CN108290694A - Wafer board and mask set for substrate manufacture - Google Patents

Abstract

A kind of system for processing wafer in vacuum processing chamber room.Carrier includes the frame for having multiple openings, and each opening is configured to accommodate a wafer.Transport mechanism is configured to transmit multiple carriers through system.Multiple wafer boards are configured to support wafer.Attachment mechanism for multiple wafer boards to be attached to each carrier, wherein, each wafer board is attached to the corresponding position at the bottom side of respective carrier so that each wafer in the wafer being positioned on one of silicon wafer carrier is positioned in one of multiple openings in carrier opening.The front side top of one of the multiple openings of mask attachment in the carrier opening.Wafer board is supported opening in the carrier following by alignment tool.Camera is oriented simultaneously to be imaged mask and wafer.

Description

Wafer board and mask set for substrate manufacture

Technical field

This application involves for vacuum processed system, in the system of solar cell, flat-panel monitor, touch screen etc. Make the middle system used.

Background technology

Various systems in known this field for manufacturing semiconducter IC, solar cell, touch screen etc..These systems Technique carries out in a vacuum, and includes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implanting, quarter Erosion etc..There are two types of basic skills for this kind of system：Single substrate processing or batch machining.In single-wafer processing, the chamber during processing There is only single substrates for interior.In batch machining, there are several substrates in chamber during processing.Single substrate processing is realized High level control to the indoor technique of chamber and the finally obtained film being fabricated on substrate or structure, but cause relatively Low treating capacity.On the contrary, batch machining causes the relatively low control for processing conditions and finally obtained film or structure, but carry Much higher treating capacity is supplied.

In general, (all to implement batch machining by being transmitted in the form of the two-dimensional array of n × m substrate and manufacturing substrate Such as the batch machining employed in the system for manufacturing solar cell, touch tablet etc.).For example, being researched and developed by Roth＆Rau The PECVD system for solar energy manufacture realize 1200 wafers of report in 2005/small using the pallet of 5 × 5 wafers When treating capacity.However, other systems utilize the support of the two-dimensional array with 6 × 6,7 × 7,8 × 8 even more quantity wafers Disk.Although improving treating capacity, the manipulation of this kind of large size pallet and loading using the pallet of two-dimentional wafer array and unloading Carrying operation becomes complicated.

In some techniques, need to apply biasing (bias), such as RF (radio frequency) or DC to the substrate being processed (direct current) potential.However, since batch system utilizes the mobile pallet with substrate, thus be difficult to apply the biasing.

Also, some techniques can be executed when flatly being kept, and some techniques can be from the lining vertically kept Benefit in bottom.However, the vertical loading of substrate and unloading than horizontal load and unload increasingly complex.

Some techniques may need to block a part for substrate from specific manufacturing process using mask.For example, covering Mould can be used for the formation of contact, or be abandoned for edge to prevent battery branch (shunting).That is, in front side and Battery with contact on rear side, the material for contact to be made may be deposited on the edge of wafer and in front contact with after Branch is formed between contact.Therefore, it is come the edge for abandoning battery using mask during manufacture at least front contact or rear contact Desirable.

Illustrate as another kind, the manufacture for silicon solar cell, forms sediment it is expected that blanket is covered metal (blanketmetal) Product is in rear surface to serve as reflective optical system and electric conductor.The metal is usually aluminium, but it can also be due to more that blanket, which covers metal, Any metal planted reason (cost, electric conductivity, solderability etc.) and used.Deposit film thickness can from very it is thin (for example, About 10nm) arrive very thick (for example, 2-3um).It is wound around the edge of Silicon Wafer however, it is necessary to prevent blanket from covering metal, because this Resistance connection, i.e. branch are formed between the front surface and rear surface of solar cell.This connection in order to prevent, can be in crystalline substance It is formed in round posterior edges and abandons region.The common-size for abandoning region is less than 2mm wide, but preferably abandons this and to the greatest extent may be used It can be thin.

It is by using mask to form a this method for abandoning region；However, there are many challenges using mask.By It must be dirt cheap in the production of the high competition of solar industry, mask.Moreover, because solar energy manufacturing equipment Format high throughput (usually 1500-2500 battery per hour), therefore mask must rapidly and easily be used for mass production.And And since mask is for preventing the film on certain parts of wafer from depositing, mask allows for absorbing and adapting to deposit Object is accumulated.In addition, since film deposit is completed at elevated temperatures, mask is allowed in raised temperature (for example, high Up to 350 DEG C) under correctly work, while still accurately keeping abandoning the width in region, while adapting to be led by thermal stress The substrate warpage of cause.

Invention content

Including following invention content to provide the basic comprehension of some aspects and feature for the present invention.The content of present invention It is not the extensive overview ot to the present invention, and therefore it is neither intended to the important or key element of the specific identification present invention also not purport Describing the scope of the present invention.The sole purpose of the content of present invention is that some concepts of the present invention are presented in simplified form, as The preamble of more detailed description presented below.

The embodiment provides a kind of modular system architecture, this is because the system can use it is different Technique and processing step, and be general, this is because the system is suitable for manufacturing a variety of devices, including such as solar-electricity Pond, flat-panel monitor, touch screen etc..In addition, the system can manipulate difference by simply changing used carrier The substrate of type and size, without being reconfigured.

The system architecture realizes that the substrate processed and separated with vacuum manipulates, and is such as loaded and unloads in atmospheric environment It carries.In addition, various embodiments can be loaded and be unloaded manually in the case where automatic device is shut down or is not provided with automatic device It carries, i.e., the system can be realized in the case of no loading/unloading automatic device.In vacuum environment, which realizes lining The static processing at bottom is processed by formula (pass-by).In certain embodiments, using actuating valve each process cavity it Between vacuum insulation is set.Various embodiments provide the electrostatic clamp of substrate, to realize accident that is effective cooling and preventing substrate It is mobile.In other embodiments, come using the spring loads clip for example with the relieving mechanism for loading/unloading substrate real Existing mechanical grip.Various embodiments can also use such as RF or DC bias powers to apply biasing or floating substrate to substrate.

Various embodiments realize that simplified substrate manipulates by executing manipulation to linear array carrier, and by simultaneously Several linear array carriers are processed to execute processing to the two-dimensional array of n × m substrate.Other embodiments provide conveyer Structure, wherein substrate it is vertically-oriented it is upper be processed, but when substrate is flatly manipulated execute load and unloading.

The embodiment of the present invention also realizes that substrate is processed using mask, this can be come real by using dual masks device It applies.Two-piece type masking (masking) system is configured to masking substrate, and includes：Interior mask, the interior mask is by with aperture Thin flat sheet of metal composition, these apertures expose wafer segment to be processed；And outer mask, the outer mask are configured to dispose Above interior mask and interior mask is sheltered, the size and shape of the opening cut of outer mask are similar to the size and shape of substrate, The thickness of outer mask is more than the thickness of interior mask.Mask frame can be configured to support interior mask and outer mask so that cover outside Mould is sandwiched between mask frame and interior mask.In the example that dual masks device is used for edge isolation, in interior mask Opening cut the size for being dimensioned slightly smaller than solar wafer so that when interior mask is placed on wafer, interior mask covers The periphery edge of lid wafer, and the opening cut in outer mask is slightly larger than the opening notch in interior mask.Top frame carrier It can be used for keeping interior mask and outer mask, and interior mask and outer mask be fixed to wafer carrier.

A kind of loading and feel trim actuator are provided, manipulate four row's substrates simultaneously.Loading/the feel trim actuator is configured to carry out Vertical and straight movement, having reduces position and raised position.Position is reduced at it, which is configured to simultaneously：From a carrier The new substrate of one row is placed on empty carrier by the middle removal processed substrate of one row, and the processed substrate of a row, which is placed in substrate, to be removed In mechanism, and from substrate delivery mechanism obtain the new substrate of a row.Substrate removing mechanism and substrate delivery mechanism can be in phase The conveyer belt advanced in same or opposite direction.In its raised position, which is configured to rotate to 180 degree.

A kind of device is utilized in certain embodiments, wherein wafer board is attached to carrier, while mask set from bottom side It is attached to the carrier from top.One of wafer board or mask set are attached to carrier with fixed orientation, while another It is a to be realigned when loading each new wafer.In the exemplary embodiment, mask set is pacified with fixed orientation It sets on carrier.When new wafer is loaded onto in wafer board, wafer board is admitted to its position below carrier.Then, Alignment of the wafer relative to mask set is verified using camera.Then, wafer board can be translated and/or rotate with reach with Mask set is correctly aligned.When reach be properly oriented within when, wafer board is raised and is attached to load for example, by series of magnet Body.In one embodiment, wafer board includes suction hole so that and vacuum is applied to suction hole during Alignment Process, so as to Wafer is kept and is pressed against in wafer board.

Description of the drawings

It is incorporated to the attached drawing in this specification and formed part of this specification and the embodiment of the present invention has been illustrated, And it is used to explaining and showing the principle of the present invention together with the description.Attached drawing is intended to diagrammatically show exemplary implementation The main feature of example.Attached drawing is neither intended to each feature for depicting practical embodiments, is not intended to and depicts institute's elements depicted Relative size, and attached drawing is not drawn to scale.

