CN108456853A - Prepare method, casting of electronic device and the electronic equipment of casting of electronic device - Google Patents
Prepare method, casting of electronic device and the electronic equipment of casting of electronic device Download PDFInfo
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- CN108456853A CN108456853A CN201810201759.4A CN201810201759A CN108456853A CN 108456853 A CN108456853 A CN 108456853A CN 201810201759 A CN201810201759 A CN 201810201759A CN 108456853 A CN108456853 A CN 108456853A
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- metal layer
- electronic device
- casting
- base material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Casings For Electric Apparatus (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The present invention provides the method, casting of electronic device and the electronic equipments that prepare casting of electronic device.The method for preparing casting of electronic device includes：Metal layer is formed on the part surface of base material, obtains prefabricated component；The prefabricated component is sintered.This method is simple, convenient, it is easy to implement, it is easy to industrialized production, and prepare metal layer and base material on the casting of electronic device of gained fuse into one, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, while there is superpower corrosion resistance and permanent wear-resisting property.
Description
Technical field
The present invention relates to technical field of electronic products, specifically, being related to preparation method, the electronic equipment of casting of electronic device
Shell and electronic equipment.
Background technology
The antenna of electronic equipment is to be formed in electronic equipment by way of printing when preparing casting of electronic device at present
On shell, the antenna adhesive force formed in this way is poor, easy to wear during use to fall off, and antenna function is caused to fail.
Thus, the existing method for preparing casting of electronic device still has much room for improvement.
Invention content
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, the present invention
One purpose is to propose a kind of simple, convenient, easy to implement, electronic equipment for being easy to industrialized production, preparing gained
Metal layer on shell fuses into one with base material, strong adhesive force, not easy to wear fall off, has excellent performance, good reliability or having
Extra-strong corrosion resistant performance, the method for preparing casting of electronic device of permanent abrasion-resistant performance.
In one aspect of the invention, the present invention provides a kind of methods preparing casting of electronic device.According to the present invention
Embodiment, this method includes：Metal layer is formed on the part surface of base material, obtains prefabricated component；The prefabricated component is carried out
Sintering.Inventor has found that this method is simple, convenient, easy to implement, is easy to industrialized production, and prepare the electronics of gained
Metal layer on apparatus casing fuses into one with base material, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, simultaneously
With superpower corrosion resistance and permanent wear-resisting property.
According to an embodiment of the invention, the material for forming the base material includes at least one in ceramics, glass, sapphire
Kind.
According to an embodiment of the invention, the metal layer is configured to the antenna of electronic equipment.
According to an embodiment of the invention, forming the metal layer includes：Protective layer, the guarantor are formed in the substrate surface
Sheath has the opening consistent with the shape of the metal layer；Described in being formed on the surface of the corresponding base material of the opening
Metal layer；Remove the protective layer.
According to an embodiment of the invention, it is forming the protective layer and/or before forming the metal layer, is further including：
The surface of the base material is cleaned.
According to an embodiment of the invention, the method for forming the protective layer is printing ink.
According to an embodiment of the invention, the method for removing the protective layer is to be washed under conditions of 40-80 DEG C.
According to an embodiment of the invention, the method for forming the metal layer is vacuum coating.
According to an embodiment of the invention, the temperature of the sintering is 600-700 DEG C.
In another aspect of the present invention, the present invention provides a kind of electronic equipment shells.According to an embodiment of the invention,
The casting of electronic device is prepared by foregoing method.Inventor has found, the gold on the casting of electronic device
Belong to layer and base material fuse into one, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, while there is superpower anti-corruption
Corrosion energy and permanent wear-resisting property.
In an additional aspect of the present invention, the present invention provides a kind of electronic equipment.According to an embodiment of the invention, the electricity
Sub- equipment includes foregoing casting of electronic device.Inventor has found that the antenna and casting of electronic device of the electronic equipment are molten
Be integrated, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, while there is superpower corrosion resistance and forever
Long wear-resisting property, and all feature and advantage with foregoing casting of electronic device, no longer excessively repeat herein.
