CN108447832A - Semiconductor heat-exchanger rig, semiconductor module and electrical equipment - Google Patents
Semiconductor heat-exchanger rig, semiconductor module and electrical equipment Download PDFInfo
- Publication number
- CN108447832A CN108447832A CN201810226703.4A CN201810226703A CN108447832A CN 108447832 A CN108447832 A CN 108447832A CN 201810226703 A CN201810226703 A CN 201810226703A CN 108447832 A CN108447832 A CN 108447832A
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- Prior art keywords
- semiconductor
- heat exchange
- heat
- exchange matrix
- air inlet
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of semiconductor heat-exchanger rigs, semiconductor module and electrical equipment, semiconductor heat-exchanger rig includes heat exchange matrix and is arranged at intervals on heat exchange matrix for installing the semiconductor mounting surface of semiconductor, the heat exchange matrix is respectively equipped with suction opening and the main air inlet for admitting air into heat exchange matrix under exhaust fan suction along two end faces of semiconductor mounting surface arranged direction, the heat exchange matrix includes the changeover portion between two neighboring semiconductor mounting surface, changeover portion is equipped with for admitting air into heat exchange matrix under exhaust fan suction to carry out the auxiliary air inlet opening of heat exchange with heat exchange matrix.Inlet air temperature in this way at the semiconductor far from main air inlet is identical as the inlet air temperature at the semiconductor of main air inlet, and the inlet air temperature effectively reduced between two neighboring semiconductor is poor.Solve the problems, such as it is existing in the prior art due to the temperature difference of two IGBT in parallel it is larger caused by IGBT use allowance and stability reduction.
Description
Technical field
The present invention relates to a kind of semiconductor heat-exchanger rig, semiconductor module and electrical equipments.
Background technology
IGTB is widely used in as semiconductor element in every field, but the development of IGBT itself cannot be fitted timely
Product demand is answered, while considering the factor of product cost, the technology of IGBT parallel connections can be used in common product, meet product
Use demand.
Authorization Notice No. is CN202523698U, and authorized announcement date is that the Chinese patent of 2012.11.07 discloses one kind
IGBT air-cooled radiators, including aluminum substrate, the side of the aluminum substrate are equipped with the peace for the installation of corresponding IGBT power module
The opposite side of dress basal plane, the aluminum substrate and the installation base surface is by aluminium extrusion technology spacing parallel arranging integrally formed with multiple aluminium
Cooling fin processed.It is IGBT air-cooled radiator small volumes, simple in structure.But since two IGBT are used perpendicular to air inlet
Mouth mounting means installation, aluminum thermal fin is sealed around, and only air inlet has wind entrance so that the air inlet temperature of two IGBT
Degree has differences, close to air inlet IGBT initial inlet air temperature by the intake air temperature less than an IGBT farther out, this
Sample then has differences the initial temperature of two IGBT, and the maximum operation temperature of IGBT is made to be locked in the upper of an IGBT farther out
Face reduces the use allowance and stability of IGBT.
Invention content
The purpose of the present invention is to provide a kind of semiconductor heat-exchanger rigs, existing in the prior art due to parallel connection to solve
Two IGBT the temperature difference it is larger caused by IGBT use allowance and stability reduce the problem of；The present invention also aims to
A kind of semiconductor module and electrical equipment to solve the above problems is provided.
The technical solution of semiconductor heat-exchanger rig of the present invention is：
Scheme 1, semiconductor heat-exchanger rig include heat exchange matrix and be arranged at intervals on heat exchange matrix for installing semiconductor half
Conductor mounting surface, the heat exchange matrix are respectively equipped with suction opening along two end faces of semiconductor mounting surface arranged direction and are used for
The main air inlet of heat exchange matrix is admitted air under exhaust fan suction, the heat exchange matrix includes in two neighboring half
Changeover portion between conductor mounting surface, changeover portion be equipped with for admitted air under exhaust fan suction heat exchange matrix with
The auxiliary air inlet opening of heat exchange is carried out with heat exchange matrix.Heat exchange matrix between adjacent semiconductor mounting surface be equipped with assist into
Air port, the inlet air temperature of auxiliary air inlet opening is identical as the inlet air temperature of main air inlet, in this way at the semiconductor far from main air inlet
Inlet air temperature it is identical as the inlet air temperature at the semiconductor of main air inlet, effectively reduce between two neighboring semiconductor
Inlet air temperature is poor.Solve it is existing in the prior art due to the temperature difference of two IGBT in parallel it is larger caused by IGBT use
The problem of allowance and stability reduce.
Scheme 2, on the basis of scheme 1, the auxiliary air inlet opening is strip, and the length direction of auxiliary air inlet opening is vertical
In the arranged direction of semiconductor mounting surface.Auxiliary air inlet opening is set as strip, makes auxiliary air inlet opening closer to auxiliary air inlet opening
The semiconductor at place facilitates the air into auxiliary air inlet opening to exchange heat with semiconductor.
Scheme 3, on the basis of scheme 1 or 2, the auxiliary air inlet opening, which is arranged on heat exchange matrix, to be equipped with semiconductor and installs
The side in face.The wind of auxiliary air inlet opening enters from semiconductor installation surface side, facilitates the heat exchange for carrying out semiconductor.
Scheme 4, on the basis of scheme 1 or 2, the heat exchange matrix include finned radiator and be encapsulated in it is finned dissipate
The encapsulating housing of hot body periphery.The heat dissipation area of finned radiator is larger, can be effectively increased the heat exchange amount of semiconductor.
Scheme 5, on the basis of scheme 4, the heat exchange matrix includes heat-conducting plate, and semiconductor mounting surface is arranged in heat-conducting plate
On, the side of the separate semiconductor mounting surface of heat-conducting plate is equipped at intervals at least two cooling fins, and each cooling fin is mutually parallel and hangs down
Directly it is arranged in heat-conducting plate, the encapsulating housing surrounds the air for making air be flowed to suction opening direction by main air inlet with heat-conducting plate
Runner, auxiliary air inlet opening are arranged on heat-conducting plate.The setting of heat exchange matrix ensure that under exhaust fan suction air from master
Air inlet enters in heat dissipation base to be cooled down to heat dissipation base.
Scheme 6, on the basis of scheme 1 or 2, the area of the auxiliary air inlet opening is the 1/4 ~ 1/6 of main air inlet area.
Auxiliary air inlet open area is the 1/4 ~ 1/6 of main air-admitting surface, both ensure that the intake of auxiliary air inlet opening and will not reduce master
Cooling of the air inlet to the semiconductor close to main air inlet.
The technical solution of semiconductor module of the present invention is：
Scheme 1, semiconductor module include semiconductor heat-exchanger rig and semiconductor, and the semiconductor heat-exchanger rig includes heat exchange matrix
With the semiconductor mounting surface for being arranged at intervals on installation semiconductor on heat exchange matrix, the heat exchange matrix is arranged along semiconductor mounting surface
It is respectively equipped with suction opening and the master for admitting air into heat exchange matrix under exhaust fan suction on two end faces in direction
Air inlet, the heat exchange matrix include the changeover portion between two neighboring semiconductor mounting surface, and changeover portion is equipped with and is used for
Heat exchange matrix is admitted air under exhaust fan suction to carry out the auxiliary air inlet opening of heat exchange with heat exchange matrix.
Scheme 2, on the basis of scheme 1, the auxiliary air inlet opening is strip, and the length direction of auxiliary air inlet opening is vertical
In the arranged direction of semiconductor mounting surface.
Scheme 3, on the basis of scheme 1 or 2, the auxiliary air inlet opening, which is arranged on heat exchange matrix, to be equipped with semiconductor and installs
The side in face.
Scheme 4, on the basis of scheme 1 or 2, the heat exchange matrix include finned radiator and be encapsulated in it is finned dissipate
The encapsulating housing of hot body periphery.
Scheme 5, on the basis of scheme 4, the heat exchange matrix includes heat-conducting plate, and semiconductor mounting surface is arranged in heat-conducting plate
On, the side of the separate semiconductor mounting surface of heat-conducting plate is equipped at intervals at least two cooling fins, and each cooling fin is mutually parallel and hangs down
Directly it is arranged in heat-conducting plate, the encapsulating housing surrounds the air for making air be flowed to suction opening direction by main air inlet with heat-conducting plate
Runner, auxiliary air inlet opening are arranged on heat-conducting plate.