Fig. 1 shows the embodiment of more substrate processing systems, wherein the linear array of transmission carrier supported substrate, but add Work executes on the two-dimensional array of substrate.

Figure 1A shows that carrier is maintained at the example of the system of horizontal orientation during transmission and processing；Figure 1B is shown simultaneously Carrier example horizontal but vertical during processing during the transmission and loading/unloading.

Fig. 2 shows the more silicon wafer carriers according to one embodiment, and Fig. 2A shows partial cross-section.

Fig. 2 B show the example of the carrier for processing Silicon Wafer, and Fig. 2 C show the load for processing glass substrate The example of body.

Fig. 3 A are according to the vertical view of the loading/feel trim actuator of one embodiment, and Fig. 3 B are the side views of the mechanism.Figure 3C shows the embodiment of substrate aligning guide.

Fig. 4 shows the embodiment for the vacuum processing chamber room 400 that can be used together with disclosed system.

Fig. 5 shows the embodiment of mask and carrier module.

Fig. 6 A to Fig. 6 C show that three embodiments, these embodiments demonstrate how vacuum chamber is equipped with various sizes The different processing sources with configuration.

Fig. 7 A to Fig. 7 E are shown to be regarded according to the more silicon wafer carriers with the device for dual masks of various embodiments Figure.

Fig. 8 is according to the cross section of the amplifier section of the frame of one embodiment, outer mask and interior mask, and Fig. 8 A are According to the cross section of the amplifier section of the frame of another embodiment, outer mask and interior mask.

Fig. 9 shows that interior mask is embedded in the embodiment of outer mask therein.

Figure 10 shows the embodiment of the interior mask for edge isolation.

Figure 11 shows the embodiment of single-wafer carrier.

Figure 12 shows the embodiment of outer mask from lower-side angle.

Figure 13 shows the embodiment of the top frame of mask and outer mask in support.

Figure 14 shows the embodiment of the interior mask for forming multiple holes in wafer.

Figure 15 shows the embodiment for the carrier being used together for the mask with Fig. 9.

Figure 16 A to Figure 16 D show that wafer board from bottom side is attached to carrier and dual masks are attached to the implementation of carrier from top side Example.

Figure 16 E show the dual masks device according to one embodiment.

Figure 16 F are according to the cross section of a part for the system of one embodiment, and wherein amplifier section is shown in illustration.

Figure 16 G show the wafer board with vacuum table and periphery buffer part according to another embodiment.

Figure 16 H show the top section of the loading alignment tool according to one embodiment.

Figure 16 I show the top section of the relieving platform according to one embodiment.

Specific implementation mode

It is described in detail below to provide the certain features and aspect for emphasizing innovative system of processing claimed herein Example.Various disclosed embodiments provide a kind of system, and multiple substrates are (for example, semiconductor or glass lined within the system Bottom) it is processed simultaneously in vacuum processing chamber room (such as plasma process chamber).Although glass substrate is (such as touching Screen those of glass substrate) be usually not considered as wafer, it is understood that be as reference with wafer in the disclosure in order to Conveniently and it can be readily appreciated that and glass substrate can be by all these with reference to replacement.

Fig. 1 is the vertical view of the embodiment of more substrate processing systems, wherein the linear array of transmission carrier supported substrate, but It is to process on the two-dimensional array of substrate to execute.In the system 100 shown in Fig. 1, substrate at loading/unloading station 105 i.e. from The same side of system is loaded and unloaded.It should be understood, however, that the system can also be designed so that loading depot setting is being On the side of system, and discharge point is arranged in the opposite side of system.In some embodiments, substrate can manually be executed to load Loading and/or substrate on body provide automatic device to execute in these tasks from the unloading of carrier, and in other embodiments One or all.

Substrate, which is loaded onto, to be located in loading/unloading station 105 and from the carrier that carrier returns to 110 transmission of station.Often A carrier in system on the direction of direction of travel the linear array of support substrate (that is, being arranged to single two Or more substrate).Carrier returns to station 110 via carrier from loading/unloading station 105 and is moved to buffered station 115.Carrier is parked in slow In punching station 115, until low vacuum lock chamber (low vacuum loadlock) (LVLL) 120 is ready to receive them. Hereinafter by some embodiments of description, buffered station acts also as inclination station, and the carrier of horizontal orientation is inclined by 90 ° in buffered station It is vertically-oriented to present.In such an embodiment, when substrate is in generally vertical orientation, substrate is maintained at using clip (clip) Position.

In reasonable time, valve 112 is opened, and the carrier being located in buffered station 115 is transferred into LVLL 120 In.It is closed with late gate 112, and LVLL 120 is evacuated to black vacuum level.Hereafter, valve 113 is opened, and carrier quilt It is sent in high vacuum lock chamber (high vacuum loadlock) (HVLL) 125 from LVLL 120.When HVLL is sucked into When its vacuum level, valve 114 is opened, and carrier is sent to from HVLL 125 in process cavity 130.The system can have Any number of process cavity 130 being aligned linearly so that carrier can be via being located between each two process cavity Valve be transferred into next chamber from a chamber.In the end of last process cavity, valve is disposed with to lead to The vacuum lock device opposite with the vacuum lock device in system entry is HVLL first and be followed by LVLL.Hereafter, it carries Body leaves via valve 116, reaches carrier and returns to module 135.Using being for example positioned in above or below process cavity 130 Conveyer (not shown) makes carrier return to station 110 back to carrier from module 135 is returned.

As mentioned above, the linear array of each carrier supported substrate, this makes it easier to load and unload substrate, and And it makes it easier to processing, manipulate and transmit carrier.However, in order to make system that there is format high throughput, 130 quilt of each process cavity It is configured to accommodate and processing simultaneously is positioned in several (that is, two or more) arranged in a manner of one by one and carries The two-dimensional array of substrate on body.For higher efficiency, in the specific embodiment of Fig. 1, buffered station 115,120 and of LVLL HVLL 125 is respectively configured to the identical carrier of the amount vector for accommodating with being accommodated simultaneously in process cavity 130 simultaneously.For example, Each carrier can support three glass substrates in a row, but each process cavity is configured to process two loads simultaneously Thus body processes the two-dimensional array of 3 × 2 substrates.

According to other embodiments, vacuum lock chamber and buffer chamber are dimensioned pairs of multiple carriers (for example, two Carrier) operation is carried out, to provide increased pumping/ventilation and pressure stability number.Moreover, buffer chamber can be used for making carrier Movement one kind out of a kind of the movement transitions to process cavity of CFS to CFS continues through movement.For example, an if process cavity With still-mode processing carrier, next chamber is processed with traveling mode, then can be arranged between the two chambers slow Rush chamber.Carrier in system forms continuous carrier current in process cavity or module, and each process cavity/module can By in a manner of head to foot (head to toe fashion) persistently it is mobile by processing source (for example, heat source, PVD, quarter Erosion etc.) 5 to 10 carriers.

As shown in fig. 1, system-specific is positioned in atmospheric environment in the part of the transmission of substrate, loading and unloading substrate In.On the other hand, all processing execute in vacuum environment.Ratio is transmitted, loads and unloaded in atmospheric environment in vacuum In it is much easier.

Figure 1A shows that an example (all systems as shown in Figure 1) for system, wherein carrier 200 are being transmitted and processed Period keeps being in horizontal orientation.Carrier returns to starting point via the linear conveyor 140 being positioned in above process cavity. Linear conveyor 140 can be conveyer belt or a series of driven wheels.As shown in Figure 1A, the support of each carrier 200 is by linearly cloth Set four substrates 220 in a row.Also, for illustrative purposes, the top of chamber 120 is removed, so that exposure is by simultaneously The arrangement of six carriers of positioning within chamber 120.Therefore, according to this embodiment, in four substrates of each carrier supported, often A chamber processes 24 substrates simultaneously.

Figure 1B shows carrier example horizontal but vertical during processing during transmission and loading/unloading.Figure Device in 1B is very similar to the device in Figure 1A, in addition to vacuum lock chamber and process cavity are vertically overturn, to add Work is in vertically-oriented substrate.The construction of vacuum lock chamber and process cavity in two embodiments of Figure 1A and Figure 1B can be with Identical, in addition to they are horizontally mounted in figure 1A, and they about its side vertical are installed in fig. ib.Cause This, buffered station 115 and the buffered station 145 on the system other end are modified by include carrying 90 ° of the directed change of carrier Device is risen, the lifting device is as shown in buffered station 145.

Fig. 2 shows the linear array carrier according to one embodiment, the carrier can be configured to for process Silicon Wafer, Glass substrate etc..As shown in Fig. 2, the structure of linear array carrier is comparatively simple and cheap according to this embodiment.It will be appreciated that Carrier can be configured to only install different fixture (chuck) by face on this carrier come for different substrate quantity and lining Bottom size.And, it should be noted that, each process cavity can be configured to house several carriers simultaneously, to process simultaneously Positioned at multiple wafers of multiple carriers.

The carrier 200 of Fig. 2 is constructed by simple frame 205, and the frame 205 is by two transmission tracks 215 and two ceramics The formation of bar 210.Ceramic bar 210 improves the thermal insulation being attached between its carrier (not shown) and the rest part of chamber. As shown in illustration, at least side of each ceramic bar 210 forms fork-shaped arrangement 235 with transmission track 215 together.In fork-shaped cloth Cavity 245 is formed in setting 235, so that ceramic bar 210 can be moved freely under thermal expansion and (be shown by double-headed arrow), without Pressure is applied to transmission track 215.

Magnetic drive bar 240 is arranged on each transmission track 225, enables to transmit carrier through system.Magnetic Property drive rod rides on magnetized wheel to transmit carrier.In order to improve the cleannes of system, drive rod 240 can be nickel plating. This magnetic devices ensure accurately to transmit, and carrier is made not slided due to high acceleration.Also, this magnetic devices realize wheel Big spacing so that carrier is attached to wheel by magnetic force, and can be as (cantilever) protruding as cantilever is big Range is come across big gap.In addition, since carrier by magnetic force is attached to wheel, this magnetic devices make it possible in vertical or water Calm down and is passed up carrier.

Carrier contact assembly 250 be attached to transmission track 225 and with the chamber contact assembly 252 that is attached to chamber (referring to illustration) cooperation.Chamber contact assembly has insulating bar 260, which, which has, is embedded in contact brush therein 262.There is contact assembly 250 conductive extension 251 (Fig. 2A), the conductive extension 251 to be inserted in insulated spring 264 and insulating bar Between 260, to be compressed against on brush contact 264 so as to receive from cooperation contact bias voltage.Biasing can be used for Such as Substrate bias, substrate clamping (being directed to electrostatic chuck) etc..Biasing can be RF or DC (continuous or pulse).Carrier touches Head assembly 250 can be arranged on the one or both sides of carrier.

Fig. 2A is to show how carrier is transmitted for and how carrier receives the partial cross-section of bias power.It is specific and Speech, Fig. 2A show the drive rod 240 on three magnetized wheels 267 for riding over and being attached to axis 268.Axis 268 extends beyond chamber Wall 269 so that the axis 268 can be rotated by the device outside the inner vacuum environment of chamber.Axis 268 is via such as O-ring Flexible-belt is attached to motor, to adapt to the change of shaft diameter.

Fig. 2 B show the example of the carrier for processing Silicon Wafer (for example, for manufacturing solar cell).In Fig. 2 B In, wafer 220 can be clamped to carrier 223 using such as clamping potential.Lifter (lifter) 215 can be used for being promoted With reduce wafer, to be loaded and unload.Fig. 2 C show that carrier can be used for processing the reality of the glass substrate of such as touch screen Apply example.In this embodiment it is possible to which substrate is held in place using mechanical spring loads fixture or clip 227.Carrier 224 It can be the simple pallet (pallet) with the device for spring loads clip.

Fig. 3 A and Fig. 3 B combination carriers return to the embodiment for showing that substrate is loaded with feel trim actuator.Fig. 3 A are to load/unload The vertical view of mounted mechanism, and Fig. 3 B are side views.As shown in Figure 1A, conveyer makes carrier return after processing is completed.Then, it carries Body is declined by lifter 107 and is flatly sent to loading/unloading station 105.As shown in Figure 3A and Figure 3B, doubly-fed machine (i.e. conveyer 301 and 303) be used to bring new substrate to be processed and remove processed wafer.Due to being anyway System is all by the operation of just the same ground, thus which conveyer brings new wafer and which conveyer to remove processed wafer It is not important.Also, it in this embodiment, shows that conveyer 301 and 303 transmits substrate in the opposite direction, but works as Two conveyers can also reach identical result when advancing in a same direction.

The device of Fig. 3 A and Fig. 3 B are supported while manipulating two carriers.Specifically, in this embodiment, by processed lining Bottom is unloaded from a carrier, while new substrate being loaded on another carrier.In addition, simultaneously, processed substrate be placed in through On process substrate conveyer, and new substrate is picked up from new substrate conveyor, to be delivered in next circle (round) To carrier.This operation is following to be executed.

Substrate pickup mechanism is configured to tool, and there are two types of movements：Rotational motion and vertical and straight movement.Four bar clamps 307 are attached To substrate pickup mechanism 305.Fixture 307 can be such as vacuum fixture, electrostatic chuck.In the specific example, using four Bernoulli Jacob (Bernoulli) fixture is arranged, Bernoulli Jacob's fixture can keep the fixture of substrate using Bernoulli suction.Four row foldings It is two rows of that tool is oriented every side so that when two bar clamps and carrier alignment, in addition two bar clamps are aligned with conveyer.Therefore, When mechanism for picking 305, which is in it, reduces position, a bar clamp picks up processed substrate from carrier, and another bar clamp will be new Substrate is placed on another carrier, and on another side, processed substrate is placed on a conveyer by a bar clamp, and another One bar clamp picks up new substrate from another conveyer.Then, mechanism for picking 305 is in its raised position and rotates 180 degree, Wherein simultaneously, carrier moves a pitch, that is, the carrier shifting for carrying new substrate moves a step, what processed substrate was removed therefrom Carrier is moved to new substrate-loading position, and another carrier with processed substrate is moved in unloading position.Pickup Mechanism 305 reduces position then in it and repeats the process.

In order to provide specific example, in the snapshot of Fig. 3 A, carrier 311 has by one on pick device 305 The processed substrate of bar clamp pickup.Carrier 313 is loading the new substrate of another bar clamp from pick device 305. On the other side of pick device 305, processed substrate is placed on conveyer 303 by a bar clamp, while another bar clamp New substrate is picked up from conveyer 301.When these action complete when, pick device 305 be promoted to its raised position and 180 degree is rotated as shown in curved arrow.Meanwhile whole carrier shiftings move a step, i.e., carrier 316 is moved to previously by carrier 317 The position occupied, the carrier 313 for being mounted with new substrate at this time are moved to the position previously occupied by carrier 316, the load of this space-time Body 311 is moved to the position previously occupied by carrier 313, and the carrier 318 for being mounted with processed substrate be moved to previously by The position that carrier 311 occupies.Pick device is reduced now so that carrier 311 is mounted with new substrate, and processed substrate is by from carrier 318 remove, and the substrate removed from carrier 311 is placed on conveyer 303, and picks up new substrate from conveyer 301.Then, Pick device 305 is raised, and repeats the process.

The embodiment of Fig. 3 A and Fig. 3 B also use optional mask lifting device 321.In this embodiment, mask by with In generating required pattern on the surface in the substrate, that is, some regions of the substrate are exposed to be processed, while covering it Its region is to prevent from processing.Carrier travels across system in the case where mask is placed in above substrate, until carrier reaches Mask lifter 321.When reaching mask lifter with the carrier of processed substrate (carrier 318 in Fig. 3 A and Fig. 3 B), Mask lifter 321 is in its raised position and promotes mask from carrier.Then, carrier can advance to discharge point to unload Its processed substrate.Meanwhile the carrier (carrier 319 in Fig. 3 B) with new substrate is moved in mask lifting device, and Mask lifter 321, which is in it, reduces position, mask to be arranged on new substrate to be carried out at processing.

As being appreciated that, in the embodiment of Fig. 3 A and Fig. 3 B, mask lifter removes mask simultaneously from a carrier And mask is placed on different carriers.That is, mask does not return to the carrier that the mask is removed from it, but pacified It sets on different carriers.According to the design and number of carrier in system, after several circles, mask would be possible to back to same One carrier, but only by after the promotion of another carrier.Vice versa, i.e., according to the design of carrier and mask in using and Number, each mask are possible by all carrier uses in system.That is, each carrier in system will be with system In each mask be used together, wherein carrier will use different masks to pass through system in each process-cycle.

As shown in illustration, carrier lifter can be by being arranged two vertical conveying devices (on every side of carrier respectively There are one) realize.Each conveying device is made of the one or more conveyer belts 333 actuated by roller 336.Lift pin 331 It is attached to conveyer belt 333 so that when conveyer belt 333 moves, lift pin 331 engages carrier and in the vertical direction mobile load Body depending on lifter (that is, upward or downward, being positioned on which side of system and carrier return conveyor being positioned in and adds Work chamber either above or below).

Fig. 3 C show the embodiment of substrate aligning guide.According to this embodiment, fixture 345 adds on side with spring Alignment pin 329 is carried, and there is recess 312 on the opposite side.As shown in dotted line and rotational arrow, rotation is promoted 341 and is constructed At entrance recess 312 with pushing tow substrate 320 against alignment pin 329, and then withdraw.Note that it 341 is not fixture that rotation, which is pushed pin, 345 or carrier a part and do not advance in system, but it is static.If using mask, spring loads alignment pin It is depressed into lower position.Therefore it provides including the substrate aligning guide of fixture, which, which has, is configured with the first of alignment pin Side, be orthogonal to the first side and be constructed there are two the second side of alignment pin, opposite with the first side and to be configured with first recessed The third side and the 4th side that is opposite with the second side and being configured with the second recess of mouth；Aligning guide further includes being configured to It is promoted into the first recess against the first of the first alignment pin with pushing tow substrate, and is configured to enter the second recess and push up Push away second distribution of the substrate against two alignment pins.

Fig. 4 shows the embodiment for the vacuum processing chamber room 400 that can be used together with disclosed system.Fig. 4's In diagram, the lid of chamber is removed with its internal structure of exposure.Chamber 400 can not form it or its construction is taken the post as What is installed in the case of changing at horizontal or vertical orientation.Chamber is by the simple babinet frame with the opening 422 for vacuumizing Frame is constituted.It is cut with entrance opening 412 in a side wall, while being cut with exit opening 413 in opposite side wall, so that Chamber can be entered, cross entire chamber and leave chamber from the other side by obtaining carrier 424.Gate valve (gate valve) is arranged on At each opening 412 and 413, although in order to which the illustrative clarity of Fig. 4 illustrates only gate valve 414.

In order to realize that efficient and accurate transmission of the carrier 424 in horizontal and vertical orientation, magnet pulley 402 are arranged on chamber In the opposing sidewalls of room.Carrier has the magnetic shaft ridden on magnet pulley 402.The axis for being equipped with wheel 402 thereon extends to chamber In external atmospheric environment, axis is actuated by motor 401.Specifically, several motors 401 are arranged, each motor utilizes Belt (for example, O-ring) actuates several axis.Also, idle pulley 404 is set laterally to limit carrier.

The embodiment of Fig. 4 is characterized in that the diameter of magnet pulley is less than the sidewall thickness of chamber.This makes it possible to magnet pulley It is placed in entrance opening 412 and exit opening 413, as shown in wheel 406 and 407.It is placed in import since 406 and 407 will be taken turns Opening 412 and exit opening 413 in minimize carrier in the case of the support not from wheel must across gap, So that carrier can further smoothly be conveyed into chamber and is communicated off from chamber.

Fig. 5 shows the embodiment of mask and carrier module.It is carried out from left to right along curved arrow, single substrate mask set Part 501 is mounted on the mask carrier 503 for supporting several mask assemblies；And mask carrier 503 is mounted to substrate load On body 505.In one embodiment, mask assembly is held in place by the spring between floating mask assembly 501, so as to It is engaged with the guiding pin 507 being arranged on substrate carrier 505 so that each its corresponding substrate alignment of mask.Each single lining Bottom mask assembly is by interior paillon mask construction that is cheap and can repeatedly using.According to desired design, paillon mask It is made of the flat sheet of the magnetic material with perforation.Outer mask covers and by protecting interior mask through affected by hot loading, makes Obtaining paillon mask will not deform.Interior masks area of the aperture exposure with perforation in outer mask.Frame is covered by interior mask and outside Mould is maintained on mask carrier 503.Interior paillon mask is pulled to and substrate contact by magnet in substrate carrier 505.

Each 517 single substrate of support of substrate support (for example, machinery or electrostatic chuck).Each fixture 517 can be changed Become to support the substrate of different type and/or size so that same system can be used for the substrate for processing different sizes and type. In this embodiment, fixture 517 has retractible substrate alignment pin 519 and substrate is made to be aligned in fixture devices above (provision).In this embodiment, realize that the device of alignment is made of the slit 512 of receiving retractable pin, the retractable pin Pushing tow substrate then retracts against alignment pin 519 and exits slit 512.This enables substrate and mask aligning substrate carrier, So that mask registration substrate.

As being appreciated that, up to the present described system manufacturing cost is low and provides (all to various substrates Such as solar cell, touch screen) high-efficiency vacuum processing.System can be configured with both ends (double end) or single-ended It loads and unloads, i.e., carry out substrate loading and unloading from side, or load from side and unloaded from opposite side.Not in a vacuum Manipulation is executed to substrate.Since required many vacuum processing chamber rooms may be mounted at input vacuum lock chamber and output vacuum lock Between determining room, therefore system is modular.Vacuum chamber has simple design, in a vacuum only seldom part.Very Plenum chamber can directionally be installed at horizontal or vertical.For example, being processed for solar cell, system can be on horizontal orientation Process substrate, and for touch screen, it can be in vertically-oriented upper process substrate.Anyway, the loading in atmospheric environment, unload It carries and transmission is completed in the case where substrate is in horizontal orientation.Processing source (for example, sputtering source) can be installed in lining Bottom above and or below.System can be carried out through formula processing or static processing, though substrate it is static during vacuum is processed or It is mobile.Chamber can accommodate sputtering source, heater, injection electron gun, ion etching source etc..

For application of solar energy, vacuum chamber may include low energy injector (for example, being less than 15KV).For specific Solar cell design (for example, PERC, IBC or SE), mask set can be used for executing the injection for applying mask.Also, line Reason etching can be executed with and without mask using ion etching source or laser assisted etching.Point is connect Electric shock pond can use the mask in the hole that contact is aligned with many.Also, it can be by being continuously directed at several pvd chambers Room and another floor is continuously formed on a floor to form thick metal layers.

For touch tablet application, chamber can be used for depositing cold and/or hot ITO layer using PVD source.If the process with Dry (for example, three) touch tablet is arranged in the width direction on each carrier and several (such as two) carriers are same When be located in the indoor mode of each chamber to execute, to realize higher treating capacity and simpler manipulation.Same system can be with The glass of touch screen or handset size to tablet computer manipulates, and is reconfigured without any inside.In simple terms, structure Make carrier appropriate and whole system remains unchanged.In addition, not executing manipulation to substrate in a vacuum.

For the substrate of all types and size, manipulates and processing operation can be identical.Empty carrier is moved with from carrier Return to lifter load.If using mask, mask is removed and rests at lifter.Substrate quilt in atmospheric environment It is loaded on carrier.Carrier moves back to lifter and mask is placed in above substrate.Then, carrier is moved to vacuum lock Determine in room.In a vacuum, the transmission of carrier is via being located in chamber wall and by the air or vacuum environment from exterior thereto Activate the simple magnet pulley of (energized).Chamber can have the valve for isolation, and can have in drawer (drawer) source above or in drawer, with the substrate of processing lower section.Substrate can be removed at the unloading end of system, Huo Zheting It stays on carrier to return to load terminal (that is, inlet side of system).Carrier is on simple conveyer belt from the processing end of system Back to the load terminal of system.Simple pin type conveyer carrier promoted or is reduced to reprinting and discharge point or from loading and Discharge point promotes or reduces carrier.

Fig. 6 A to Fig. 6 C show three embodiments, illustrate how vacuum chamber is equipped with different sizes and configuration Different processing sources.In the example of Fig. 6 A to Fig. 6 C, presentation is three substrates arranged along width, but make it is of course possible to More or fewer substrate is arranged on carrier in the width direction.Moreover, in Fig. 6 A to Fig. 6 C, presentation is that process cavity can Several (for example, two or three) carriers are accommodated, to be carried out at the same time processing.Source shown in Fig. 6 A to Fig. 6 C can be any adds Work source, PVD, etching, injection etc..

Fig. 6 A show the embodiment that single source 601 is arranged on chamber 600.The single source is positioned in chamber for processing All substrates in room 600.Source 601 can have while cover the length and/or width of all substrates.For certain sources, system Making so large-sized single source may be too complicated or too expensive.For example, if source 601 is sputtering source, target body must manufacture Must be very big, this is costly, complicated, and causes utilization rate insufficient.Therefore, it according to the embodiment of Fig. 6 B and Fig. 6 C, uses Several smaller sources.In the embodiment of Fig. 6 B, each of source 603A-603C is sufficiently wide only to cover single substrate, But it alongst (that is, on direction that substrate is advanced) can also cover more than one substrate.By the way that source is interlocked Arrangement so that each source one of only covers in each carrier substrate, all substrates and can be processed.This arrangement is special Fit through formula processing.On the contrary, in the embodiment of Fig. 6 C, each of source 606A-606C is sufficiently wide i.e. perpendicular to lining All substrates in a carrier are covered on the direction of bottom direction of travel, but they are too narrow and cannot cover and be located in chamber All substrates.In fact, in some embodiments, each of source 606A-606C or even than one substrate are narrow.This arrangement It is equally applicable to through formula processing or static processing.

Above mentioned embodiment provide a kind of vacuum processing chamber room, which, which has, is dimensioned so as to for holding Receive and process simultaneously the vaccum case of several substrate carriers.The shell is further configured to for simultaneously supporting several processing Source.Processing source for example can be sputtering source, which can be that length is enough across all substrates kept by substrate carrier But width can be narrower than the width of the substrate on carrier narrow source.Several this introduces a collections can be on carrier direction of travel (back-to-back) is located in the whole length or partial-length of chamber in a manner of back-to-back.Chamber, which has, to be positioned in Several axis on two opposite sides, to transmit carrier in chamber.Each axis is rotated by the flexible-belt actuated by motor.Often A axis has several magnet pulleies being positioned on alternate pole order (pole order), i.e. the periphery quilt when a wheel It is magnetized to south and internal diameter is when being geomagnetic into north, the periphery of adjacent wheel is geomagnetic into north and internal diameter is geomagnetic into south.Chamber Also with the import side wall and exit side wall opposite and with exit opening with the import side wall for carrying entrance opening；Wherein Magnetization wheel apparatus is positioned in import side wall and is projected into entrance opening, and magnetization wheel apparatus is located in exit side wall It is interior and be projected into exit opening, to drive substrate carrier to pass through entrance opening and exit opening.

Disclosed system is linear system, and the mode that middle chamber is attached to next chamber with a chamber is linear Ground is arranged so that substrate carrier enters system, crosses all chambers in a linear fashion and leave on the opposite side from side is System.Carrier moves directly to next chamber via the gate valve for separating chamber from a chamber.Once carrier leaves the true of system Altitude, carrier are put into lifter and are vertically moved to return conveyor, which by carrier levels passes The entrance side for sending system back to enters another lifter in entrance side carrier and is vertically moved to load new substrate, and And it is again introduced into the vacuum environment of system.When carrier transmits in atmospheric environment, carrier is retained horizontal orientation.However, In one embodiment, when carrier enters vacuum environment, it is rolled over vertically-oriented so that substrate is being held in vertically It is subject to processing when in orientation.

System can have the loading and discharge point for being positioned in system entry side.It loads and there is uninstalling system rotation to tie Structure, four bar clamps are located in a manner of in each two rows in every side of pivot center in the rotational structure.In every side of pivot center On, a bar clamp is configured for unloading processed substrate, and a bar clamp is configured for loading new substrate.Rotation Structure is configured to vertical and straight movement, wherein substrate is picked up when the rotational structure is in structure when it reduces position, and working as should The structure rotates 180 degree when rotational structure is in its raised position.Also, it when the structure, which is in it, reduces position, is rotating On every side of axis, a bar clamp picks up substrate, while the placement of another bar clamp (that is, release) its substrate.In one embodiment In, the entrance across system is arranged two conveyers, and one of conveyer delivers new substrate, and another conveyer remove through Process substrate.Rotational structure is constructed such that, in its reduction by one bar clamp of position by the conveyer with the new substrate of delivering Alignment, and another bar clamp is aligned with the conveyer for removing processed substrate.Meanwhile on the other side of pivot center, one Bar clamp is by the carrier alignment with sky, and another bar clamp is by the carrier alignment with the processed substrate of holding.

In some embodiments, the device for applying potential to substrate is set.Specifically, each carrier includes conductive bar, When carrier enters process cavity, conductive bar is inserted into including elongated contacts brush and compliant type (conformal) insulated spring Slider in, which is configured to conductive bar being pressed against on the elongated contacts brush.Insulation strip is (all Such as Kapton items) it can be used for conductive bar being attached to carrier.

When the processing of substrate is needed using mask, mask can be individually placed in above each substrate, Huo Zheyi A mask can be formed with while cover all substrates of a carrier.Mask can be maintained at using such as magnet Position.However, in order to accurately process, mask must be done very thin, and therefore may during processing due to thermal stress and Deformation.In addition, thin mask can rapidly collect deposit, and these deposits may interfere with the accurate placement of mask And masking.Therefore, it will be advantageous using according to the dual masks device of embodiments hereinafter disclosed.

Fig. 7 A to Fig. 7 E show regarding for more silicon wafer carriers with the device for dual masks according to various embodiments Figure.Fig. 7 A show more silicon wafer carriers with dual masks device, and wherein mask set, which is in, reduces position so that interior mask with Wafer is in closely physical contact；Fig. 7 B show that more silicon wafer carriers with dual masks device, wherein mask set are in Raised position, to realize the replacement of wafer；Fig. 7 C show more silicon wafer carriers with dual masks device, including wafer Lifter for load/unload wafer；Fig. 7 D show the partial cross-section of more silicon wafer carriers with dual masks device, wherein Mask set and wafer lifter are in raised position；And Fig. 7 E show the office of more silicon wafer carriers with dual masks device Cross section figure, wherein mask set and wafer lifter, which are in, reduces position.

With reference to figure 7A, more silicon wafer carriers, also referred to as carrier support 700, tool there are three individual single-wafer carrier or Carrier 705, these single-wafer carriers or carrier are supported by carrier frame or bar 710, and carrier frame or bar 710 are for example It is made of ceramics.Each single-wafer carrier 705 is configured for keeping together single wafer and dual masks device.Scheming In 7A, dual masks device, which is in, reduces position, but is located in arbitrary carrier without wafer, to expose the construction of carrier. In Fig. 7 B, dual masks device is shown at raised position, also without wafer in arbitrary carrier.In the reality of Fig. 7 A to Fig. 7 E It applies in example, lifter 715 is for promoting and reducing dual masks device；However, in order to reduce cost and reduce complexity, Ke Yiqu Disappear lifter 715 and can be with hand hoisting dual masks device.Transmission track 725 is arranged on every side of frame 710, so that System can be run through by, which obtaining, transmits carrier 700.

There is each single-wafer carrier 705 base portion 730 (visible in figure 7b), the base portion 730 to have with recess portion 735 Raised frame 732, to support the wafer suspended by its periphery.Base portion 730 with frame 732 forms bag under the wafer of suspension Shape portion (pocket) 740, the pocket 740 are beneficial for the damaged wafer fragment of capture.In some embodiments, frame 732 can detach with base portion 730.Outer mask 745 is configured to be installed on frame 732, so as in covering framework 732 and covering The periphery of mask, but exposure is corresponding to the interior mask center part of wafer.Cross-sectional view citing in this embodiment by Fig. 8 Explanation.

In fig. 8, base portion or carrier 805 have the raised frame 830 with recess portion 832, and the protrusion frame is in its week Wafer 820 is supported at side.Base portion 805 with frame 830 forms pocket 840, and wafer is suspended above in the pocket Side.Series of magnet 834 is positioned in raised frame 830, so as to around the periphery of wafer 820.In some embodiments, especially High-temperature operation, magnet 834 can be made in it of SmCo (SmCo).Interior mask 850 is positioned in raised frame 830 and wafer It above 820, and is held in place by magnet 834 so that the interior mask physically contacts with wafer.In outer mask 845 is placed in Above mask 850 and physically contact with the interior mask so that outer mask covering is designed in addition to interior mask to wafer Assign 850 periphery of interior mask other than the region of processing.Fig. 9 shows the example of outer mask 945, in this example outer mask by The aluminium flake of folding is made, wherein since the example is for the isolation processing of edge branch, thus the interior mask of outer mask covering is in addition to small Region other than periphery edge 952.Figure 10 shows that the example for the interior mask 750 being isolated for edge branch, interior mask are basic It is flat sheet metal, there is aperture, size (for example, than the size of wafer smaller 1-2mm) of the aperture in addition to being slightly less than wafer In addition, size and shape are identical as the size and shape of wafer.In the embodiment in fig. 8, mask frame 836 is configured to enabled Interior mask and outer mask are simultaneously lifted off carrier by enough interior masks of support and outer mask.In this configuration, outer mask 845 is pressed from both sides Between mask frame 836 and interior mask 850.

Fig. 8 A show another embodiment, can for example be used to form contact pattern on the back side of wafer.At this In embodiment, carrier formed top platform with by wafer support over its entire surface.Top table of the magnet 834 in carrier It is embedded in the whole region of carrier under face.Interior mask 850 covers the whole surface of wafer 820, and is designed according to contact With multiple holes.

Fig. 7 A to Fig. 7 E are returned to, lifter 715 can be used for together rising outer mask and interior mask.Also, wafer carries It rises device 752 to can be used for wafer lifting off frame 730, so as to replace with the wafer for processing using manipulator New wafer.However, it is possible to cancel lifter 715 and 752, alternatively complete to promote mask in a manual fashion and replace wafer Operation.

In the embodiment described above with reference to Fig. 8, carrier supports wafer on its periphery edge so that wafer is hanged It sets.It is formed in the damaged wafer fragment of the capture of the pocket below wafer and prevents the package of deposition materials.On the other hand, exist In the embodiment of Fig. 8 A, wafer is supported over its entire surface.Mask assembly be lowered to for sputter or it is other plus The position of work form, and manually or mechanically promoted the loading to carry out wafer and unloading.A series of magnetic on carrier Body helps to fix in place by interior mask and interior mask is made to be in close contact with wafer.After repeated use, interior mask and outer mask can It is replaced, while the rest part of carrier module can be used again.Frame 810, also referred to as mask assembly side lever, can be by Low thermal expansion material (such as aluminium oxide or titanium) is made.

According to above example, interior mask and substrate are established close and gapless are contacted.Mask in the protection of outer mask, Carrier and carrier frame are not influenced by deposition materials.In the shown embodiment, outer mask open and interior mask open are in quasi- side Shape shape is suitably applied the monocrystalline solar cells during edge branch isolation technology.During other techniques, interior mask tool There are certain apertures to arrange, and outer mask has the aperture of quasi- square configuration.Quasi- square configuration is that corner is cut according to wafer from it Billet cutting it is rectangular.Certainly, if using polycrystalline square wafer, outer mask open and interior mask open are also rectangular 's.

Figure 11 shows the embodiment of single-wafer carrier 1105.Wafer is placed at its periphery on recess portion 1132.With void Magnet 1134 shown in line all around wafer is arranged in carrier inside.Alignment pin 1160 is for making external module be directed at carrier 1105.Figure 12 shows the embodiment of outer mask from the visual angle of downside.Outer mask 1245 has the alignment corresponding to carrier 12 05 The alignment hole or recess portion 1262 of pin 1260.

Figure 13 is shown for keeping outer mask and interior mask and mask being fixed to the top frame 1336 of carrier Embodiment.Top frame 1336 can be made of such as two longitudinal rods 1362, the two longitudinal rods 1362 pass through two cross It keeps together to bar 1364.Outer mask is maintained in pocket 1366.Alignment hole 1368 is configured to make top frame pair Quasi- carrier.

Figure 14 shows that the example of the interior mask with sectional hole patterns, sectional hole patterns are for example designed to manufacture on wafer Multiple contacts.This interior mask can be used together with carrier shown in figure 15, and wherein magnet 1534 is distributed over wafer In the whole region of lower face.Magnet is oriented alternant polarization.

Top or outer mask can be made of the aluminium, steel or other similar materials of thin (for example, about 0.03 inch), and by It is configured to coordinate with substrate carrier.Interior mask is by the flat steel disc of very thin (for example, about 0.001 to 0.003 inch) or other Magnetic material is made, and is configured to be nested in outer mask.

According to other embodiments, the device for supporting wafer during processing is provided, which includes：With raised frame The silicon wafer carrier or carrier of frame, the protrusion frame have for the perimeter support wafer around wafer and are restricted to wafer The recess portion in precalculated position；It is configured to be placed in the interior mask above raised frame, which, which has, is configured to masking crystalline substance The aperture arrangement of a round part and the rest part of exposure wafer；And it is configured to be placed in above raised frame and be located at Outer mask above interior mask, the outer mask have the single opening for being configured to partly cover interior mask.Top frame carries Body can be used for keeping interior mask and outer mask, and interior mask and outer mask are fixed to wafer carrier.

Magnet is positioned in carrier, and is being carried completely around frame in the form of N-S-N-S-N or completely Replace below the whole surface of device and immediately below wafer.Outer mask and interior mask are designed to only keep to frame by magnetic force Frame, so as to which substrate easily and quickly can be loaded and be unloaded.

Mask assembly can be removed from silicon wafer carrier and braced frame, to load a substrate into carrier.Outer mask and Interior mask is elevated as a part for mask assembly.Once wafer is positioned on carrier, is located in wafer pocket, mask Component is just lowered back down on carrier.The top surface of interior mask and wafer is folded.Magnet in carrier frame is covered interior Mould is pulled to downwards to be in close contact with substrate.This forms the edge of wafer and closely complies with sealing.Outer mask is designed to use In preventing from depositing on mask in thin compliance.As described above, depositing technics may lead to interior mask heating, mask is caused to stick up Song simultaneously makes the contact with wafer fluff.If mask loses the contact with wafer, metal film can be deposited on the table of substrate wafer In exclusionary zone on face.Pocket prevents substrate and mask opposite with the frictional force generated by magnet during transmission and deposit It moves each other, and outer mask prevents that film deposit occurs on interior mask and prevents interior mask warpage.

By using vacuum carrier exchanger, mask assembly can be removed periodically from the system with carrier. The carrier exchanger is the vacuum shell for having carrier transport mechanism.It enables carrier " (onthe in operation Fly it) " is exchanged, the continuous operation without halt system.

Figure 16 A to Figure 16 D show the embodiment that can be realized in loading depot (such as loading depot 105).In the implementation In example, wafer board is used to support wafer, and wherein wafer board is removably attached to carrier from bottom side, while dual masks are attached from top side It connects.Figure 16 A to Figure 16 D illustrate only the relevant portion of system to simplify explanation.Also, some elements have been had been removed so as to reality The visualization of the feature of current embodiment.

In Figure 16 A to Figure 16 D, carrier 1600 includes the simple frame 1605 for having multiple openings 1602, the multiple Shape of the opening 1602 with substrate to be processed (for example, semiconductor crystal wafer), but can be slightly larger so that substrate can be from wherein Pass through.Multiple wafer boards 1610 are attached to the bottom of each carrier 1600.Wafer board 1610 is typically the aluminium sheet of simple form, and And may include the attachment mechanism for the bottom side that wafer board is attached to carrier 1600.When wafer board 1610 is attached to carrier 1600 When, the substrate 1620 being located on the front of wafer board 1610 is aligned with opening 1602 and is exposed by the opening 1602.Attachment Mechanism may include mechanical clip, spring, magnet etc..In the illustrated example, multiple magnets 1612 (Figure 16 C) are used as being attached Mechanism.

Mask set 1649 is positioned on the top side of each carrier 1600 so that each covering of mask set 1649 passes through One substrate of 1602 exposure of opening.Mask set 1645 can be analogous to the dual masks dress of device shown in Fig. 9 and Figure 10 It sets, but other devices can also be used, this depends on pending processing.For example, Figure 16 E show dual masks device, wherein Interior mask 1650 is the simple thin flat sheet of metal stamped out, and the sheet metal is made of paramagnetic material in this example.Outer mask 1645 be simple aluminium sheet, with the shape opening similar but slightly larger with the opening of interior mask.Note that being filled in this dual masks In setting, the inside dimension of the opening of only interior mask is crucial, and all other size does not need high fabrication tolerance, therefore is dropped The complexity and cost of low manufacture mask.And in the apparatus, mask is attached to carrier 1600 with fixed orientation so that The opening of interior mask 1650 is aligned with the opening 1602 in carrier.

For the sake of clarity, carrier 1600 is shown as in some drawings as being suspended, but certainly, carrier is supported And it is transmitted by transport mechanism such as shown in figure 1A.On the other hand, wafer board is independently advanced on dedicated conveyer belt 1632, Until they are delivered to platform 1664 and are then attached to carrier 1600.The operation of the mechanism is as follows.Hoisting mechanism 1662 is set It is set to and wafer board 1610 is loaded on wafer board linear conveyor (such as conveyer belt) 1633.Platform mechanism 1664 is configured to pair Each wafer board 1610 is aligned, and (using camera 1670) is so that be positioned in mask 1650 in wafer alignment thereon Opening, and wafer board is then risen so that it is attached to carrier 1600.In this embodiment, when wafer board is positioned in platform 1662 When upper, by 1614 applying vacuum of hole in wafer board 1610, to keep wafer during alignment procedures and to prevent it from moving. It prevents wafer to move since wafer board is clamped to carrier, can be terminated once wafer board is attached to carrier 1600 The vacuum.

In addition it is possible to use loader mechanism 1605 (Figure 16 D) loads a substrate into wafer board 1610.Note that can be with Wafer board 1610 is set to be mounted with substrate before wafer board 1610 is loaded on carrier.For example, at the time of shown in Figure 16 A, Show following process：Two wafer boards (being identified as A and B) do not have wafer, and a wafer board (being identified as C), which has, is placed in it On wafer but the wafer board be not yet attached to carrier 1600, and a wafer board (being identified as D) has and is positioned on Wafer and be raised and be attached to carrier 1600.

The advantages of embodiment shown in Figure 16 A to Figure 16 D is the transmission of the wafer board for loading and unloading wafer and load The transmission of body and mask is separately completed.In this way, wafer board can be removed from system to be cleaned.Moreover, by It is made of relatively cheap aluminum slab (slab) in wafer board, it is thus possible to new wafer board is easily changed into, without influencing system The operation of system.

As more clearly illustrated in Figure 16 B and Figure 16 D, empty carrier 1600 is delivered to work by lifter 1635 It stands, is then positioned on conveyer (for example, conveyer belt 1633).In this illustration, each carrier is configured to receiving two A wafer board, to process two wafers simultaneously, but carrier can also be made into accommodating the wafer board of other quantity.Another Conveyer (for example, conveyer belt 1632) transmits wafer board 1610 below conveyer 1633.Wafer load mechanism is (for example, machine People 1605) wafer is arranged in wafer board 1610.When wafer is arranged in wafer board 1610, conveyer 1632 is by wafer Plate 1610 is moved to the alignment station of 1664 top of alignment tool.Suction then is delivered to wafer board using vacuum pump 1647, to incite somebody to action Wafer is maintained in wafer board and wafer board is maintained on alignment tool.Specifically, wafer board has very below wafer Emptying aperture 1614.When applying suction by this some holes 1614, wafer is maintained in wafer board and seals this some holes.Therefore, The identical suction that wafer is stopped causes wafer board to be located against alignment tool holding by vacuum.Meanwhile conveyer 1633 will be empty Carrier 1600 is delivered to the alignment station right over platform 1664.Carrier in alignment station has in opening 1602 is attached to the carrier Mask set 1649.In order to execute alignment, the rise of carrier 1600 is left conveyer by actuator 1667 so that carrier is mechanical Ground is maintained at resting position.Then, platform 1664 promotes wafer board and executes rotation or translation as needed, with such as controller 1671 by making the opening of wafer alignment mask 1645 determined by the image that is obtained by camera 1670 like that.Once realizing just Really alignment, platform further rises wafer board, until the bottom side of wafer board contact carrier.Vacuum is terminated at this time so that wafer board passes through Carrier is attached to by mechanically or magnetically property device.Then, platform 1664 declines to receive another wafer board, while conveyer 1633 will Loaded carrier removes alignment and stands and bring the carrier of unloaded to repeat the technique.

In one embodiment, it is carried out as follows with the program of process substrate for loading：There is no the carrier of wafer from unloading It stands return.In the embodiment that wafer board is delivered by being attached to carrier, wafer board for example passes through 1662 quilt of hoisting mechanism It is removed from carrier and is reduced to conveyer.Selectively, wafer board 1610 can be delivered independently of carrier.Loader mechanism will Multiple wafers are arranged in a manner of one wafer of each wafer board in corresponding wafer board.Then, wafer board and carrier are only It is on the spot moved to alignment station, wherein camera 1670 is imaged wafer and mask.These images are provided to controller 1671, The controller 1617 checks alignment of the mask open relative to wafer.That is, in this particular example, mask 1645 with Fixed orientation is attached to carrier.Silicon wafer carrier is located on the x-y-z- θ platforms 1664 below camera.Using by camera 1670 images provided calculate location/orientation of the wafer relative to mask open by controller, and controller 1671 is to platform 1664 transmission signals as desired by translating or rotating x-y-z- θ platforms 1664 to correct orientation.Then, wafer board is carried by platform It rises and is attached to carrier, wherein wafer is oriented to contact with interior mask.In this position, wafer board is maintained at by magnetic force In carrier so that wafer is immovable, can then release vacuum.Moreover, identical magnetic force keeps dual masks device to be pressed against crystalline substance Circle.It is moved it is therefore prevented that wafer is directed at position relative to it.That is, in one embodiment, standing when wafer board is located at alignment In and wafer be positioned in alignment position when, via wafer board to wafer applying vacuum, to prevent wafer from moving.So And once wafer board is attached to carrier and mask contact wafer, so that it may to terminate vacuum suction.Then, carrier moves through For the system of processing, and the process is repeated when processing is completed.

In one embodiment, after processing is completed, wafer is removed in discharge point from wafer board, and subsequent wafer Plate is inclined to vertically-oriented.This, if any wafer is damaged during processing, to return to carry out in wafer board Topple over fragment before other processing.

Figure 16 F are the cross sections of the part of system, and amplifier section is shown in illustration.As can be seen that in this embodiment Dual masks device is used, wherein interior mask 1650 is covered by outer mask 1645.Magnet 1612 is around the periphery of wafer board 1610 Setting keeps wafer board 1610 to the bottom side of carrier 1605.

In a particular embodiment, following process is executed, wherein each carrier can support five wafer boards.Five wafer quilts It is loaded into five individual wafer boards.Subsequent five loaded wafer boards are moved to alignment station.In this specific embodiment In, each wafer board has the gasket that magnet is arranged around edge.Gasket can be belonged to by class in ASTM D1418 and ISO The fluoroelastomer for being named as FKM under 1629 standards is made.In alignment is stood, alignment tool carries five wafer boards from conveyer It lifts away from out and (provides five individual alignment tools herein to be aligned simultaneously to five wafer boards).When wafer board is by from conveying When machine lifts off, wafer board is firmly held on lifter and wafer is firmly held in wafer board by vacuum. At this moment, five cameras are respectively imaged five wafers.Then, carrier is moved to right over wafer board by conveyer In alignment station so that each of carrier opening is located in one of above wafer board.Then, carrier by from conveyer belt promoted from It opens, to locate the carrier within the resting position being mechanically fixed.Then, start camera with to five on carrier openings carry out at Picture.Then, x-axis and y-axis in each of the x-axis of each mask open of system-computed and y-axis and five wafers.Then, five A X/Y/ θ platforms move each wafer, so that the x-axis and y-axis of each wafer are overlapped to the x-axis of each corresponding mask and y-axis.With Afterwards, five wafer boards are moving upward, until wafer board contacts and is attached to carrier so that the wafer in each wafer board is determined In the corresponding opening of position in the carrier and contact mask in corresponding.Then, vacuum is released from so that wafer board is mechanical at this time Ground is magnetically attached to carrier.Then, carrier and platform are reduced and the process is repeated to second row.

Figure 16 G show the alternative embodiment of wafer board 1610.In this embodiment, wafer board 1610 is still by aluminum slab system At.Three vacuum tables (mesa) 1613 are arranged on the front of wafer board 1610, and each table top has vacuum hole 1614.One In a embodiment, table top is made of soft material, and each table top includes the sealing element 1611 around each hole 1614.Therefore, Above wafer is placed in wafer board 1610 and when vacuum is applied to table top, wafer is maintained at three platforms by vacuum Above face so that wafer does not contact the surface of wafer board 1610.Since three table tops are only arranged, will not apply to wafer makes Its power for being bent or fractureing.Moreover, buffering ring 1618 is arranged around the periphery of wafer board 1610.Magnet 1612 is embedded in buffering ring In 1618.In this embodiment, buffering ring does not provide gas-tight seal to wafer, to avoid towards the area suction of wafer board 1610 Wafer.This manufactures buffering ring 1618 or setting air duct 1619 to provide from environment to wafer by using porous material The fluid communication in the space between the top surface of wafer board 1610 is realized.

Figure 16 H show the top surface of the seat board 1672 according to one embodiment, which can be assembled to Both loading stage 1669 or alignment tool 1664, or be assembled to.Seat board 1672 is fixed to loading stage 1669 and alignment tool 1664 Top, and wafer board 1610 is placed on seat board 1672.As shown in Fig. 16 H, the top surface across seat board 1672 is set Set two groups of vacuum holes：Corresponding with wafer board 1610 the vacuum hole in first group of hole 1,668 1614 is aligned and that vacuum is formed to it is logical Road is kept wafer to wafer board 1610 with delivering suction to wafer.Second group of hole 1667 provides suction with by wafer board 1610 keep to the portions of alignment tool 1664.Therefore, in one embodiment, when carrier is delivered to loading depot, loading stage It is raised and at least starts the suction to second group of hole 1667 so that each loading stage is attached corresponding wafer by vacuum power Plate.When loading stage reduces, wafer board 1610 is detached from the carrier by the way that wafer board is kept the vacuum power to seat board 1672.By In in one embodiment, carrier returns in the case of no wafer (wafer is unloaded at discharge point), therefore in the work Device to hole 1668 is not needed in skill delivers vacuum.In fact, this some holes can be blocked or loading stage is provided with only with vacuum The seat board 1672 in hole 1667.

Figure 16 I show the top surface of seat board 1674, which can be assembled to for example in Fig. 1, Tu1AHe Carrier shown in Figure 1B returns to the relieving platform at chamber 135.Seat board 1674 is fixed to the top of relieving platform, and wafer board 1610 It is placed on seat board 1674.As shown in Figure 16 I, first group of hole 1668 is blocked or is not arranged first group of hole 1668 so that The vacuum passage of the corresponding vacuum hole 1614 of wafer board 1610 is not led to.That is, being not applied in relieving platform Wafer is keeping wafer to the suction of wafer board 1610.Second group of hole 1667 provides suction keeping wafer board 1610 to right The portions of quasi- platform 1664.Therefore, in one embodiment, when carrier is delivered to discharge point, start the suction of device to hole 1667 To keep corresponding wafer board by vacuum power.Then, as shown in curved arrow, relieving platform makes seat board 1674 tilt so that if There are the wafer fragment of any breakage on wafer platform 1610, then the fragment will slide from wafer board 1610 and enter collecting tank In 1682.

As that can understand from disclosed above, a kind of system for processing wafer is provided, which includes：Dress Station is carried, which, which has, to move in the vertical direction and with the loading stage of loading seat board, the loading seat board is with the One group of suction hole；Alignment station, the alignment station have can be moved on the directions x-y-z and rotation direction and be aligned seat board Alignment tool, the alignment seat board have second group of suction hole and third group suction hole；Discharge point, which has can be perpendicular Histogram to moved on inclined direction and with the relieving platform of unloading seat board, which has the 4th group of suction hole, when unloading It is vertically-oriented that seat board presentation is unloaded when microscope carrier in an inclined direction moves；It is at least one true between alignment station and discharge point Empty process cavity；Multiple wafer boards, each wafer board are configured to one wafer of support and have the 5th group of suction hole, this Five groups of suction holes are configured to the wafer applying vacuum to being located in wafer board；Transport mechanism, the transport mechanism are configured to Multiple wafer boards are continuously sent to alignment station, vacuum processing chamber room, discharge point from loading depot and return to loading depot；Wherein First group of suction hole, second group of suction hole and the 4th group of suction hole are configured to wafer board applying vacuum, third group vacuum hole It is aligned with the 5th group of suction hole and provides it fluid communication.The system can also include multiple carriers, and each carrier is constructed At the multiple wafer boards of bottom support from carrier；And multiple masks, each mask are attached at the top table of one of carrier Above face.

Each wafer board may include three table tops, and each table top accommodates one of suction hole.Each table top can be with It include the sealing element around suction hole.Each wafer board can also include buffering ring and the multiple magnetic for being attached to the buffering ring Body.System may include the container for being configured to receive from wafer board when discharge point is in an inclined direction moved wafer fragment. Alignment station can also include camera, which is aligned to carry out imaging to the wafer in wafer board and be carried to being attached to The mask of body is imaged, which is placed in alignment tool.Moreover, controller receives the image from camera and to alignment Platform sends registration signal, to make wafer alignment mask.Transport mechanism may include being configured to the first conveying of transmission carrier Band and the second conveyer belt for being configured to transmission wafer board.

