the dispersion liquid B in the solution A and step 2 in step 1 is uniformly mixed, is formed stable
Block copolymer systems C;The mold for the polytetrafluoroethylene (PTFE) crossed by releasing agent spray treatment is placed in an oven, to described poly- four
The block copolymer systems C being added in step 3 in vinyl fluoride mold is several, carries out curing dry 1h at 100 DEG C;Obtain desciccate D;
Desciccate D in step 4 is subjected to ablation with plasma ablator, at 2800 DEG C after 70S ablations, you can obtain one kind
The graphene composite film of high thermal conductivity carries out rolling process using hot pressing machine, obtains after the heat conducting film cooled to room temperature
To final products.
It is tested by universal tensile instrument, when bending radius is 2mm, by 20,000 uninterrupted follow-on tests, system of the present invention
Standby heat conducting film is not broken, and is had extraordinary flexibility, is carried out the test of thermal conductivity to it, find its horizontal direction
Thermal conductivity is up to 2200W/mK.
Comparative example 1
Other steps are same as Example 1, difference lies in carrying out ablation without using plasma ablator, but use conventional elder generation
Graphited processing mode after carbonization, the thermal conductivity of graphene composite film obtained is also in 2000 W/mK or more, this proof
Serious decline will not be caused to influence the performance of product using plasma ablator.
Comparative example 2
Other steps are same as Example 1, difference lies in the graphene oxide for using traditional Hummers methods to prepare, from final
From the point of view of the thermal conductivity of product, performance is obviously not so good as using the good of single-layer graphene oxide, this also illustrates the property of the composite heat conduction film
There can be prodigious relationship with the quality of graphene.
Claims (10)
1. a kind of preparation method of the graphene composite film of high thermal conductivity, which is characterized in that include the following steps:
Step 1, amine substance is added in organic solvent and anhydride substance is several, stir evenly, until being completely dissolved, obtain solution
A;
Step 2, several single-layer graphene oxides are taken, in dispersion in solution, the ultrasound 5-10min under 30-60 DEG C of ultrasound condition,
Obtain orange-yellow graphene oxide colloidal dispersion B;
Step 3, it is stirred continuously in 50-80 DEG C of water-bath, the dispersion liquid B in the solution A and step 2 in step 1 is mixed
Uniformly, stable block copolymer systems C is formed;
Step 4, the mold of the polytetrafluoroethylene (PTFE) Jing Guo pre-treatment is placed in an oven, into the Teflon mould
The block copolymer systems C being added in step 3 is several, and solidification drying is carried out at 50-300 DEG C;Obtain desciccate D;
Step 5, desciccate D in step 4 is subjected to ablation with plasma ablator, after 30-70S, you can obtain one kind
The graphene composite film of high thermal conductivity.
2. a kind of preparation method of the graphene composite film of high thermal conductivity according to claim 1, it is characterised in that:Also wrap
It includes the film cooled to room temperature after ablation, is then rolled using hot pressing machine.
3. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 1
Described in organic solvent include one or more of acetone, N,N-Dimethylformamide, dimethyl sulfoxide.
4. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 1
Described in amine substance include one or more of p-phenylenediamine, m-phenylene diamine (MPD), dichloro benzidine.
5. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 1
Described in anhydride substance include pyromellitic acid anhydride, diphenyl ether tetracarboxylic dianhydride, one kind in biphenyltetracarboxylic dianhydride or
It is several.
6. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 1
Described in amine substance and anhydride substance molar ratio be 1:1-2.
7. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 2
Described in single-layer graphene oxide, piece diameter be 0.5-5 microns, thickness 0.8-1.2nm;The mono-layer graphite oxide
Alkene, a concentration of 0.05-0.1mg/ml.
8. according to a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:Step 4
Described in Teflon mould can have any shape, the oven temperature is 80-100 degrees Celsius, and drying time is
0.5-1h;The pre-treatment refers to spraying Teflon mould using releasing agent.
9. a kind of preparation method of the graphene composite film of high thermal conductivity described in claim 1, it is characterised in that:In step 5
The plasma ablator is that ablation is carried out at 2100-3000 DEG C, horizontal or vertical with the speed of 1-5mm/s in ablation process
Object to be ablated is moved in translation.
