CN108264370B - Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support - Google Patents
Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support Download PDFInfo
- Publication number
- CN108264370B CN108264370B CN201611257642.5A CN201611257642A CN108264370B CN 108264370 B CN108264370 B CN 108264370B CN 201611257642 A CN201611257642 A CN 201611257642A CN 108264370 B CN108264370 B CN 108264370B
- Authority
- CN
- China
- Prior art keywords
- sintering
- support
- copper sheet
- dbc
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
Abstract
The invention discloses a method for simultaneously sintering two sides of DBC by adopting a sintering bracket, belonging to the technical field of DBC production, which comprises the following steps: s1: a mould of the sintering support is manufactured in advance; s2: filling the mold; s3: standing for 20-30 min after the filling of the mold is finished, and then demolding; s4: performing glue discharging treatment on the die under a low-temperature condition; s5: the sintering support is sintered at high temperature, the sintering quality of the two surfaces is more uniform in the sintering production process, the product is more uniform and stable in the sintering process, the sintered ceramic chips can be sintered on the two surfaces at the same time in a rapid mode, the two surfaces of the ceramic chips are sintered at the same time through the sintering support, the copper sheets on the lower surface need to be supported by the sintering support in the sintering production process, and on the other hand, the sintering support also has the function of supporting the ceramic chips.
Description
Technical Field
The invention relates to the technical field of DBC production, in particular to a method for simultaneously sintering two sides of DBC by adopting a sintering support.
Background
Metallized ceramic substrates, represented by DBC (direct bonded copper-ceramic substrate) and DPC (direct copper-plated ceramic substrate), have superior performance in heat conduction, insulation, voltage resistance, heat resistance, etc., have become the first choice for power device packaging and have gradually gained market acceptance. The direct copper-coating technology is characterized in that oxygen-containing eutectic liquid of copper is utilized to directly coat the copper on the ceramic, the basic principle is that a proper amount of oxygen element is introduced between the copper and the ceramic before or during the coating process, the copper and the oxygen form Cu-O eutectic liquid within the temperature range of 1065-1083 ℃, and the DBC technology utilizes the eutectic liquid to soak the copper foil to realize the combination of the ceramic substrate and the copper plate.
In the prior art, in the DBC production process, a product can only be sintered through one side, and after the one side is sintered, the other side is sintered. For example, the first side is sintered first, and after completion, the second side is sintered using the same process. Such a sintering method is equivalent to double the time for sintering the same product, and for this reason, we propose a method for simultaneously sintering both sides of the DBC by using a sintering support to solve the above problems.
Disclosure of Invention
The invention aims to provide a method for simultaneously sintering two sides of a DBC (direct bonded copper) by adopting a sintering support, which solves the problems that the product proposed in the background technology can only be sintered by one side, and the sintering of the other side is carried out after the one side is sintered, and the sintering method is time-consuming, labor-consuming, inconsistent in quality and easy to have the defect of poor product tendency of one side.
In order to achieve the purpose, the invention provides the following technical scheme: a method for simultaneously sintering two sides of DBC by adopting a sintering support comprises the following specific steps:
s1: according to the requirements of a design drawing, a mold of the sintering support is manufactured in advance;
s2: filling the mould after the sintering support mould is manufactured;
s3: standing for 20-30 min after the filling of the mold is finished, and then demolding;
s4: performing glue discharging treatment on the die under a low-temperature condition;
s5: and sintering the sintering support at a high temperature to form the sintering support which is compact, high-strength and high-temperature resistant.
Preferably, in step S2, the mold is filled with a refractory material.
Preferably, in the step S4, the temperature of the glue discharging treatment is 350 to 600 ℃.
Preferably, in the step S5, a high-temperature sintering furnace is used to sinter the support at 1070 to 1080 ℃ for 5 to 15 min.
Preferably, in step S5, after the sintering is completed, the surface of the sintered support is finely ground to maintain the contact surface of the product to be smooth during the production process of the sintered support and the DBC product.
