CN108389821A - A kind of wafer individually picks and places and precise positioning mechanism with MASK - Google Patents
A kind of wafer individually picks and places and precise positioning mechanism with MASK Download PDFInfo
- Publication number
- CN108389821A CN108389821A CN201810421572.5A CN201810421572A CN108389821A CN 108389821 A CN108389821 A CN 108389821A CN 201810421572 A CN201810421572 A CN 201810421572A CN 108389821 A CN108389821 A CN 108389821A
- Authority
- CN
- China
- Prior art keywords
- wafer
- mask
- support plate
- support element
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 241000233855 Orchidaceae Species 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract 7
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000003028 elevating effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafers and MASK individually to pick and place and precise positioning mechanism, including the lifting shaft vertically lifted, wafer support plate, MASK, and positioning carrier, at least three supporting rods are provided at the top of lifting shaft, it is used to support the first support element of wafer support plate there are one being respectively provided on each supporting rod and one is located at first support element top, it is used to support the second support element of MASK, it is provided with for supporting rod on positioning carrier, first support element and the second support element vertically pass through the first of positioning carrier to step down and are open, the second resigning opening that wafer support plate is vertically passed through for the second support element is additionally provided on wafer support plate.The beneficial effects of the invention are as follows：It solves the problems, such as wafer and MASK precise positionings in vacuum environment, also creatively devises double-layer lifting device, realize that wafer and the independent of MASK take, put.
Description
Technical field
The present invention relates to wafer processing techniques field, especially a kind of wafer individually picks and places and precise positioning machine with MASK
Structure.
Background technology
In semiconductor PVD, CVD technique, it is often necessary to be placed above wafer in vacuum environment of different shapes
MASK（Mask plate）, by specific figure on MASK, the film of specific function is deposited in crystal column surface.To ensure the essence of film
Degree, must be requested that wafer and MASK precise positionings.But that there are positioning accuracies is low for existing detent mechanism, is difficult to quantity-produced technology
Problem.
Invention content
It is an object of the invention to overcome the prior art, a kind of wafer is provided and is individually picked and placeed with MASK and precisely calmly
Position mechanism, may be implemented during continuous coating, wafer and MASK individually pick and place and precise positioning, in wafer table
The film that face deposits special shape provides necessary condition.
Coordinate wafer manipulator, realize the precise locating function of wafer and MASK in vacuum environment, while ensureing wafer
It can individually be picked and placeed with MASK, be convenient for continuous production
The purpose of the present invention is achieved through the following technical solutions：A kind of wafer and MASK individually pick and place with precise positioning mechanism,
Lifting shaft including vertically lifting, wafer support plate, MASK for containing wafer（Mask plate）And fixed setting and
It is used to support wafer support plate and the positioning carrier of MASK, horizontally extending connecting plate is provided at the top of lifting shaft,
It is provided at least three supporting rods being arranged in vertical at the top of connecting plate, is respectively provided on each supporting rod there are one being used for
First support element of support wafer support plate and second support for being located above first support element, being used to support MASK
Part, wafer support plate is horizontally-supported by the first support element, MASK it is horizontally-supported by the second support element and positioned at wafer support plate just on
Side, when lifting arm is located at a high position, positioning carrier is located at the lower section of MASK and wafer support plate, is set on the positioning carrier
It is equipped with the first resigning opening that positioning carrier is vertically passed through for supporting rod, the first support element and the second support element, it is fixed
Multiple positioning pins extended in the vertical direction are additionally provided on the carrier of position, are provided on the MASK and the positioning pin phase
The first positioning hole of cooperation, be provided on wafer support plate with the matched second location hole of the positioning pin, on wafer support plate also
It is provided with the second resigning opening that wafer support plate is vertically passed through for the second support element.When lifting shaft declines downwards from high-order
When to status, supporting rod vertical downward movement, first support element out of first resigning opening pass through vertically down first
The first resigning opening of carrier is positioned, while the first positioning hole of wafer support plate is set on positioning pin, and finally by positioning
Carrier supports wafer support plate, supporting rod to continue vertically downward, and what the second support element was passed down through wafer support plate successively second allows
First resigning opening of position opening and positioning carrier, meanwhile, the second vacancy hole of MASK is set on positioning pin, and final
MASK is covered on wafer support plate.Supporting rod continuation completely disengages wafer support plate and MASK vertically downward.
When work, lifting shaft is risen into highest order, then wafer support plate is placed under elevating mechanism by manipulator
Layer, then elevating mechanism declines a distance, then MASK is placed to the upper layer of elevating mechanism by manipulator, can guarantee in this way
Wafer and the independent of MASK pick and place.It is carried with positioning by the first positioning hole in the second location hole and MASK on wafer support plate
The cooperation of the positioning pin of disk, it is ensured that the site error of wafer and MASK are less than ± 0.1mm.The space reserved between supporting rod, side
Just manipulator disengaging picks and places wafer and MASK.There are four supporting rods for setting in the present embodiment.Preferably, it is arranged on the MASK
Have with the matched third location hole of manipulator, be provided on the wafer support plate and matched 4th positioning of manipulator
Hole.
It includes the fixation of fixed setting that the lifting axis connection, which drives its driving device lifted, the driving device,
Flange is provided with the through-hole passed through for lifting shaft on mounting flange, and the bottom of mounting flange is installed with straight line module successively
The driving motor vertically lifted with the sliding block of driving straight line module, the bottom of lifting shaft is fixedly connected with a slide block.It is fixed
Flange and positioning carrier can be fixedly installed in rack.It is driven and is lifted by servo motor, accurately control lifting distance.
Preferably, it is equipped with and is set in outside lifting shaft, for sealing lifting shaft between the sliding block and mounting flange
Welding bellows.
The present invention has the following advantages：
The present invention has well solved the problem of wafer is with MASK precise positionings in vacuum environment, also creatively devises double
Layer lifting gear realizes that wafer and the independent of MASK take, put.Therefore, wafer is only needed to change, quantity-produced mesh can be reached
, production efficiency is substantially increased, while having saved cost.By the cooperation of pin hole, wafer and the automatic precision of MASK are realized
It determines bit function, ensures that position error is less than ± 0.1mm.By the way that double-layer lifting mechanism is arranged, realize that wafer and MASK's is independent
It picks and places.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention.
Fig. 2 is the dimensional structure diagram of the present invention.
Fig. 3 is integrally-built dimensional structure diagram after the lifting shaft of the present invention declines.
Fig. 4 is the schematic diagram of wafer support plate and the first support element fit structure in one embodiment of the invention.
Fig. 5 is the schematic diagram of MASK and the second support element fit structure in one embodiment of the invention.
Fig. 6 is the structural schematic diagram that loading plate is positioned in one embodiment of the invention.
Specific implementation mode
The present invention will be further described below in conjunction with the accompanying drawings：
As shown in figs 1 to 6, a kind of wafer and MASK are individually picked and placeed and precise positioning mechanism, including the liter that vertically lifts
Axis 1, wafer support plate 8, MASK for containing wafer drop（Mask plate）7 and fixed setting and be used to support 8 and of wafer support plate
The top of the positioning carrier 4 of MASK7, lifting shaft 1 is provided with horizontally extending connecting plate 2, and the top of connecting plate 2 is set
At least three supporting rods 3 being arranged in vertical are equipped with, are respectively provided on each supporting rod 3 there are one being used to support wafer support plate
8 the first support element 5 and second support element 6 for being located at first support element, 5 top, being used to support MASK7, wafer
Plate 8 is horizontally-supported by the first support element 5, and MASK7 is horizontally-supported by the second support element 6 and surface positioned at wafer support plate 8, when
When lifting arm is located at high-order, positioning carrier 4 is located at the lower section of MASK7 and wafer support plate 8, is set on the positioning carrier 4
It is equipped with the first resigning opening that positioning carrier 4 is vertically passed through for supporting rod 3, the first support element 5 and the second support element 6
15, position carrier 4 on be additionally provided with multiple positioning pins 9 extended in the vertical direction, be provided on the MASK7 with it is described
9 matched first positioning hole 10 of positioning pin is provided with and 9 matched second location hole of the positioning pin on wafer support plate 8
11, it is additionally provided on wafer support plate 8 and vertically passes through the second of wafer support plate 8 to step down opening 12 for the second support element 6.When
When lifting shaft 1 is lowered down to status from a high position, supporting rod 3 vertical downward movement, first support out of first resigning opening 15
Part 5 passes through the first resigning opening 15 of positioning carrier 4, while the first positioning of wafer support plate 8 vertically down first
Hole 10 is set on positioning pin 9, and finally supports wafer support plate 8, supporting rod 3 to continue vertically downward by positioning carrier 4, and second
Support element 6 be passed down through successively wafer support plate 8 second step down opening 12 and positioning carrier 4 first step down opening 15, together
When, the second vacancy hole of MASK7 is set on positioning pin 9, and final MASK7 is covered on wafer support plate 8.Supporting rod 3 continues
Wafer support plate 8 and MASK7 are completely disengaged vertically downward.
