CN108449063A - 一种塑料封装石英晶体谐振器及其制备方法 - Google Patents
一种塑料封装石英晶体谐振器及其制备方法 Download PDFInfo
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- CN108449063A CN108449063A CN201810220565.9A CN201810220565A CN108449063A CN 108449063 A CN108449063 A CN 108449063A CN 201810220565 A CN201810220565 A CN 201810220565A CN 108449063 A CN108449063 A CN 108449063A
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- quartz
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- pedestal
- plastic
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- 239000004033 plastic Substances 0.000 title claims abstract description 83
- 229920003023 plastic Polymers 0.000 title claims abstract description 82
- 239000013078 crystal Substances 0.000 title claims abstract description 60
- 238000002360 preparation method Methods 0.000 title claims description 8
- 239000010453 quartz Substances 0.000 claims abstract description 69
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 69
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 238000001746 injection moulding Methods 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 101000688543 Homo sapiens Shugoshin 2 Proteins 0.000 claims description 8
- 102100024238 Shugoshin 2 Human genes 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 17
- 230000004308 accommodation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- 244000132059 Carica parviflora Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810220565.9A CN108449063A (zh) | 2018-03-16 | 2018-03-16 | 一种塑料封装石英晶体谐振器及其制备方法 |
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CN201810220565.9A CN108449063A (zh) | 2018-03-16 | 2018-03-16 | 一种塑料封装石英晶体谐振器及其制备方法 |
Publications (1)
Publication Number | Publication Date |
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CN108449063A true CN108449063A (zh) | 2018-08-24 |
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Family Applications (1)
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CN201810220565.9A Withdrawn CN108449063A (zh) | 2018-03-16 | 2018-03-16 | 一种塑料封装石英晶体谐振器及其制备方法 |
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CN (1) | CN108449063A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020082245A1 (zh) * | 2018-10-23 | 2020-04-30 | 华为技术有限公司 | 单片集成baw谐振器制作方法 |
CN113650223A (zh) * | 2021-08-23 | 2021-11-16 | 东莞市速力科技有限公司 | 一种石英传感器封装方法及设备 |
CN114785308A (zh) * | 2022-04-10 | 2022-07-22 | 合肥同晶电子有限公司 | 一种石英晶体封装结构 |
-
2018
- 2018-03-16 CN CN201810220565.9A patent/CN108449063A/zh not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020082245A1 (zh) * | 2018-10-23 | 2020-04-30 | 华为技术有限公司 | 单片集成baw谐振器制作方法 |
US12028035B2 (en) | 2018-10-23 | 2024-07-02 | Huawei Technologies Co., Ltd. | Monolithic integrated BAW resonator production method |
CN113650223A (zh) * | 2021-08-23 | 2021-11-16 | 东莞市速力科技有限公司 | 一种石英传感器封装方法及设备 |
CN114785308A (zh) * | 2022-04-10 | 2022-07-22 | 合肥同晶电子有限公司 | 一种石英晶体封装结构 |
CN114785308B (zh) * | 2022-04-10 | 2022-12-20 | 合肥同晶电子有限公司 | 一种石英晶体封装结构 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20201014 Address after: Floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Hogg Technology Co., Ltd Address before: 200135 Shanghai city Pudong New Area mud Town Road No. 979 Building 2 Hon Applicant before: SHANGHAI CIJIN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: 518000 floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Cijin Technology (Guangdong) Co.,Ltd. Address before: 518000 floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Hogg Technology Co., Ltd |
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CB02 | Change of applicant information | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180824 |
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WW01 | Invention patent application withdrawn after publication |