Compared with the prior art, the invention has the beneficial effects that: in the sintering production process, the sintering quality of the two surfaces is more uniform, the product is more uniform and stable in the sintering process, the sintered ceramic chips can be sintered on the two surfaces simultaneously in a rapid mode, the two surfaces of the ceramic chips are sintered simultaneously through the sintering support, the copper sheet on the lower surface plays a role in supporting the ceramic chips in the sintering production process, and on the other hand, the sintering support also plays a role in supporting the ceramic chips.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a method for simultaneously sintering two sides of DBC by adopting a sintering support comprises the following specific steps:
s1: according to the requirements of a design drawing, a mold of the sintering support is manufactured in advance;
s2: filling the mold after the sintering support mold is manufactured, and filling the mold with a high-temperature resistant material;
s3: standing for 20-30 min after the filling of the mold is finished, and then demolding;
s4: performing glue discharging treatment on the die at a low temperature, wherein the temperature of the glue discharging treatment is 350-600 ℃;
s5: and sintering the sintering support at a high temperature to form a compact high-strength high-temperature-resistant sintering support, sintering the support at a high temperature by using a high-temperature sintering furnace at 1070-1080 ℃ for 5-15 min, finely polishing the surface of the sintering support after sintering is finished, and keeping the contact surface of the product smooth in the production process of the sintering support and the DBC product.
Firstly, a sintering support D is placed on a horizontal charging platform, and a copper sheet is pre-pressed to a certain radian by using a pre-pressing die. Firstly, a lower surface copper sheet C is placed on a sintering support D, the oxidation surface of the lower surface copper sheet C faces upwards to support a supporting point of the lower surface copper sheet C, D1 is a supporting point for supporting the edge of the lower surface copper sheet C, and a groove with a certain radian is contacted with the edge of the copper sheet at the position D1. The design has the effects that firstly, the position of the lower surface copper sheet C can be fixed more accurately; secondly, after the copper sheet C enters a normal sintering process, the radian bending of the lower surface copper sheet C in the sintering process can be ensured, and meanwhile, a certain allowance is reserved for the extending amount of the copper sheet C after the copper sheet C is sintered. D3 is a supporting point for supporting the middle of the lower surface copper sheet C, a ceramic chip B is placed on the lower surface copper sheet C, D2 is a supporting point for supporting the edge of the ceramic chip, then an upper surface copper sheet A is placed on the ceramic chip B, and the oxidized surface of the upper surface copper sheet A faces downwards. And after the product and the bracket are assembled, putting the product into a sintering furnace for sintering.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A method for simultaneously sintering two sides of DBC by adopting a sintering support is characterized in that: the method comprises the following specific steps:
s1: according to the requirements of a design drawing, a mold of the sintering support is manufactured in advance;
s2: filling the mould after the sintering support mould is manufactured;
s3: standing for 20-30 min after the filling of the mold is finished, and then demolding;
s4: performing glue discharging treatment on the die under a low-temperature condition;
s5: sintering the sintering support at a high temperature to form a compact high-strength high-temperature-resistant sintering support;
the steps of sintering the two sides by adopting the sintering bracket are as follows:
firstly, placing a sintering support D on a horizontal charging platform, and prepressing a copper sheet to a certain radian by using a prepressing die; firstly, placing a lower surface copper sheet C on a sintering support D, wherein the oxidation surface of the lower surface copper sheet C faces upwards to support a supporting point of the lower surface copper sheet C, D1 is a supporting point for supporting the edge of the lower surface copper sheet, and a groove with a certain radian is contacted with the edge of the copper sheet at a position D1; d3 is a supporting point for supporting the middle of the lower surface copper sheet C, a ceramic chip B is placed on the lower surface copper sheet C, D2 is a supporting point for supporting the edge of the ceramic chip, then an upper surface copper sheet A is placed on the ceramic chip B, the oxidized surface of the upper surface copper sheet A faces downwards, and after the product is assembled with the support, the product is placed into a sintering furnace for sintering.
2. The method of claim 1 for simultaneous sintering of both sides of DBC using sintered supports, wherein: in step S2, the mold is filled with a refractory material.
3. The method of claim 1 for simultaneous sintering of both sides of DBC using sintered supports, wherein: in the step S4, the temperature of the glue discharging treatment is 350-600 ℃.
4. The method of claim 1 for simultaneous sintering of both sides of DBC using sintered supports, wherein: in the step S5, a high-temperature sintering furnace is adopted to sinter the support at a high temperature of 1070-1080 ℃ for 5-15 min.
5. The method of claim 1 for simultaneous sintering of both sides of DBC using sintered supports, wherein: in step S5, after sintering, the surface of the sintering support is finely ground to keep the contact surface of the product smooth and round during the production process of the sintering support and the DBC product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611257642.5A CN108264370B (en) | 2016-12-30 | 2016-12-30 | Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611257642.5A CN108264370B (en) | 2016-12-30 | 2016-12-30 | Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108264370A CN108264370A (en) | 2018-07-10 |
| CN108264370B true CN108264370B (en) | 2021-01-08 |
Family
ID=62754662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611257642.5A Active CN108264370B (en) | 2016-12-30 | 2016-12-30 | Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108264370B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5730929A (en) * | 1997-03-06 | 1998-03-24 | Eastman Kodak Company | Low pressure injection molding of fine particulate ceramics and its composites at room temperature |
| CN102276260A (en) * | 2011-06-09 | 2011-12-14 | 中国科学院唐山高新技术研究与转化中心 | Atmospheric-pressure and low-temperature sintering method of beta-silicon nitride ceramic |
| CN102320829A (en) * | 2011-05-31 | 2012-01-18 | 马强 | Based on ornamental of crystallite nano ceramics and preparation method thereof |
| CN105236936A (en) * | 2015-09-09 | 2016-01-13 | 三达膜科技（厦门）有限公司 | Multi-channel aluminum oxide plate ceramic membrane support, preparation method and application thereof |
-
2016
- 2016-12-30 CN CN201611257642.5A patent/CN108264370B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5730929A (en) * | 1997-03-06 | 1998-03-24 | Eastman Kodak Company | Low pressure injection molding of fine particulate ceramics and its composites at room temperature |
| CN102320829A (en) * | 2011-05-31 | 2012-01-18 | 马强 | Based on ornamental of crystallite nano ceramics and preparation method thereof |
| CN102276260A (en) * | 2011-06-09 | 2011-12-14 | 中国科学院唐山高新技术研究与转化中心 | Atmospheric-pressure and low-temperature sintering method of beta-silicon nitride ceramic |
| CN105236936A (en) * | 2015-09-09 | 2016-01-13 | 三达膜科技（厦门）有限公司 | Multi-channel aluminum oxide plate ceramic membrane support, preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108264370A (en) | 2018-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101694837B (en) | Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof | |
| CN105428266B (en) | The product of flip-chip eutectic bonding method and acquisition with medium bridge | |
| US7987566B2 (en) | Capacitor forming method | |
| CN103153000A (en) | Manufacture method for gold finger circuit board and circuit board manufactured by method | |
| CN102728919B (en) | Eutectic machine and eutectic method | |
| TW201232674A (en) | Method and apparatus of compression molding for reducing viods in molding compound | |
| CN108819447A (en) | A kind of halftone pressing machine and halftone pressing and forming method | |
| US9082760B2 (en) | Dual layered lead frame | |
| CN108264370B (en) | Method for simultaneously sintering two sides of DBC (direct bonded copper) by adopting sintering support | |
| CN106505043B (en) | The manufacturing method and manufacturing device of semiconductor device | |
| CN105261431A (en) | Manufacturing method for radial glass packaged thermistor, and thermistor | |
| CN103346014A (en) | Graphite paper and barium titanate ceramic film capacitor and preparation method thereof | |
| CN203344455U (en) | Semiautomatic multi-chip mounter adhering machine | |
| CN105622083A (en) | Preparation method of thermistor | |
| CN104602853A (en) | Pressure impregnation type method for preparing metal matrix composite | |
| CN102856216B (en) | Method for packaging square and flat soldering lug without pin | |
| CN102689465A (en) | Metamaterial composite plate and method for processing same | |
| CN206011375U (en) | A kind of high voltage ceramic capacitor ceramic dielectric chip shaping diel | |
| CN112563187A (en) | LED packaging substrate and manufacturing process thereof | |
| CN203339210U (en) | LED eutectic packaging pedestal, | |
| CN210753435U (en) | Carrier for coating soldering flux on preformed soldering lug | |
| CN209676576U (en) | A kind of structure preventing pcb board slab warping | |
| CN208029214U (en) | A kind of support plate for solving small-sized Resistor-Capacitor Unit and setting up a monument | |
| CN111863687A (en) | Semiconductor TO encapsulation double-material-sheet rail device | |
| CN207122761U (en) | A kind of LED disjunctors Frame lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |