CN108375447A - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN108375447A CN108375447A CN201810171575.8A CN201810171575A CN108375447A CN 108375447 A CN108375447 A CN 108375447A CN 201810171575 A CN201810171575 A CN 201810171575A CN 108375447 A CN108375447 A CN 108375447A
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- Prior art keywords
- detecting element
- pressure detecting
- mentioned
- pressure sensor
- joint component
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of pressure sensor, even if the pressure sensor is in the case where enclosed resin is expanded because heated, or, enclosed resin is cooled and in the case of shrinking, thermal stress will not be generated between pressure detecting element and the substrate for connecting outside lead, substrate is not in damaged damage, can reliably carry out pressure detecting.The pressure sensor has：It is formed with the joint component (14) of flow path (12)；The pressure detecting element (16) configured in a manner of opposed with the flow path of joint component；The outside lead (54) being connect with pressure detecting element；And the enclosed resin portion (52) of bonding agent is filled to the gap for the inside for being formed in cover member (42) and constitutes, pressure detecting element (16) is configured with the substrate (38) for connecting outside lead (54) with the state of abutting.
Description
The application is divisional application；Its female case application No. is " 2013101988911 ", entitled " pressure sensings
Device ".
Technical field
The present invention relates to liquid-seal type pressure sensors.
Background technology
All the time, the pressure sensor as detection Fluid pressure, in (the Japanese Unexamined Patent Publication 2012- of patent document 1
No. 68105 bulletins) in disclose be configured without gap so that moisture will not from outside intrusion liquid-seal type pressure sensor
100。
As shown in figure 5, the pressure sensor 100 is by pressure detecting element 102, joint component 104 and cover member 106
Combination constitute.
Also, the peripheral edge portion of made of metal diaphragm 108 is hermetic fastened on pressure detecting element 102 by welding
A side end face (bottom surface) on.Wire bonding 112 is by terminal pin 114 and the following table in pressure detecting element 102 is arranged
The sensor chip 110 in face connects.
Also, it as shown in figure 5, the terminal pin 114 is connected to substrate 116, is connect with outside lead 118.Also, cover member
Be sealed with the enclosed resin 122 being made of bonding agent in space in 106, also, cover member 106 and joint component 104 it
Between space in, be also sealed with the enclosed resin 124 being made of bonding agent.Gap is not present as a result, prevents the liquid such as moisture
Into inside.
In addition, in the pressure sensor 100 of patent document 1, as shown in figure 5, constitute the cover member 106 of waterproof shell
Shape be by as large-diameter portion cover main body portion 120a, be extended in the stage portion 120b of internal side diameter and from the stage portion
120b vertically erects the structure that the small diameter portion 120c of setting is constituted.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2012-68105 bulletins
Invention content
But in that liquid-seal type pressure sensor 100 described in Patent Document 1 existing in this way, as shown in figure 5,
The gap T for separating certain intervals is formd between pressure detecting element 102 and substrate 116.
Therefore, in the pressure sensor 100 of the patent document 1, enclose resin 122 enter pressure detecting element 102 with
Between substrate 116, in the case where enclosed resin 122 expand due to heated, alternatively, enclosed resin 122 is cooled and contraction
In the case of, as shown in the arrow A of Fig. 5, generate thermal stress.
As a result, because of the thermal stress, the damaged damage sometimes of substrate 116 can not reliably carry out the detection of pressure.
In addition, in the case where enclosed resin 122 expand due to heated, alternatively, enclosed resin 122 is cooled and contraction
In the case of, generate thermal stress between pressure detecting element 102 and the substrate 116 being connect with outside lead 118.
Damage is generated with the coupling part 128 for the terminal pin 114 for connecting pressure detecting element 102 and substrate 116 as a result,
Electrical connection is cut off, and connecting substrate 116 generates damage with the coupling part 130 of outside lead 118 and is electrically connected and is cut off sometimes,
It can not carry out accurate pressure detecting.
Also, as shown in figure 5, the shape of pressure detecting element 102 and the substrate 116 that is connect with outside lead 118 to leave
State is configured, thus pressure detecting element 102 and outside lead 118 connect substrate 116 between there are gap T.Therefore,
It needs largely to constitute the enclosed resin 122 of bonding agent, cost is got higher, and pressure sensor itself also becomes large-scale.