Description of the drawings
Fig. 1 shows the flow diagram of the method for preparing casting of electronic device of one embodiment of the invention.
Fig. 2 a to 2b show the flow diagram of the method for preparing casting of electronic device of another embodiment of the present invention.
Fig. 3 shows the flow diagram of the method for preparing casting of electronic device of another embodiment of the invention.
Fig. 4 a to 4c show the flow diagram of the method for preparing casting of electronic device of further embodiment of the present invention.
Fig. 5 shows the flow diagram of the method for preparing casting of electronic device of further embodiment of the present invention.
Fig. 6 shows the flow diagram of the method for preparing casting of electronic device of further embodiment of the present invention.
Fig. 7 shows the flow diagram of the method for preparing casting of electronic device of further embodiment of the present invention.
Reference numeral：
100：Prefabricated component 110：Base material 120：Metal layer 130：Protective layer 131：Opening 200：Casting of electronic device
Specific implementation mode
The embodiment of the present invention is described below in detail.The embodiments described below is exemplary, and is only used for explaining this hair
It is bright, and be not considered as limiting the invention.Particular technique or condition are not specified in embodiment, according to text in the art
It offers described technology or condition or is carried out according to product description.Reagents or instruments used without specified manufacturer,
For can be with conventional products that are commercially available.
In one aspect of the invention, the present invention provides a kind of methods preparing casting of electronic device 200.According to this hair
Bright embodiment, (left figure is planar structure schematic diagram to a to 2b in Fig. 2 a and Fig. 2 b, and right figure is edge in left figure referring to Figures 1 and 2
The cross-sectional view of A-A ' lines), this approach includes the following steps：
S100：Metal layer 120 is formed on the part surface of base material 110, obtains prefabricated component 100, structural schematic diagram reference
Fig. 2 a.
According to an embodiment of the invention, the specific material category of the base material 110 is not particularly limited, and is wanted as long as meeting
It asks, those skilled in the art can flexibly be selected as needed, such as can include but is not limited to ceramics, glass, Lan Bao
Stone etc..In some embodiments of the invention, the specific material category of the base material 110 can be ceramics.Thus, it is possible to so that
200 hardness of casting of electronic device for preparing gained is high, wear-resistant, highlights, smooth, beautiful, and can make to include the electronics
The electronic equipment of apparatus casing 200 supports wireless charging.
According to an embodiment of the invention, the thickness of the base material 110 is not particularly limited, as long as meeting the requirements, this field
Technical staff can flexibly be selected as needed.In some embodiments of the invention, the thickness of the base material 110 can be with
For 0.3-1.0mm.
According to an embodiment of the invention, the specific material category of the metal layer 120 is not particularly limited, and is wanted as long as meeting
It asks.Those skilled in the art can flexibly be selected as needed, for example, can include but is not limited to chromium, aluminium, copper, gold, nickel,
Titanium etc..In some embodiments of the invention, the specific material category of the metal layer 120 can be copper.Material source as a result,
Extensively, it is easy to get, cost is relatively low, and electric conductivity is preferable.
According to an embodiment of the invention, the thickness of the metal layer 120 is not particularly limited, as long as meeting the requirements, ability
Field technique personnel can flexibly be selected as needed.In some embodiments of the invention, the thickness of the metal layer 120
Can be 0.05-0.2mm.
According to an embodiment of the invention, the function of the metal layer 120 is not particularly limited, as long as meeting the requirements, ability
Field technique personnel can flexibly be selected as needed.In some embodiments of the invention, the metal layer 120 is constructed
For the antenna of the casting of electronic device 200.The antenna and base material prepared as a result, by this method combines together, in conjunction with
Power is preferable, not easily to fall off, to ensure that antenna performance is reliable.