Although the exemplary embodiment with regard to specific material and specific steps discusses the present invention, fields Technical staff it is to be understood that can make and/or using these specific examples modification, and this structures and methods will It is obtained from by described and shown practice and the explanation understanding to be administered carried out for operation, it can be to facilitate The modification made in the case of without departing substantially from the range being defined by the following claims of the invention.

Claims (28)

1. a kind of system for processing wafer in vacuum processing chamber room, including：

Multiple carriers, each carrier includes the frame for having multiple openings, and each opening is configured to accommodate one Wafer；

It is configured to transmit the transport mechanism of the multiple carrier through the system；

Multiple wafer boards, each wafer board are configured to one wafer of support；

Attachment mechanism for multiple wafer boards to be attached to each carrier, wherein each wafer board is attached to phase Answer the corresponding position at the bottom side of carrier so that each of the wafer being positioned on one of them described silicon wafer carrier Wafer is positioned in one of the multiple opening in carrier opening；

Multiple masks, each mask are attached at the front side of one of the multiple opening in carrier opening Top；

Alignment tool, the alignment tool are configured to for one of them wafer board to be supported on the multiple opening of the carrier One of opening in the following, the alignment tool is configured to be translated, rotate and elevating movement；

Camera, the camera be positioned at when the wafer board is positioned on the alignment tool to the multiple mask its In a mask carry out be imaged and the wafer being positioned in one of them described wafer board is imaged；

It receives the image from the camera and sends the controller of revise signal to the alignment tool.

2. system according to claim 1, which is characterized in that the multiple mask includes：

Multiple interior masks, each interior mask are configured to be placed in one of the multiple opening in the carrier Above, the interior mask has the opening figure of the rest part of the part for sheltering the wafer and the exposure wafer to opening Case；And

Multiple outer masks, each outer mask are configured to be placed in corresponding above mask, and there is the described of opening outer to cover Mould is configured to partly cover the interior mask.

3. system according to claim 1, which is characterized in that each the wafer board includes tablet made of aluminum.

4. system according to claim 3, which is characterized in that the attachment mechanism includes being attached to the multiple wafer board In each wafer board multiple magnets.

5. system according to claim 4, which is characterized in that each wafer board in the multiple wafer board further includes true Emptying aperture.

6. system according to claim 1, which is characterized in that further include be configured to the wafer board being sent to it is described The conveyer belt of position in the visual field of camera.

7. system according to claim 1, which is characterized in that the transport mechanism includes being configured to transmit the carrier The first linear conveyor and be configured to transmit the second of the wafer board when the wafer board is unloaded from the carrier Linear conveyor.

8. system according to claim 5, which is characterized in that the alignment tool includes seat board, and the seat board has and institute It states first group of vacuum hole of the vacuum hole alignment of wafer board and is configured to delivering suction to keep the wafer board To second group of vacuum hole of the seat board.

9. system according to claim 5, which is characterized in that further include relieving platform, the relieving platform includes unloading seat board, The unloading seat board is configured to stop the vacuum hole of the wafer board, to prevent the fluid to the vacuum hole from connecting Logical, the unloading seat board includes being configured to delivering suction keeping the wafer board to one group of vacuum of the unloading seat board Hole.

10. system according to claim 1, which is characterized in that further include substrate discharge point, the substrate discharge point has Leaning device, the leaning device is for making the wafer board come from institute to vertically-oriented to collect in collecting box inclined upward State any substrate fragment of wafer board.

11. a kind of system for processing wafer, including：

Loading depot, loading stage of the loading depot with that can move in the vertical direction and with seat board is loaded, the loading Seat board has first group of suction hole；

Alignment station, pair of the alignment station with that can be moved on the directions x-y-z and rotation direction and with seat board is directed at Quasi- platform, the alignment seat board have second group of suction hole and third group suction hole；

Discharge point, unloading of the discharge point with that can be moved on vertical direction and inclined direction and with seat board is unloaded Platform, unloading seat board have the 4th group of suction hole, and when the relieving platform moves on the inclined direction, the unloading seat board is in It is existing vertically-oriented；

At least one vacuum processing chamber room between the alignment station and the discharge point；

Multiple wafer boards, each wafer board is configured to one wafer of support, and has the 5th group of suction hole, and described the Five groups of suction holes are configured to the wafer applying vacuum being positioned in the wafer board；

Transport mechanism, the transport mechanism are configured to the multiple wafer board being continuously sent to from the loading depot described It is directed at station, the vacuum processing chamber room, the discharge point, and the multiple wafer board is made to be back to the loading depot；

Wherein, first group of suction hole, second group of suction hole and the 4th group of suction hole are configured to the crystalline substance Plectane applying vacuum, the third group suction hole are aligned with the 5th group of suction hole and provide the 5th group of suction hole Fluid communication.

12. system according to claim 11, which is characterized in that further include multiple carriers, each carrier is constructed At the multiple wafer boards of bottom support from the carrier.

13. system according to claim 12, which is characterized in that further include multiple masks, each mask is attached Wherein above the top surface of a carrier.

14. system according to claim 11, which is characterized in that each wafer board includes three table tops, Mei Gesuo It states table top and accommodates one of them described suction hole.

15. system according to claim 14, which is characterized in that each table top further includes around the suction hole Sealing element.

16. system according to claim 14, which is characterized in that each wafer board further includes buffering ring and attachment To multiple magnets of the buffering ring.

17. system according to claim 11, which is characterized in that further include being configured to incline described when the discharge point Receive the case of the wafer fragment from wafer board when rectangle moves up.

18. system according to claim 13, which is characterized in that the alignment station further includes camera, and the camera is right Standard is to the wafer being positioned in the wafer board being placed on the alignment tool be imaged and cover to being attached to carrier Mould is imaged.

19. system according to claim 18, which is characterized in that further include receiving the image from the camera and to institute It states alignment tool and sends registration signal to make the controller of mask described in the wafer alignment.

20. system according to claim 12, which is characterized in that the transport mechanism includes being configured to transmit the load It the first conveyer belt of body and is configured to transmit the second conveyer belt of the wafer board.

21. a kind of method for processing wafer in vacuum processing chamber room, including：

Mask is fixed on the top surface of carrier, the mask is folded with the opening in the carrier；

It will be on the top surface of wafer load to wafer board；

The wafer board with the wafer is sent to alignment station, and the wafer board is arranged on alignment tool；

Start camera to be imaged to the wafer on the alignment tool；

The carrier with the mask is sent to the alignment station；

Start the camera to be imaged to the mask；

Degrees of misalignment is calculated using the image of the wafer and the mask, and activates the alignment tool so that the crystalline substance Circle is directed at the mask；

Once mask described in the wafer alignment rises the alignment tool, so that the wafer board is attached to the carrier Bottom side so that the wafer is positioned in the opening in the carrier；

Reduce the alignment tool；

The carrier is transmitted in the vacuum processing station, to process the wafer.

22. according to the method for claim 21, which is characterized in that further include when the wafer board is positioned in the alignment Apply suction to the wafer when on platform.

23. according to the method for claim 21, which is characterized in that the fixed mask include interior mask is attached to it is described Carrier and outer mask is attached above the interior mask.

24. according to the method for claim 21, which is characterized in that wrap the bottom side that the wafer board is attached to the carrier It includes and applies magnetic force between the wafer board and the carrier.

25. according to the method for claim 24, which is characterized in that further include applying the magnetic force to the mask.

26. a kind of method for processing wafer in vacuum processing chamber room, including：

Wafer board is sent to " loaded " position, and will be in wafer load to the wafer board；

The wafer board is moved to alignment station, and the wafer board is placed on alignment tool；

Apply suction so that the wafer to be maintained in the wafer board；

The wafer is imaged using camera, and calculates the x-axis and y-axis of the wafer according to image；

Carrier is transmitted in the alignment station, and the carrier is located in above the wafer board so that in the carrier Opening be located above the wafer board, wherein the mask with mask open is positioned in above the carrier；

The carrier is promoted, so that the carrier is located in the resting position being mechanically fixed；

Start the camera to be imaged to the mask open on the carrier, and calculates the x-axis of the mask open And y-axis；

The alignment tool is activated with the movement wafer board, so that the x-axis and the y-axis of the wafer and the mask The x-axis and the y-axis of opening overlap；

It is lifted up the wafer board, until the wafer board contacts the carrier and is attached to the carrier so that described Wafer is positioned in the opening in the carrier；

Release the vacuum；And

The carrier with the wafer board is transmitted in the vacuum processing chamber room.

27. according to the method for claim 26, which is characterized in that the applications suction includes application suction with by the crystalline substance Circle keeps keeping to the alignment tool to the wafer board and by the wafer board.

28. according to the method for claim 26, which is characterized in that further include that the carrier is communicated off the vacuum to add The wafer board is simultaneously loaded on relieving platform by work chamber, and activate the relieving platform so that the wafer board tilt, to Remove any wafer fragment being located in the wafer board.