CN108251885A - A kind of mode of connection for improving electroplating evenness - Google Patents
A kind of mode of connection for improving electroplating evenness Download PDFInfo
- Publication number
- CN108251885A CN108251885A CN201810085413.2A CN201810085413A CN108251885A CN 108251885 A CN108251885 A CN 108251885A CN 201810085413 A CN201810085413 A CN 201810085413A CN 108251885 A CN108251885 A CN 108251885A
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- plated item
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to surface processing equipment technical fields, refer in particular to a kind of mode of connection for improving electroplating evenness, the anode of the motor-generator set is electrically connected with the head end of anode rod, and the cathode of motor-generator set is electrically connected with the end of cathode rod, and the distance of first plated item and anode rod head end is set as L1, n-th plated item and the distance of anode rod head end are set as Ln, first plated item and the distance of cathode rod end are set as M1, N plated items and the distance of cathode rod end are set as Mn, first plated item to the relationship between n-th plated item be set as L1+M1=L2+M2=L3+M3=......=Ln+Mn.In the present invention, due to L1+M1=L2+M2=L3+M3=......=Ln+MnSo as to which first plated item is equal to the line resistance between n-th plated item, and then ensure that the electric current that first plated item is subject to n-th plated item is equal, effectively improve electroplating evenness, and the length of wires that need not ensure to be connected to anode rod both ends and be connected to cathode rod both ends is equal, so as to improve the convenience of wire rod connection, wiring efficiency is improved.
Description
Technical field
The present invention relates to the technical fields of surface processing equipment, refer in particular to a kind of wiring side for improving electroplating evenness
Method.
Background technology
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique for making the surface of metal or other materials product attachment layer of metal film using electrolysis prevents metal oxygen so as to play
Change（Such as corrosion）, improve wearability, electric conductivity, reflective, corrosion resistance（Copper sulphate etc.）And the effects that having improved aesthetic appearance.
As shown in Figure 1, the both ends that the mode of connection being electroplated at present is anode rod are electrically connected with the anode of motor-generator set, cathode
The both ends of bar are electrically connected with the cathode of motor-generator set, and it is unequal that this mode of connection be easy to cause the line resistance that each plated item is subject to,
So as to cause the electric current that each plated item is passed through unequal, and then cause same to hang the plated item on flying bar and plate the thickness of metal
Difference has seriously affected the quality of electroplated product, also results in the waste of plating metal, and anode rod both ends connect respectively it is whole
The length of wires of stream machine anode is A and B, and the length of wires that the both ends of cathode rod connect motor-generator set cathode respectively is C and D, at this
It needs to ensure A=B=C=D in connection mode, and A=B=C=D is difficult to ensure that in actual mechanical process, lead to connecing for the connection mode
Line is extremely complex.
Invention content
The technical problem to be solved in the present invention is to provide a kind of raising electroplating evenness and wiring easily to improve plating
The mode of connection of uniformity.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that：A kind of wiring for improving electroplating evenness
Method, including motor-generator set, electroplating bath, the anode rod set on electroplating bath and with rectification mechatronics, set on electroplating bath and and rectification
The cathode rod of mechatronics and at least one plated item set on electroplating bath, the anode of the motor-generator set and the head end of anode rod
Electrical connection, the cathode of motor-generator set are electrically connected with the end of cathode rod, and the distance of first plated item and anode rod head end is set
It is set to L1, n-th plated item and the distance of anode rod head end are set as Ln, first plated item and cathode rod end away from
From being set as M1, the N plated items and the distance of cathode rod end are set as Mn, first plated item to n-th plating
Relationship between part is set as L1+M1=L2+M2=L3+M3=......=Ln+Mn。
Preferably, first plated item is to the material all same between n-th plated item.
Preferably, as N=3, the electroplating bath sets that there are three plated item, first plated items to third plated item
Between relationship be set as L1+ M1=L2+M2=L3+M3。
Preferably, as N=5, the electroplating bath sets that there are five plated item, first plated items to the 5th plated item
Between relationship be set as L1+M1=L2+M2=L3+M3=L4+M4=L5+M5。
The beneficial effects of the present invention are：The present invention provides a kind of mode of connection for improving electroplating evenness, during energization,
Electric current is flowed out from motor-generator set, and motor-generator set is back to from the end of cathode rod again after the head end of anode rod flows into electroplating bath, so as to
Ensure the distance L of first plated item and anode rod head end1And first plated item and the distance M of cathode rod end1The sum of L1
+M1, until the distance L of n-th plated item and anode rod head endnAnd the distance M of n-th plated item and cathode rod endnThe sum of Ln+Mn
Between be equal, and then ensure that first plated item is equal to the line resistance between n-th plated item, due to first plating
Part is electroplated to n-th plated item in same electroplating bath, then the ion resistance of first plated item and n-th plated item
It is equal, since first plated item to n-th plated item is to connect rectifier, then first plated item by same contact point
It is equal with the contact resistance of n-th plated item, and due to In=V/（RLine n+RFrom n+RContact n）, so first plated item and N
Electric current suffered by a plated item is equal, so as to effectively improve the uniformity of plating, and in the mode of connection, is connected without ensuring
It is equal in anode rod both ends and the length of wires for being connected to cathode rod both ends, so as to improve the convenience of wire rod connection, carries
High wiring efficiency.