According to an embodiment of the invention, the concrete mode for forming the metal layer 120 is not particularly limited, and is wanted as long as meeting
It asks, those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, with reference to Fig. 3 and figure
(left figure is planar structure schematic diagram to 4a to Fig. 4 c in Fig. 4 a to Fig. 4 c, and right figure is that the cross-section structure in left figure along A-A ' lines is illustrated
Figure), it forms the metal layer 120 and specifically includes following steps：
S110：Protective layer 130 is formed on 110 surface of the base material, the protective layer 130 has and the metal layer 120
The consistent opening 131 of shape, structural schematic diagram is with reference to Fig. 4 a.
According to an embodiment of the invention, the specific material category of the protective layer 130 is not particularly limited, and is wanted as long as meeting
Ask, those skilled in the art can flexibly be selected as needed, such as can include but is not limited to ink, cover jig,
Mask plate etc..In some embodiments of the invention, the specific material category of the protective layer 130 can be ink.As a result, may be used
So that masking is more accurate, antenna size is more stable.
According to an embodiment of the invention, the thickness of the protective layer 130 is not particularly limited, as long as meeting the requirements, ability
Field technique personnel can flexibly be selected as needed.In some embodiments of the invention, the thickness of the protective layer 130
Can be 0.02-0.05mm.
According to an embodiment of the invention, the concrete mode for forming the protective layer 130 is not particularly limited, and is wanted as long as meeting
It asks, those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the protection is formed
The concrete mode of layer 130 can be printing.It is simple, convenient as a result, it is easy to implement, be easy to industrialized production, cost compared with
It is low, and the protective layer 130 formed easily removes.
S120：The metal layer 120, structural representation are formed on the surface of the 131 corresponding base materials 110 of the opening
Figure is with reference to Fig. 4 b.
According to an embodiment of the invention, as long as the concrete mode for forming the metal layer 120 is not particularly limited satisfaction and wants
It asks, those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the metal is formed
The concrete mode of layer 120 can be vacuum coating.It is simple, convenient as a result, it is easy to implement, it is easy to industrialized production, and shape
At the metal layer 120 and the binding force of the base material 110 it is stronger, not easy to wear to fall off, good reliability.
According to an embodiment of the invention, the specific type of the vacuum coating is not particularly limited, as long as meeting the requirements, this
Field technology personnel can flexibly be selected as needed, for example, can include but is not limited to vacuum evaporation, vacuum sputtering, from
Son plating etc..Thus, it is possible to further such that formed the metal layer 120 and the binding force of the base material 110 it is stronger, be not easy to grind
Damage falls off, good reliability.
According to an embodiment of the invention, the specific type, equipment etc. of the vacuum evaporation are not particularly limited, as long as full
Foot requires, and those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the vacuum
Evaporation can be resistance-type heating evaporation, electron beam heating evaporation, low-voltage, high-current reactive evaporation etc..Thus, it is possible to further
So that the metal layer 120 and the binding force of the base material 110 that are formed are stronger, not easy to wear to fall off, good reliability.
According to an embodiment of the invention, the specific type, equipment etc. of the vacuum sputtering are not particularly limited, as long as full
Foot requires, and those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the vacuum
Sputtering can be two level sputtering, radio-frequency sputtering, reactive sputtering, non-balance magnetically controlled sputter, medium frequency magnetron reaction sputtering etc..As a result,
Can with further such that formed the metal layer 120 and the binding force of the base material 110 it is stronger, it is not easy to wear to fall off, reliably
Property is good.
According to an embodiment of the invention, the specific type, equipment etc. of the ion plating are not particularly limited, as long as meeting
It is required that those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the ion plating
Can be sputtering ion plating, hallow cathode deposition, HCD, reactive ion plating, filtered cathode vacuum arc etc..Thus, it is possible to further make
The metal layer 120 and the binding force of the base material 110 that must be formed are stronger, not easy to wear to fall off, good reliability.
According to an embodiment of the invention, the concrete technology condition of the vacuum evaporation is not particularly limited, art technology
Personnel can flexibly select as needed, such as be referred to routine operation progress, no longer excessively repeat herein.
According to an embodiment of the invention, before carrying out the vacuum coating, can also include：By the base material 110 into
The step of luggage is hung.As a result, after hanging the base material 110 into luggage, the vacuum coating can be made to be smoothed out, and shape
At the metal layer 120 uniformly, stablize.
