CN110591127A - High-thermal-conductivity polyimide film with isolation structure and preparation method thereof - Google Patents
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Abstract
The invention discloses a high-thermal-conductivity polyimide film with an isolation structure and a preparation method thereof, wherein the film is prepared by coating polyimide particles which are not completely thermally imidized with a thermal conductive filler to form a thermal conductive network of the isolation structure, calendering and completely thermally imidizing the thermal conductive network. The film has high heat conductivity coefficient, and the preparation method has simple process, low cost, short molding period and high production efficiency, and has wide application prospect in the fields of electronics, aerospace and machinery.
Description
Technical Field
The invention belongs to the technical field of polyimide films, and particularly relates to a high-thermal-conductivity polyimide film with an isolation structure and a preparation method thereof.
Background
While electronic products can provide convenience for life, the structural density of the electronic products is becoming more and more miniaturized and integrated. With the various requirements of people on the functions of electronic equipment, the required driving power is increased all the time, the heat generated by the equipment is increased, and the heat dissipation problem of electronic products becomes a core problem influencing the use of the electronic products. Polyimide film is widely used as electronic packaging material due to its excellent physical and chemical properties, but its own thermal conductivity is not high, so a new manufacturing process is designed by adding specific thermal conductive filler to make the film have good thermal conductivity.
For this reason, studies have been made on a polyimide film, which is a two-dimensional material, hexagonal boron nitride having a layered structure similar to graphite, is called "white graphene" due to its atomically flat and electrically insulating surface, relatively low density and low price, and has not only high thermal conductivity (about 600W/(m · K)) in the planar direction but also excellent electrical insulation. The patent CN 106243715B discloses a polyimide/boron nitride composite material with high thermal conductivity and a preparation method thereof, the patent adopts boron nitride and polyimide microspheres to prepare a polyimide thermal conductive material, the process cost is complex, the polyimide microspheres need to be prepared, and the microspheres are thermoplastic polyetherimide and are not traditional thermosetting polyimide. The performance of the polyimide heat-conducting film in the current market can only meet the general requirements of electronic materials, and is relatively poor in some precise high-end equipment fields. Therefore, the high-thermal-conductivity polyimide film with the isolation structure has a great application prospect.
At present, the heat conduction coefficient of a heat conduction material is generally improved by two modes, one mode is to add a filler with high heat conduction coefficient and innovate the mode and the effect of constructing a heat conduction channel; the other is to reduce the interface scattering of phonons by improving the compatibility of the matrix and the filler. According to the invention, an isolated heat conduction network is constructed by a simple method of extrusion granulation and in-situ coating bonding, and a good heat conduction network is formed in a polyimide matrix, so that the preparation of the polyimide film with high heat conduction is dedicated.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a high-thermal-conductivity polyimide film with an isolation structure and a preparation method thereof. The film has the characteristics of high heat conductivity coefficient, low processing cost, simple preparation method and process and short forming period.
A polyimide film with an isolation structure and high thermal conductivity is prepared by wrapping polyimide particles which are not completely thermally imidized with a thermal conductive filler to form a thermal conductive network of the isolation structure, and rolling and completely thermally imidizing the thermal conductive network;
the heat-conducting filler is at least one of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, copper particles, silver particles, carbon nano tubes, graphene, flaky carbon powder and graphite, and the size of the heat-conducting filler is 10nm-10 mu m.
The thickness of the film is 10-500 μm.
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 50-1000 mu m at the temperature of 100-200 ℃ to obtain polyimide particles which are not fully thermally imidized;
(2) wetting the polyimide particles obtained in the step (1) with a polyamic acid solution to wrap a layer of thin polyamic acid solution on the surfaces of the particles to obtain wetted particles;
(3) putting the wetted particles into a mixer containing a heat-conducting filler for dry mixing, and coating a layer of heat-conducting filler on the surfaces of the particles to obtain particles coated with the heat-conducting filler;
(4) rolling the particles coated with the heat-conducting filler by using a rolling machine to obtain a film with a specific thickness;
(5) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, and cooling to obtain the high-thermal-conductivity polyimide film with the isolation structure after complete thermal imidization.
