CN101861058B - Method of PCB board processing technology - Google Patents
Method of PCB board processing technology Download PDFInfo
- Publication number
- CN101861058B CN101861058B CN2010101916869A CN201010191686A CN101861058B CN 101861058 B CN101861058 B CN 101861058B CN 2010101916869 A CN2010101916869 A CN 2010101916869A CN 201010191686 A CN201010191686 A CN 201010191686A CN 101861058 B CN101861058 B CN 101861058B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- back drill
- depth
- hole
- drill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Drilling Tools (AREA)
Abstract
The invention discloses a method of a PCB board processing technology, which comprises the following steps: drilling a PCB board; electroplating the drilled PCB board; manufacturing outer-layer graphs on the electroplated PCB board; electroplating graphs on the PCB board after the outer-layer graphs are formed; carrying out back drilling on the through hole of the PCB board after graph electroplating at least at twice, wherein the first back drilling depth is smaller than required appointed back drilling depth; and etching. The invention carries out back drilling on the through hole for at least at twice, the depth of each time of back drilling is smaller than the required back drilling depth, with so many times of back drilling, the depth of each time of back drilling is shallower, and copper wire and resin powder generated in back drilling can be discharged along with a dust absorption system on a drill bit and a discharge groove on the drill bit so as to reduce or avoid the situation that the processing efficiency and the PCB yield are affected by back drilling hole blockage and drill bit winding because the copper cuttings and resin powder generated when back drilling is carried out on the PCB board with high thickness-diameter ratio can not be discharged in time.
Description
Technical field
The present invention relates to a kind of pcb board technological method for processing.
Background technology
In the manufacture process of pcb board, need through hole to realize the electrical connection of inner layer circuit board interlayer, through hole is drilled with by rig usually, and its requirement on machining accuracy is higher, and rig is drilled to through hole after heavy copper is electroplated, and in through hole, forms conductive layer and realizes being electrically connected.But the end of some plated-through-hole does not have connection, and this will cause turning back of signal, and resonance also can alleviate, and can cause the reflection, scattering, delay of signal transmission etc., can bring the problem of " distortion " to signal.This just need further process plated-through-hole, i.e. back drill.The effect of back drill is the through hole section of boring to fall not play any connection or transmitting effect, avoids causing the reflection, scattering, delay of signal transmission etc., brings " distortion " to signal, thus general on the pcb board not the through hole of consent all to carry out back drill.
Back drill is extremely important for the transmission of signal; But because processing request and precision are higher; Be easy in the operating process Lou bore; To the bad control of the degree of depth in back drill hole, and the method that detects the back drill hole depth at present mainly is through manual work whether the circuit board level of the appointment degree of depth and the level that re-uses microscopic back drill hole of cutting into slices to be met the demands.
The technological method for processing of existing P CB plate generally comprises following steps: at first pcb board is drilled through the hole; Then whole pcb board is electroplated; Again the pcb board after electroplating is made outer graphics, carry out disposable back drill then as requested, carry out etching at last.To drill through the aperture in hole less be that radius-thickness ratio (10: 1 and more than) is when bigger circuit board carries out back drill yet for thickness is big; Because the aperture in the hole that drills through is little; And circuit board thickness is thicker, so can produce a large amount of copper scale, copper wires in the process of back drill and can be mingled with toner, and dust collecting system and the discharge launder on the drill bit that the disposable back drill degree of depth is not easy on the rig are excessively deeply in time discharged toner and copper scale outside the through hole; Toner and copper scale are piled together and are pressed in the through hole; Easy blocking need be treated the through hole of back drill, and long copper wire also snarls drill bit easily, and influence drills through efficient.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of pcb board technological method for processing, can solve the problem of the big pcb board back drill plug-hole of radius-thickness ratio.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of pcb board technological method for processing is provided, comprises the steps:
A, pcb board is drilled through the hole;
B, the pcb board that drills through behind the hole is electroplated;
C, on the PCB after the plating, make outer graphics;
Carry out graphic plating on D, the pcb board after forming outer graphics;
E, the through hole to the pcb board behind the graphic plating carries out back drill at least at twice, and wherein back drill hole depth ratio requires to specify the back drill hole depth little for the first time;
F, carry out etching.
Wherein, in step e, back drill hole depth ratio requires to specify the little 0.15mm～0.5mm of back drill hole depth for the first time.
Wherein, in step e, adopt bit diameter less than the drill bit of back drill bore dia through hole to be carried out the back drill first time, the back drill degree of depth is inequality with the appointment back drill degree of depth; Adopt the drill bit identical with the back drill bore dia to carry out the back drill second time then, the back drill degree of depth is the degree of depth that requires appointment.
Wherein, in step e, use the drill bit identical that through hole is carried out back drill with the diameter that requires the back drill hole.
Wherein, in step e, the back drill deep processing is to requiring designated depth for the second time.
Wherein, in step e, the back drill working depth further comprises back drill processing for the third time less than requiring designated depth for the second time, and the back drill working depth is machined to and requires designated depth for the third time.
Wherein, said drill bit drills through direction for from top to bottom.
Wherein, said drill bit drills through direction for from bottom to top.
The invention has the beneficial effects as follows: be different from the circuit board that radius-thickness ratio is bigger in the prior art and carry out back drill one time; Require the disposable designated depth that gets into of drill bit; It is darker to drill through the degree of depth, and the aperture in the hole that drills through is little, and circuit board thickness is thicker; So produce a large amount of copper scale, copper wires in the process of back drill and can be mingled with toner and be difficult in time to discharge heap and be pressed in the through hole, easy blocking need be treated the through hole of back drill and twine the resistance drill bit easily and influence the situation that drills through efficient.Pcb board technological method for processing of the present invention carries out back drill through dividing at least twice pair of through hole; And the depth ratio of back drill requires the back drill degree of depth little each time; Back drill so several times; The degree of depth of back drill is more shallow each time; The copper wire that produces during back drill, toner can be discharged with dust collecting system on the drill bit and the discharge launder on the drill bit timely, thereby the copper scale and the toner that are produced can reduce or avoid the pcb board of high thickness to diameter ratio to carry out back drill the time are difficult in time discharge the back drill hole influences working (machining) efficiency and PCB yield with twining the resistance drill bit the situation of stopping up.
Description of drawings
Fig. 1 is the process chart of pcb board technological method for processing of the present invention;
Fig. 2 is the half-finished structural representation after the pcb board of pcb board technological method for processing of the present invention carries out the back drill first time;
Fig. 3 is the finished product structural representation after the pcb board of pcb board technological method for processing of the present invention finishes repeatedly back drill.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, Fig. 2 and Fig. 3, pcb board technological method for processing of the present invention comprises the steps:
A, on pcb board, drill through the hole.
B, the PCB behind the hole that steps A drills through is electroplated, through hole edge is formed with electrodeposited coating.
C, the pcb board after electroplating is carried out outer graphics.
D, the pcb board behind the outer graphics is carried out graphic plating.
E, the lead to the hole site place is carried out the back drill first time; This, bit diameter that back drill adopts specified the back drill bore dia identical with the client first time, and back drill hole depth and the little 0.15mm～0.5mm of customer requirement back drill hole depth promptly require to guarantee the back drill hole depth of the plug-hole degree of depth less than customer requirement; Because the back drill degree of depth is more shallow for the first time, the copper wire that is produced during back drill, powder can in time be discharged outside the groove with dust collecting system on the drill bit and the discharge launder on the drill bit timely, only retain a little residual copper wire, powder; In the present embodiment, said first time back drill on the A copper layer, first back drill proposes through hole with drill bit after accomplishing, and changes simultaneously and covers the aluminium sheet on the pcb board face to Fig. 2.
F, carry out the back drill second time again, the bit diameter that this second time, back drill was adopted specifies the back drill bore dia identical with the client, and back drill is machined to the degree of depth of customer requirement appointment; In the process of carrying out the back drill second time; Because the brill of drill bit squeezes effect; Make that remaining in a little copper wire, the powder waiting to drill through in the hole in the first time during back drill can push from through hole; And the degree of depth that the second time, back drill drilled through is also more shallow; The copper wire that is produced in the time of in the back drill process, powder can in time be discharged outside the groove with dust collecting system on the drill bit and the discharge launder on the drill bit timely, only retain a little residual copper wire, powder and stay below the back drill hole or be blocked in the copper wire treated in the back drill hole, toner seldom; In the present embodiment, the back drill degree of depth is between A copper layer and the B copper layer for the second time.
In another embodiment, the back drill working depth is specified the back drill degree of depth less than requiring for the second time, thereby further comprises back drill processing for the third time, and the back drill working depth is machined to and requires designated depth for the third time.
Among the another embodiment, adopt bit diameter less than the drill bit of back drill bore dia through hole to be carried out the back drill first time, the back drill degree of depth is inequality with the appointment back drill degree of depth; Adopt the drill bit identical with the back drill bore dia to carry out the back drill second time then, the back drill degree of depth is the degree of depth that requires appointment.
Again among the embodiment, adopt in bit diameter and the steps A the identical drill bit of the bore dia that drills through through hole is carried out the back drill first time, the back drill degree of depth is identical with the appointment back drill degree of depth; Adopt the drill bit identical with the back drill diameter to carry out the back drill second time then, the back drill hole depth is the back drill degree of depth that requires appointment.
The direction that drills through of said drill bit can be for from top to bottom or from bottom to top.
G, the copper wire, the toner etching that remain in back drill hole or the through hole are removed with etching solution.
Be different from the circuit board that radius-thickness ratio is bigger in the prior art and carry out back drill one time; Require the disposable designated depth of getting by drilling of drill bit; It is darker to drill through the degree of depth; And the aperture in the hole that drills through is little, and circuit board thickness is thicker, so produces a large amount of copper scale, copper wires in the process of back drill and can be mingled with toner and be difficult in time discharge through hole and stop up through hole and the copper wire of treating back drill and twine the situation that the influence of resistance drill bit drills through efficient easily.Pcb board technological method for processing of the present invention is through carry out back drill to through hole several times; And the depth ratio of back drill requires the back drill degree of depth little for the first time; Back drill so several times; The degree of depth of back drill is more shallow each time; The copper wire that produces during back drill, toner can in time in time be discharged outside the groove with dust collecting system on the drill bit and the discharge launder on the drill bit, thereby the copper scale and the toner that are produced can reduce or avoid the pcb board of high thickness to diameter ratio to carry out back drill the time are difficult in time discharge and stop up the back drill hole and twine the situation that hinders drill bit and influence working (machining) efficiency and PCB yield.
In sum, pcb board technological method for processing of the present invention is simple, and copper scale that is produced in the time of effectively reducing or avoid the pcb board of high thickness to diameter ratio to carry out back drill and toner stop up the situation in back drill hole.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. a pcb board technological method for processing is characterized in that, comprises the steps:
A, pcb board is drilled through the hole;
B, the pcb board that drills through behind the hole is electroplated;
C, on the PCB after the plating, make outer graphics;
Carry out graphic plating on D, the pcb board after forming outer graphics;
E, the through hole to the pcb board behind the graphic plating carries out back drill at least at twice, and wherein back drill hole depth ratio requires to specify the back drill hole depth little for the first time;
F, carry out etching.
2. pcb board technological method for processing according to claim 1 is characterized in that: in step e, back drill hole depth ratio requires to specify the little 0.15mm～0.5mm of back drill hole depth for the first time.
3. pcb board technological method for processing according to claim 2 is characterized in that: in step e, adopt bit diameter less than the drill bit of back drill bore dia through hole to be carried out the back drill first time earlier; Adopt the drill bit identical with the back drill bore dia to carry out the back drill second time then, the back drill degree of depth is the degree of depth that requires appointment.
4. pcb board technological method for processing according to claim 2 is characterized in that: in step e, use the drill bit identical with the diameter that requires the back drill hole that through hole is carried out back drill.
5. pcb board technological method for processing according to claim 4 is characterized in that: in step e, the back drill deep processing is to requiring designated depth for the second time.
6. pcb board technological method for processing according to claim 4 is characterized in that: in step e, the back drill working depth further comprises back drill processing for the third time less than requiring designated depth for the second time, and the back drill working depth is machined to and requires designated depth for the third time.
7. pcb board technological method for processing according to claim 1 is characterized in that: said drill bit drill through direction for from top to bottom.
8. pcb board technological method for processing according to claim 1 is characterized in that: said drill bit drill through direction for from bottom to top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101916869A CN101861058B (en) | 2010-06-04 | 2010-06-04 | Method of PCB board processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101916869A CN101861058B (en) | 2010-06-04 | 2010-06-04 | Method of PCB board processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101861058A CN101861058A (en) | 2010-10-13 |
| CN101861058B true CN101861058B (en) | 2012-05-09 |
Family
ID=42946609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101916869A Active CN101861058B (en) | 2010-06-04 | 2010-06-04 | Method of PCB board processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101861058B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300412A (en) * | 2011-08-19 | 2011-12-28 | 东莞生益电子有限公司 | Processing method for back drilling of PCB |
| CN103124476A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Printed circuit board and machining method thereof |
| CN102984892B (en) * | 2012-11-15 | 2017-06-13 | 华为机器有限公司 | A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product |
| CN103298273B (en) * | 2013-05-07 | 2016-02-24 | 深圳崇达多层线路板有限公司 | The method of a kind of wiring board bottom outlet copper facing not plug-hole |
| CN103517562B (en) * | 2013-10-10 | 2017-01-04 | 广东生益科技股份有限公司 | The groove-shaped hole forming method of pcb board |
| JP6723156B2 (en) * | 2014-01-22 | 2020-07-15 | サンミナ コーポレーションＳａｎｍｉｎａ Ｃｏｒｐｏｒａｔｉｏｎ | Method of forming plated through hole having high aspect ratio and highly accurate method of removing stub in printed circuit board |
| CN105323970B (en) * | 2015-11-03 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of production method of asymmetry printed circuit board back drill |
| CN105979709B (en) * | 2016-07-15 | 2019-04-02 | 武汉华星光电技术有限公司 | Multilayer board boring method |
| CN108366489B (en) * | 2018-01-22 | 2019-10-22 | 深圳崇达多层线路板有限公司 | A kind of undesirable method of optimization back drill aperture turmeric |
| CN110972398A (en) * | 2019-12-11 | 2020-04-07 | 芜湖雅葆轩电子科技股份有限公司 | Processing technology of PCB (printed circuit board) free of high-temperature resistant material |
| CN113873759A (en) * | 2021-08-31 | 2021-12-31 | 广州广合科技股份有限公司 | PCB back drilling processing method and PCB |
| CN114900966B (en) * | 2022-05-19 | 2023-09-01 | 深圳崇达多层线路板有限公司 | Near-hole back drilling method for circuit board, communication electronic equipment and processing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101692757B (en) * | 2009-09-07 | 2011-05-11 | 皆利士多层线路版(中山)有限公司 | Process for manufacturing 12OZ thick copper multilayer circuit board |
| CN101861055B (en) * | 2010-06-04 | 2012-03-28 | 深南电路有限公司 | Method of PCB board processing technology |
-
2010
- 2010-06-04 CN CN2010101916869A patent/CN101861058B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101861058A (en) | 2010-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101861058B (en) | Method of PCB board processing technology | |
| CN101861055B (en) | Method of PCB board processing technology | |
| CN102036492B (en) | Drilling method for printed circuit board (PCB) | |
| CN102387668A (en) | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges | |
| CN105025658A (en) | Mechanical backdrilling method for PCB | |
| CN104768338A (en) | PCB edge semi-hole metallization manufacturing process | |
| CN109348621A (en) | A kind of PCB production method and PCB | |
| CN106304696B (en) | Has the printed wiring board and preparation method thereof that multilayer intersects blind slot | |
| CN111417262A (en) | Method for manufacturing deep micro-via hole | |
| CN103813652B (en) | Processing method of blind hole | |
| CN103124476A (en) | Printed circuit board and machining method thereof | |
| CN105517349A (en) | Back drilling detection method | |
| CN201871786U (en) | End mill combined with drilling, chamfering and thread milling | |
| CN103200791A (en) | High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material | |
| CN104607684A (en) | Machining method for 5-12 oz thick copper power circuit board drilling | |
| CN103889166A (en) | Mechanical controlled deep blind hole processing technology | |
| CN201008996Y (en) | Multiple edged screw tap drill | |
| CN102554303A (en) | Blind hole machining method for pre-bonded metal substrate | |
| CN102275018A (en) | Drilling-tapping integrated composite screw tap | |
| CN112969312B (en) | PCB metallized half-hole processing technology | |
| CN104690769B (en) | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers | |
| CN209882237U (en) | Blind buried orifice plate structure | |
| CN102036489B (en) | Method for processing high-precision PCB (Printed Circuit Board) with nonmetal and metal edges | |
| CN112770504A (en) | Method for processing countersunk hole of multilayer circuit board | |
| CN202317177U (en) | Counterbore machining drill |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |