CN108419368A - A kind of concentric pylone processing method of printed wiring board - Google Patents
A kind of concentric pylone processing method of printed wiring board Download PDFInfo
- Publication number
- CN108419368A CN108419368A CN201810375816.0A CN201810375816A CN108419368A CN 108419368 A CN108419368 A CN 108419368A CN 201810375816 A CN201810375816 A CN 201810375816A CN 108419368 A CN108419368 A CN 108419368A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- hole
- processing method
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention provides a kind of concentric pylone processing methods of printed wiring board comprising following preparation process：1) it is once drilled to printed wiring board；2) sealer processing is carried out to the via hole of printed wiring board；3) copper plating treatment is carried out to printed wiring board, layers of copper covers in step 1) on the hole wall of the through-hole for the formation that once drills；4) after positioning printed wiring board, secondary drilling is carried out to the through-hole after copper facing in step 3), the aperture for the hole body that secondary drilling is formed is more than the aperture for the through-hole that primary drilling is formed.The present invention can efficiently solve the problem of Concentricity tolerance between primary drilling and secondary drilling compared to the prior art.
Description
Technical field
The present invention relates to printed wiring board fields, in particular to a kind of concentric pylone processing side of printed wiring board
Method.
Background technology
Printed wiring board is semi-insulating in order to be formed in printed wiring board mainly including four layers or the above copper coating board of multilayer
It with semi-metal through-hole, needs to do secondary drilling processing to the through-hole in printed wiring board, so that the part covered in through-hole
Layers of copper is removed.
Traditional secondary drilling mainly carries out secondary add by drill point on the basis of primary drilling is formed by through-hole
Work, often can be because of positioning in process the problems such as, be caused once to drill and secondary drilling are formed by the concentricity in two holes
There is deviation, to form the problems such as layers of copper removal is not thorough, influences semi-insulating and semi-metal through-hole function.
Invention content
In consideration of it, the present invention provides one kind can efficiently solving primary drilling and secondary drilling Concentricity tolerance problem
Printed wiring board concentric pylone processing method.
The present invention provides a kind of concentric pylone processing methods of printed wiring board comprising following preparation process：
1) it is once drilled to printed wiring board；
2) sealer processing is carried out to the via hole of printed wiring board；
3) copper plating treatment is carried out to printed wiring board, layers of copper covers in step 1) hole wall of the through-hole for the formation that once drills
On；
4) after positioning printed wiring board, secondary drilling is carried out to the through-hole after copper facing in step 3), what secondary drilling was formed
The aperture of hole body is more than the aperture for the through-hole that primary drilling is formed.
Further, above-mentioned steps 2) in, it is handled using dry film sealer.
Further, above-mentioned dry film is Changxing E9415 dry films.
Further, above-mentioned steps 4) in, the sealer of via hole is removed, after being positioned by via hole, carries out secondary brill
Hole.
Further, above-mentioned steps 4) in, secondary drilling is drilled using back drill technique.
Further, above-mentioned secondary drilling carries out bore operation using 165 ° of wolfram steel one drill points of drill point angle.
Further, use single-side coated copper plate as cover board when above-mentioned drilling.
Further, above-mentioned single-side coated copper plate is 0.50Z.
A kind of concentric pylone processing method of printed wiring board provided by the present invention, it is main compared to the prior art to have
It has the advantage that：Sealer processing is carried out to via hole so that subsequent processing (such as copper facing) does not interfere with via hole so that auxiliary
The precision in hole is retained, and when positioning can eliminate the factor of via hole, so that the concentricity of the through-hole to drill twice
Precision the problem of being improved, efficiently solving Concentricity tolerance between primary drilling and secondary drilling.
Description of the drawings
By reading the detailed description of hereafter preferred embodiment, various other advantages and benefit are common for this field
Technical staff will become clear.Attached drawing only for the purpose of illustrating preferred embodiments, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings：
Fig. 1 is concentric pylone in a kind of concentric pylone processing method of printed wiring board involved by the embodiment of the present invention
Procedure of processing schematic diagram.
Specific implementation mode
The exemplary embodiment of the disclosure is described in more detail below.Although attached drawing shows the exemplary reality of the disclosure
Apply example, it being understood, however, that may be realized in various forms the disclosure without should be limited by embodiments set forth here.Phase
Instead, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can completely pass the scope of the present disclosure
Up to those skilled in the art.
As shown in Figure 1, a kind of concentric pylone processing method of printed wiring board involved by the present embodiment, includes mainly
Following preparation process：
1) it is once drilled to printed wiring board；
2) sealer processing is carried out to the via hole A of printed wiring board, which specifically may be used Changxing E9415 dry films；
3) copper plating treatment is carried out to printed wiring board, layers of copper covers in step 1) hole wall of the through-hole for the formation that once drills
On；
4) sealer of via hole is removed, after being positioned by via hole, back drill is passed through to the through-hole after copper facing in step 3)
Technique carries out secondary drilling, and the aperture for the hole body that secondary drilling is formed is more than the aperture for the through-hole that primary drilling is formed.
It may include into plate → press mold → exposure to carry out the specific production process of sealer processing to the via hole of printed wiring board
Light → development.
Press mold operating procedure specifically includes：1) basis waits for the sub- size selection respective width dry film of pressing plate；2) it removes dry up and down
Film wheel loads onto dry film, and twirl is next to load onto dry film wheel；3) polyethylene protective film for tearing internal layer pad pasting face uses glue around excessive film wheel
Band is sticked on PE idler wheels；4) it after temperature is raised to specified value, opens pressure switch and transmission switch is adjusted to analog value；5) it puts
Enter to be drilled pcb board and carries out press mold production.
Exposing operation step specifically includes：1) energy lattice are done by one block of useless plate for posting film, adjustment energy sound of laughing number is in work
Within the scope of skill；2) it carries out putting plate operation after determining technological parameter；3) it presses vacuum key and inhales vacuum, when vacuum degree reaches setting value
Afterwards, it presses into frame button, frame is just automatically into exposure region.
Developing procedures specifically include：1) developing machine control switch is opened；2) it carries out putting plate after determining technological parameter OK.
Back drill hole making step can specifically include：1) two brill navigation datas are transferred, location hole is drilled out on work top,
And it is implanted into shop bolt using special supplementary module；2) pcb board after plating is positioned on the work top of drilling machine, using fixed
Position pin is inserted in periphery without copper location hole；3) 0.50Z single-side coated copper plates are installed on pcb board as cover board, four side adhesive tape patch jails；
4) check that POSALUX drilling machines interface back drill function is opened；5) 165 ° of drill point angle wolfram steel one drills of the knife diameter that meets the requirements are filled
It fits on drilling machine blade row；6) two brill formulas are transferred to start to drill, subdrilling instrument connection, confirms and controlling depth meets client (or MI is wanted
Ask) start volume production afterwards.
A kind of specific works parameter of the concentric pylone processing method of printed wiring board involved by embodiment such as following table institute
Show.
Sealing of hole：Make to cover layer protecting film in edges of boards periphery holes by video transfer techniques.
Secondary drilling：Required back drill hole is drilled out by mechanical processing to the plank after plating.
To sum up, the concentric pylone processing method for a kind of printed wiring board that the present embodiment is provided, compared to existing skill
Art mainly has the following advantages：Sealer processing is carried out to via hole so that subsequent processing (such as copper facing) does not interfere with via hole,
So that the precision of via hole is retained, when positioning, can eliminate the factor of via hole, so that the through-hole to drill twice
The precision of concentricity the problem of being improved, efficiently solving Concentricity tolerance between primary drilling and secondary drilling.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of concentric pylone processing method of printed wiring board, which is characterized in that including following preparation process：
1) it is once drilled to printed wiring board；
2) sealer processing is carried out to the via hole of printed wiring board；
3) copper plating treatment is carried out to printed wiring board, layers of copper covers in step 1) on the hole wall of the through-hole for the formation that once drills；
4) after positioning printed wiring board, secondary drilling, the hole body that secondary drilling is formed are carried out to the through-hole after copper facing in step 3)
Aperture be more than the aperture of the through-hole that primary drilling is formed.
2. a kind of concentric pylone processing method of printed wiring board according to claim 1, which is characterized in that the step
2) it in, is handled using dry film sealer.
3. a kind of concentric pylone processing method of printed wiring board according to claim 2, which is characterized in that the dry film
For Changxing E9415 dry films.
4. a kind of concentric pylone processing method of printed wiring board according to claim 1, which is characterized in that the step
4) in, the sealer of via hole is removed, after being positioned by via hole, carries out secondary drilling.
5. a kind of concentric pylone processing method of printed wiring board according to claim 1, which is characterized in that the step
4) in, secondary drilling is drilled using back drill technique.
6. the concentric pylone processing method of a kind of printed wiring board according to claim 1 or 5, which is characterized in that secondary
Drilling carries out bore operation using 165 ° of wolfram steel one drill points of drill point angle.
7. a kind of concentric pylone processing method of printed wiring board according to claim 1, which is characterized in that adopted when drilling
Use single-side coated copper plate as cover board.
8. a kind of concentric pylone processing method of printed wiring board according to claim 7, which is characterized in that the single side
Copper-clad plate is 0.50Z.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810375816.0A CN108419368A (en) | 2018-04-24 | 2018-04-24 | A kind of concentric pylone processing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810375816.0A CN108419368A (en) | 2018-04-24 | 2018-04-24 | A kind of concentric pylone processing method of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108419368A true CN108419368A (en) | 2018-08-17 |
Family
ID=63136562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810375816.0A Pending CN108419368A (en) | 2018-04-24 | 2018-04-24 | A kind of concentric pylone processing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108419368A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109618492A (en) * | 2018-11-23 | 2019-04-12 | 广东工业大学 | A kind of processing method of PTFE circuit board apertures |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300412A (en) * | 2011-08-19 | 2011-12-28 | 东莞生益电子有限公司 | Processing method for back drilling of PCB |
| CN105636357A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Method for controlling hole position accuracy of back drill hole |
| CN106793509A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of back drilling method for improving plug-hole |
| CN106735433A (en) * | 2016-12-29 | 2017-05-31 | 新野鼎泰电子精工科技有限公司 | A kind of processing method of PCB printed circuit board (PCB)s backboard drilling |
-
2018
- 2018-04-24 CN CN201810375816.0A patent/CN108419368A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300412A (en) * | 2011-08-19 | 2011-12-28 | 东莞生益电子有限公司 | Processing method for back drilling of PCB |
| CN105636357A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Method for controlling hole position accuracy of back drill hole |
| CN106793509A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of back drilling method for improving plug-hole |
| CN106735433A (en) * | 2016-12-29 | 2017-05-31 | 新野鼎泰电子精工科技有限公司 | A kind of processing method of PCB printed circuit board (PCB)s backboard drilling |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109618492A (en) * | 2018-11-23 | 2019-04-12 | 广东工业大学 | A kind of processing method of PTFE circuit board apertures |
| CN109618492B (en) * | 2018-11-23 | 2021-02-26 | 广东工业大学 | Machining method for PTFE circuit board hole |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180817 |