Description of the drawings
Fig. 1 is the structure diagram of existing plating mode of connection on the market.
Fig. 2 is the structure diagram for the mode of connection that the present invention improves electroplating evenness.
Fig. 3 is the structure diagram for the mode of connection embodiment one that the present invention improves electroplating evenness.
Fig. 4 is the structure diagram for the mode of connection embodiment two that the present invention improves electroplating evenness.
Specific embodiment
For the ease of the understanding of those skilled in the art, with reference to embodiment, the present invention is further illustrated, real
The content that the mode of applying refers to not is limitation of the invention.
As shown in Fig. 2, a kind of mode of connection for improving electroplating evenness, including motor-generator set 1, electroplating bath 2, set on electroplating bath
2 and the anode rod 3 being electrically connected with motor-generator set 1, the cathode rod 4 that is electrically connected set on electroplating bath 2 and with motor-generator set 1 and set on plating
At least one plated item 5 of slot 2, the anode of the motor-generator set 1 are electrically connected with the head end of anode rod 3, cathode and the moon of motor-generator set 1
The end electrical connection of pole bar 4, the distance of first plated item 5 and 3 head end of anode rod are set as L1, n-th plated item 5 with
The distance of 3 head end of anode rod is set as Ln, first plated item 5 and the distance of 4 end of cathode rod are set as M1, the N
Plated item 5 and the distance of 4 end of cathode rod are set as Mn, first plated item 5 to the relationship between n-th plated item 5
It is set as L1+M1=L2+M2=L3+M3=......=Ln+Mn；First plated item is homogeneous to the material between n-th plated item
Together.
The motor-generator set and the wire rod of anode rod electrical connection are consistent with the wire specification that motor-generator set and cathode rod are electrically connected；It is logical
When electric, electric current is flowed out from motor-generator set 1, again from the end of cathode rod 4 after the head end of anode rod 3 flows into the plated item 5 in electroplating bath 2
End is back to motor-generator set 1, ensures that the distance L of first plated item 5 and 3 head end of anode rod1And first plated item 5 with
The distance M of 4 end of cathode rod1The sum of L1+M1, until the distance L of n-th plated item 5 and 3 head end of anode rodnAnd n-th plated item 5
With the distance M of 4 end of cathode rodnThe sum of Ln+MnBetween be equal, and then ensure first plated item 5 to n-th plated item 5
Between line resistance it is equal, since first plated item 5 to n-th plated item 5 is electroplated in same electroplating bath 2, then
First plated item 5 is equal with the ion resistance of n-th plated item 5, since first plated item 5 to n-th plated item 5 is
Rectifier is connected by same contact point, then first plated item 5 is equal with the contact resistance of n-th plated item 5, and due to
In=V/（RLine n+RFrom n+RContact n）, so first plated item 5 is equal with electric current suffered by n-th plated item 5, so as to effectively improve
The uniformity of plating, and in the mode of connection, without ensuring to be connected to anode rod both ends and being connected to cathode rod both ends
Length of wires is equal, and so as to improve the convenience of wire rod connection, improves wiring efficiency.
A kind of embodiment one for the mode of connection for improving electroplating evenness of the present invention is illustrated in figure 3, it is described as N=3
Electroplating bath 2 is set there are three plated item 5, and first plated item 5 to the relationship between third plated item 5 is set as L1+M1=L2+
M2=L3+M3.The electric current outflow of motor-generator set 1 flows into anode rod 3 to plated item 5, then from plated item 5 through the moon from the head end of anode rod 3
It is L to return to the distance that motor-generator set 1 is passed through after 4 end of pole bar inflow cathode rod 4n+Mn, so as to obtain the first plated item 5 to
Three plated items 5 are respectively L1+M1、L2+M2And L3+M3, and then ensure first plated item, 5, second plated items 5 and
Line resistance between three plated items 5 is equal, due to first plated item, 5, second plated items 5 and third plated item 5
Be electroplated in same electroplating bath 22, then first plated item, 5, second plated items 5 and third plated item 5 from
Sub- resistance is equal, since first plated item, 5, second plated items 5 and third plated item 5 are by same contact point
Connecting rectifier, then the contact resistance of first plated item, 5, second plated items 5 and third plated item 5 is equal, and
Due to In=V/（RLine n+RFrom n+RContact n）, so suffered by first plated item, 5, second plated items 5 and third plated item 5
Electric current is equal, so as to effectively improve the uniformity of plating.
A kind of embodiment two for the mode of connection for improving electroplating evenness of the present invention is illustrated in figure 4, with above-described embodiment
The difference lies in：As N=5, the electroplating bath 2 sets that there are five plated item 5, first plated items 5 to the 5th plated item
Relationship between 5 is set as L1+M1=L2+M2=L3+M3=L4+M4=L5+M5.Due to InSize be by RLine nIt determines, passes through L1+M1
=L2+M2=L3+M3=L4+M4=L5+M5It can obtain RLine 1、RLine 2、RLine 3、RLine 4And RLine 5Be equal, ensure that the first plated item 5,
The electric current that second plated item 5, three plated items 5, the 4th plated item 5 and the 5th plated item 5 are respectively subject to is equal, and is both effectively carried
The high electroplating evenness of each plated item 5, and five plated items 5 are processed simultaneously, effectively improve production efficiency.
In the description of the present invention, it should be noted that for the noun of locality, if any term, " " center ", " laterally (X) " " indulge
To (Y) ", " vertical (Z) " " length ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " water
It is flat ", " top ", " bottom ", " interior ", " outer ", " clockwise ", the indicating positions such as " counterclockwise " and position relationship is based on shown in the drawings
Orientation or position relationship, be for only for ease of the narration present invention and simplify description rather than instruction or imply signified device or
Element must have specific orientation, be constructed and operated with particular orientation, it is impossible to be interpreted as the specific protection model of the limitation present invention
It encloses.
In addition, description purpose is only used for if any term " first ", " second ", and it is not intended that indicating or implying relatively heavy
The property wanted or the implicit quantity for indicating technical characteristic." first " is defined as a result, " second " feature can be expressed or implicit include
One or more this feature, in the present description, " several " are meant that two or more, unless otherwise clearly having
The restriction of body.
In the present invention, except as otherwise clear stipulaties and restriction, should make if any term " assembling ", " connected ", " connection " term
Broad sense goes to understand, for example, it may be being fixedly connected or being detachably connected or be integrally connected；Can also be that machinery connects
It connects；It can be directly connected or be connected by intermediary, can be connected inside two elements.For ability
For the those of ordinary skill of domain, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Embodiment described above only expresses several embodiments of the present invention, and description is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. a kind of mode of connection for improving electroplating evenness, including motor-generator set（1）, electroplating bath（2）, set on electroplating bath（2）And with
Motor-generator set（1）The anode rod of electrical connection（3）, set on electroplating bath（2）And and motor-generator set（1）The cathode rod of electrical connection（4）And it sets
In electroplating bath（2）At least one plated item（5）, it is characterised in that：The motor-generator set（1）Anode and anode rod（3）Head
End electrical connection, motor-generator set（1）Cathode and cathode rod（4）End electrical connection, first plated item（5）With anode rod
（3）The distance of head end is set as L1, n-th plated item（5）With anode rod（3）The distance of head end is set as Ln, first electricity
Plating piece（5）With cathode rod（4）The distance of end is set as M1, the N plated items（5）With cathode rod（4）The distance of end is set
It is set to Mn, first plated item（5）To n-th plated item（5）Between relationship be set as L1+M1=L2+M2=L3+M3
=......=Ln+Mn。
2. a kind of mode of connection for improving electroplating evenness according to claim 1, it is characterised in that：First electricity
Plating piece（5）To n-th plated item（5）Between material all same.
3. a kind of mode of connection for improving electroplating evenness according to claim 1, it is characterised in that：It is described as N=3
Electroplating bath（2）If there are three plated items（5）, first plated item（5）To third plated item（5）Between relationship be set as
L1+M1=L2+M2=L3+M3。
4. a kind of mode of connection for improving electroplating evenness according to claim 1, it is characterised in that：It is described as N=5
Electroplating bath（2）If there are five plated items（5）, first plated item（5）To the 5th plated item（5）Between relationship be set as
L1+M1=L2+M2=L3+M3=L4+M4=L5+M5。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810085413.2A CN108251885B (en) | 2018-01-29 | 2018-01-29 | A kind of mode of connection improving electroplating evenness |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810085413.2A CN108251885B (en) | 2018-01-29 | 2018-01-29 | A kind of mode of connection improving electroplating evenness |
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| Publication Number | Publication Date |
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| CN108251885A true CN108251885A (en) | 2018-07-06 |
| CN108251885B CN108251885B (en) | 2019-08-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112522746A (en) * | 2020-11-23 | 2021-03-19 | 北京科技大学 | Method for electroplating trivalent thick chromium coating on inner wall of pipe with large length-diameter ratio |
| CN112981515A (en) * | 2021-05-06 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Current regulation and control method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570876A (en) * | 2009-06-08 | 2009-11-04 | 深圳市常兴金刚石磨具有限公司 | Electroplating device and electroplating method for electroplating drills |
| CN102021638A (en) * | 2010-12-30 | 2011-04-20 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
| CN202543364U (en) * | 2012-04-24 | 2012-11-21 | 博敏电子股份有限公司 | Sectional striking current electroplating bath |
| CN203683711U (en) * | 2013-12-26 | 2014-07-02 | 深圳市华大电路科技有限公司 | Copper plating rectifying device |
| CN204058637U (en) * | 2014-08-21 | 2014-12-31 | 金悦通电子（翁源）有限公司 | A kind of micro electric coating apparatus of short run pcb board |
| CN204185584U (en) * | 2014-09-25 | 2015-03-04 | 提珂隆(天津)表面技术有限公司 | Electroplanting device and conducting rod thereof |
| CN104404605A (en) * | 2014-12-03 | 2015-03-11 | 东莞市智和胜电器有限公司 | Electroplating device with two output rectifiers |
| CN204342906U (en) * | 2014-12-03 | 2015-05-20 | 东莞市智和胜电器有限公司 | A kind of electroplanting device of tool dual output rectifier |
| CN104878424A (en) * | 2015-04-29 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Method for improving electroplating layer uniformity of PCB (printed circuit board) vertical electroplating line |
| CN105350062A (en) * | 2015-12-07 | 2016-02-24 | 依力柏电能有限公司 | Electroplating device |
| CN106435697A (en) * | 2016-11-01 | 2017-02-22 | 东莞市智和胜电器有限公司 | Electroplating device for VCP dual-output rectifiers |
| CN206521532U (en) * | 2017-04-06 | 2017-09-26 | 东莞市智和胜电器有限公司 | A kind of electroplanting device for monitoring dual output rectifier |
-
2018
- 2018-01-29 CN CN201810085413.2A patent/CN108251885B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570876A (en) * | 2009-06-08 | 2009-11-04 | 深圳市常兴金刚石磨具有限公司 | Electroplating device and electroplating method for electroplating drills |
| CN102021638A (en) * | 2010-12-30 | 2011-04-20 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
| CN202543364U (en) * | 2012-04-24 | 2012-11-21 | 博敏电子股份有限公司 | Sectional striking current electroplating bath |
| CN203683711U (en) * | 2013-12-26 | 2014-07-02 | 深圳市华大电路科技有限公司 | Copper plating rectifying device |
| CN204058637U (en) * | 2014-08-21 | 2014-12-31 | 金悦通电子（翁源）有限公司 | A kind of micro electric coating apparatus of short run pcb board |
| CN204185584U (en) * | 2014-09-25 | 2015-03-04 | 提珂隆(天津)表面技术有限公司 | Electroplanting device and conducting rod thereof |
| CN104404605A (en) * | 2014-12-03 | 2015-03-11 | 东莞市智和胜电器有限公司 | Electroplating device with two output rectifiers |
| CN204342906U (en) * | 2014-12-03 | 2015-05-20 | 东莞市智和胜电器有限公司 | A kind of electroplanting device of tool dual output rectifier |
| CN104878424A (en) * | 2015-04-29 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Method for improving electroplating layer uniformity of PCB (printed circuit board) vertical electroplating line |
| CN105350062A (en) * | 2015-12-07 | 2016-02-24 | 依力柏电能有限公司 | Electroplating device |
| CN106435697A (en) * | 2016-11-01 | 2017-02-22 | 东莞市智和胜电器有限公司 | Electroplating device for VCP dual-output rectifiers |
| CN206521532U (en) * | 2017-04-06 | 2017-09-26 | 东莞市智和胜电器有限公司 | A kind of electroplanting device for monitoring dual output rectifier |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112522746A (en) * | 2020-11-23 | 2021-03-19 | 北京科技大学 | Method for electroplating trivalent thick chromium coating on inner wall of pipe with large length-diameter ratio |
| CN112522746B (en) * | 2020-11-23 | 2023-01-24 | 北京科技大学 | Method for electroplating trivalent thick chromium coating on inner wall of pipe with large length-diameter ratio |
| CN112981515A (en) * | 2021-05-06 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Current regulation and control method |
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| Publication number | Publication date |
|---|---|
| CN108251885B (en) | 2019-08-23 |
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