The polyamic acid solution is prepared by dissolving diamine in an organic solvent and then adding dibasic anhydride into the diamine solution; the mass ratio of the dibasic anhydride to the diamine is 1: 1-1.05, and the mass concentration of the polyamic acid solution is 15-40%.
The binary anhydride is pyromellitic dianhydride and 3, 3，，4，4，Biphenyltetracarboxylic dianhydride, 2, 3，，3，4，Biphenyltetracarboxylic dianhydride, 3，，4，4，Benzophenone tetracarboxylic dianhydride, 2, 3，，6，7，-at least one of naphthalene tetracarboxylic dianhydrides;
the diamine is p-phenylenediamine, m-phenylenediamine, biphenyldiamine, 4，Diaminodiphenyl ether, p-xylylenediamine, 3, 4，Diaminodiphenyl ether, 4，Diaminodiphenylmethane, 3，-at least one of dimethoxybenzidine;
the organic solvent is at least one of N, N-dimethylacetamide, N-dimethylformamide, N-methylpyrrolidone, dimethylacetamide and dimethyl sulfoxide.
Has the advantages that:
the invention provides a polyimide film with an isolation structure and high thermal conductivity and a preparation method thereof, wherein the preparation principle of the film is as follows: the heat conducting filler is coated with polyimide particles, and the heat conducting filler is connected to form a three-dimensional isolation structure, so that an isolation heat conducting network is formed in the polyimide, and effective transmission of phonons is facilitated. The film has two advantages, one is that the process is simple, a modifier and a complex process are not needed, and from the cost perspective, the production cost is greatly reduced and the production efficiency is improved; secondly, the high-thermal-conductivity polyimide film adopts a three-dimensional isolation network structure, the structure has a high thermal conductivity effect, and the effect of the thermal conductive filler is exerted to the best effect.
Drawings
Fig. 1 is a schematic view of an isolation structure inside a high thermal conductivity polyimide film.
Detailed Description
The invention is further described below by way of examples, but is not limited thereto.
Example 1
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) 8.615g of diamine 4, 4，Dissolving diaminodiphenyl ether in 82g N, N-dimethylacetamide organic solvent, then adding 9.385g of PDMA into diamine solution, wherein the PDMA is added into the reaction solvent for four times, namely 50%, 20% and 8%, and the PDMA is added into the reaction solvent at intervals of 0.5h every time, and the viscosity of the system is adjusted by the residual 2% of PDMA to reach 50000 MPa & s, so as to prepare polyamic acid solution;
(2) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 5-30 mu m at the temperature of 160 ℃, and preparing the particles of the polyimide which is not completely thermally imidized;
(3) wetting the polyimide particles obtained in the step (2) with a polyamic acid solution to enable the surfaces of the particles to be coated with a thin polyamic acid solution, so as to obtain wetted particles;
(4) putting the wetted particles into a mixer containing 6.3g of boron nitride for dry mixing, and coating a layer of boron nitride heat-conducting filler on the surfaces of the particles to obtain particles coated with the boron nitride heat-conducting filler;
(5) rolling the particles coated with the boron nitride heat-conducting filler by using a rolling machine to obtain a film with the thickness of 40 mu m;
(6) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, keeping the temperature of the oven at a rate of 2 ℃/min, keeping the temperature of the oven at 40 ℃ for 20min from room temperature until the temperature reaches 350 ℃, and then completely thermally imidizing the film, and cooling the film to obtain the polyimide film with the isolation structure and high thermal conductivity.
The prepared polyimide film is tested for heat conductivity by a laser flash method, and the in-plane heat conductivity coefficient of the film is 4.05W (m.K)-1The out-of-plane thermal conductivity coefficient is 0.43W (m.K)-1。
Example 2
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) 8.615g of diamine 4, 4，Dissolving diaminodiphenyl ether in 82g N, N-dimethylacetamide organic solvent, then adding 9.385g of PDMA into diamine solution, wherein the PDMA is added into the reaction solvent for four times, namely 50%, 20% and 8%, and the PDMA is added into the reaction solvent at intervals of 0.5h every time, and the viscosity of the system is adjusted by the residual 2% of PDMA to reach 50000 MPa & s, so as to prepare polyamic acid solution;
(2) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 5-30 mu m at the temperature of 160 ℃, and preparing the particles of the polyimide which is not completely thermally imidized;
(3) wetting the polyimide particles obtained in the step (2) with a polyamic acid solution to enable the surfaces of the particles to be coated with a thin polyamic acid solution, so as to obtain wetted particles;
(4) putting the wetted particles into a mixer containing 3.15g of boron nitride and 3.15g of graphene for dry mixing, and coating a layer of heat-conducting filler containing the mixture of boron nitride and graphene on the surface of the particles to obtain particles coated with the heat-conducting filler containing the mixture of boron nitride and graphene;
(5) rolling the particles coated with the boron nitride and graphene mixed heat-conducting filler by using a rolling machine to obtain a film with the thickness of 40 mu m;
(6) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, keeping the temperature of the oven at the rate of 2 ℃/min, keeping the temperature of the oven at 40 ℃ for 20min from the room temperature until the temperature reaches 350 ℃, completing thermal imidization, and cooling to obtain the polyimide film with the isolation structure and high thermal conductivity.
The prepared polyimide film is processed by a laser flash methodTesting of thermal conductivity, the film had an in-plane thermal conductivity of 3.92W (m.K)-1The out-of-plane thermal conductivity coefficient is 0.43W (m.K)-1。
Example 3
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) 8.615g of diamine 4, 4，Dissolving diaminodiphenyl ether in 82g N, N-dimethylacetamide organic solvent, then adding 9.385g of PDMA into diamine solution, wherein the PDMA is added into the reaction solvent for four times, namely 50%, 20% and 8%, and the PDMA is added into the reaction solvent at intervals of 0.5h every time, and the viscosity of the system is adjusted by the residual 2% of PDMA to reach 50000 MPa & s, so as to prepare polyamic acid solution; (2) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 5-30 mu m at the temperature of 160 ℃, and preparing the particles of the polyimide which is not completely thermally imidized;
(3) wetting the polyimide particles obtained in the step (1) with a polyamic acid solution to enable the surfaces of the particles to be coated with a thin polyamic acid solution to obtain wetted particles;
(4) the wetted particles are put into a mixer containing 5.4g of crystalline flake graphite for dry mixing, so that the surfaces of the particles are coated with a layer of heat-conducting filler containing crystalline flake graphite to obtain particles coated with the heat-conducting filler containing crystalline flake graphite;
(5) putting the particles coated with the crystalline flake graphite heat-conducting filler into a calender for calendering to obtain a film with the thickness of 40 mu m;
(6) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, keeping the temperature of the oven at a rate of 2 ℃/min, keeping the temperature of the oven at 40 ℃ for 20min from room temperature until the temperature reaches 350 ℃, completing the complete thermal imidization, and cooling to obtain the polyimide film with the isolation structure and high thermal conductivity.
The prepared polyimide film is tested for heat conductivity by a laser flash method, and the in-plane heat conductivity coefficient of the film is 3.88W (m.K)-1The out-of-plane thermal conductivity coefficient is 0.41W (m.K)-1。
Example 4
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) 8.615g of diamine 4, 4，Dissolving diaminodiphenyl ether in 82g N, N-dimethylacetamide organic solvent, then adding 9.385g of PDMA into diamine solution, wherein the PDMA is added into the reaction solvent for four times, namely 50%, 20% and 8%, and the PDMA is added into the reaction solvent at intervals of 0.5h every time, and the viscosity of the system is adjusted by the residual 2% of PDMA to reach 50000 MPa & s, so as to prepare polyamic acid solution;
(2) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 5-30 mu m at the temperature of 160 ℃, and preparing the particles of the polyimide which is not completely thermally imidized;
(3) wetting the polyimide particles obtained in the step (2) with a polyamic acid solution to enable the surfaces of the particles to be coated with a thin polyamic acid solution, so as to obtain wetted particles;
(4) putting the wetted particles into a mixer containing 2.7g of boron nitride and 2.7g of carbon nano tubes for dry mixing, and coating a layer of heat-conducting filler containing the mixture of the boron nitride and the carbon nano tubes on the surfaces of the particles to obtain particles coated with the heat-conducting filler containing the mixture of the boron nitride and the carbon nano tubes;
(5) rolling the particles coated with the boron nitride and carbon nanotube mixed heat-conducting filler by using a rolling machine to obtain a film with the thickness of 40 mu m;
(6) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, keeping the temperature of the oven at a rate of 2 ℃/min, keeping the temperature of the oven at 40 ℃ for 20min from room temperature until the temperature reaches 350 ℃, completing the complete thermal imidization, and cooling to obtain the polyimide film with the isolation structure and high thermal conductivity.
The prepared polyimide film is tested for heat conductivity by a laser flash method, and the in-plane heat conductivity coefficient of the film is 5.24W (m.K)-1The out-of-plane thermal conductivity coefficient is 0.53W (m.K)-1。
Example 5
A preparation method of a high-thermal-conductivity polyimide film with an isolation structure comprises the following steps:
(1) 8.615g are binaryAmines 4, 4，Dissolving diaminodiphenyl ether in 82g N, N-dimethylacetamide organic solvent, then adding 9.385g of PDMA into diamine solution, wherein the PDMA is added into the reaction solvent for four times, namely 50%, 20% and 8%, and the PDMA is added into the reaction solvent at intervals of 0.5h every time, and the viscosity of the system is adjusted by the residual 2% of PDMA to reach 50000 MPa & s, so as to prepare polyamic acid solution; (2) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 5-30 mu m at the temperature of 160 ℃, and preparing the particles of the polyimide which is not completely thermally imidized;
(3) wetting the polyimide particles obtained in the step (2) with a polyamic acid solution to enable the surfaces of the particles to be coated with a thin polyamic acid solution, so as to obtain wetted particles;
(4) putting the wetted particles into a mixer containing 1g of boron nitride and 5g of graphite for dry mixing, and coating a layer of heat-conducting filler containing the mixture of boron nitride and graphite on the surfaces of the particles to obtain particles coated with the heat-conducting filler containing the mixture of boron nitride and graphite;
(5) rolling the particles coated with the boron nitride and graphene mixed heat-conducting filler by using a rolling machine to obtain a film with the thickness of 40 mu m;
(6) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, keeping the temperature of the oven at a rate of 2 ℃/min, keeping the temperature of the oven at 40 ℃ for 20min from room temperature until the temperature reaches 350 ℃, completing the complete thermal imidization, and cooling to obtain the polyimide film with the isolation structure and high thermal conductivity.
The prepared polyimide film is tested for heat conductivity by a laser flash method, and the in-plane heat conductivity coefficient of the film is 4.22W (m.K)-1The out-of-plane thermal conductivity coefficient is 0.48W (m.K)-1。
Claims (5)
1. A polyimide film with an isolation structure and high thermal conductivity is characterized in that the film is prepared by coating polyimide particles which are not completely thermally imidized with a thermal conductive filler to form a thermal conductive network of the isolation structure, and performing calendering and complete thermal imidization;
the heat-conducting filler is at least one of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, copper particles, silver particles, carbon nano tubes, graphene, flaky carbon powder and graphite, and the size of the heat-conducting filler is 10nm-10 mu m.
2. The polyimide film with high thermal conductivity of an isolation structure as claimed in claim 1, wherein the thickness of the film is 10-500 μm.
3. A preparation method of a high-thermal-conductivity polyimide film with an isolation structure is characterized by comprising the following steps:
(1) adding the polyamic acid solution into an extruder, extruding and cutting the polyamic acid solution into particles with the particle size of 50-1000 mu m at the temperature of 100-200 ℃ to obtain polyimide particles which are not fully thermally imidized;
(2) wetting the polyimide particles obtained in the step (1) with a polyamic acid solution to wrap a layer of thin polyamic acid solution on the surfaces of the particles to obtain wetted particles;
(3) putting the wetted particles into a mixer containing a heat-conducting filler for dry mixing, and coating a layer of heat-conducting filler on the surfaces of the particles to obtain particles coated with the heat-conducting filler;
(4) rolling the particles coated with the heat-conducting filler by using a rolling machine to obtain a film with a specific thickness;
(5) and (3) putting the rolled film into a high-temperature oven to continue thermal imidization, and cooling to obtain the high-thermal-conductivity polyimide film with the isolation structure after complete thermal imidization.