Scheme 6, on the basis of scheme 1 or 2, the area of the auxiliary air inlet opening is the 1/4 ~ 1/6 of main air inlet area.
The present invention electrical equipment technology scheme be：
Scheme 1, electrical equipment include semiconductor module and exhaust fan, and the semiconductor module includes semiconductor heat-exchanger rig and half
Conductor, the semiconductor heat-exchanger rig include heat exchange matrix and are arranged at intervals on the semiconductor peace of installation semiconductor on heat exchange matrix
Dress face, the heat exchange matrix are respectively equipped with suction opening along two end faces of semiconductor mounting surface arranged direction and in exhausting
The main air inlet of heat exchange matrix is admitted air under machine suction, the heat exchange matrix includes pacifying in two neighboring semiconductor
Changeover portion between dress face, changeover portion be equipped with for admitted air under exhaust fan suction heat exchange matrix with heat exchange
Matrix carries out the auxiliary air inlet opening of heat exchange.
Scheme 2, on the basis of scheme 1, the auxiliary air inlet opening is strip, and the length direction of auxiliary air inlet opening is vertical
In the arranged direction of semiconductor mounting surface.
Scheme 3, on the basis of scheme 1 or 2, the auxiliary air inlet opening, which is arranged on heat exchange matrix, to be equipped with semiconductor and installs
The side in face.
Scheme 4, on the basis of scheme 1 or 2, the heat exchange matrix include finned radiator and be encapsulated in it is finned dissipate
The encapsulating housing of hot body periphery.
Scheme 5, on the basis of scheme 4, the heat exchange matrix includes heat-conducting plate, and semiconductor mounting surface is arranged in heat-conducting plate
On, the side of the separate semiconductor mounting surface of heat-conducting plate is equipped at intervals at least two cooling fins, and each cooling fin is mutually parallel and hangs down
Directly it is arranged in heat-conducting plate, the encapsulating housing surrounds the air for making air be flowed to suction opening direction by main air inlet with heat-conducting plate
Runner, auxiliary air inlet opening are arranged on heat-conducting plate.
Scheme 6, on the basis of scheme 1 or 2, the area of the auxiliary air inlet opening is the 1/4 ~ 1/6 of main air inlet area.
Scheme 7, on the basis of scheme 1 or 2, the semiconductor module be equipped at least two, each semiconductor module is arranged side by side
The exhausting of arrangement and the main air inlet and another semiconductor module of a two neighboring semiconductor module semiconductor module in the block
Mouth connection, so that the air flow channel of the heat exchange matrix of each semiconductor module is interconnected.
Description of the drawings
Fig. 1 is the front view of the specific embodiment one of the semiconductor module of the present invention；
Fig. 2 is the right view of Fig. 1；
Fig. 3 is main view of the semiconductor module in the specific embodiment one of the semiconductor module of the present invention for reactive power compensator
Figure；
Fig. 4 is the A direction views of Fig. 3；
Fig. 5 is the front view of the specific embodiment two of the semiconductor module of the present invention；
Fig. 6 is the front view of the specific embodiment three of the semiconductor module of the present invention；
In figure：1- heat exchange matrixes, 2- auxiliary air inlet openings, 3- semiconductors, 4- fins, 20- auxiliary air inlet openings, 21- auxiliary air inlet openings.
Specific implementation mode
Embodiments of the present invention are described further below in conjunction with the accompanying drawings.
