CN108367961A - 支承玻璃基板的制造方法 - Google Patents
支承玻璃基板的制造方法 Download PDFInfo
- Publication number
- CN108367961A CN108367961A CN201680069435.9A CN201680069435A CN108367961A CN 108367961 A CN108367961 A CN 108367961A CN 201680069435 A CN201680069435 A CN 201680069435A CN 108367961 A CN108367961 A CN 108367961A
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- support glass
- manufacturing
- substrate
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
- C03B17/064—Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-246131 | 2015-12-17 | ||
JP2015246131 | 2015-12-17 | ||
PCT/JP2016/086427 WO2017104513A1 (ja) | 2015-12-17 | 2016-12-07 | 支持ガラス基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108367961A true CN108367961A (zh) | 2018-08-03 |
Family
ID=59056471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680069435.9A Pending CN108367961A (zh) | 2015-12-17 | 2016-12-07 | 支承玻璃基板的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6987356B2 (ja) |
KR (1) | KR102588111B1 (ja) |
CN (1) | CN108367961A (ja) |
TW (1) | TWI701221B (ja) |
WO (1) | WO2017104513A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2021322B1 (en) * | 2018-06-28 | 2020-01-06 | Corning Inc | Continuous methods of making glass ribbon and as-drawn glass articles from the same |
WO2020005555A1 (en) | 2018-06-28 | 2020-01-02 | Corning Incorporated | Continuous methods of making glass ribbon and as-drawn glass articles from the same |
US20210292220A1 (en) * | 2018-07-16 | 2021-09-23 | Corning Incorporated | Setter plates and methods of ceramming glass articles using the same |
CA3129655C (en) | 2018-07-16 | 2023-01-03 | Corning Incorporated | Glass ceramic articles having improved properties and methods for making the same |
US11834363B2 (en) | 2018-07-16 | 2023-12-05 | Corning Incorporated | Methods for ceramming glass with nucleation and growth density and viscosity changes |
WO2020018285A1 (en) * | 2018-07-16 | 2020-01-23 | Corning Incorporated | Methods of ceramming glass articles having improved warp |
CN113692395B (zh) | 2019-01-28 | 2023-10-31 | 康宁股份有限公司 | 玻璃陶瓷制品、组合物及其制造方法 |
CN114450255B (zh) | 2019-09-13 | 2023-11-21 | 康宁股份有限公司 | 采用回旋管微波加热装置形成玻璃带的连续方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3441422A (en) * | 1965-09-30 | 1969-04-29 | Gen Electric | Coating glasses for electrical devices |
WO2013145503A1 (ja) * | 2012-03-29 | 2013-10-03 | コニカミノルタ株式会社 | Hdd用ガラス基板の製造方法 |
WO2015156075A1 (ja) * | 2014-04-07 | 2015-10-15 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4792705B2 (ja) | 2003-04-03 | 2011-10-12 | 旭硝子株式会社 | TiO2を含有するシリカガラスおよびその製造法 |
JP5332085B2 (ja) | 2006-06-28 | 2013-11-06 | 日本電気硝子株式会社 | フラットパネルディスプレイ用のガラス基板の製造方法 |
JP6287070B2 (ja) * | 2012-11-09 | 2018-03-07 | 日本電気硝子株式会社 | ガラスフィルム積層体を製造する方法及び電子・電気デバイスの製造方法 |
JP6593669B2 (ja) | 2013-09-12 | 2019-10-23 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた搬送体 |
JP6379678B2 (ja) * | 2014-05-29 | 2018-08-29 | 日本電気硝子株式会社 | ガラス基板の製造方法 |
JP6031613B2 (ja) * | 2014-06-30 | 2016-11-24 | AvanStrate株式会社 | シートガラスの製造方法及びシートガラス製造装置 |
JP6742593B2 (ja) * | 2015-01-05 | 2020-08-19 | 日本電気硝子株式会社 | 支持ガラス基板の製造方法及び積層体の製造方法 |
-
2016
- 2016-12-07 WO PCT/JP2016/086427 patent/WO2017104513A1/ja active Application Filing
- 2016-12-07 JP JP2017556000A patent/JP6987356B2/ja active Active
- 2016-12-07 KR KR1020187014644A patent/KR102588111B1/ko active IP Right Grant
- 2016-12-07 CN CN201680069435.9A patent/CN108367961A/zh active Pending
- 2016-12-08 TW TW105140524A patent/TWI701221B/zh active
-
2021
- 2021-11-19 JP JP2021188397A patent/JP7268718B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3441422A (en) * | 1965-09-30 | 1969-04-29 | Gen Electric | Coating glasses for electrical devices |
WO2013145503A1 (ja) * | 2012-03-29 | 2013-10-03 | コニカミノルタ株式会社 | Hdd用ガラス基板の製造方法 |
WO2015156075A1 (ja) * | 2014-04-07 | 2015-10-15 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層体 |
Non-Patent Citations (3)
Title |
---|
中国南玻集团工程玻璃事业部: "《安全玻璃加工技术》", 31 March 2010, 华南理工大学出版社 * |
祁学孟: "《非晶态光电功能材料》", 31 July 2012, 国防工业出版社 * |
西北轻工业学院: "《玻璃工艺学》", 31 August 2007, 中国轻工业出版社 * |
Also Published As
Publication number | Publication date |
---|---|
TW201731783A (zh) | 2017-09-16 |
JP7268718B2 (ja) | 2023-05-08 |
JP6987356B2 (ja) | 2021-12-22 |
KR20180095513A (ko) | 2018-08-27 |
TWI701221B (zh) | 2020-08-11 |
JP2022025147A (ja) | 2022-02-09 |
KR102588111B1 (ko) | 2023-10-12 |
WO2017104513A1 (ja) | 2017-06-22 |
JPWO2017104513A1 (ja) | 2018-10-04 |
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