CN108471695A - Portable terminal - Google Patents
Portable terminal Download PDFInfo
- Publication number
- CN108471695A CN108471695A CN201810281367.3A CN201810281367A CN108471695A CN 108471695 A CN108471695 A CN 108471695A CN 201810281367 A CN201810281367 A CN 201810281367A CN 108471695 A CN108471695 A CN 108471695A
- Authority
- CN
- China
- Prior art keywords
- portable terminal
- interfacial material
- graphite
- heat
- thermal interfacial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of portable terminal, the portable terminal includes at least metal shell and heat source chip, the heat source chip is set on circuit board, in the portable terminal, it is equipped with radiator structure to less than the corresponding position of the heat source chip between the circuit board and the metal shell, the heat generated from the heat source chip is discharged into outside through the radiator structure by the metal shell.According to portable terminal provided by the present invention, the heat that the heat source chip of portable terminal generates can be discharged outward by the high metal shell of thermal conductivity, greatly accelerate the radiating rate of portable terminal.
Description
Technical field
The present invention relates to a kind of portable terminals, more particularly to improve the portable terminal of heat dissipation effect.
Background technology
With the raising of function of the portable terminal such as smart mobile phone, carry at operation and the application of store function
The operation power for managing the chips such as device chip is higher and higher, and the equipment heating generated therewith also becomes a pain spot of user experience.
Above application processor chips etc. are the core of the hardware component of portable terminal and the main heating source of equipment.With intelligent hand
For machine, at present generally use heat sink conception as shown in Figure 1, the heat generated by heat source chip 1 by be arranged in heat source core
Thermal interfacial material (the TIM of 1 top of piece：Thermal Interface Material) 2, front housing 3, double faced adhesive tape 4 and screen 5 discharge
To outside.Alternatively, graphite heat radiation fin is further arranged between screen 5 and double faced adhesive tape 4.But either which kind of layout, road of radiating
Diameter is externally radiated eventually by glass from heat source chip 1 to screen 5 always.
It is well known that the thermal conductivity of glass only has 0.5~1.0W/mK, heat dissipation effect unsatisfactory.Therefore user is playing
Youngster's game sees when video often Caton phenomenon occur because of fever, or fever causes to scald one's hand, and the operation of chip for cell phone
Speed as fever and be restricted, reduce user experience.
Invention content
The present invention is proposed to solve the problems, such as described above, and its purpose is to provide a kind of raising portable terminals
The heat dissipation effect at end, prevents the problem of equipment heating causes, and improves the portable terminal of user experience.
Portable terminal provided by the present invention, includes at least metal shell and heat source chip, which is set to
On circuit board, in the portable terminal, to less than the heat source chip between the circuit board and the metal shell
Corresponding position is equipped with radiator structure, the heat generated from the heat source chip after the circuit board and the radiator structure by
The metal shell is discharged into outside.
The thermal conductivity of portable terminal provided by the present invention, the radiator structure is more than air.
Portable terminal provided by the present invention, the radiator structure include the shielding being successively set below circuit board
Lid, thermal interfacial material and graphite heat radiation fin, the screening cover and the graphite heat radiation fin are separately fixed at the bottom of the circuit board
The inner surface in face and the metal shell, the thermal interfacial material between the screening cover and the graphite heat radiation fin with it is described
Screening cover and the graphite heat radiation fin are bonded to each other.
The size of portable terminal provided by the present invention, the thermal interfacial material is at least up to the graphite heat radiation fin
The 4% of area, and/or, the size of the thermal interfacial material is 2~3 times of the heat source chip area.
Portable terminal provided by the present invention, the thermal interfacial material is in the outer surface of screening cover and the heat source chip
Face shifts to install.
Portable terminal provided by the present invention, the thermal conductivity of the thermal interfacial material be 1.2~8W/Mk and/or, it is described
Thermal interfacial material has compressibility.
Portable terminal provided by the present invention, the thermal interfacial material are heat-conducting silicone grease, heat-conducting cream or heat-conducting glue.
The size of portable terminal provided by the present invention, the graphite heat radiation fin at least covers the thermal interfacial material.
Portable terminal provided by the present invention, the size of the graphite heat radiation fin at least cover the thermal interfacial material and
Battery.
Portable terminal provided by the present invention, the graphite heat radiation fin be graphite flake, stepped construction graphite copper sheet, stone
One kind in black alkene copper sheet.
