CN108396929B - Composite ceramic plate and preparation method thereof - Google Patents
Composite ceramic plate and preparation method thereof Download PDFInfo
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- CN108396929B CN108396929B CN201810339226.2A CN201810339226A CN108396929B CN 108396929 B CN108396929 B CN 108396929B CN 201810339226 A CN201810339226 A CN 201810339226A CN 108396929 B CN108396929 B CN 108396929B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 209
- 239000002131 composite material Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 60
- 238000013329 compounding Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 5
- 239000011449 brick Substances 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 41
- 239000007787 solid Substances 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 14
- 239000004831 Hot glue Substances 0.000 claims description 13
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 12
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 12
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- 229920000570 polyether Polymers 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 6
- 239000006004 Quartz sand Substances 0.000 claims description 6
- 229920002472 Starch Polymers 0.000 claims description 6
- -1 alcohol ester Chemical class 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 6
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 6
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 6
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 6
- 229920006255 plastic film Polymers 0.000 claims description 6
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 6
- 239000011118 polyvinyl acetate Substances 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- 239000003469 silicate cement Substances 0.000 claims description 6
- 239000008107 starch Substances 0.000 claims description 6
- 235000019698 starch Nutrition 0.000 claims description 6
- 239000002562 thickening agent Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 238000009472 formulation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000005034 decoration Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- 230000032683 aging Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/14—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass
- E04F13/142—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass with an outer layer of ceramics or clays
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
- C04B28/04—Portland cements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Civil Engineering (AREA)
- Finishing Walls (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a composite ceramic plate which comprises a decorative film, an adhesive layer, a ceramic thin plate, an adhesive layer and a porous ceramic plate which are sequentially arranged in parallel from top to bottom, wherein the adhesive layer is used for bonding the decorative film and the ceramic thin plate, the adhesive layer is used for bonding the ceramic thin plate and the porous ceramic plate, and the ceramic thin plate is a ceramic brick with a surface free of glaze or a surface free of polishing. Correspondingly, the invention also discloses a preparation method of the composite ceramic plate, which comprises the following steps: treating the surface of the ceramic sheet; bonding the decorative film and the ceramic sheet through an adhesive layer; compounding the ceramic thin plate and the porous ceramic plate through an adhesive layer; obtaining the composite ceramic plate. The ceramic decorative plate has good decorative effect by compounding the ceramic thin plate with the porous ceramic plate after the decorative film is arranged on the surface of the ceramic thin plate, and the ceramic decorative plate is light in weight, low in cost and simple in manufacturing process. The composite ceramic plate can be used for inner wall decoration and outer wall decoration.
Description
Technical Field
The invention relates to the technical field of building decoration materials, in particular to a composite ceramic plate and a preparation method thereof.
Background
The surface decoration of the ceramic tile is usually realized by glazing, printing and other processes, and the glazed or printed green tile is fired into the ceramic tile with the surface pattern, so that the ceramic tile can realize diversified patterns, but the patterns are not fine enough, and the cost for arranging the surface patterns is high.
Foamed ceramics have been developed for decades, and have become mature in the application of building ceramics, and gradually enter the stages of large-scale production and building application. Generally, the production process of the foamed ceramic can be divided into a sagger filling process and a cloth direct-pressure forming process according to different production processes, wherein the density of the product produced by the former process is in the range of 0.2-0.8, and the density can be controlled to be about 0.6 in consideration of the problems of transportation and the brittleness strength of the product. After the product is sintered, the semi-finished product is cut into a regular three-dimensional shape by cutting equipment, but the surface of the product is a uniform hole-shaped structure and can be applied only by post decoration. The product is widely applied to indoor partition walls at the present stage, and needs to be subjected to processes such as ceramic scraping and the like at the later stage, so that the surface decoration effect is single.
Disclosure of Invention
The invention aims to provide a composite ceramic plate which has the characteristic of diversified surface decoration effects. .
The invention aims to provide a preparation method of a composite ceramic plate, which has the characteristic of simple process.
To achieve the purpose, the invention adopts the following technical scheme:
the composite ceramic plate comprises a decorative film, an adhesive layer, a ceramic thin plate, an adhesive layer and a porous ceramic plate which are sequentially arranged in parallel from top to bottom, wherein the adhesive layer is used for bonding the decorative film and the ceramic thin plate, the adhesive layer is used for bonding the ceramic thin plate and the porous ceramic plate, and the ceramic thin plate is a ceramic brick with a surface free of glaze or a surface free of polishing.
The ceramic decorative plate has good decorative effect by compounding the ceramic thin plate with the porous ceramic plate after the decorative film is arranged on the surface of the ceramic thin plate, and the ceramic decorative plate is light in weight, low in cost and simple in manufacturing process. The composite ceramic plate can be used for inner wall decoration and outer wall decoration.
Further, the bonding layer comprises a liquid ceramic tile adhesive layer and a solid ceramic tile adhesive layer, the liquid ceramic tile adhesive layer is arranged on the bottom surface of the ceramic sheet and the top surface of the porous ceramic plate, and the solid ceramic tile adhesive layer is arranged between the two liquid ceramic tile adhesive layers. Adopt liquid ceramic tile glue and solid ceramic tile glue to bond ceramic sheet and porous ceramic plate, liquid ceramic tile glue film and solid ceramic tile glue film form the buffering and combine for the cohesiveness and the ageing resistance that two ceramic plates bond are stronger, thereby improve composite ceramic plate's life.
Further, the formula raw materials of the liquid tile adhesive comprise the following components in percentage by weight: 10 to 18 percent of water-soluble phenolic resin glue, 55 to 65 percent of polyvinyl acetate copolymer, 2 to 3 percent of organosilicon modified epoxy resin, 3 to 4 percent of fluorine modified epoxy resin, 0.2 percent of polyacrylic thickener, 0.3 percent of polyether modified siloxane, 0.1 percent of p-hydroxybenzoic acid, 0.4 percent of alcohol ester, 5 percent of quartz powder and 14 percent of deionized water. The liquid ceramic tile adhesive adopting the formula has good heat resistance, leveling property, bonding property with a substrate and pressure resistance.
Further, the formula raw materials of the solid tile glue comprise: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 4-6% of redispersible latex powder, 1-3% of fluorine modified epoxy resin, 0.5-1.5% of organosilicon modified epoxy resin, 0.5-1.5% of hydroxypropyl methyl cellulose, 0.4-0.6% of carboxymethyl starch ether and 0.4-0.6% of polyether modified siloxane. The solid tile adhesive adopting the formula has better leveling property and bonding property.
Further, the adhesive layer is an inorganic adhesive layer or an organic adhesive layer.
Further, the adhesive layer is a hot melt adhesive layer. The hot melt adhesive is adopted as the adhesive layer, so that the adhesion of the decorative film is firmer, and the adhesion step is simple and easy to operate.
Further, the decorative film is a plastic film or a composite film. . Both decorative films have good decorative effect and can be selected according to different use conditions.
Further, the porous ceramic plate is a foamed ceramic, a honeycomb ceramic or a granular ceramic agglomerate. Both ceramic tiles can be used as a substrate to be coated with a decorative film, so that the diversity of products is improved.
The preparation method of the composite ceramic plate comprises the following steps:
treating the surface of the ceramic sheet;
bonding the decorative film and the ceramic sheet through an adhesive layer;
compounding the ceramic thin plate and the porous ceramic plate through an adhesive layer;
obtaining the composite ceramic plate.
Further, in the step of compounding the ceramic sheet and the porous ceramic plate by the adhesive layer: and respectively coating liquid ceramic tile glue on the bottom surface of the ceramic thin plate and the top surface of the porous ceramic plate, and bonding the ceramic thin plate and the porous ceramic plate through solid ceramic tile glue after the liquid ceramic tile glue is dried, wherein the solid ceramic tile glue layer is positioned between the two layers of liquid ceramic tile glue layers.
Further, the adhesive layer is a hot melt adhesive layer.
The beneficial effects of the invention are as follows:
1. by arranging the decorative film on the ceramic substrate with no glaze or polishing surface, compared with the existing sintered ceramic decorative plate, the pattern of the composite plate with the decorative film is finer and more vivid, has better decorative effect, and has low cost and simple manufacturing process;
2. the porous ceramic plate is used as the bottom plate, so that the composite ceramic plate has the characteristic of light weight.
3. Adopt liquid ceramic tile glue and solid ceramic tile glue to bond ceramic sheet and porous ceramic plate, liquid ceramic tile glue film and solid ceramic tile glue film form the buffering and combine for the cohesiveness and the ageing resistance that two ceramic plates bond are stronger, thereby improve composite ceramic plate's life.
Drawings
Fig. 1 is an exploded schematic view of a composite ceramic plate according to an embodiment of the present invention.
Wherein: a decorative film 1, an adhesive layer 2, a ceramic sheet 3, an adhesive layer 4 and a porous ceramic plate 5.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings and the specific embodiments.
The composite ceramic plate comprises a decorative film 1, an adhesive layer 2, a ceramic thin plate 3, an adhesive layer 4 and a porous ceramic plate 5 which are sequentially arranged in parallel from top to bottom, wherein the adhesive layer 2 is used for bonding the decorative film 1 and the ceramic thin plate 3, the adhesive layer 4 is used for bonding the ceramic thin plate 3 and the porous ceramic plate 5, and the ceramic thin plate 3 is a ceramic tile with a surface free of glaze or a surface free of polishing.
By compounding the ceramic decorative plate 3 with the porous ceramic plate 5 after the decorative film 1 is arranged on the surface of the ceramic thin plate 3, the ceramic decorative plate has good decorative effect, and is light in weight, low in cost and simple in manufacturing process. The composite ceramic plate can be used for inner wall decoration and outer wall decoration.
The ceramic sheet 3 can be made of vitrified tiles, has lighter ground color, and can keep the pattern color of the decorative film 1 full without being influenced by the ground color of the ceramic sheet 3. The thickness of the ceramic sheet is 3-5 mm.
The decorative film 1 can be a plastic film, such as a PP film, a PVC film and PVDF film, and the cost of printing or printing patterns on the plastic film is low, and the patterns are fine, the colors are rich, and the surface texture is lifelike. The decorative film 1 may also be a composite film, such as a composite film of a nonwoven fabric and a plastic film, a composite film of a thin veneer and a plastic film, with richer patterns. The thickness of the decorative film is 0.3-2 mm.
The adhesive layer is a hot melt adhesive layer. The hot melt adhesive is adopted as the adhesive layer, so that the adhesion of the decorative film is firmer, and the adhesion step is simple and easy to operate. The parameters of the hot melt adhesive adopted in the embodiment are as follows: the melting temperature is 60+/-10, and the density after melting is 520-640g/L; the melt index of the hot melt adhesive is 150g/min and the melt viscosity is 240Pa.s at 160 ℃. The thickness of the hot melt adhesive layer is 0.5-1.5 mm.
The porous ceramic plate 4 can be foamed ceramic, honeycomb ceramic or granular ceramic aggregate, is made of silicate ceramic materials by high-temperature firing, has high temperature resistance, fire resistance, aging resistance, high strength, difficult volume deformation, good compression resistance and bearing property and insulation resistance. The heat conductivity coefficient of the porous ceramic plate 7 is less than or equal to 0.15W/(m.K). The porosity of the foamed ceramic is 80-90%, the porosity of the honeycomb ceramic is 70%, and the porosity of the granular ceramic aggregate is 30-50%, wherein the porosity refers to the percentage of the open pore volume of the ceramic material to the total volume of the material.
The adhesive layer 4 comprises a liquid tile adhesive layer 41 and a solid tile adhesive layer 42, wherein the liquid tile adhesive layer 41 is arranged on the bottom surface of the ceramic sheet 3 and the top surface of the porous ceramic plate 5, and the solid tile adhesive layer 42 is arranged between the two liquid tile adhesive layers 41. Adopt liquid ceramic tile glue and solid ceramic tile glue to bond ceramic sheet and porous ceramic plate, liquid ceramic tile glue film and solid ceramic tile glue film form the buffering and combine for the cohesiveness and the ageing resistance that two ceramic plates bond are stronger, thereby improve composite ceramic plate's life. The thickness of the liquid ceramic tile adhesive layer is 0.5-1.5 mm, the thickness of the solid ceramic tile adhesive layer is 2-5 mm, preferably, the thickness of the liquid ceramic tile adhesive layer is 0.8-1 mm, and the thickness of the solid ceramic tile adhesive layer is 3-4 mm.
Preferably, the formula raw materials of the liquid tile adhesive comprise the following components in percentage by weight: 10 to 18 percent of water-soluble phenolic resin glue, 55 to 65 percent of polyvinyl acetate copolymer, 2 to 3 percent of organosilicon modified epoxy resin, 3 to 4 percent of fluorine modified epoxy resin, 0.2 percent of polyacrylic thickener, 0.3 percent of polyether modified siloxane, 0.1 percent of p-hydroxybenzoic acid, 0.4 percent of alcohol ester, 5 percent of quartz powder and 14 percent of deionized water. The liquid ceramic tile adhesive adopting the formula has good heat resistance, leveling property, bonding property with a substrate and pressure resistance.