The present invention is in view of such present situation, and its purpose is to provide following pressure sensors, even if the pressure sensor
In the case where enclosed resin expand due to heated alternatively, enclosed resin is cooled and in the case of shrinking, pressure detecting element
With thermal stress will not be generated between the substrate for connecting outside lead, substrate is not in damaged damage, can reliably be carried out
Pressure detecting.
It is further an object that providing such as lower pressure sensor, the pressure sensor is in enclosed resin because heated
And in the case of expanding, alternatively, enclosed resin it is cooled and in the case of shrinking, be not in by pressure detecting element and base
The interconnecting piece of cut-off situation or connecting substrate and outside lead is damaged and be electrically connected in the coupling part of the terminal pin of plate connection
Divide damage and be electrically connected cut-off situation, can reliably carry out pressure detecting.
In addition, the purpose of the present invention is to provide such as lower pressure sensor, in the pressure sensor, bonding agent envelope is constituted
The quantitative change for entering resin is few, can reduce cost and pressure sensor is enabled to become compact and small-sized.
The present invention is the invention completed to realize above-mentioned project and purpose in the prior art, pressure of the invention
Sensor is characterized in that having：It is formed with the joint component of flow path；It is fastened to detect the Fluid pressure in above-mentioned flow path
On above-mentioned joint component, and the pressure detecting element configured in a manner of opposed with the flow path of joint component；With above-mentioned pressure
The outside lead of detecting element connection；And fill to the gap for the inside for being formed in cover member and constitute the enclosed tree of bonding agent
Fat portion, above-mentioned pressure detecting element are configured with the substrate for connecting outside lead with the state abutted.
With this configuration, matched with the state abutted with the substrate for connecting outside lead due to pressure detecting element
It sets, so gap is not present between pressure detecting element and the substrate for connecting outside lead.As a result, bonding agent is constituted in injection
In the case of enclosed resin, enclosed resin is also not present between pressure detecting element and the substrate of connection outside lead.
Therefore, in the case where enclosed resin is expanded because heated, alternatively, the case where enclosed resin is cooled and shrinks
Under, thermal stress will not be generated between pressure detecting element and the substrate for connecting outside lead, substrate is not in damaged damage,
Pressure detecting can reliably be carried out.
In addition, because not generating thermal stress between pressure detecting element and the substrate for connecting outside lead, will not go out
It now is electrically connected cut-off situation with the coupling part of pressure detecting element and the terminal pin of substrate connection is damaged, or connection
Substrate damages with the coupling part of outside lead and is electrically connected cut-off situation, can reliably carry out pressure detecting.
Also, since pressure detecting element is configured with the substrate for connecting outside lead with the state abutted, so
Gap is not present between pressure detecting element and the substrate for connecting outside lead.Therefore, the amount of the enclosed resin of bonding agent is constituted
It tails off, cost can be reduced and pressure sensor is enabled to become compact and small-sized.
In addition, the pressure sensor of the present invention is characterized in that, above-mentioned cover member is to accommodate the part for enclosing resin portion
In have the barrel shape of the part for substantially vertically erectting setting.
With this configuration, cover member is that have the portion for substantially vertically erectting setting in accommodating the part for enclosing resin
The barrel shape divided, therefore there is the stage portion being extended in internal side diameter unlike the past, the enclosed resin portion of cover member is
Open state.
Therefore, even if in the case where enclosed resin is expanded because heated, in the member of enclosed resin and pressure detecting element
Stripping will not be generated between part main body because of thermal stress, defective insulation will not be generated or to pressure because moisture is externally entering
Power detecting element brings the influences such as corrosion, can carry out accurate pressure detecting.
In addition, cover member is the cylinder for having in accommodating the part for enclosing resin portion the part for substantially vertically erectting setting
Shape, so, unlike the past, exists and be extended the stage portion in internal side diameter, small diameter portion, the enclosed resin portion of cover member
As open state.
Therefore, when resin is enclosed in injection, injection operation is easy, and without spending time and labor, can reduce cost, and
And resin is throughout the entire cover for constituting waterproof shell, it is bad not will produce injection, generates bubble, will not crack, Bu Huiyin
Moisture is externally entering and generates defective insulation or bring the influences such as corrosion to pressure detecting element, can accurately be pressed
Power detects.
The effect of the present invention is as follows.
According to the present invention, since pressure detecting element is configured with the substrate for connecting outside lead with the state abutted,
So gap is not present between pressure detecting element and the substrate for connecting outside lead.The envelope of bonding agent is constituted in injection as a result,
In the case of entering resin, enclosed resin is also not present between pressure detecting element and the substrate of connection outside lead.
Therefore, in the case where enclosed resin is expanded because heated, alternatively, the case where enclosed resin is cooled and shrinks
Under, thermal stress will not be generated between pressure detecting element and the substrate for connecting outside lead, substrate is not in damaged damage,
Pressure detecting can reliably be carried out.
In addition, because not generating thermal stress between pressure detecting element and the substrate for connecting outside lead, will not go out
It now is electrically connected cut-off situation with the coupling part of pressure detecting element and the terminal pin of substrate connection is damaged, or connection
Substrate damages with the coupling part of outside lead and is electrically connected cut-off situation, can reliably carry out pressure detecting.
Also, since pressure detecting element is configured with the substrate for connecting outside lead with the state abutted, so
Gap is not present between pressure detecting element and the substrate for connecting outside lead.Therefore, the amount of the enclosed resin of bonding agent is constituted
It tails off, cost can be reduced and pressure sensor is enabled to become compact and small-sized.
Description of the drawings
Fig. 1 is the longitudinal section view of the pressure sensor of the present invention.
Fig. 2 is the longitudinal section view of another embodiment of the pressure sensor of the present invention.
Fig. 3 is the partial enlargement longitudinal section view of the pressure sensor of the present invention of Fig. 2.
Fig. 4 is the figure for indicating stress analysis.
Fig. 5 is the longitudinal section view for the pressure sensor 100 for indicating existing liquid-seal type.
In figure：
10-pressure sensors, 12-flow paths, 14-joint components, 14a-flange part, 16-pressure detecting elements,
18-element bodies, 18a-upper surface, 20-central openings, 22-seal glass, 24-diaphragms, 26-intercommunicating pores, 28-films
Piece protective cover, 30-fluid-tight rooms, 32-sensor chips, 34-terminal pins, 34a-front end, 36-metal wires, 38-substrates,
38a-through hole, 40-balancing gate pits, 42-cover members, 44-base end parts, 46-element body fitting portions, 48-enclosed resins
Receiving portion, 48a-enclose resin receiving portion main body, 48b-stage portion, 48c-small diameter portion, 50-opening portions, 52-enclosed trees
Fat portion, 54-outside leads, 100-pressure sensors, 102-pressure detecting elements, 104-joint components, 106-cover portions
Part, 108-diaphragms, 110-sensor chips, 112-wire bondings, 114-terminal pins, 116-substrates, 118-outside leads,
120a-cover main body portion, 120b-stage portion, 120c-small diameter portion, 122-enclosed resins, 124-enclosed resins, 126-members
Part main body, 128-coupling parts, 130-coupling parts.
Specific implementation mode
Hereinafter, embodiments of the present invention (embodiment) are described in detail based on attached drawing.
Embodiment 1
Fig. 1 is the longitudinal section view of the pressure sensor of the present invention.
In Fig. 1, symbol 10 integrally indicates the pressure sensor of the present invention.
As shown in Figure 1, the pressure sensor 10 of the present invention is liquid-seal type pressure sensor, has and be formed with connecing for flow path 12
The pressure detecting element 16 of head part 14 and the Fluid pressure in detection flow path 12.
Also, pressure detecting element 16 is configured in a manner of opposed with the flow path 12 of the joint component 14, in its week
Edge is fastened with the welding of joint component 14.
Pressure detecting element 16 has the metal element body 18 such as stainless steel, aluminium, is being formed in element body
18 central opening 20, which is embedded in, is fastened with seal glass 22.
In addition, as shown in Figure 1, the element body 18 of pressure detecting element 16, metal diaphragm 24 and the company of being formed with
The diaphragm protective cover 28 of through-hole 26 is fastened as a whole in their peripheral edge portion by welding.
Also, with this configuration, in the part of the central opening 20 of element body 18, seal glass 22 and diaphragm 24 it
Between form enclose oil fluid-tight room 30.
On the other hand, as shown in Figure 1, face in 30 side of fluid-tight room of seal glass 22, is fixed with by bonding agent
The sensor chip 32 of single chip architecture.
The sensor chip 32 is disposed in fluid-tight room 30, as the pressure elements of detection pressure and to the pressure detecting
Pressure sensor piece that the integrated circuit that the output signal of element is handled is formed as one and constitute.
In addition, being fixed with multiple terminal pins 34 using encapsulation process respectively with breakthrough status on seal glass 22, this is more
A terminal pin 34 is used to carry out the input and output of the signal for sensor chip 32.
In this embodiment, although it is not shown, but terminal pin 34 altogether be equipped with eight.I.e., equipped with as input and output end
Three terminal pins 34 that the aftermentioned outside lead 62a (Vout) of son, 62b (Vcc), 62c (GND) are used and as sensor chip
Five terminal pins 34 of the terminal of 32 adjustment.
Terminal pin 34 is made of such as metal wire 36 of gold system or aluminum and the conducting connection of sensor chip 32 (wire bonding)
External leading-out terminal, the External input terminals of sensor chip 32.
Also, it is transmitted to the Fluid pressure in balancing gate pit 40 from the flow path of joint component 14 12 and passes through diaphragm protective cover 28
Intercommunicating pore 26 and surface by pressuring film plate 24, and detect the signature pressure using the sensor chip 32 in fluid-tight room 30.
In addition, shown in Fig. 1, in the top of pressure detecting element 16, pressure detecting element 16 and connection outside lead 54
Substrate 38 is configured with the state of abutting.The front end 34a of terminal pin 34 is inserted in a manner of penetrating through is formed in the substrate 38
The through hole 38a of the end of one side, and be electrically connected with the circuit (not shown) of substrate 38 for example, by solder etc..
On the other hand, in the end of another party of substrate 38, outside lead 54 is for example, by solder etc. and substrate 38
Circuit electrical connection (not shown).
In addition, as shown in Figure 1, state to be abutted with the flange part 14a of joint component 14, installs the cardinal extremity of cover member 42
Portion 44.Such as solder, welding, bonding agent are utilized between the base end part 44 of cover member 42 and the flange part 14a of joint component 14
Etc. being fastened.
In addition, though base end part 44 to cover member 42 and being fastened between the flange part 14a of joint component 14, still
It can also carry out chimeric installation.
In this case, as shown in Figure 1, cover member 42 is by the base that is abutted in this way with the flange part 14a of joint component 14
End 44, the element body fitting portion 46 chimeric with the element body 18 of pressure detecting element 16 and diameter are than element master
Body fitting portion 46 is small and accommodates and encloses the enclosed resin receiving portion 48 of resin portion 52 and be integrally formed.
In addition, as shown in Figure 1, enclosed resin receiving portion 48 is from enclosing resin receiving portion main body 48a, extending to internal side diameter
The structure that the stage portion 48b of setting and the small diameter portion 48c that setting is vertically erect from stage portion 48b are constituted.
In addition, as shown in Figure 1, cover member 42 is the tubular for having opening portion 50 in the top of enclosed resin receiving portion 48
Shape.
As a result, as shown in Figure 1, gap S is formed in the inside of the enclosed resin receiving portion 48 of cover member 42, from cover member 42
50 side of opening portion the enclosed resin for constituting bonding agent is filled to gap S, formed and enclose resin portion 52.
In the pressure sensor 10 of the present invention constituted in this way, as shown in Figure 1, pressure detecting element 16 and outside connecting
The substrate 38 of lead 54 is configured with the state of abutting, so pressure detecting element 16 and the substrate 38 for connecting outside lead 54
Between be not present gap.Therefore, though injection constitute bonding agent enclosed resin in the case of, pressure detecting element 16 with connect
Also enclosed resin portion 52 is not present between the substrate 38 of outside lead 54.
Therefore, in the case where enclosed resin is expanded because heated, alternatively, the case where enclosed resin is cooled and shrinks
Under, thermal stress will not be generated between pressure detecting element 16 and the substrate for connecting outside lead 54, substrate 38 is not in brokenly
Damage damage, can reliably carry out pressure detecting.
In addition, because not generating thermal stress between pressure detecting element 16 and the substrate 38 for connecting outside lead 54,
Be not in and the coupling part (the front end 34a of terminal pin 34) for the terminal pin 34 for connecting pressure detecting element 16 with substrate 38
It damages and is electrically connected cut-off situation or connecting substrate 38 and damages and be electrically connected with the coupling part (54a) of outside lead 54
Cut-off situation can reliably carry out pressure detecting.
Embodiment 2
Fig. 2 is the longitudinal section view of another embodiment of the pressure sensor of the present invention, and Fig. 3 is the pressure of the present invention of Fig. 2
The partial enlargement longitudinal section view of force snesor, Fig. 4 are the figures for indicating stress analysis.
The pressure sensor 10 of the present embodiment is essentially same structure with Fig. 1~pressure sensor shown in Fig. 2 10, right
In identical component parts, same reference marks is marked, description is omitted.
It is identical as the pressure sensor 10 of embodiment of embodiment 1 shown in FIG. 1, pressure detecting element 16 with connect it is external
The substrate 38 of lead 54 is configured with the state of abutting.
In addition, as shown in Fig. 2, cover member 42 constitutes the portion for substantially vertically erectting setting in the enclosed resin receiving portion 48
Divide and have above it barrel shape of opening portion 50.
In this case, the shape of cover member 42 is as the enclosed resin receiving portion for accommodating the part for enclosing resin portion 52
" substantially vertical " in 48 in the meaning of the described part for substantially vertically erectting setting refers to, as shown in figure 3, for example, pressure
The upper surface 18a of the element body 18 of power detecting element 16 and 48 angulation α of enclosed resin receiving portion is 90 ° or so, excellent
It is selected in the range of 90 ° ± 1 °, it will be able to realize aftermentioned effect.
In the pressure sensor 10 of the present invention constituted in this way, as shown in Fig. 2, cover member 42 is as the enclosed tree of receiving
It is the part for substantially vertically erectting setting in the enclosed resin receiving portion 48 of the part in fat portion 52, is that have this substantially vertical
The barrel shape of the part of setting is erect on ground, therefore there is the stage portion being extended in internal side diameter, cover member unlike the past
42 enclosed resin portion 52 is the state of opening.
Therefore, even if in the case where enclosed resin is expanded because heated, alternatively, enclosed resin is cooled and the feelings of contraction
Under condition, as shown in figure 3, (being wrapped by the ellipse of Fig. 3 between resin portion 52 and the element body 18 of pressure detecting element 16 enclosed
The part A enclosed), stripping will not be generated because of thermal stress, will not generate defective insulation or to pressure because moisture is externally entering
Detecting element brings the influences such as corrosion, can carry out accurate pressure detecting.
In addition, as shown in Fig. 2, cover member 42 is as the enclosed resin receiving portion for accommodating the part for enclosing resin portion 52
Have the barrel shape for the part for substantially vertically erectting setting in 48, is extended in internal side diameter so existing unlike the past
Stage portion, small diameter portion, enclose the enclosed resin portion 52 of the gap S of the inside to the enclosed resin receiving portion 48 of cover member 42 at
For the state opened using the opening portion 50 of cover member 42.
Therefore, when resin is enclosed in injection, injection operation is easy, and without spending time and labor, can reduce cost, and
And resin not will produce throughout the entire cover member 42 for constituting waterproof shell and inject bad, generation bubble, will not crack,
Will not because moisture is externally entering generate defective insulation or to pressure detecting element 16 bring corrosion etc. influences, can carry out
Accurate pressure detecting.
Fig. 4 is the figure for indicating to be changed to the stress analysis in the case of -40 DEG C from 100 DEG C, as shown in Fig. 4 (A), such as patent
The pressure sensor 100 of document 1 is such, if the shape for constituting the cover member 106 of waterproof shell is by the cover as large-diameter portion
Main part 120a, it is extended in the stage portion 120b of internal side diameter and vertically erects the small of setting from stage portion 120b
The structure that diameter portion 120c is constituted, then enclosed between resin 122 and the element body 126 of pressure detecting element 102, stress value is big
To 21MPa.
In contrast, as shown in Fig. 4 (B), as the pressure sensor 10 of the present invention, the cover member of waterproof shell is constituted
42 shape is substantially vertically to erect setting in as the enclosed resin receiving portion 48 for accommodating the part for enclosing resin portion 52
Part, be in the case of having the barrel shape of part for substantially vertically erectting setting, it is known that stress value 6MPa, can
It is reduced to one third.
More than, the preferred embodiments of the present invention is illustrated, but the present invention is not limited to this, for example,
In above-described embodiment, base end part 44 and pressure detecting element 16 that cover member 42 is abutted by the flange part 14a with joint component 14
Element body 18 it is chimeric element body fitting portion 46 and diameter it is slightly smaller than the element body fitting portion 46 and accommodate and enclose
The enclosed resin receiving portion 48 of resin portion 52 is integrally formed, but can also make the cover for being made of seperated component and mutually fastening
Component etc. can make various changes in the range of not departing from the purpose of the present invention.
Industrial availability
The present invention can be applied to liquid-seal type pressure sensor.
Claims (7)
1. a kind of pressure sensor, which is characterized in that
Have：
It is formed with the joint component of flow path；
It is fastened on above-mentioned joint component to detect the Fluid pressure in above-mentioned flow path, and with the flow path pair with joint component
The pressure detecting element that the mode set configures；
The outside lead being connect with above-mentioned pressure detecting element；And
The enclosed resin portion of bonding agent is filled to the gap for the inside for being formed in cover member and constitutes,
Above-mentioned pressure detecting element is the structure for having enclosed oil,
Above-mentioned pressure detecting element is configured with the substrate for connecting outside lead with the state abutted.
2. pressure sensor according to claim 1, which is characterized in that
Above-mentioned pressure sensor is liquid-seal type pressure sensor.
3. pressure sensor according to claim 2, which is characterized in that
The metal element body of above-mentioned pressure detecting element by welded is fastened with metal in its peripheral edge portion
The diaphragm of system.
4. pressure sensor according to claim 3, which is characterized in that
Above-mentioned pressure detecting element is welded and is fastened with above-mentioned joint component in its peripheral part.
5. a kind of pressure sensor, which is characterized in that
Have：
It is formed with the joint component of flow path；
It is fastened on above-mentioned joint component to detect the Fluid pressure in above-mentioned flow path, and with the flow path pair with joint component
The pressure detecting element that the mode set configures；
The outside lead being connect with above-mentioned pressure detecting element；And
The enclosed resin portion of bonding agent is filled to the gap for the inside for being formed in cover member and constitutes,
Above-mentioned pressure detecting element has metal element body,
Said elements main body by welded is fastened with metal diaphragm,
The fluid-tight room for enclosing oil is formed between said elements main body and above-mentioned diaphragm,
Above-mentioned pressure detecting element is configured with the substrate for connecting outside lead with the state abutted.
6. a kind of pressure sensor, which is characterized in that
Have：
It is formed with the joint component of flow path；
It is fastened on above-mentioned joint component to detect the Fluid pressure in above-mentioned flow path, and with the flow path pair with joint component
The pressure detecting element that the mode set configures；
The outside lead being connect with above-mentioned pressure detecting element；And
The enclosed resin portion of bonding agent is filled to the gap for the inside for being formed in cover member and constitutes,
Above-mentioned pressure detecting element has metal element body, is embedded in seal glass in said elements main body and fastens,
Said elements main body by welded is fastened with metal diaphragm,
The fluid-tight room for enclosing oil is formed between above-mentioned seal glass and above-mentioned diaphragm in said elements main body,
Above-mentioned pressure detecting element is configured with the substrate for connecting outside lead with the state abutted.