According to the present invention, the heat source chip generation of portable terminal can be discharged outward by the high metal shell of thermal conductivity
Heat greatly accelerates the radiating rate of portable terminal.Moreover, radiator structure is by using thermal interfacial material and graphite radiating
The combination of piece, the heat conduction as homogeneously as possible in the plane of graphite heat radiation fin when heat being made to be passed, to avoid portable terminal
The metal shell local pyrexia at end or hot phenomenon.In addition, by making thermal interfacial material and heat source chip shift to install, into
One step improves the uniformity of heat transfer, avoids the local pyrexia of metal shell.In addition to this, by by the heat in radiator structure
In the gap that boundary material and graphite heat radiation fin are arranged between screening cover and metal shell, to which the design for being not take up structure is empty
Between, while greatly improving radiating efficiency.
Description of the drawings
Fig. 1 is the schematic cross-section for indicating existing mobile phone heat dissipation path.
Fig. 2 is the floor map for the installation position for indicating the mobile phone heat source chip and radiator structure of the present invention.
Fig. 3 is the schematic diagram of the Section A-A along Fig. 2 of the distribution of the component for indicating mobile phone heat source beneath chips.
Fig. 4 is the schematic diagram of the Section A-A along Fig. 2 of the mobile phone radiator structure for indicating embodiment of the present invention.
Specific implementation mode
Hereinafter, illustrating embodiments of the present invention referring to Figure 2 to Figure 4.It should be noted that in the following description, with
Mobile phone is illustrated as an example of portable terminal of the present invention.But the portable terminal of the present invention is not limited to hand
Machine can also be other terminal devices such as tablet computer, laptop.
In order to improve the heat dissipation effect of the portable terminals such as mobile phone, heat dissipation path that the present invention radiates except through screen it
Outside, it also is provided with radiator structure in the lower section of heat source chip, opens the heat dissipation path to radiate by mobile phone metal shell.Under
Face, it is assumed that portable terminal is smart mobile phone, and application processor chip (hereinafter referred to as AP chips) is lifted as heat source chip
Example explanation.
Fig. 2 is the floor map for the installation position for indicating the mobile phone heat source chip and radiator structure of the present invention.Fig. 3 is to use
In the schematic diagram of the Section A-A along Fig. 2 of the distribution for the component for indicating mobile phone heat source beneath chips.
As shown in figure 3, AP chips 1 are set on circuit board 2.Here, AP chips can be arranged in mobile phone on the circuit board 2
Screen side, can also be arranged in the side of mobile phone battery cover.In the present embodiment, AP chips are set to the screen one of mobile phone
Side, but the side for being actually disposed at mobile phone battery cover is equally suitable for the scheme of the application.
It is equipped with screening cover 7 in the lower section of circuit board 2, for shielding electromagnetic interference and/or radiation.The screening cover 7 is upward
The box-like being just open, by the shielding of the interference sources such as component, circuit on circuit board in 7 the inside of screening cover.When AP chips are arranged
When the rear shell side of mobile phone, AP chips are surrounded by the side wall of screening cover 7.
Under normal conditions, the lower section of screening cover 7 is exactly the metal shell (that is, rear shell) 8 of mobile phone.Outside screening cover 7 and metal
Scheduled gap is equipped between shell 8, which is usually 0.2mm.
In structure shown in Fig. 3, the heat generated by AP chips 1, to screening cover 7, then can only by 2 heat conduction of circuit board
It is transmitted to metal shell by air by rejects heat to outside.It is well known that the metal shell thermal conductivity of aluminium alloy is 160W/Mk,
And the thermal conductivity of air is only 0.01~0.04W/Mk, therefore in such a configuration, because being limited by air conduction rate,
It almost can be ignored by the heat dissipation effect of metal shell.
In order to improve the radiating efficiency of the metal shell by mobile phone, as shown in figure 4, the present invention is in the lower section of circuit board 2
Provided with radiator structure A.Fig. 4 is showing for the Section A-A along Fig. 2 of the mobile phone radiator structure for indicating embodiment of the present invention
It is intended to.
Radiator structure A includes above-mentioned screening cover 7, the hot boundary being arranged between the screening cover 7 and above-mentioned metal shell 8
Plane materiel material 9 and graphite heat radiation fin 10.The thermal interfacial material 9 and graphite heat radiation fin 10 will be between screening cover 7 and metal shells 8
Gap (substantially 0.2mm) is filled up, that is, graphite heat radiation fin 10 is arranged in the inside of metal shell 8, thermal interfacial material 9 is close to
State screening cover 7 bottom surface and above-mentioned graphite heat radiation fin 10 and be arranged.
In order to make thermal interfacial material 9 and graphite heat radiation fin 10 fill up the gap between screening cover 7 and metal shell 8, hot boundary
Plane materiel material, which can use, has compressional material, and heat-conducting silicone grease, heat-conducting cream, heat-conducting glue etc. can be used for example.These hot boundaries
The thermal conductivity of plane materiel material is 1.2~8W/Mk.
Graphite heat radiation fin 10 has the characteristic of uniform heat conduction in both directions, and within the scope of 150~1500W/Mk
Super-high heat-conductive performance.In embodiments of the present invention, graphite heat radiation fin 10 is attached to metal in the state of covering thermal interfacial material 9
The inner surface of shell 8.In view of the battery of mobile phone is also one kind of heat source, it is preferable that graphite heat radiation fin 10 can be further
The inner surface of metal shell 8 is attached in the state of covering battery of mobile phone.If it is considered that heat dissipation effect, graphite heat radiation fin 10
Size is the bigger the better, but considers space and the cost of interior of mobile phone simultaneously, and graphite heat radiation fin can be gold in the present embodiment
Belong to the half of the size of shell 8.Here, graphite heat radiation fin 10 can be graphite flake, the graphite copper sheet of stepped construction, graphene copper
Any one in piece.Only, graphene copper sheet is expensive, and cost is too high, therefore preferably graphite flake or graphite copper sheet.
Therefore, be transmitted to above-mentioned thermal interfacial material 9 heat can uniformly and efficiently heat conduction to graphite heat radiation fin 10
Entire plane, and then the metal shell 8 by being contacted with graphite heat radiation fin 10 is discharged into outside.
In order to improve radiating efficiency, the area of thermal interfacial material 9 is the bigger the better.But, it is contemplated that the space of interior of mobile phone
And cost, in the present embodiment, the 4% of the size for being preferably sized to graphite heat radiation fin 10 of thermal interfacial material 9, or preferably
2~3 times of the heat source chip size.If the size of thermal interfacial material 9 is too small, may cause to generate in graphite heat radiation fin 10
Hot spot.
In addition, though the case where thermal interfacial material is located at 1 underfaces of chip AP is shown in FIG. 4, still, as this hair
Bright another embodiment, thermal interfacial material can be shifted to install with AP chips 1, such as.At this point it is possible to avoid heat intensively court
Direction heat conduction immediately below AP chips 1 leads to mobile phone metal shell local pyrexia, reduces user experience.
After above-mentioned radiator structure A is arranged below the circuit board 2 of the present invention, inventor has measured in one section of mobile phone of operation
In the case of time, the temperature change of 8 each different parts of metal shell before and after above-mentioned radiator structure A is set.By test
It is found that being arranged after above-mentioned radiator structure A, the temperature-averaging of each different parts rises 7.2 DEG C~9.2 DEG C, and metal
The temperature difference of each different parts of shell 8 is no more than 2 degrees Celsius, this illustrates the heat dissipation effect of the above-mentioned radiator structure A of the present invention
Obviously, and heat dissipation is uniform.
According to the abovementioned embodiments of the present invention, it by the way that radiator structure A is arranged in the metal shell side of heat source chip, opens up
The heat dissipation path that can outward be radiated by the high metal shell of thermal conductivity, greatly accelerates the radiating rate of mobile phone.
Moreover, combinations of the radiator structure A by using thermal interfacial material and graphite heat radiation fin, in stone when heat being made to be passed
The plane of black cooling fin heat conduction as homogeneously as possible, to avoid mobile phone metal shell local pyrexia.In addition, by making hot interface
Material and heat source chip shift to install, and further increase the uniformity of heat transfer, avoid the local pyrexia of metal shell.
In addition to this, by by radiator structure A thermal interfacial material and graphite heat radiation fin be arranged in screening cover 1 and metal
In gap between shell 8, to be not take up the design space of structure, while radiating efficiency is greatly improved.
Accordingly, the portable terminal provided through the invention, will not be because of fever when user plays game, sees video
And there is Caton phenomenon, hot phenomenon, or because fever causes the mobile phone speed of service slack-off, to improve user experience,
Also protect the core component AP chips of mobile phone.
Claims (10)
1. a kind of portable terminal, which includes at least metal shell and heat source chip, which is set to
On circuit board, which is characterized in that
In the portable terminal, to corresponding less than the heat source chip between the circuit board and the metal shell
Position is equipped with radiator structure, and the heat generated from the heat source chip is discharged into through the radiator structure by the metal shell outer
Portion.
2. portable terminal according to claim 1, which is characterized in that the thermal conductivity of the radiator structure is more than air.
3. portable terminal according to claim 2, which is characterized in that the radiator structure includes being successively set on circuit
Screening cover, thermal interfacial material below plate and graphite heat radiation fin, the screening cover and the graphite heat radiation fin are separately fixed at institute
The inner surface of the bottom surface and the metal shell of circuit board is stated, the thermal interfacial material is in the screening cover and the graphite radiating
It is bonded to each other with the screening cover and the graphite heat radiation fin between piece.
4. portable terminal according to claim 3, which is characterized in that the size of the thermal interfacial material is at least up to institute
The 4% of the size of graphite heat radiation fin is stated, and/or, the size of the thermal interfacial material is 2~3 times of the heat source chip size.
5. portable terminal according to claim 3 or 4, which is characterized in that the thermal interfacial material is in the outer of screening cover
Surface and the heat source chip face shift to install.
6. portable terminal according to claim 3, which is characterized in that the thermal conductivity of the thermal interfacial material be 1.2~
8W/Mk and/or the thermal interfacial material have compressibility.
7. portable terminal according to claim 6, which is characterized in that the thermal interfacial material is heat-conducting silicone grease, heat conduction
Cream or heat-conducting glue.
8. portable terminal according to claim 4, which is characterized in that the size of the graphite heat radiation fin at least covers institute
State thermal interfacial material.
9. portable terminal according to claim 3, which is characterized in that the size of the graphite heat radiation fin at least covers institute
State thermal interfacial material and battery.
10. portable terminal according to claim 9, which is characterized in that the graphite heat radiation fin is graphite flake, stacking knot
One kind in the graphite copper sheet of structure, graphene copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810281367.3A CN108471695A (en) | 2018-04-02 | 2018-04-02 | Portable terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810281367.3A CN108471695A (en) | 2018-04-02 | 2018-04-02 | Portable terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108471695A true CN108471695A (en) | 2018-08-31 |
Family
ID=63262365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810281367.3A Pending CN108471695A (en) | 2018-04-02 | 2018-04-02 | Portable terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108471695A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112804851A (en) * | 2019-10-28 | 2021-05-14 | 华为终端有限公司 | Electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202873205U (en) * | 2012-10-19 | 2013-04-10 | 青岛海信移动通信技术股份有限公司 | Heat radiation type housing and portable mobile terminal |
| CN104869184A (en) * | 2014-02-21 | 2015-08-26 | 三星电子株式会社 | Mobile communication terminal having radiant-heat sheet |
| CN105009464A (en) * | 2013-02-22 | 2015-10-28 | 三星电子株式会社 | Antenna device for portable terminal, portable terminal and case with antenna device, and method of manufacture |
| CN204967873U (en) * | 2015-02-06 | 2016-01-13 | Lg电子株式会社 | Mobile terminal with front camera and large LCD |
| CN205071082U (en) * | 2015-11-05 | 2016-03-02 | 深圳禾苗通信科技有限公司 | High heat dissipation cell -phone structure with blocking function |
| KR20160056374A (en) * | 2014-11-10 | 2016-05-20 | 주식회사 아모그린텍 | Heat radiation and insulation sheet and portable terminal equipment having the same |
| CN107249283A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
| CN206674017U (en) * | 2017-04-17 | 2017-11-24 | 杭州高烯科技有限公司 | A kind of high radiating mobile phone based on graphene |
-
2018
- 2018-04-02 CN CN201810281367.3A patent/CN108471695A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202873205U (en) * | 2012-10-19 | 2013-04-10 | 青岛海信移动通信技术股份有限公司 | Heat radiation type housing and portable mobile terminal |
| CN105009464A (en) * | 2013-02-22 | 2015-10-28 | 三星电子株式会社 | Antenna device for portable terminal, portable terminal and case with antenna device, and method of manufacture |
| CN104869184A (en) * | 2014-02-21 | 2015-08-26 | 三星电子株式会社 | Mobile communication terminal having radiant-heat sheet |
| KR20160056374A (en) * | 2014-11-10 | 2016-05-20 | 주식회사 아모그린텍 | Heat radiation and insulation sheet and portable terminal equipment having the same |
| CN204967873U (en) * | 2015-02-06 | 2016-01-13 | Lg电子株式会社 | Mobile terminal with front camera and large LCD |
| CN205071082U (en) * | 2015-11-05 | 2016-03-02 | 深圳禾苗通信科技有限公司 | High heat dissipation cell -phone structure with blocking function |
| CN206674017U (en) * | 2017-04-17 | 2017-11-24 | 杭州高烯科技有限公司 | A kind of high radiating mobile phone based on graphene |
| CN107249283A (en) * | 2017-07-12 | 2017-10-13 | 普联技术有限公司 | A kind of mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112804851A (en) * | 2019-10-28 | 2021-05-14 | 华为终端有限公司 | Electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180831 |
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| RJ01 | Rejection of invention patent application after publication |