Further preferably, the liquid tile adhesive can be prepared according to the formula 1-3, specifically, the formula 1: 14% of water-soluble phenolic resin glue, 60% of polyvinyl acetate copolymer, 3% of organosilicon modified epoxy resin, 3% of fluorine modified epoxy resin, 0.2% of polyacrylic thickener, 0.3% of polyether modified siloxane, 0.1% of parahydroxybenzoic acid, 0.4% of alcohol ester twelve, 5% of quartz powder and 14% of deionized water;
formula 2: 18% of water-soluble phenolic resin glue, 55% of polyvinyl acetate copolymer, 3% of organosilicon modified epoxy resin, 4% of fluorine modified epoxy resin, 0.2% of polyacrylic thickener, 0.3% of polyether modified siloxane, 0.1% of parahydroxybenzoic acid, 0.4% of alcohol ester twelve, 5% of quartz powder and 14% of deionized water;
formula 3: 10% of water-soluble phenolic resin glue, 65% of polyvinyl acetate copolymer, 2% of organosilicon modified epoxy resin, 3% of fluorine modified epoxy resin, 0.2% of polyacrylic thickener, 0.3% of polyether modified siloxane, 0.1% of parahydroxybenzoic acid, 0.4% of alcohol ester twelve, 5% of quartz powder and 14% of deionized water.
The liquid tile adhesive forms a layer of film and has cohesiveness to vitrified tiles with low water absorption, thereby greatly reducing the risks of hollowing and falling off of the tiles. The compression shear adhesive strength of the liquid tile adhesive after heat aging is 0.2MPa, the tensile adhesive strength of the liquid tile adhesive after the open time is prolonged by 30min is 0.2MPa, and the liquid tile adhesive meets JC/T547-2005 standard. The liquid ceramic tile adhesive meets the national standard GB18582-2008 of limiting the harmful substances of interior decoration materials and adhesives.
Preferably, the solid tile glue comprises the following formula raw materials: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 4-6% of redispersible latex powder, 1-3% of fluorine modified epoxy resin, 0.5-1.5% of organosilicon modified epoxy resin, 0.5-1.5% of hydroxypropyl methyl cellulose, 0.4-0.6% of carboxymethyl starch ether and 0.4-0.6% of polyether modified siloxane. The solid tile adhesive adopting the formula has better leveling property and bonding property.
Further preferred is: the solid tile adhesive can adopt a formula 1-3, specifically a formula 1: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 5% of redispersible latex powder, 2% of fluorine modified epoxy resin, 1% of organosilicon modified epoxy resin, 1% of hydroxypropyl methyl cellulose, 0.5% of carboxymethyl starch ether and 0.5% of polyether modified siloxane;
formula 2: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 4% of redispersible latex powder, 3% of fluorine modified epoxy resin, 0.5% of organic silicon modified epoxy resin, 1.5% of hydroxypropyl methyl cellulose, 0.6% of carboxymethyl starch ether and 0.4% of polyether modified siloxane;
formula 3: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 6% of redispersible latex powder, 1% of fluorine modified epoxy resin, 1.5% of organic silicon modified epoxy resin, 0.5% of hydroxypropyl methyl cellulose, 0.4% of carboxymethyl starch ether and 0.6% of polyether modified siloxane.
The solid tile glue is in powder form, and is mixed into sticky state by adding water when in use. The tensile bonding strength of the solid ceramic tile adhesive is more than or equal to 0.5MPa (the bonding strength after soaking, heat aging and airing for 20 min) and meets the C1 standard in JC/T547-2005.
Further, in other embodiments, the adhesive layer is an inorganic adhesive layer or an organic adhesive layer.
The preparation method of the composite ceramic plate comprises the following steps:
s1, treating the surface of the ceramic thin plate 3, namely cleaning dust particles on the surface of the ceramic thin plate 3, and ensuring that the adhesion surface of the film has no large particles.
S2, bonding the decorative film 1 and the ceramic thin plate 3 through the adhesive layer 2. The hot melt adhesive layer 2 can be directly attached to the bottom surface of the decorative film 1, and when the decorative film 1 with the hot melt adhesive layer 2 is required to be compounded with the ceramic tile 3, the decorative film is adhered to the surface of the ceramic tile 3 through a pressing machine, so that the operation is simple and quick.
Alternatively, the hot melt adhesive powder may be melted, the hot melt adhesive melt may be applied to the bottom surface of the decorative film 1 or the surface of the tile 3, and then the decorative film 1 may be applied to the tile 3. The method for applying the decorative film 1 has low equipment requirement and saves equipment cost.
S3, compounding the ceramic thin plate 3 and the porous ceramic plate 5 through the adhesive layer 4; obtaining the composite ceramic plate.
Specifically, the bottom surface of the ceramic sheet 3 and the top surface of the porous ceramic plate 5 are coated with liquid tile glue respectively, and after the liquid tile glue dries, the ceramic sheet and the porous ceramic plate are bonded by the solid tile glue, that is, the solid tile glue layer 42 is located between the two liquid tile glue layers 41.
When the liquid ceramic tile glue is coated, a layer of liquid ceramic tile glue is coated on the bottom surface of the ceramic tile sheet 1 and the top surface of the porous ceramic plate 7 by using a hairbrush, the ceramic tile sheet and the porous ceramic plate are kept stand for 10-15 min, after the liquid ceramic tile glue is dried, the ceramic tile sheet and the porous ceramic plate are bonded by using the solid ceramic tile glue which is blended into a sticky state, and then the ceramic tile sheet and the porous ceramic plate are kept stand for 24 hours.
The liquid tile glue can fully infiltrate into the tile thin plate and the porous ceramic plate, forms a buffer bonding layer with the solid tile glue, combines the tile glue in the two layers, and has stronger adhesiveness and ageing resistance.
The preparation method of the composite ceramic plate is simple and easy to operate.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (7)
1. The composite ceramic plate is characterized by comprising a decorative film, an adhesive layer, a ceramic thin plate, an adhesive layer and a porous ceramic plate which are sequentially arranged in parallel from top to bottom, wherein the adhesive layer is used for bonding the decorative film and the ceramic thin plate, the adhesive layer is used for bonding the ceramic thin plate and the porous ceramic plate, and the ceramic thin plate is a ceramic brick with a surface free of glaze or a surface free of polishing;
the bonding layer comprises a liquid ceramic tile adhesive layer and a solid ceramic tile adhesive layer, the liquid ceramic tile adhesive layer is arranged on the bottom surface of the ceramic thin plate and the top surface of the porous ceramic plate, and the solid ceramic tile adhesive layer is positioned between the two liquid ceramic tile adhesive layers;
the liquid ceramic tile adhesive comprises the following formula raw materials in percentage by weight: 10 to 18 percent of water-soluble phenolic resin glue, 55 to 65 percent of polyvinyl acetate copolymer, 2 to 3 percent of organosilicon modified epoxy resin, 3 to 4 percent of fluorine modified epoxy resin, 0.2 percent of polyacrylic thickener, 0.3 percent of polyether modified siloxane, 0.1 percent of p-hydroxybenzoic acid, 0.4 percent of alcohol ester, 5 percent of quartz powder and 14 percent of deionized water.
2. The composite ceramic tile glue of claim 1, wherein the solid tile glue formulation comprises: 55% of ordinary silicate cement, 25% of quartz sand, 10% of heavy calcium carbonate, 4-6% of redispersible latex powder, 1-3% of fluorine modified epoxy resin, 0.5-1.5% of organosilicon modified epoxy resin, 0.5-1.5% of hydroxypropyl methyl cellulose, 0.4-0.6% of carboxymethyl starch ether and 0.4-0.6% of polyether modified siloxane.
3. The composite ceramic panel of claim 1, wherein the adhesive layer is a hot melt adhesive layer.
4. The composite ceramic sheet material of claim 1, wherein the decorative film is a plastic film or a composite film.
5. The composite ceramic sheet according to claim 1, wherein the porous ceramic plate is a foamed ceramic, a honeycomb ceramic or a granular ceramic monolith.
6. A method of preparing the composite ceramic sheet material of claim 1, comprising the steps of:
treating the surface of the ceramic sheet;
bonding the decorative film and the ceramic sheet through an adhesive layer;
compounding the ceramic thin plate and the porous ceramic plate through an adhesive layer;
obtaining the composite ceramic plate.
7. The method of manufacturing a composite ceramic plate according to claim 6, wherein in the step of compositing the ceramic thin plate and the porous ceramic plate by the adhesive layer: and the bottom surface of the ceramic thin plate and the top surface of the porous ceramic plate are respectively coated with liquid ceramic tile glue, and after the liquid ceramic tile glue is dried, the ceramic thin plate and the porous ceramic plate are bonded through the solid ceramic tile glue, namely the solid ceramic tile glue layer is positioned between the two layers of liquid ceramic tile glue layers.
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Address after: 528000, Floor 3, Building 5, No. 3 Jiaxue Road, Nanzhuang Town, Chancheng District, Foshan City, Guangdong Province (Residence application) Patentee after: GUANGDONG KITO CERAMICS GROUP Co.,Ltd. Patentee after: FOSHAN JINYI GREEN ENERGY NEW MATERIAL TECHNOLOGY Co.,Ltd. Address before: 528000 zuotan Private Development Zone, southwest Street, Sanshui District, Foshan City, Guangdong Province (F6) Patentee before: GUANGDONG KITO CERAMICS GROUP Co.,Ltd. Patentee before: FOSHAN JINYI GREEN ENERGY NEW MATERIAL TECHNOLOGY Co.,Ltd. |