S130：The protective layer 130 is removed, structural schematic diagram is with reference to Fig. 4 c.
According to an embodiment of the invention, the concrete mode for removing the protective layer 130 is not particularly limited, and is wanted as long as meeting
It asks, those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the protection is removed
The concrete mode of layer 130 can be to be washed under conditions of 40-80 DEG C.In some specific embodiments of the invention, the temperature
Degree can be specially 40 DEG C, 50 DEG C, 60 DEG C, 70 DEG C, 80 DEG C.It is washed under this temperature range, can both make the guarantor
Sheath 130 completely removes, and also can guarantee that the performance of the metal layer 120 is preferable, and simple, convenient, easy to implement, is easy to
Industrialized production, cost is relatively low, farthest saves water resource.
S200：The prefabricated component 100 is sintered, obtains the casting of electronic device 200, structural schematic diagram is with reference to figure
2b。
According to an embodiment of the invention, inventor has found by a large amount of careful investigations and experimental verification, inventor by institute
It states after prefabricated component 100 is sintered, can significantly improve in conjunction with reliability so that prepare the casting of electronic device of gained
Metal layer 120 on 200 fuses into one with base material 110, the strong adhesive force of the metal layer 120, it is not easy to wear fall off, performance it is excellent
Different, good reliability, while there is superpower corrosion resistance and permanent wear-resisting property.
According to an embodiment of the invention, the concrete technology condition, equipment etc. of the sintering are not particularly limited, as long as full
Foot requires, and those skilled in the art can flexibly be selected as needed.In some embodiments of the invention, the sintering
Temperature be 600-700 DEG C.In some of the invention specific embodiments, the temperature of the sintering can be 600 DEG C, 620 DEG C,
640℃、660℃、680℃、700℃.Thus, it is possible to which further such that it is one that the metal layer 120 is melted with the base material 110
Body, to the metal layer 120 adhesive force it is stronger, it is more not easy to wear fall off, performance is more excellent, better reliability, together
When with superpower corrosion resistance and permanent wear-resisting property.
In other embodiments of the present invention, with reference to Fig. 5 to Fig. 7, this method can also include：
The surface of the base material 110 is cleaned.
It according to an embodiment of the invention, both can be only before having formed the protective layer 130 to the surface of the base material 110
(step S300, flow diagram is with reference to Fig. 5) is cleaned, it can also be only before forming the metal layer 120 to the base
(step S140, flow diagram is with reference to Fig. 6) is cleaned on the surface of material 110, can also form the protective layer 130 and institute
(step S300 and S140 flow diagram reference figure is cleaned to the surface of the base material 110 before stating metal layer 120
7)。
According to an embodiment of the invention, clean concrete mode is carried out to the surface of the base material 110 to be not particularly limited,
As long as meeting the requirements, those skilled in the art can flexibly be selected as needed, such as can include but is not limited to ultrasound
Wave cleaning, manual wipping and ion beam cleaning etc..In some embodiments of the invention, formed the protective layer 130 it
The preceding surface to the base material 110 carries out ultrasonic cleaning or manual wipping, simple, convenient as a result, easy to implement, at
This relatively low and cleaning effect is preferable.In some embodiments of the invention, to the base material before forming the metal layer 120
110 surface carries out ion beam cleaning, is more favorable for forming the metal layer 120 as a result, can make the metal to be formed
Layer is 120 stronger with the binding force of the base material 110, thus further such that the metal layer 120 it is not easy to wear fall off, performance it is excellent
Different, good reliability, while there is superpower corrosion resistance and permanent wear-resisting property.
In another aspect of the present invention, the present invention provides a kind of electronic equipment shells 200.Implementation according to the present invention
Example, with reference to Fig. 2 b, which prepared by foregoing method (flow diagram is referring to Figure 1 to Figure 7)
It obtains.Inventor has found, the metal layer 120 on the casting of electronic device 200 fuses into one with base material 110, strong adhesive force, no
It is easy to wear fall off, have excellent performance, good reliability, while there is superpower corrosion resistance and permanent wear-resisting property.
According to an embodiment of the invention, with reference to Fig. 2 b, which includes：Base material 110 and metal layer 120,
All feature and advantage of the base material 110 and metal layer 120 are same as previously described, no longer excessively repeat herein.
According to an embodiment of the invention, the metal layer 120 is construed as including the electronics of the casting of electronic device 200
The antenna of equipment, the antenna and the base material 110 fuse into one, strong adhesive force, not easy to wear fall off, has excellent performance, reliably
Property it is good, while there is superpower corrosion resistance and permanent wear-resisting property, and the institute with foregoing metal layer 120
There are feature and advantage, no longer excessively repeats herein.
In an additional aspect of the present invention, the present invention provides a kind of electronic equipment.According to an embodiment of the invention, the electricity
Sub- equipment includes foregoing casting of electronic device 200.Inventor has found that metal layer 120 and the electronics of the electronic equipment are set
Standby shell 200 fuses into one, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, while there is superpower anti-corruption
Corrosion energy and permanent wear-resisting property, and all feature and advantage with foregoing casting of electronic device 200, herein
No longer excessively repeat.
According to an embodiment of the invention, the metal layer 120 is configured to the antenna of the electronic equipment, the antenna with
The casting of electronic device 200 fuses into one, strong adhesive force, it is not easy to wear fall off, have excellent performance, good reliability, have simultaneously
Superpower corrosion resistance and permanent wear-resisting property, and all feature and advantage with foregoing metal layer 120,
It no longer excessively repeats herein.
According to an embodiment of the invention, the shape of the electronic equipment, construction, preparation process etc. are not particularly limited, only
It meets the requirements, those skilled in the art can flexibly select as needed.And it will be understood by those skilled in the art that in addition to preceding
Casting of electronic device 200 described in face, the electronic equipment have the structure of conventional electronic device in this field, no longer excessive herein
It repeats.
According to an embodiment of the invention, which does not limit especially
System, for example, can be the subsequent rear shell of electronic equipment.
According to an embodiment of the invention, the specific type of the electronic equipment is not particularly limited, such as includes but not limited to
Mobile phone, tablet computer, wearable device etc..
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on ... shown in the drawings or
Position relationship is merely for convenience of description of the present invention and simplification of the description, and does not indicate or imply the indicated device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is directly under or diagonally below the second feature, or is merely representative of fisrt feature level height and is less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (11)
1. a kind of method preparing casting of electronic device, which is characterized in that including：
Metal layer is formed on the part surface of base material, obtains prefabricated component；
The prefabricated component is sintered.
2. according to the method described in claim 1, it is characterized in that, the material for forming the base material includes ceramics, glass and indigo plant
At least one of jewel.
3. according to the method described in claim 1, it is characterized in that, the metal layer is configured to the antenna of electronic equipment.
4. according to the method described in claim 1, it is characterized in that, forming the metal layer and including：
Protective layer is formed in the substrate surface, the protective layer has the opening consistent with the shape of the metal layer；
The metal layer is formed on the surface of the corresponding base material of the opening；
Remove the protective layer.
5. according to the method described in claim 4, it is characterized in that, forming the protective layer and/or forming the metal
Before layer, further include：The surface of the base material is cleaned.
6. according to the method described in claim 4, it is characterized in that, the method for forming the protective layer is printing ink.
7. according to the method described in claim 6, it is characterized in that, the method for removing the protective layer is the item at 40-80 DEG C
It is washed under part.
8. according to the method described in claim 1, it is characterized in that, the method for forming the metal layer is vacuum coating.
9. according to the method described in claim 1, it is characterized in that, the temperature of the sintering is 600-700 DEG C.
10. a kind of electronic equipment shell, which is characterized in that obtained by the method preparation described in any one of claim 1-9
.
11. a kind of electronic equipment, which is characterized in that including casting of electronic device according to any one of claims 10.
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