7. pressure sensor according to claim 6, which is characterized in that
Above-mentioned pressure detecting element has metal element body, is embedded in the central opening for being formed in said elements main body
Seal glass simultaneously fastens,
In the part of the central opening of said elements main body, enclosed oil is formed between above-mentioned seal glass and above-mentioned diaphragm
Fluid-tight room.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-134314 | 2012-06-13 | ||
| JP2012134314 | 2012-06-13 | ||
| JP2012229761A JP5656320B2 (en) | 2012-06-13 | 2012-10-17 | pressure sensor |
| JP2012-229761 | 2012-10-17 | ||
| CN201310198891.1A CN103487204A (en) | 2012-06-13 | 2013-05-24 | Pressure sensor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310198891.1A Division CN103487204A (en) | 2012-06-13 | 2013-05-24 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108375447A true CN108375447A (en) | 2018-08-07 |
Family
ID=49827603
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310198891.1A Pending CN103487204A (en) | 2012-06-13 | 2013-05-24 | Pressure sensor |
| CN201810171575.8A Pending CN108375447A (en) | 2012-06-13 | 2013-05-24 | Pressure sensor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310198891.1A Pending CN103487204A (en) | 2012-06-13 | 2013-05-24 | Pressure sensor |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101567938B1 (en) |
| CN (2) | CN103487204A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6633597B2 (en) * | 2017-11-13 | 2020-01-22 | 株式会社鷺宮製作所 | Pressure sensor |
| JP2020008306A (en) * | 2018-07-03 | 2020-01-16 | 株式会社不二工機 | Pressure detection unit and pressure sensor using the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010013254A1 (en) * | 2000-02-15 | 2001-08-16 | Endress And Hauser Gmbh+Co. | Pressure sensor |
| CN2650097Y (en) * | 2003-05-07 | 2004-10-20 | 骆振平 | Engine oil pressure sensor |
| CN201780181U (en) * | 2010-07-27 | 2011-03-30 | 浙江欧德利科技有限公司 | Pressure transmitter provided with encapsulated sensor |
| JP2012068105A (en) * | 2010-09-22 | 2012-04-05 | Fuji Koki Corp | Pressure sensor |
| CN102439410A (en) * | 2009-07-31 | 2012-05-02 | 株式会社鹭宫制作所 | Pressure sensor and method of adjusting the same |
| CN202255753U (en) * | 2011-08-29 | 2012-05-30 | 中国石油化工股份有限公司 | Demounting and mounting device for case body of buckling pressure gauge and mounting plate thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340891A (en) | 2003-05-19 | 2004-12-02 | Mitsubishi Electric Corp | Pressure sensor device |
| CN100535623C (en) * | 2006-06-26 | 2009-09-02 | 阮志成 | Insulation type IC pressure sensing device |
| JP5200951B2 (en) | 2009-01-16 | 2013-06-05 | 株式会社デンソー | Pressure sensor and manufacturing method thereof |
-
2013
- 2013-04-30 KR KR1020130048448A patent/KR101567938B1/en active IP Right Grant
- 2013-05-24 CN CN201310198891.1A patent/CN103487204A/en active Pending
- 2013-05-24 CN CN201810171575.8A patent/CN108375447A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010013254A1 (en) * | 2000-02-15 | 2001-08-16 | Endress And Hauser Gmbh+Co. | Pressure sensor |
| CN2650097Y (en) * | 2003-05-07 | 2004-10-20 | 骆振平 | Engine oil pressure sensor |
| CN102439410A (en) * | 2009-07-31 | 2012-05-02 | 株式会社鹭宫制作所 | Pressure sensor and method of adjusting the same |
| CN201780181U (en) * | 2010-07-27 | 2011-03-30 | 浙江欧德利科技有限公司 | Pressure transmitter provided with encapsulated sensor |
| JP2012068105A (en) * | 2010-09-22 | 2012-04-05 | Fuji Koki Corp | Pressure sensor |
| CN202255753U (en) * | 2011-08-29 | 2012-05-30 | 中国石油化工股份有限公司 | Demounting and mounting device for case body of buckling pressure gauge and mounting plate thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101567938B1 (en) | 2015-11-10 |
| KR20130139764A (en) | 2013-12-23 |
| CN103487204A (en) | 2014-01-01 |
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