10. the graphene composite film of high thermal conductivity prepared by preparation method described in claim 1, it is characterised in that:This is compound
Film so keeps good flexibility when bending radius is 2mm, by 20,000 bending successors, and its thermal conductivity is more than 2000 W/
mK。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810352536.8A CN108503383B (en) | 2018-04-19 | 2018-04-19 | Preparation method of graphene composite film with high thermal conductivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810352536.8A CN108503383B (en) | 2018-04-19 | 2018-04-19 | Preparation method of graphene composite film with high thermal conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108503383A true CN108503383A (en) | 2018-09-07 |
CN108503383B CN108503383B (en) | 2021-03-26 |
Family
ID=63382515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810352536.8A Active CN108503383B (en) | 2018-04-19 | 2018-04-19 | Preparation method of graphene composite film with high thermal conductivity |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108503383B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109384942A (en) * | 2018-09-30 | 2019-02-26 | 广州特种承压设备检测研究院 | A kind of flexibility high thermal conductivity graphene compound polyimide film and preparation method thereof |
CN109650892A (en) * | 2019-03-04 | 2019-04-19 | 重庆云天化瀚恩新材料开发有限公司 | A kind of high thermal conductivity graphene film and preparation method thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA856689A (en) * | 1970-11-24 | Filial Vsesojuznogo Nauchno-Issledovatelskogo Instituta Elektromekhaniki | Process for manufacture of flexible graphite material from rayon cord | |
CN1399017A (en) * | 2002-08-06 | 2003-02-26 | 中国科学院山西煤炭化学研究所 | Method and special plant for producing graphitized carbon fiber |
CN1522956A (en) * | 2003-09-12 | 2004-08-25 | 大连理工大学 | Process for preparing nanometer carbon microballoon by arc discharging technology |
CN102616770A (en) * | 2012-03-28 | 2012-08-01 | 福州大学 | Method for preparing grapheme nano belts by etching carbon nano tubes through water vapor |
CN105000552A (en) * | 2015-07-24 | 2015-10-28 | 浙江大学 | Preparation method for graphene oxide |
CN105541328A (en) * | 2015-12-16 | 2016-05-04 | 无锡市惠诚石墨烯技术应用有限公司 | Graphene oxide based method for preparing highly oriented pyrolytic graphite film |
US9363932B2 (en) * | 2012-06-11 | 2016-06-07 | Nanotek Instruments, Inc. | Integrated graphene film heat spreader for display devices |
CN106853966A (en) * | 2015-12-07 | 2017-06-16 | 株洲时代新材料科技股份有限公司 | The method for preparing high heat conduction graphite film using Graphene doping polyamic acid resin |
CN206783318U (en) * | 2016-12-31 | 2017-12-22 | 南京新月材料科技有限公司 | A kind of equipment that can be continuously produced graphene heat conduction film |
-
2018
- 2018-04-19 CN CN201810352536.8A patent/CN108503383B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA856689A (en) * | 1970-11-24 | Filial Vsesojuznogo Nauchno-Issledovatelskogo Instituta Elektromekhaniki | Process for manufacture of flexible graphite material from rayon cord | |
CN1399017A (en) * | 2002-08-06 | 2003-02-26 | 中国科学院山西煤炭化学研究所 | Method and special plant for producing graphitized carbon fiber |
CN1522956A (en) * | 2003-09-12 | 2004-08-25 | 大连理工大学 | Process for preparing nanometer carbon microballoon by arc discharging technology |
CN102616770A (en) * | 2012-03-28 | 2012-08-01 | 福州大学 | Method for preparing grapheme nano belts by etching carbon nano tubes through water vapor |
US9363932B2 (en) * | 2012-06-11 | 2016-06-07 | Nanotek Instruments, Inc. | Integrated graphene film heat spreader for display devices |
CN105000552A (en) * | 2015-07-24 | 2015-10-28 | 浙江大学 | Preparation method for graphene oxide |
CN106853966A (en) * | 2015-12-07 | 2017-06-16 | 株洲时代新材料科技股份有限公司 | The method for preparing high heat conduction graphite film using Graphene doping polyamic acid resin |
CN105541328A (en) * | 2015-12-16 | 2016-05-04 | 无锡市惠诚石墨烯技术应用有限公司 | Graphene oxide based method for preparing highly oriented pyrolytic graphite film |
CN206783318U (en) * | 2016-12-31 | 2017-12-22 | 南京新月材料科技有限公司 | A kind of equipment that can be continuously produced graphene heat conduction film |
Non-Patent Citations (3)
Title |
---|
亓淑英: "聚酰亚胺膜碳化过程中结构和性能变化研究", 《材料科学与工程学报》 * |
付长璟: "《石墨烯的制备、结构与应用》", 30 June 2017, 哈尔滨工业大学出版社 * |
刘韧: "前驱体聚酰亚胺薄膜梯度升温制备碳膜过程中的结构演变与性能研究", 《中国学术期刊(光盘版)工程科技Ⅰ辑》 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109384942A (en) * | 2018-09-30 | 2019-02-26 | 广州特种承压设备检测研究院 | A kind of flexibility high thermal conductivity graphene compound polyimide film and preparation method thereof |
CN109384942B (en) * | 2018-09-30 | 2021-08-17 | 广州特种承压设备检测研究院 | Flexible high-thermal-conductivity graphene composite polyimide film and preparation method thereof |
CN109650892A (en) * | 2019-03-04 | 2019-04-19 | 重庆云天化瀚恩新材料开发有限公司 | A kind of high thermal conductivity graphene film and preparation method thereof |
CN109650892B (en) * | 2019-03-04 | 2021-09-24 | 重庆云天化瀚恩新材料开发有限公司 | High-thermal-conductivity graphene film and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN108503383B (en) | 2021-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108251076B (en) | Carbon nanotube-graphene composite heat dissipation film, and preparation method and application thereof | |
Sun et al. | Humidification of high-performance and multifunctional polyimide/carbon nanotube composite foams for enhanced electromagnetic shielding | |
US10494557B2 (en) | Method of preparing nitrogen-doped graphene and method of producing composite heat dispatching plate thereof | |
CN109929129A (en) | A kind of carboxylic carbon nano-tube/polyimide composite film and preparation method thereof | |
CN109401314B (en) | Preparation method of graphene/polyimide composite material | |
CN109456645B (en) | Surfactant-free graphene composite conductive ink | |
Yao et al. | Effects of frequency and thermal conductivity on dielectric breakdown characteristics of epoxy/cellulose/BN composites fabricated by ice-templated method | |
CN107383873A (en) | A kind of graphene/polyimide composite film and preparation method thereof | |
CN105541328A (en) | Graphene oxide based method for preparing highly oriented pyrolytic graphite film | |
CN106535560A (en) | Manufacturing process for heat-conducting graphite paste films for flat computers | |
CN104023505A (en) | Method for preparing high thermal conductivity graphite film | |
Chen et al. | Polyurethane-templated 3D BN network for enhanced thermally conductive property of epoxy composites | |
CN108503383A (en) | A kind of preparation method of the graphene composite film of high thermal conductivity | |
CN111471300A (en) | Heat-conducting polyimide insulating film and preparation method thereof | |
CN110591127A (en) | High-thermal-conductivity polyimide film with isolation structure and preparation method thereof | |
CN111410190B (en) | Graphene-boron nitride composite film with insulating and heat-conducting properties and preparation method thereof | |
TW201821360A (en) | Manufacturing method of polyimide film and manufacturing method of graphite film using the same | |
Murugesan et al. | A carbon fiber solder matrix composite for thermal management of microelectronic devices | |
Li et al. | Paving 3D interconnected Cring-C3N4@ rGO skeleton for polymer composites with efficient thermal management performance yet high electrical insulation | |
JP5905766B2 (en) | Graphite thin film and manufacturing method thereof | |
JPWO2017018493A1 (en) | Heat dissipation material using mixed graphite and method for producing the same | |
Yan et al. | A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites | |
CN105086659A (en) | Preparation method of high-thermal-conductivity nano carbon copper foil | |
CN108219757B (en) | Preparation method of high-in-plane heat-conducting insulating composite film | |
CN113939167A (en) | Graphite film with high heat conductivity in thickness direction and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210304 Address after: 361000 No.1, 1st floor, No.3 workshop, No.9 Shishan Road, Dongfu Town, Haicang District, Xiamen City, Fujian Province Applicant after: Xiamen Chengyu Industrial Co.,Ltd. Address before: 233600 Wohe East Road, Chengguan Town, Woyang County, Bozhou City, Anhui Province 115136 Applicant before: Han Jinling |
|
GR01 | Patent grant | ||
GR01 | Patent grant |