When work, lifting shaft 1 is risen into highest order, wafer support plate 8 is then placed on by elevating mechanism by manipulator
Lower layer, then elevating mechanism declines a distance, then MASK7 is placed to the upper layer of elevating mechanism by manipulator, in this way
Ensure that wafer and the independent of MASK7 pick and place.Pass through the first positioning hole in the second location hole 11 and MASK7 on wafer support plate 8
10 with positioning carrier 4 positioning pin 9 cooperation, it is ensured that the site error of wafer and MASK7 be less than ± 0.1mm.Supporting rod 3
Between reserve space, facilitate manipulator disengaging pick and place wafer and MASK7.There are four supporting rods 3 for setting in the present embodiment.It is preferred that
, be provided on the MASK7 with the matched third location hole 13 of manipulator, be provided on the wafer support plate 8 with
Matched 4th location hole 14 of manipulator.
It includes consolidating for fixed setting that the connection of lifting shaft 1, which drives the driving device of its lifting, the driving device,
Determine flange 17, the through-hole passed through for lifting shaft 1 is provided on mounting flange 17, the bottom of mounting flange 17 is installed with successively
The driving motor 19 that the sliding block of straight line module 18 and driving straight line module 18 vertically lifts, the bottom of lifting shaft 1 and cunning
Block is fixedly connected.Mounting flange 17 and positioning carrier 4 can be fixedly installed on rack（It is not shown in figure）On.By servo motor
Driving lifting, accurately controls lifting distance.
Preferably, it is equipped with and is set in outside lifting shaft 1, for sealing lifting between the sliding block and mounting flange 17
The welding bellows 20 of axis 1.
The surface that carrier 4 is mounted on elevating mechanism is positioned, 4 intermediate hollow out of carrier is positioned, convenient for elevating mechanism
Four supporting rods 3 lift.Three positioning pins 9 of disk circumference, position is consistent with the location hole of wafer support plate 8 and MASK7, protects
Positioning accuracy after card placement.
Support element is mounted on the supporting rod 3 of elevating mechanism, totally eight in the present embodiment, is divided into upper layer and lower layer, upper layer is used
Place MASK7, lower layer is used for placing wafer support plate 8.By adjusting the position height of every support element, ensure every layer of support element
Apparent height is consistent, by adjusting angle, ensures the gap between support element and wafer support plate 8 and MASK7, while ensureing upper layer
Support element, which just can step down to be open from 12 from the second of wafer support plate 8, to be passed through.
MASK7 is circular flat plate structure, intermediate according to coating process needs, processes different pattern.MASK7 surroundings processing the
A positioning hole 10 and third location hole 13, first positioning hole 10 coordinate with the positioning pin 9 on positioning carrier 4, guarantee and wafer
Positional precision, the positioning pin 9 of third location hole 13 and mechanical paw on hand coordinates, and ensures essence when manipulator picks and places MASK7
Degree.
Wafer support plate 8 is circular flat plate structure, intermediate to process wafer carrying table top according to wafer size.Wafer surrounding is processed
Second location hole 11 and the 4th location hole 14, third location hole 13 with positioning carrier 4 on positioning pin 9 coordinate, ensure with
The positional precision of MASK7, the 4th location hole 14 coordinates with the positioning pin 9 of mechanical paw on hand, when ensureing that manipulator picks and places wafer
Precision.Meanwhile the second resigning of 8 surrounding of wafer support plate processing opening 12, position is consistent with the second support element 6, ensures placement
When MASK7, the second support element 6 will not interfere with wafer support plate 8.