The specific embodiment one of the semiconductor module of the present invention, as shown in Figures 1 to 4, semiconductor module includes semiconductor
Heat-exchanger rig and semiconductor 3, semiconductor heat-exchanger rig include heat exchange matrix 1 and are arranged at intervals on the semiconductor peace of heat exchange matrix 1
Dress face, semiconductor 3 are mounted on semiconductor mounting surface.Semiconductor 3 in the present embodiment is IGBT, and heat exchange matrix 1 is equipped with two
A semiconductor mounting surface, i.e., there are two IGBT for installation on heat exchange matrix 1.In the present embodiment, used into the air in heat exchange matrix 1
In the operating temperature for reducing IGBT, to ensure the normal operation of IGBT.In other embodiments, it can be spaced and set on heat exchange matrix
Set three or more semiconductor mounting surfaces.Be ensure IGBT in the suitable operating temperature range, in heat exchange matrix 1 along half
Be respectively equipped on two end faces of conductor mounting surface arranged direction suction opening and for make under exhaust fan suction air into
Enter the main air inlet of heat exchange matrix 1.As shown in Figure 3 and Figure 4, two semiconductor modules are mounted in reactive power compensator side by side,
The main air inlet of two semiconductor modules semiconductor module in the block is connected to the suction opening of another semiconductor module, so that
The air flow channel of the heat exchange matrix 1 of two semiconductor modules is interconnected.The direction of Fig. 3 arrows is the flow direction of air, i.e., empty wind
The main air inlet of semiconductor module under exhaust fan suction on the left of reactive power compensator shown in Fig. 3 enters, along scattered
Air flow channel in hot basal body flows to the suction opening of the semiconductor module on the right side of reactive power compensator shown in Fig. 3.Two such
Semiconductor module, which shares same exhaust fan, makes air enter heat dissipation base from the main air inlet of the semiconductor module far from exhaust fan
Heat dissipation is carried out at the same time to two semiconductor modules.In other embodiments, semiconductor module can be used in frequency converter, switchgear etc.
On electrical equipment；Semiconductor module also can arrange one, three or four or more along semiconductor arrangement direction；Two semiconductor modules
Block can also be arranged perpendicular to semiconductor arrangement direction.
Heat exchange matrix 1 includes the changeover portion between the two neighboring semiconductor mounting surface, in order to reduce two IGBT it
Between temperature difference, on changeover portion be equipped with for admitted air under exhaust fan suction heat exchange matrix 1 with heat exchange base
Body 1 carries out the auxiliary air inlet opening 2 of heat exchange.Can make in this way apart from a main air inlet IGBT farther out with apart from main air inlet
Closer IGBT's is initial essentially identical into demeanour, passes through the air for entering auxiliary air inlet opening 2 and separate main air inlet in this way
IGBT carries out heat exchange, can reduce the temperature difference between two IGBT, improve the use allowance and stability of IGBT.It solves existing
Present in technology since the temperature difference of two IGBT in parallel is larger caused by IGBT asked using what allowance and stability reduced
Topic.
As shown in figures 1 and 3, for make auxiliary air inlet opening 2 closer to IGBT with facilitate and IGBT carry out heat exchange, this implementation
The side equipped with semiconductor mounting surface is arranged on heat exchange matrix 1 in auxiliary air inlet opening 2 in example, and auxiliary air inlet opening 2 is strip
Shape, the arranged direction of the length direction of auxiliary air inlet opening 2 perpendicular to semiconductor mounting surface.In other embodiments, auxiliary air inlet
Mouth may also be arranged on the separate semiconductor mounting surface of heat exchange matrix 1 or perpendicular to the side of semiconductor mounting surface；Auxiliary air inlet
The hole of the other shapes such as mouth or round hole, rectangular opening, diamond hole.The length direction of two IGBT in the present embodiment with it is auxiliary
Help the length direction of air inlet 2 consistent, in other embodiments, the length direction of IGBT can also be arranged perpendicular to strip hole.Such as
Shown in Fig. 2, to increase the heat dissipation area of heat exchange matrix 1, the heat exchange matrix 1 in the present embodiment includes heat-conducting plate and is arranged in heat conduction
Fin 4 on plate, i.e. heat exchange matrix 1 be finned radiator, fin 4 be arranged heat-conducting plate separate semiconductor mounting surface one
Side, each fin 4 are mutually parallel and are arranged perpendicular to heat-conducting plate.Heat exchange matrix 1 in the present embodiment include finned radiator and
It is encapsulated in the encapsulating housing of finned radiator periphery.Encapsulating housing is surrounded with heat-conducting plate makes air by main air inlet to suction opening
The air flow channel of direction flowing, auxiliary air inlet opening 2 are arranged on heat-conducting plate.To reduce the cost of heat-exchanger rig and ensureing heat exchange effect
Fruit, the heat exchange matrix 1 in the present embodiment are made of aluminium section.In other embodiments, heat exchange matrix can be by the base that exchanges heat
The panel radiator that body itself radiates；Heat exchange matrix can also be made of proximate matters such as copper, aluminium alloys.
The present invention provides a kind of semiconductor heat dissipation device suitable for PRIMPACK encapsulation IGBT parallel connections.Two IGBT are pacified
On the heat-conducting plate of finned radiator, is stayed among two IGBT there are one auxiliary air inlet opening 2, distance can be reduced in this way
The initial air inlet temperature difference of the IGBT of main air inlet farther out and the IGBT closer apart from main air inlet.While it according to calculating and imitating
Very, when the area of auxiliary air inlet opening 2 is equivalent to 1/5th of main air inlet area, the air inlet temperature difference of two IGBT is minimum,
It improves IGBT and uses allowance and stability.In other embodiments, the area of auxiliary air inlet opening can be main air-admitting surface
1/6th, the second-class other values of four parts of First Five-Year Plan point.
The specific embodiment two of the semiconductor module of the present invention, one phase of specific embodiment with the semiconductor module of the present invention
Than differing only in：As shown in figure 5, the transition between the semiconductor mounting surface of two semiconductors adjacent on heat exchange matrix
There are two auxiliary air inlet openings 20 by Duan Shangshe.
The specific embodiment three of the semiconductor module of the present invention, one phase of specific embodiment with the semiconductor module of the present invention
Than differing only in：As shown in fig. 6, the transition between the semiconductor mounting surface of two semiconductors adjacent on heat exchange matrix
For Duan Shangshe there are six auxiliary air inlet opening 21, auxiliary air inlet opening 21 is rectangular opening.
The specific embodiment of the semiconductor heat-exchanger rig of the present invention, the semiconductor heat-exchanger rig and above-mentioned half in the present embodiment
The structure of any one of semiconductor heat-exchanger rig is identical in the specific embodiment one to embodiment three of conductor module, no longer
It repeats.
The specific embodiment of the electrical equipment of the present invention, electrical equipment includes semiconductor module and exhaust fan, the present embodiment
In semiconductor module and semiconductor any one of in the specific embodiment one to embodiment three of above-mentioned semiconductor module
The structure of module is identical, repeats no more.
Claims (8)
1. semiconductor heat-exchanger rig, including heat exchange matrix and it is arranged at intervals on the semiconductor on heat exchange matrix for installing semiconductor
Mounting surface, characterized in that the heat exchange matrix is respectively equipped with suction opening along two end faces of semiconductor mounting surface arranged direction
With the main air inlet for admitting air into heat exchange matrix under exhaust fan suction, the heat exchange matrix includes in adjacent
Changeover portion between two semiconductor mounting surfaces, changeover portion are equipped with for admitting air into heat exchange under exhaust fan suction
Matrix is to carry out the auxiliary air inlet opening of heat exchange with heat exchange matrix.
2. semiconductor heat-exchanger rig according to claim 1, characterized in that the auxiliary air inlet opening is strip, auxiliary
Arranged direction of the length direction of air inlet perpendicular to semiconductor mounting surface.
3. semiconductor heat-exchanger rig according to claim 1 or 2, characterized in that the auxiliary air inlet opening setting is exchanging heat
Matrix is equipped with the side of semiconductor mounting surface.
4. semiconductor heat-exchanger rig according to claim 1 or 2, characterized in that the heat exchange matrix includes finned dissipates
Hot body and the encapsulating housing for being encapsulated in finned radiator periphery.
5. semiconductor heat-exchanger rig according to claim 4, characterized in that the heat exchange matrix includes heat-conducting plate, is partly led
Body mounting surface is arranged on heat-conducting plate, and the side of the separate semiconductor mounting surface of heat-conducting plate is equipped at intervals at least two cooling fins,
Each cooling fin is mutually parallel and is arranged perpendicular to heat-conducting plate, the encapsulating housing and heat-conducting plate surround make air by main air inlet extremely
The air flow channel of suction opening direction flowing, auxiliary air inlet opening are arranged on heat-conducting plate.
6. semiconductor heat-exchanger rig according to claim 1 or 2, characterized in that the area of the auxiliary air inlet opening is main
The 1/4 ~ 1/6 of air-admitting surface.
7. semiconductor module, including semiconductor heat-exchanger rig and semiconductor, the semiconductor heat-exchanger rig include heat exchange matrix and
It is arranged at intervals on the semiconductor mounting surface that semiconductor is installed on heat exchange matrix, characterized in that the heat exchange matrix is pacified along semiconductor
It is respectively equipped with suction opening on two end faces of dress face arranged direction and for admitting air into heat exchange under exhaust fan suction
The main air inlet of matrix, the heat exchange matrix include the changeover portion between the two neighboring semiconductor mounting surface, on changeover portion
Equipped with for admitting air into heat exchange matrix under exhaust fan suction to carry out the auxiliary air inlet of heat exchange with heat exchange matrix
Mouthful.
8. electrical equipment, including semiconductor module and exhaust fan, the semiconductor module includes semiconductor heat-exchanger rig and partly leads
Body, the semiconductor heat-exchanger rig include heat exchange matrix and are arranged at intervals on the semiconductor installation of installation semiconductor on heat exchange matrix
Face, characterized in that the heat exchange matrix is respectively equipped with suction opening and use along two end faces of semiconductor mounting surface arranged direction
In the main air inlet for admitting air into heat exchange matrix under exhaust fan suction, the heat exchange matrix includes in two neighboring
Changeover portion between semiconductor mounting surface, changeover portion are equipped with for admitting air into heat exchange matrix under exhaust fan suction
To carry out the auxiliary air inlet opening of heat exchange with heat exchange matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810226703.4A CN108447832A (en) | 2018-03-19 | 2018-03-19 | Semiconductor heat-exchanger rig, semiconductor module and electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810226703.4A CN108447832A (en) | 2018-03-19 | 2018-03-19 | Semiconductor heat-exchanger rig, semiconductor module and electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108447832A true CN108447832A (en) | 2018-08-24 |
Family
ID=63195795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810226703.4A Pending CN108447832A (en) | 2018-03-19 | 2018-03-19 | Semiconductor heat-exchanger rig, semiconductor module and electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108447832A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101848625A (en) * | 2009-03-26 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat radiating system thereof |
| CN203279432U (en) * | 2013-04-09 | 2013-11-06 | 杭州华三通信技术有限公司 | Electronic device case |
| CN203984859U (en) * | 2014-07-16 | 2014-12-03 | 哈尔滨工业大学深圳研究生院 | A kind of cooling system of electronic load |
| CN204179931U (en) * | 2014-11-27 | 2015-02-25 | 长江三峡能事达电气股份有限公司 | A kind of power born of the same parents structure adopting heat pipe self-cold radiating |
| CN204425196U (en) * | 2015-03-31 | 2015-06-24 | 南京南瑞太阳能科技有限公司 | A kind of power cabinet heat abstractor of photovoltaic DC-to-AC converter |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
-
2018
- 2018-03-19 CN CN201810226703.4A patent/CN108447832A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848625A (en) * | 2009-03-26 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat radiating system thereof |
| CN203279432U (en) * | 2013-04-09 | 2013-11-06 | 杭州华三通信技术有限公司 | Electronic device case |
| CN203984859U (en) * | 2014-07-16 | 2014-12-03 | 哈尔滨工业大学深圳研究生院 | A kind of cooling system of electronic load |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
| CN204179931U (en) * | 2014-11-27 | 2015-02-25 | 长江三峡能事达电气股份有限公司 | A kind of power born of the same parents structure adopting heat pipe self-cold radiating |
| CN204425196U (en) * | 2015-03-31 | 2015-06-24 | 南京南瑞太阳能科技有限公司 | A kind of power cabinet heat abstractor of photovoltaic DC-to-AC converter |
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Application publication date: 20180824 |
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