CN209676576U

CN209676576U - A kind of structure preventing pcb board slab warping

Info

Publication number: CN209676576U
Application number: CN201821893138.9U
Authority: CN
Inventors: 李彬
Original assignee: SHENZHEN SHI ZHENG JI ELECTRONICS CO Ltd
Current assignee: SHENZHEN SHI ZHENG JI ELECTRONICS CO Ltd
Priority date: 2018-11-16
Filing date: 2018-11-16
Publication date: 2019-11-22
Anticipated expiration: 2028-11-16

Abstract

The utility model relates to a kind of structures for preventing pcb board slab warping, it includes insulating substrate and line layer, copper-clad laminated board is formed by the insulating substrate and the line layer, dielectric layer is provided at the top of the copper-clad laminated board, the dielectric layer includes several package blocks, each package block is wrapped in above the corresponding route item, each package block includes header field and two plate portions, wherein, the header field is at the top of the route item, two plate portions are located at the route two sides, several package blocks are arranged independently of each other, empty avoiding area is both provided between the package block of two of arbitrary neighborhood.

Description

A kind of structure preventing pcb board slab warping

Technical field

The utility model relates to a kind of structures for producing pcb board, and particularly relating to one kind can during producing pcb board Control the structure of plate body size and angularity.

Background technique

It is well known that with the development of electronic technology, more and more functional circuits are all integrated into one piece of circuit board, The various electric equipment products that have been used in that the circuit substrate of big sheet is very universal suffer.

But in the manufacturing process without core package substrate for pursuing the big sheet of high efficiency production, the pressing of dielectric layer increasing layer Contraction of organic polymer during curing, which is pullled, will cause the inconsistent situation of plate body local size harmomegathus, and then can shadow The stability of castanets body size can lead to the problem of slab warping simultaneously, and this is the major defect for traditional technology.

Utility model content

The utility model provides a kind of structure for preventing pcb board slab warping, can during producing pcb board energy Plate body size and angularity are enough controlled, and this is the main purpose for the utility model.

The technology employed by the present utility model is a kind of structure for preventing pcb board slab warping comprising insulation base Plate and line layer, line layer setting are formed and are covered on the insulating substrate top surface, and by the insulating substrate and the line layer Layers of copper lamination forms a trace clearance between the two lines travel permit of arbitrary neighborhood if the line layer includes main line item.

It is provided with dielectric layer at the top of the copper-clad laminated board, which includes several package blocks, each package block It is wrapped in above the corresponding route item, each package block includes header field and two plate portions, wherein should Header field is at the top of the route item, and two plate portions are located at the route two sides, and several package blocks are mutual It is independently arranged, is both provided with empty avoiding area between two of the arbitrary neighborhood package blocks.

Several stress slots are offered at the top of each package block.Several stress slots are arranged in parallel in the package block top Portion.

The utility model has the following beneficial effects: the utility model relate to can dielectric layer increasing layer pressing organic polymer cured The dimensional stability for causing local size harmomegathus inconsistent and warpage issues are pullled in contraction in journey, by its structure in big sheet Dielectric layer is first completed to be pasted in advance with after precuring, and big sheet is cut into strip mode in a manner of laser, plasma-based or machine cuts, High-temperature maturing is carried out again, in this approach the coverage of control office's cloth harmomegathus, require height depending on product quality, sheet is small cuts It cuts, office's cloth harmomegathus is smaller, and simultaneously up to more preferably stress release, and controls up to better warpage.

Detailed description of the invention

Fig. 1 is the flow sheet of the utility model.

Fig. 2 is the structural schematic diagram of the utility model.

Specific embodiment

As shown in Fig. 1 to 2, a kind of structure preventing pcb board slab warping comprising insulating substrate 10 and line layer 21, the line layer 21 setting forms on 10 top surface of insulating substrate, and by the insulating substrate 10 and the line layer 21 and covers copper Plywood 30 forms a trace clearance 22 if the line layer 21 includes main line item between the two lines travel permit of arbitrary neighborhood.

It is provided with dielectric layer at the top of the copper-clad laminated board 30, which includes several package blocks 50, each package Block 50 is all wrapped in above the corresponding route item, each package block 50 includes header field and two side plates Point, wherein the header field is at the top of the route item, and two plate portions are located at the route two sides, several to be somebody's turn to do It wraps up block 50 to be arranged independently of each other, is both provided with empty avoiding area between two of the arbitrary neighborhood package blocks 50.

When specific implementation, each 50 top of package block offers several stress slots 80, is somebody's turn to do by several Stress slot 80 can further decrease the stress of the package block 50, and several stress slots 80 are arranged in parallel in the package block 50 top Portion, to facilitate production and processing.

When being produced, the pre- fitting of big sheet dielectric layer 40 is carried out at the top of the line layer 21 first, this is big Sheet dielectric layer 40 includes route dielectric layer portions 41 and gap dielectric layer portions 42, wherein the route dielectric layer portions 41 It is fitted in 21 top of line layer, which is erected at 22 top of trace clearance of the line layer 21, is having When body is implemented, which can be made of PI material or CBC material or PBO material.

Then, precuring processing is carried out, heated fall of the gap dielectric layer portions 42 is filled into the trace clearance 22, together When, the big sheet dielectric layer 40 whole levelling above the copper-clad laminated board 30, this moment, which is wrapped in the sheet In shape dielectric layer 40, precuring processing enables the gap dielectric layer portions 42 to be sufficient filling in the trace clearance 22, meanwhile, Enable the abundant levelling of big sheet dielectric layer 40.

Later, it is cut by laser in 22 position of trace clearance, which is cut into several packets Block 50 is wrapped up in, each package block 50 is wrapped in wherein to by the line layer 21, which is wrapped in the route simultaneously Layer 21 top and two sides, the effect for defining several package blocks 50 be avoid subsequent maturing process dielectric layer to plate body into Capable a wide range of harmomegathus is pullled, and is controlled plate body size and is prevented slab warping.

Finally, carrying out high-temperature maturing, obtain finished product, curing temperature is controlled at 180-200 DEG C, to several package blocks 50 into Row high-temperature maturing, curing time controlled at 1 hour, can only generate the drawing of small range harmomegathus at the package block 50 in maturing process Pull stress, can only generate it is smaller with local stress, so harmomegathus size is smaller, can be avoided dielectric layer plate body is carried out it is big Range harmomegathus is pullled, and is controlled plate body size and is prevented slab warping.

Claims

1. a kind of structure for preventing pcb board slab warping comprising insulating substrate and line layer, line layer setting are exhausted at this On edge substrate top surface, and copper-clad laminated board is formed by the insulating substrate and the line layer, if the line layer includes main line item, A trace clearance is formed between the two lines travel permit of arbitrary neighborhood, it is characterised in that:

It is provided with dielectric layer at the top of the copper-clad laminated board, which includes several package blocks, each package block wraps up Above the corresponding route item, each package block includes header field and two plate portions, wherein the top cover It is partially at the top of the route item, two plate portions are located at the route two sides, and several package blocks are mutually indepedent It is arranged, is both provided with empty avoiding area between two of the arbitrary neighborhood package blocks.

2. a kind of structure for preventing pcb board slab warping as described in claim 1, it is characterised in that: each package block Top all offers several stress slots.

3. a kind of structure for preventing pcb board slab warping as claimed in claim 2, it is characterised in that: several stress slots are flat Row is arranged at the top of the package block.