Claims (4)
1. a kind of wafer individually picks and places and precise positioning mechanism with MASK, it is characterised in that：Including the liter vertically lifted
It drop axis, the wafer support plate for containing wafer, MASK and fixed setting and is used to support the positioning of wafer support plate and MASK and holds
Load plate is provided with horizontally extending connecting plate at the top of lifting shaft, and at least three are provided at the top of connecting plate along hanging down
Histogram is respectively provided with that there are one the first support element for being used to support wafer support plate and one on each supporting rod to the supporting rod of setting
Above first support element, it is used to support the second support element of MASK, wafer support plate is horizontally-supported by the first support element,
MASK is horizontally-supported by the second support element and is located at the surface of wafer support plate, when lifting arm is located at a high position, positions carrier
Positioned at the lower section of MASK and wafer support plate, it is provided on the positioning carrier for supporting rod, the first support element and second
Support member vertically pass through positioning carrier first step down opening, position carrier on be additionally provided with it is multiple vertically
The positioning pin of extension, be provided on the MASK with the matched first positioning hole of the positioning pin, be arranged on wafer support plate
Have with the matched second location hole of the positioning pin, be additionally provided on wafer support plate and vertically passed through for the second support element
The second of wafer support plate, which is stepped down, to be open.
2. a kind of wafer according to claim 1 individually picks and places and precise positioning mechanism with MASK, it is characterised in that：It is described
MASK on be provided with the matched third location hole of manipulator, be provided on the wafer support plate and matched with manipulator
The 4th location hole.
3. a kind of wafer according to claim 1 individually picks and places and precise positioning mechanism with MASK, it is characterised in that：It is described
Lifting axis connection drive its lift driving device, the driving device include fixed setting mounting flange, fixation
The through-hole passed through for lifting shaft is provided on orchid, the bottom of mounting flange is installed with straight line module and driving straight line mould successively
The driving motor that the sliding block of group vertically lifts, the bottom of lifting shaft is fixedly connected with a slide block.
4. a kind of wafer according to claim 3 individually picks and places and precise positioning mechanism with MASK, it is characterised in that：It is described
Sliding block and mounting flange between be equipped be set in outside lifting shaft, the welding bellows for sealing lifting shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810421572.5A CN108389821A (en) | 2018-05-04 | 2018-05-04 | A kind of wafer individually picks and places and precise positioning mechanism with MASK |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810421572.5A CN108389821A (en) | 2018-05-04 | 2018-05-04 | A kind of wafer individually picks and places and precise positioning mechanism with MASK |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108389821A true CN108389821A (en) | 2018-08-10 |
Family
ID=63070340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810421572.5A Pending CN108389821A (en) | 2018-05-04 | 2018-05-04 | A kind of wafer individually picks and places and precise positioning mechanism with MASK |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108389821A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686689A (en) * | 2018-12-14 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer device for attaching/detaching |
| CN111223789A (en) * | 2018-11-27 | 2020-06-02 | 深圳市永盛隆科技有限公司 | Lifting mechanism for chamber and semiconductor processing equipment |
| CN111468814A (en) * | 2019-01-23 | 2020-07-31 | 湖南汉坤建筑安保器材有限公司 | High-frequency butt-welding device with accurate positioning function |
| CN112164670A (en) * | 2020-09-28 | 2021-01-01 | 西安微电子技术研究所 | Visual alignment column planting device and method for CCGA device |
| CN113130373A (en) * | 2020-01-16 | 2021-07-16 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
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| CN208142152U (en) * | 2018-05-04 | 2018-11-23 | 成都华聚科技有限公司 | A kind of wafer and MASK are individually picked and placed and precise positioning mechanism |
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| JP2009016678A (en) * | 2007-07-06 | 2009-01-22 | Yaskawa Electric Corp | Stage device, its lifting control method, and exposure device using stage device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223789A (en) * | 2018-11-27 | 2020-06-02 | 深圳市永盛隆科技有限公司 | Lifting mechanism for chamber and semiconductor processing equipment |
| CN111223789B (en) * | 2018-11-27 | 2024-04-26 | 紫石能源有限公司 | Lifting mechanism for chamber and semiconductor processing equipment |
| CN109686689A (en) * | 2018-12-14 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer device for attaching/detaching |
| CN111468814A (en) * | 2019-01-23 | 2020-07-31 | 湖南汉坤建筑安保器材有限公司 | High-frequency butt-welding device with accurate positioning function |
| CN113130373A (en) * | 2020-01-16 | 2021-07-16 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113130373B (en) * | 2020-01-16 | 2024-05-14 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN112164670A (en) * | 2020-09-28 | 2021-01-01 | 西安微电子技术研究所 | Visual alignment column planting device and method for CCGA device |
| CN112164670B (en) * | 2020-09-28 | 2023-09-26 | 珠海天成先进半导体科技有限公司 | Visual alignment column planting device and method for CCGA (CCGA) device |
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