CN108456853B - Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment - Google Patents

Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment Download PDF

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Publication number
CN108456853B
CN108456853B CN201810201759.4A CN201810201759A CN108456853B CN 108456853 B CN108456853 B CN 108456853B CN 201810201759 A CN201810201759 A CN 201810201759A CN 108456853 B CN108456853 B CN 108456853B
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metal layer
electronic equipment
electronic device
present
substrate
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CN108456853A (en
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蒋正南
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment

Abstract

The invention provides a method for preparing an electronic equipment shell, the electronic equipment shell and electronic equipment. The method for preparing the electronic equipment shell comprises the following steps: forming a metal layer on a part of the surface of the substrate to obtain a prefabricated member; sintering the preform. The method is simple and convenient to operate, easy to realize and easy for industrial production, and the prepared metal layer on the electronic equipment shell and the base material are fused into a whole, so that the electronic equipment shell is strong in adhesive force, not easy to wear and drop, excellent in performance and good in reliability, and simultaneously has super-strong corrosion resistance and permanent wear resistance.

Description

Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment
Technical Field
The invention relates to the technical field of electronic products, in particular to a method for preparing an electronic equipment shell, the electronic equipment shell and electronic equipment.
Background
The antenna of the present electronic equipment is formed on the electronic equipment shell in a printing mode when the electronic equipment shell is prepared, so that the formed antenna has poor adhesive force and is easy to wear and fall off in the using process, and the function failure of the antenna is caused.
Thus, existing methods of preparing electronic device housings remain to be improved.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a method for manufacturing an electronic device case, which is simple and convenient to operate, easy to implement, and easy for industrial production, and the manufactured electronic device case has a metal layer and a base material fused together, and has strong adhesion, is not easy to wear and drop, has excellent performance and good reliability, or has super corrosion resistance and permanent wear resistance.
In one aspect of the invention, a method of making an electronic device housing is provided. According to an embodiment of the invention, the method comprises: forming a metal layer on a part of the surface of the substrate to obtain a prefabricated member; sintering the preform. The inventor finds that the method is simple and convenient to operate, easy to implement and easy for industrial production, and the prepared metal layer on the electronic equipment shell and the base material are fused into a whole, so that the electronic equipment shell is strong in adhesive force, not easy to wear and drop, excellent in performance and good in reliability, and has super-strong corrosion resistance and permanent wear resistance.
According to an embodiment of the invention, the material forming the substrate comprises at least one of ceramic, glass, sapphire.
According to an embodiment of the invention, the metal layer is configured as an antenna of an electronic device.
According to an embodiment of the present invention, forming the metal layer includes: forming a protective layer on the surface of the base material, wherein the protective layer is provided with an opening which is consistent with the shape of the metal layer; forming the metal layer on the surface of the substrate corresponding to the opening; and removing the protective layer.
According to an embodiment of the present invention, before forming the protective layer and/or before forming the metal layer, further comprising: cleaning the surface of the substrate.
According to an embodiment of the present invention, the method of forming the protective layer is printing ink.
According to the embodiment of the invention, the method for removing the protective layer is water washing at 40-80 ℃.
According to the embodiment of the invention, the method for forming the metal layer is vacuum plating.
According to the embodiment of the invention, the sintering temperature is 600-700 ℃.
In another aspect of the invention, an electronic device housing is provided. According to the embodiment of the invention, the electronic equipment shell is prepared by the method. The inventor finds that the metal layer on the electronic equipment shell and the base material are fused into a whole, the adhesive force is strong, the electronic equipment shell is not easy to wear and drop, the performance is excellent, the reliability is good, and meanwhile, the electronic equipment shell has super-strong corrosion resistance and permanent wear resistance.
In yet another aspect of the invention, an electronic device is provided. According to an embodiment of the present invention, the electronic device includes the electronic device case described above. The inventor finds that the antenna of the electronic equipment and the electronic equipment shell are fused into a whole, the adhesive force is strong, the antenna is not easy to wear and fall off, the performance is excellent, the reliability is good, meanwhile, the antenna has super-strong corrosion resistance and permanent wear resistance, and all the characteristics and advantages of the electronic equipment shell are achieved, so that redundant description is omitted.
Drawings
Fig. 1 shows a schematic flow chart of a method for preparing an electronic device housing according to an embodiment of the invention.
Fig. 2a to 2b show a flow chart of a method for manufacturing an electronic device housing according to another embodiment of the present invention.
Fig. 3 shows a schematic flow chart of a method for preparing an electronic device housing according to another embodiment of the invention.
Fig. 4a to 4c show a flow chart of a method for preparing an electronic device housing according to still another embodiment of the present invention.
Fig. 5 shows a schematic flow chart of a method for preparing an electronic device housing according to yet another embodiment of the invention.
Fig. 6 shows a flow chart of a method of preparing an electronic device housing according to yet another embodiment of the invention.
Fig. 7 shows a schematic flow chart of a method for preparing an electronic device housing according to yet another embodiment of the invention.
Reference numerals:
100: the prefabricated part 110: substrate 120: metal layer 130: protective layer 131: opening 200: electronic equipment shell
Detailed Description
The following describes embodiments of the present invention in detail. The following examples are illustrative only and are not to be construed as limiting the invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
In one aspect of the invention, a method of making an electronic device housing 200 is provided. According to an embodiment of the present invention, referring to fig. 1 and fig. 2a to 2b (the left drawing in fig. 2a and fig. 2b is a schematic plan view, and the right drawing is a schematic sectional view along line a-a' in the left drawing), the method includes the following steps:
s100: a metal layer 120 is formed on a portion of the surface of the substrate 110 to obtain a preform 100, and the structure diagram refers to fig. 2 a.
According to an embodiment of the present invention, the specific material type of the substrate 110 is not particularly limited, and may be flexibly selected by those skilled in the art as needed, for example, including but not limited to ceramic, glass, sapphire, etc., as long as the requirements are satisfied. In some embodiments of the present invention, the specific material type of the substrate 110 may be ceramic. Therefore, the prepared electronic device shell 200 is high in hardness, wear-resistant, high-brightness, flat and attractive, and the electronic device comprising the electronic device shell 200 can support wireless charging.
According to an embodiment of the present invention, the thickness of the substrate 110 is not particularly limited, and one skilled in the art can flexibly select the thickness as needed as long as the requirement is satisfied. In some embodiments of the present invention, the substrate 110 may have a thickness of 0.3 to 1.0 mm.
According to an embodiment of the present invention, the specific material type of the metal layer 120 is not particularly limited as long as the requirement is satisfied. One skilled in the art can make a flexible choice as desired, and may include, but is not limited to, chromium, aluminum, copper, gold, nickel, titanium, and the like, for example. In some embodiments of the present invention, the specific material type of the metal layer 120 may be copper. Therefore, the material has wide source, easy obtaining, lower cost and better electric conductivity.
According to the embodiment of the present invention, the thickness of the metal layer 120 is not particularly limited, and one skilled in the art can flexibly select the thickness as needed as long as the requirement is satisfied. In some embodiments of the present invention, the metal layer 120 may have a thickness of 0.05-0.2 mm.
According to the embodiment of the present invention, the function of the metal layer 120 is not particularly limited, and one skilled in the art can flexibly select the function as needed as long as the requirement is satisfied. In some embodiments of the present invention, the metal layer 120 is configured as an antenna of the electronic device housing 200. Therefore, the antenna prepared by the method is integrated with the base material, the binding force is good, and the antenna is not easy to fall off, so that the reliability of the performance of the antenna is ensured.
According to the embodiment of the present invention, the specific manner of forming the metal layer 120 is not particularly limited, and one skilled in the art may flexibly select the metal layer as needed as long as the requirement is met. In some embodiments of the present invention, referring to fig. 3 and fig. 4a to 4c (a left drawing in fig. 4a to 4c is a schematic plan structure, and a right drawing is a schematic sectional structure along a line a-a' in the left drawing), the forming of the metal layer 120 specifically includes the following steps:
s110: a protection layer 130 is formed on the surface of the substrate 110, the protection layer 130 has an opening 131 conforming to the shape of the metal layer 120, and the structure diagram refers to fig. 4 a.
According to the embodiment of the present invention, the specific material type of the protection layer 130 is not particularly limited, and a person skilled in the art can flexibly select the protection layer according to the requirement, for example, the protection layer may include but is not limited to ink, a masking jig, a mask plate, etc. In some embodiments of the present invention, the specific material type of the protection layer 130 may be ink. Therefore, the shielding is more accurate, and the size of the antenna is more stable.
According to an embodiment of the present invention, the thickness of the protective layer 130 is not particularly limited, and one skilled in the art may flexibly select the thickness as needed as long as the requirement is satisfied. In some embodiments of the present invention, the thickness of the protective layer 130 may be 0.02 to 0.05 mm.
According to the embodiment of the present invention, the specific manner of forming the protective layer 130 is not particularly limited, and one skilled in the art may flexibly select the protective layer as needed as long as the requirement is satisfied. In some embodiments of the present invention, a specific manner of forming the protection layer 130 may be printing. Therefore, the operation is simple and convenient, the realization is easy, the industrial production is easy, the cost is low, and the formed protective layer 130 is easy to remove.
S120: the metal layer 120 is formed on the surface of the substrate 110 corresponding to the opening 131, and the structure diagram refers to fig. 4 b.
According to the embodiment of the present invention, the specific manner of forming the metal layer 120 is not particularly limited as long as the requirement is satisfied, and those skilled in the art can flexibly select the metal layer as needed. In some embodiments of the present invention, a specific manner of forming the metal layer 120 may be vacuum plating. Therefore, the operation is simple and convenient, the realization is easy, the industrial production is easy, the formed metal layer 120 and the base material 110 have strong binding force, the metal layer is not easy to wear and drop, and the reliability is good.
According to the embodiment of the present invention, the specific type of the vacuum coating is not particularly limited, and the skilled person can flexibly select the vacuum coating according to the requirement, for example, the vacuum coating may include, but is not limited to, vacuum evaporation, vacuum sputtering, ion plating, etc. Therefore, the formed metal layer 120 and the substrate 110 have stronger bonding force, are not easy to wear and fall off, and have good reliability.
According to the embodiment of the present invention, the specific kind, equipment, etc. of the vacuum evaporation are not particularly limited, and those skilled in the art can flexibly select the vacuum evaporation according to the requirement as long as the requirement is met. In some embodiments of the present invention, the vacuum evaporation may be resistive heating evaporation, electron beam heating evaporation, low-pressure high-current reactive evaporation, or the like. Therefore, the formed metal layer 120 and the substrate 110 have stronger bonding force, are not easy to wear and fall off, and have good reliability.
According to the embodiment of the present invention, the specific type, equipment, etc. of the vacuum sputtering are not particularly limited, and those skilled in the art can flexibly select the vacuum sputtering according to the requirements as long as the requirements are met. In some embodiments of the present invention, the vacuum sputtering may be two-stage sputtering, radio frequency sputtering, reactive sputtering, unbalanced magnetron sputtering, medium frequency magnetron reactive sputtering, or the like. Therefore, the formed metal layer 120 and the substrate 110 have stronger bonding force, are not easy to wear and fall off, and have good reliability.
According to the embodiment of the present invention, the specific type, equipment, etc. of the ion plating are not particularly limited, and those skilled in the art can flexibly select the ion plating according to the requirements as long as the requirements are met. In some embodiments of the present invention, the ion plating may be sputter ion plating, hollow cathode ion plating, reactive ion plating, vacuum arc ion plating, or the like. Therefore, the formed metal layer 120 and the substrate 110 have stronger bonding force, are not easy to wear and fall off, and have good reliability.
According to the embodiment of the present invention, specific process conditions of the vacuum evaporation are not particularly limited, and those skilled in the art may flexibly select the process conditions according to needs, for example, the process conditions may be performed by referring to conventional operations, and thus, redundant description is not repeated herein.
According to an embodiment of the present invention, before performing the vacuum coating, the method may further include: the substrate 110 is mounted. Thus, after the substrate 110 is attached, the vacuum deposition can be smoothly performed, and the metal layer 120 is formed uniformly and stably.
S130: the protective layer 130 is removed, and the structure diagram refers to fig. 4 c.
According to the embodiment of the present invention, the specific manner of removing the protective layer 130 is not particularly limited, and one skilled in the art can flexibly select the manner as needed as long as the requirement is satisfied. In some embodiments of the present invention, a specific manner of removing the protective layer 130 may be washing with water at 40 to 80 ℃. In some specific embodiments of the invention, the temperature may specifically be 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃. The water washing is carried out in the temperature range, so that the protective layer 130 can be completely removed, the performance of the metal layer 120 can be ensured to be better, the operation is simple and convenient, the realization is easy, the industrial production is easy, the cost is lower, and the water resource is saved to the greatest extent.
S200: and sintering the preform 100 to obtain the electronic device shell 200, wherein the structural schematic diagram refers to fig. 2 b.
According to the embodiment of the invention, after a great deal of thorough investigation and experimental verification, the inventor finds that after the prefabricated part 100 is subjected to sintering treatment, the bonding reliability can be remarkably improved, so that the metal layer 120 on the prepared electronic device shell 200 and the base material 110 are fused into a whole, the metal layer 120 has strong adhesive force, is not easy to wear and drop, has excellent performance and good reliability, and simultaneously has super-strong corrosion resistance and permanent wear resistance.
According to the embodiment of the invention, the specific process conditions, equipment and the like of the sintering are not particularly limited, and as long as the requirements are met, the skilled person can flexibly select the sintering process according to the needs. In some embodiments of the present invention, the sintering temperature is 600-700 ℃. In some embodiments of the present invention, the sintering temperature may be 600 ℃, 620 ℃, 640 ℃, 660 ℃, 680 ℃, 700 ℃. Therefore, the metal layer 120 and the base material 110 can be further fused into a whole, so that the metal layer 120 has stronger adhesion, is less prone to wear and shedding, has more excellent performance and better reliability, and has super-strong corrosion resistance and permanent wear resistance.
In other embodiments of the present invention, referring to fig. 5 to 7, the method may further include:
the surface of the substrate 110 is cleaned.
According to the embodiment of the present invention, the surface of the substrate 110 may be cleaned only before the protective layer 130 is formed (step S300, the flowchart is shown in fig. 5), the surface of the substrate 110 may be cleaned only before the metal layer 120 is formed (step S140, the flowchart is shown in fig. 6), or the surface of the substrate 110 may be cleaned both before the protective layer 130 and the metal layer 120 are formed (steps S300 and S140, the flowcharts are shown in fig. 7).
According to the embodiment of the present invention, the specific manner of cleaning the surface of the substrate 110 is not particularly limited, and the skilled person can flexibly select the cleaning method according to the requirement, such as but not limited to ultrasonic cleaning, manual wiping, ion beam cleaning, etc. In some embodiments of the present invention, the surface of the substrate 110 is cleaned by ultrasonic wave or manually wiped before the protective layer 130 is formed, so that the operation is simple, convenient, easy to implement, low in cost and good in cleaning effect. In some embodiments of the present invention, the surface of the substrate 110 is ion beam cleaned before the metal layer 120 is formed, thereby facilitating the formation of the metal layer 120, and the bonding force between the formed metal layer 120 and the substrate 110 is stronger, so that the metal layer 120 is further not easily worn and removed, has excellent performance and good reliability, and has superior corrosion resistance and permanent wear resistance.
In another aspect of the invention, an electronic device housing 200 is provided. According to an embodiment of the present invention, referring to fig. 2b, the electronic device housing 200 is prepared by the method (the flow schematic diagrams refer to fig. 1 to 7) described above. The inventor finds that the metal layer 120 on the electronic device shell 200 and the base material 110 are fused into a whole, and the electronic device shell has strong adhesion, is not easy to wear and fall off, has excellent performance and good reliability, and simultaneously has super-strong corrosion resistance and permanent wear resistance.
According to an embodiment of the present invention, referring to fig. 2b, the electronic device case 200 includes: all features and advantages of the substrate 110 and the metal layer 120, and the substrate 110 and the metal layer 120 are the same as those described above, and will not be described in detail herein.
According to an embodiment of the present invention, the metal layer 120 is configured as an antenna of an electronic device including the electronic device housing 200, the antenna is fused with the substrate 110, and has strong adhesion, low tendency to wear and tear, excellent performance, good reliability, super corrosion resistance, and permanent wear resistance, and all the features and advantages of the metal layer 120 are not described in detail herein.
In yet another aspect of the invention, an electronic device is provided. According to an embodiment of the present invention, the electronic device includes the electronic device case 200 described above. The inventor finds that the metal layer 120 of the electronic device is fused with the electronic device case 200, and has strong adhesion, less possibility of abrasion and falling, excellent performance, good reliability, super corrosion resistance and permanent wear resistance, and all the features and advantages of the electronic device case 200 described above, which are not described herein in detail.
According to an embodiment of the present invention, the metal layer 120 is configured as an antenna of the electronic device, the antenna is fused with the electronic device housing 200, and the antenna has strong adhesion, is not easy to be worn and fall off, has excellent performance and good reliability, and has super-strong corrosion resistance and permanent wear resistance, and has all the features and advantages of the metal layer 120, which are not described in detail herein.
According to the embodiment of the present invention, the shape, configuration, manufacturing process, and the like of the electronic device are not particularly limited, and those skilled in the art can flexibly select the electronic device as needed as long as the requirements are satisfied. And those skilled in the art will understand that the electronic device has a structure of a conventional electronic device in the art except for the electronic device case 200 described above, and thus, redundant description thereof is omitted.
According to the embodiment of the present invention, the position where the electronic device case 200 is disposed on the electronic device is not particularly limited, and may be, for example, a rear case behind the electronic device.
According to the embodiment of the present invention, the specific category of the electronic device is not particularly limited, for example, including but not limited to a mobile phone, a tablet computer, a wearable device, and the like.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (9)

1. A method of making an electronic device housing, comprising:
forming a metal layer on a part of the surface of the substrate to obtain a prefabricated member;
sintering the preform;
the metal layer is configured as an antenna for an electronic device;
forming the metal layer includes:
forming a protective layer on the surface of the base material, wherein the protective layer is provided with an opening which is consistent with the shape of the metal layer;
forming the metal layer on the surface of the substrate corresponding to the opening;
and removing the protective layer.
2. The method of claim 1, wherein the substrate is formed from a material comprising at least one of a ceramic, a glass, and sapphire.
3. The method of claim 1, further comprising, prior to forming the protective layer and/or prior to forming the metal layer: cleaning the surface of the substrate.
4. The method of claim 1, wherein the protective layer is formed by printing ink.
5. The method according to claim 4, wherein the protective layer is removed by washing with water at 40-80 ℃.
6. The method of claim 1, wherein the metal layer is formed by vacuum coating.
7. The method as claimed in claim 1, wherein the sintering temperature is 600-700 ℃.
8. An electronic device housing, characterized in that it is obtained by a process according to any one of claims 1 to 7.
9. An electronic device comprising the electronic device housing of claim 8.
CN201810201759.4A 2018-03-12 2018-03-12 Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment Active CN108456853B (en)

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Application Number Priority Date Filing Date Title
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