CN108489998A - A kind of scolding tin defect inspection method and device - Google Patents
A kind of scolding tin defect inspection method and device Download PDFInfo
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- CN108489998A CN108489998A CN201810239716.5A CN201810239716A CN108489998A CN 108489998 A CN108489998 A CN 108489998A CN 201810239716 A CN201810239716 A CN 201810239716A CN 108489998 A CN108489998 A CN 108489998A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention provides a kind of scolding tin defect inspection method and devices, are related to hardware art.In the present invention, scolding tin defect inspection method acquire object to be detected the light source of different angle image information；Judge the scolding tin defect on object to be detected according to image information.Scolding tin defect inspection method and device provided by the invention can improve the working efficiency of scolding tin defects detection.
Description
Technical field
The present invention relates to hardware arts, in particular to a kind of scolding tin defect inspection method and device.
Background technology
Pin is essentially all to be connected by scolding tin when being connect with circuit board, needs the weldering for detecting pin and circuit board
Whether tin connection is secured, and detection method efficiency at present on the market is all relatively low.
Invention content
The purpose of the present invention is to provide a kind of scolding tin defect inspection methods, can improve the work effect of scolding tin defects detection
Rate.
The purpose of the present invention is to provide a kind of scolding tin defect detecting devices, can improve the work effect of scolding tin defects detection
Rate.
The present invention provides a kind of technical solution：
A kind of scolding tin defect inspection method, the scolding tin defect for detecting object to be detected, including：
Acquire the image information of light source of the object to be detected in different angle；
Judge the scolding tin defect on the object to be detected according to described image information.
Further, described to judge the object to be detected according to described image information in preferred embodiments of the present invention
On the scolding tin defect the step of include：
Analyze accounting value of the light source of the different angle in described image information；
The scolding tin defect on object to be detected described in ratio in judgement is accounted for according to described in.
Further, it in preferred embodiments of the present invention, is accounted for described in the foundation on object to be detected described in ratio in judgement
The scolding tin defect the step of include：
The accounting value and pre-set interval are compared, to judge scolding tin defect.
Further, in preferred embodiments of the present invention, the comparison accounting value and the pre-set interval, to sentence
The step of disconnected scolding tin defect includes：
When the accounting value is in the first pre-set interval, judge that scolding tin is full；
When the accounting value is in the second pre-set interval, judge that scolding tin lacks tin；
When the accounting value is in third pre-set interval, judge that scolding tin is short of.
Further, in preferred embodiments of the present invention, the scolding tin defect inspection method further includes：It is waited for described in control
Detectable substance moves along a straight line.
A kind of scolding tin defect detecting device includes：
Image collecting device, the image information for acquiring light source of the object to be detected in different angle；
Control device, for judging the scolding tin defect on the object to be detected according to described image information.
Further, in preferred embodiments of the present invention,
The control device is additionally operable to analyze accounting value of the light source of the different angle in described image information；
The control device is additionally operable to account for the scolding tin defect on object to be detected described in ratio in judgement according to described in.
Further, in preferred embodiments of the present invention, the control device be additionally operable to compare the accounting value with it is pre-
If section, to judge scolding tin defect.
Further, in preferred embodiments of the present invention,
The control device is additionally operable to, when the accounting value is in the first pre-set interval, judge that scolding tin is full；
The control device is additionally operable to, when the accounting value is in the second pre-set interval, judge that scolding tin lacks tin；
The control device is additionally operable to when the accounting value is in third pre-set interval, judges that scolding tin is short of.
Further, in preferred embodiments of the present invention, the scolding tin detection device further includes carrying apparatus；
The carrying apparatus is for controlling the object linear motion to be detected.
The advantageous effect of scolding tin defect inspection method and device provided by the invention is：In the present invention, scolding tin defect is examined
Survey method acquire object to be detected the light source of different angle image information；Judge the scolding tin on object to be detected according to image information
Defect.Scolding tin defect inspection method and device provided by the invention can improve the working efficiency of scolding tin defects detection.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the composition frame chart for the scolding tin defect detecting device that the embodiment of the present invention one provides.
Fig. 2 is the structural schematic diagram of the light-source structure for the scolding tin defect detecting device that the embodiment of the present invention one provides.
Fig. 3 is that the structure of the light source assembly of the light-source structure for the scolding tin defect detecting device that the embodiment of the present invention one provides is shown
It is intended to.
Fig. 4 is the structural schematic diagram of the carrier arrangement for the scolding tin defect detecting device that the embodiment of the present invention one provides.
Fig. 5 is the flow chart of scolding tin defect inspection method provided by Embodiment 2 of the present invention.
Fig. 6 is the flow chart of the sub-step of the step S200 of scolding tin defect inspection method provided by Embodiment 2 of the present invention.
Fig. 7 is the flow chart of the sub-step of the step S220 of scolding tin defect inspection method provided by Embodiment 2 of the present invention.
Icon：100- scolding tin defect detecting devices；110- light-source structures；112- light source assemblies；1122- accommodating cavities；1124-
Light source slot；114- first light source parts；The first mounting plates of 1142-；1144- first light sources；116- second light source parts；1162- second
Mounting plate；1164- second light sources；118- third light source components；1182- third mounting plates；1184- third light sources；119- end caps；
120- image collecting devices；130- control devices；140- carrier arrangements；142- racks；144- actuators；146- article carrying pieces；
1462- fixed parts；The driving sections 1464-.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
The every other embodiment that technical staff is obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
In the description of the present invention, it is to be understood that, term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, or be somebody's turn to do
Invention product using when the orientation or positional relationship usually put or those skilled in the art orientation or position that usually understand
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, equipment is not indicated or implied the indicated or element is necessary
With specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, it is not understood to indicate or imply
Relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, can also be electrical connection；It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Embodiment
Referring to Fig. 1, a kind of scolding tin defect detecting device 100 is present embodiments provided, scolding tin inspection provided in this embodiment
Examining system can improve the working efficiency of scolding tin defect detecting device 100.
Scolding tin defect detecting device 100 provided in this embodiment is used to detect the scolding tin defect on object to be detected.Pin is logical
The mode for crossing scolding tin is connect with object to be detected, and scolding tin defect detecting device 100 is used to detect the weldering of the solder sections on object to be detected
Tin defects.
In the present embodiment, object to be detected can be pcb board, can be the article that other need scolding tin to connect, for side
Just it describes, is illustrated so that object to be detected is pcb board as an example in the present embodiment.
In the present embodiment, scolding tin defect detecting device 100 includes light-source structure 110, image collecting device 120, control
Device 130 and carrier arrangement 140；
Carrier arrangement 140 is for carrying object to be detected；
Light-source structure 110 is arranged along the extending direction of carrier arrangement 140, the light for providing different angle to solder sections
Source；
Image collecting device 120 is used to acquire the image information of object to be detected；
Control device 130 is connect with image collecting device 120, is judged for receiving image information, and according to image information
The scolding tin defect of solder sections.
In the present embodiment, light-source structure 110 can provide the light source of different angle to solder sections, make image collecting device
120 can shoot the solder sections on the object to be detected of multiple angles, enable to analyze solder sections in 130 image information of control device
Scolding tin defect.In the present embodiment, once shooting can shoot the scolding tin of multiple angles to 120 need of image collecting device
Portion repeats to shoot, improves the working efficiency of scolding tin defect detecting device 100 without multi-angle.
In the present embodiment, control device 130 is used to analyze accounting value of the light source of different angle in image information, and
According to the scolding tin defect accounted on ratio in judgement object to be detected.
In the present embodiment, control device 130 is additionally operable to comparison accounting value and preset value, to judge scolding tin defect.
In the present embodiment, control device 130 can according to accounting value of the light source of different angle in image information, and
Accounting value and preset value are compared, to judge the scolding tin defect of solder sections.
In the present embodiment, after pin is welded to the welding hole on pcb board, scolding tin can be in the junction of pcb board and pin
Accumulation forms weld part.Solder sections are generally conical.
The inclined-plane of the full solder sections of scolding tin is in sty.The solder sections of few tin substantially have shallow slope surface.Lack the scolding tin of tin
Portion do not have scolding tin accumulate on pcb board.
The light source for the different angle that light-source structure 110 provides can be irradiated to the different parts of weld part, can be according to not
With accounting value of the light source in image information of angle, to judge the scolding tin defect of solder sections.
Fig. 2 and Fig. 3 is please referred to, in the present embodiment, light-source structure 110 includes that light-source structure 110 includes light source assembly
112, light source assembly 112 include first light source part 114, second light source part 116 and third light source component 118, first light source part 114,
Second light source part 116 and third light source component 118 are in that angle connects successively.
In the present embodiment, in the present embodiment, first light source part 114, second light source part 116 and third light source component 118
It is in that angle connects successively, first light source part 114, second light source part 116 and third light source component 118 is enable to irradiate from different perspectives
Onto solder sections, image collecting device 120 is enable to take the image information of multiple angles of solder sections.
In the present embodiment, first light source part 114 includes the first mounting plate 1142 and multiple first light sources 1144, Duo Ge
One light source 1144 is successively set on the first mounting plate 1142, and second light source part 116 includes the second mounting plate 1162 and multiple the
Two light sources 1164, multiple second light sources 1164 are successively set on the second mounting plate 1162, and third light source component 118 is pacified including third
Loading board 1182 and multiple third light sources 1184, multiple third light sources 1184 are successively set on third mounting plate 1182, the first peace
Loading board 1142, the second mounting plate 1162 and third mounting plate 1182 are in that angle connects successively.
In the present embodiment, the first mounting plate 1142, the second mounting plate 1162 and third mounting plate 1182 are along carrier arrangement
140 extending direction extends.
In the present embodiment, multiple first light sources 1144 are arranged in arrays.
It should be noted that in the present embodiment, multiple first light sources 1144 are arranged on the first mounting plate 1142 in matrix
Row, but not limited to this, and in other embodiments of the invention, multiple first light sources 1144 can be otherwise in the first peace
It is arranged in loading board 1142, the scheme being equal with the present embodiment, can achieve the effect that the present embodiment, the protection in the present invention
In range.
In the present embodiment, multiple second light sources 1164 are arranged in arrays.
It should be noted that in the present embodiment, multiple second light sources 1164 are arranged on the second mounting plate 1162 in matrix
Row, but not limited to this, and in other embodiments of the invention, multiple second light sources 1164 can be otherwise in the second peace
It is arranged in loading board 1162, the scheme being equal with the present embodiment, can achieve the effect that the present embodiment, the protection in the present invention
In range.
In the present embodiment, multiple third light sources 1184 are arranged in arrays.
It should be noted that in the present embodiment, multiple third light sources 1184 are arranged on third mounting plate 1182 in matrix
Row, but not limited to this, and in other embodiments of the invention, multiple third light sources 1184 can otherwise pacify in third
It is arranged in loading board 1182, the scheme being equal with the present embodiment, can achieve the effect that the present embodiment, the protection in the present invention
In range.
In the present embodiment, the luminescent color and third light source of the luminescent color, second light source 1164 of first light source 1144
1184 luminescent color is all different.
In the present embodiment, the luminescent color of first light source 1144, second light source 1164 and third light source 1184 not phase
Together, first light source 1144, second light source 1164 and third light source 1184 is made to expose in solder sections back reflection from different perspectives not
With the light of color.Image collecting device 120 acquires the image information of pcb board, and control device 130 analyzes first from image information
The accounting of light source 1144, second light source 1164 and third light source 1184 in image information, the scolding tin to analyze solder sections lack
It falls into.
Preferably, in the present embodiment, 1144 burn red of first light source, 1164 glow green of second light source, third light
Turn blue coloured light in source 1184.
It should be noted that in the present embodiment, 1144 burn red of first light source, 1164 glow green of second light source,
Third light source 1184 turns blue coloured light.But not limited to this, can be that first light source 1144 is sent out in other embodiments of the invention
Green light, second light source 1164 turn blue coloured light, 1184 burn red of third light source.Can also be that first light source 1144 is turned blue color
Light, 1164 burn red of second light source, 1184 glow green of third light source.Can also be other three kinds of different colors.With this
The equivalent scheme of embodiment, can achieve the effect that the present embodiment, be within the scope of the invention.
In the present embodiment, first light source 1144 is parallel with object to be detected, and second light source 1164 is with object to be detected at 30 degree
Angle, third light source 1184 is with object to be detected at 60 degree of angles.Third light source 1184 is substantially vertical with sty, second light source
1164 is substantially vertical with shallow slope surface, and first light source 1144 is substantially vertical with pcb board.
When accounting value is in the first pre-set interval, judge that scolding tin is full；
In the present embodiment, it is more than second light source 1164 and first that the first pre-set interval, which refers to the accounting of third light source 1184,
The accounting of light source 1144.Image information is substantially in blue.That is the reflected light of blue light is in the majority, illustrates that the inclined-plane of solder sections is substantially in
Sty, the scolding tin to illustrate solder sections are full.
When accounting value is in the second pre-set interval, judge that scolding tin lacks tin.
In the present embodiment, it is more than first light source 1144 and third that the second pre-set interval, which refers to the accounting of second light source 1164,
The accounting of light source 1184.When illustrating solder sections when the green light of second light source 1164 is in the majority almost without blue light in image information
Inclined-plane substantially be in shallow slope surface.To illustrate that solder sections lack tin.
When accounting value is in third pre-set interval, judge that scolding tin is short of.
In the present embodiment, it is more than second light source 1164 and third that third pre-set interval, which refers to the accounting of first light source 1144,
Light source 1184.When in image information almost without blue light and green light, when the red light of first light source 1144 is in the majority, illustrate to weld
Tin portion is without stacking, to illustrate that solder sections lack tin.
In the present embodiment, light source assembly 112 is two, first light source part 114, the second light of two light source assemblies 112
Source part 116 and third light source component 118 are symmetrical arranged.
In the present embodiment, two light source assemblies 112 are symmetrical arranged, and can make the first light source of two light source assemblies 112
Part 114, second light source part 116 and third light source component 118 can be symmetrical arranged, and make the source symmetric being irradiated in solder sections.
In the present embodiment, two light source assemblies 112 form accommodating cavity 1122, and second light source part 116 is to close to accommodating cavity
1122 direction tilts, and forms angle with first light source part 114, third light source component 118 close to the direction of accommodating cavity 1122 as inclining
Tiltedly setting forms angle with second light source part 116.
In the present embodiment, object to be detected is arranged at accommodating cavity 1122.
Preferably, in the present embodiment, the angle between first light source part 114 and second light source part 116 is 30 degree, second
Angle between light source component 116 and third light source component 118 is 30 degree.
In the present embodiment, the interval of first light source part 114 setting of two light source assemblies 112, forms light source slot 1124.Figure
Picture harvester 120 is arranged in light source slot 1124, acquires image information from there.
In the present embodiment, light-source structure 110 further includes two end caps 119, and two end caps 119 are separately positioned on light source group
The both ends of part 112 connect two light source assemblies 112.
In the present embodiment, first light source part 114, second light source part 116 and third light source component 118 are prolonged in the same direction
It stretches.
In the present embodiment, the first mounting plate 1142, the second mounting plate 1162 and third mounting plate 1182 are along carrier arrangement
Extend on 140 extending direction.First mounting plate 1142, the second mounting plate 1162 and third mounting plate 1182 are all strip.
Referring to Fig. 4, in the present embodiment, carrier arrangement 140 includes rack 142, actuator 144 and article carrying piece 146, is carried
Object 146 and actuator 144 are arranged in rack 142, and article carrying piece 146 is for placing object to be detected, and actuator 144 is for driving
Article carrying piece 146 moves, to drive detected material to move.
In the present embodiment, article carrying piece 146 includes fixed part 1462 and driving section 1464, fixed part 1462 and rack 142
Connection, driving section 1464 are arranged on fixed part 1462, and detected material is arranged on driving section 1464.
In the present embodiment, object to be detected is placed on driving section 1464, and actuator 144 drives driving section 1464 at the uniform velocity to transport
It is dynamic, to drive object to be detected at the uniform velocity to advance.
In the present embodiment, image collecting device 120 is line scan camera.
The operation principle of scolding tin defect detecting device 100 provided in this embodiment：In the present embodiment, object to be detected is placed
On driving section 1464, driving section 1464 is at the uniform velocity advanced under the drive of actuator 144.Image collecting device 120 acquires to be checked
The image information of object is surveyed, and analyzes the accounting value of first light source 1144, second light source 1164 and third light source 1184.When accounting value
When in the first pre-set interval, judge that scolding tin is full；When accounting value is in the second pre-set interval, judge that scolding tin lacks tin；When accounting for
When ratio is in third pre-set interval, judge that scolding tin is short of.
In conclusion scolding tin defect detecting device 100 provided in this embodiment, in the present embodiment, 110 energy of light-source structure
Enough light sources that different angle is provided to solder sections, enable image collecting device 120 to shoot on the object to be detected of multiple angles
Solder sections enable the scolding tin defect that solder sections are analyzed in 130 image information of control device.In the present embodiment, Image Acquisition
Once shooting can shoot the solder sections of multiple angles to 120 need of device, repeat to shoot without multi-angle, improve scolding tin and lack
Fall into the working efficiency of detection device 100.
Embodiment two
Referring to Fig. 5, a kind of scolding tin defect inspection method is present embodiments provided, scolding tin defect inspection provided in this embodiment
Survey method can improve the detection efficiency of scolding tin defect.
In order to briefly describe, the present embodiment does not refer to place, can refer to embodiment one.
It is as follows：
Step S100, acquire object to be detected the light source of different angle image information.
In the present embodiment, image collecting device 120 is used to acquire object to be detected and believes in the image of the light source of different angle
Breath.
Step S200 judges the scolding tin defect on object to be detected according to image information.
In the present embodiment, control device 130 is used to judge the scolding tin defect on object to be detected according to image information.
Referring to Fig. 6, wherein step S200 includes step S210 and step S220；
Step S210 analyzes accounting value of the light source of different angle in image information.
In the present embodiment, control device 130 is used to analyze accounting value of the light source of different angle in image information.
Step S220, according to the scolding tin defect accounted on ratio in judgement object to be detected.
In the present embodiment, control device 130 is used for according to the scolding tin defect accounted on ratio in judgement object to be detected.
In the present embodiment, control device 130 is for comparing accounting value and pre-set interval, to judge scolding tin defect.
Referring to Fig. 7, wherein, step S220 includes step S222, step S224 and step S226.
Step S222 judges that scolding tin is full when accounting value is in the first pre-set interval.
In the present embodiment, control device 130 is used for when accounting value is in the first pre-set interval, judges that scolding tin is full.
Step S224 judges that scolding tin lacks tin when accounting value is in the second pre-set interval.
In the present embodiment, control device 130 is used for when accounting value is in the second pre-set interval, judges that scolding tin lacks tin.
Step S226 judges that scolding tin is short of when accounting value is in third pre-set interval.
In the present embodiment, control device 130 is used for when accounting value is in third pre-set interval, judges that scolding tin is short of.
Please continue to refer to Fig. 5, step S300, object linear motion to be detected is controlled.
In the present embodiment, carrier arrangement 140 is for controlling object linear motion to be detected.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of scolding tin defect inspection method, the scolding tin defect for detecting object to be detected, which is characterized in that including：
Acquire the image information of light source of the object to be detected in different angle；
Judge the scolding tin defect on the object to be detected according to described image information.
2. scolding tin defect inspection method according to claim 1, which is characterized in that described to judge according to described image information
The step of scolding tin defect on the object to be detected includes：
Analyze accounting value of the light source of the different angle in described image information；
The scolding tin defect on object to be detected described in ratio in judgement is accounted for according to described in.
3. scolding tin defect inspection method according to claim 2, which is characterized in that account for ratio in judgement institute described in the foundation
The step of stating the scolding tin defect on object to be detected include：
The accounting value and pre-set interval are compared, to judge scolding tin defect.
4. scolding tin defect inspection method according to claim 3, which is characterized in that the comparison accounting value with it is described
Pre-set interval, to include the step of judging scolding tin defect：
When the accounting value is in the first pre-set interval, judge that scolding tin is full；
When the accounting value is in the second pre-set interval, judge that scolding tin lacks tin；
When the accounting value is in third pre-set interval, judge that scolding tin is short of.
5. scolding tin defect inspection method according to claim 1, which is characterized in that the scolding tin defect inspection method also wraps
It includes：Control the object linear motion to be detected.
6. a kind of scolding tin defect detecting device, the scolding tin defect for detecting object to be detected, which is characterized in that including：
Image collecting device, the image information for acquiring light source of the object to be detected in different angle；
Control device, for judging the scolding tin defect on the object to be detected according to described image information.
7. scolding tin defect detecting device according to claim 6, which is characterized in that
The control device is additionally operable to analyze accounting value of the light source of the different angle in described image information；
The control device is additionally operable to account for the scolding tin defect on object to be detected described in ratio in judgement according to described in.
8. scolding tin defect detecting device according to claim 7, which is characterized in that the control device is additionally operable to comparison institute
Accounting value and pre-set interval are stated, to judge scolding tin defect.
9. scolding tin defect detecting device according to claim 8, which is characterized in that
The control device is additionally operable to, when the accounting value is in the first pre-set interval, judge that scolding tin is full；
The control device is additionally operable to, when the accounting value is in the second pre-set interval, judge that scolding tin lacks tin；
The control device is additionally operable to when the accounting value is in third pre-set interval, judges that scolding tin is short of.
10. scolding tin defect detecting device according to claim 6, which is characterized in that the scolding tin defect detecting device is also
Including carrying apparatus；
The carrying apparatus is for controlling the object linear motion to be detected.
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Application publication date: 20180904 |