4. The polyimide film with a high thermal conductivity and an isolation structure as claimed in claim 3, wherein the polyamic acid solution is prepared by dissolving diamine in an organic solvent and then adding dicarboxylic anhydride into the diamine solution; the mass ratio of the dibasic anhydride to the diamine is 1: 1-1.05, and the mass concentration of the polyamic acid solution is 15-40%.
5. The polyimide film with high thermal conductivity of isolation structure as claimed in claim 3, wherein the binary anhydride,is pyromellitic dianhydride, 3，4, 4-biphenyltetracarboxylic dianhydride, 2, 3，，3，4，Biphenyltetracarboxylic dianhydride, 3，，4，4，Benzophenone tetracarboxylic dianhydride, 2, 3，，6，7，-at least one of naphthalene tetracarboxylic dianhydrides;
the diamine is p-phenylenediamine, m-phenylenediamine, biphenyldiamine, 4，Diaminodiphenyl ether, p-xylylenediamine, 3, 4，Diaminodiphenyl ether, 4，Diaminodiphenylmethane, 3，-at least one of dimethoxybenzidine;
the organic solvent is at least one of N, N-dimethylacetamide, N-dimethylformamide, N-methylpyrrolidone, dimethylacetamide and dimethyl sulfoxide.
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| CN113234321A (en) * | 2021-04-13 | 2021-08-10 | 南京翌动新材料科技有限公司 | Preparation method of ceramic composite material |
| CN113337116A (en) * | 2021-06-16 | 2021-09-03 | 中国科学院宁波材料技术与工程研究所 | High-conductivity flexible polyimide composite film and preparation method thereof |
| WO2022033481A1 (en) * | 2020-08-14 | 2022-02-17 | 中兴通讯股份有限公司 | Heat dissipation structure, heat dissipation component and mounting method therefor, and foldable terminal |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105038160A (en) * | 2015-08-11 | 2015-11-11 | 四川大学 | Preparation method of carbon nano tube (CNT)/polylactic acid (PLA) electromagnetic shielding composite material with isolation structure |
| CN105646986A (en) * | 2016-03-01 | 2016-06-08 | 西南科技大学 | Thermally-conductive and insulating polymer composite material with three-dimensional isolation structure and preparation method of thermally-conductive and insulating polymer composite material |
-
2019
- 2019-09-25 CN CN201910912356.5A patent/CN110591127A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105038160A (en) * | 2015-08-11 | 2015-11-11 | 四川大学 | Preparation method of carbon nano tube (CNT)/polylactic acid (PLA) electromagnetic shielding composite material with isolation structure |
| CN105646986A (en) * | 2016-03-01 | 2016-06-08 | 西南科技大学 | Thermally-conductive and insulating polymer composite material with three-dimensional isolation structure and preparation method of thermally-conductive and insulating polymer composite material |
Non-Patent Citations (2)
| Title |
|---|
| DONGLIANG DING ET AL.: ""Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks"", 《MACROMOLECULAR RAPID COMMUNICATIONS》 * |
| 高传伟 等: "" 具有隔离结构绝缘导热复合材料性能的研究"", 《现代塑料加工应用》 * |
Cited By (6)
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|---|---|---|---|---|
| CN111017921A (en) * | 2019-12-27 | 2020-04-17 | 深圳烯湾科技有限公司 | Preparation method of polyimide graphite film |
| CN111171318A (en) * | 2020-02-07 | 2020-05-19 | 西安交通大学 | Preparation method and application of boron nitride graphene polyimide composite wave-absorbing heat-conducting material |
| CN111171318B (en) * | 2020-02-07 | 2021-08-13 | 西安交通大学 | Preparation method and application of boron nitride graphene polyimide composite wave-absorbing heat-conducting material |
| WO2022033481A1 (en) * | 2020-08-14 | 2022-02-17 | 中兴通讯股份有限公司 | Heat dissipation structure, heat dissipation component and mounting method therefor, and foldable terminal |
| CN113234321A (en) * | 2021-04-13 | 2021-08-10 | 南京翌动新材料科技有限公司 | Preparation method of ceramic composite material |
| CN113337116A (en) * | 2021-06-16 | 2021-09-03 | 中国科学院宁波材料技术与工程研究所 | High-conductivity flexible polyimide composite film and preparation method thereof |
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