CN108196427A - Photosensitive resin composition, and color photoresist structure and display using same - Google Patents

Photosensitive resin composition, and color photoresist structure and display using same Download PDF

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Publication number
CN108196427A
CN108196427A CN201810047769.7A CN201810047769A CN108196427A CN 108196427 A CN108196427 A CN 108196427A CN 201810047769 A CN201810047769 A CN 201810047769A CN 108196427 A CN108196427 A CN 108196427A
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China
Prior art keywords
methyl
acrylic acid
resin composition
photosensitive resin
esters
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CN201810047769.7A
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Chinese (zh)
Inventor
蔡於展
田中聪
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Sumika Technology Co Ltd
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Sumika Technology Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)

Abstract

A photosensitive resin composition, and a color photoresist structure and a display using the same. The photosensitive resin composition comprises a colorant, a resin, a photopolymerization monomer, a photopolymerization initiator and a solvent. Colorants include pigments and dyes. The resin comprises a first monomer unit with a hydroxyl group and a second monomer unit with an ester functional group, and the sum of the first monomer unit and the second monomer unit accounts for more than 30 mol% of the resin. The photosensitive resin composition has good heat resistance and solvent resistance.

Description

Photosensitive resin composition and apply its chromatic photoresist structure and display
Technical field
The present invention relates to a kind of photosensitive resin compositions.The present invention is also made of about one kind the photoresist The chromatic photoresist structure that object is formed.The present invention is also about a kind of display for including the chromatic photoresist structure.
Background technology
In the display, the color of each picture element is generally controlled using color filter structures such as colored filters.For example, In the liquid crystal display of relatively early stage, colored filter is formed on the substrate relative to thin film transistor base plate, usually It is referred to as colored filter substrate.Colored filter may include the chromatic photoresist structure of multiple color, such as be but not limited to red The light resistance structure of color, green and blue.These light resistance structures can use resin combination, particularly photoresist to form Object is formed.In general, in order to coordinate various types of display applications, the ingredient of photosensitive resin composition can be adjusted Whole and optimization.
Invention content
The present invention is about a kind of photosensitive resin composition and applies its chromatic photoresist structure and display.Implement The photosensitive resin composition of example has good heat resistance and solvent resistance.
An embodiment according to the present invention, proposes a kind of photosensitive resin composition.This sense rotation optical activity resin combination Including colorant, resin, photo polymerization monomer, Photoepolymerizationinitiater initiater and solvent.The colorant includes pigment and dyestuff.It is described Resin includes the first monomeric unit and second comonomer unit, and the summation of first monomeric unit and the second comonomer unit accounts for More than the 30mol% of the resin, first monomeric unit have structure as described in chemical formula 1:
[chemical formula 1]
And
The second comonomer unit has the structure as shown in chemical formula 2:
[chemical formula 2]
Wherein R1And R2It is separately the alkyl of carbon number 1 to 10, n and m are separately positive integer, R3Represent hydrogen The alkyl of atom or carbon number 1 to 2.
The summation of an embodiment according to the present invention, first monomeric unit and the second comonomer unit accounts for the tree 30mol%~90mol% of fat.
An embodiment according to the present invention, first monomeric unit account for 25~60mol% of the resin, and described second Monomeric unit accounts for more than the 5mol% of the resin.
An embodiment according to the present invention, the resin further include Third monomer unit, and the Third monomer unit has N-phenylmaleimide functional group.
An embodiment according to the present invention, the Third monomer unit account for 10mol%~30mol% of the resin.
An embodiment according to the present invention, the resin further include the 4th monomeric unit, and the 4th monomeric unit has Methyl methacrylate.
An embodiment according to the present invention, the 4th monomeric unit account for 0mol%~50mol% of the resin.
An embodiment according to the present invention, relative to the resin of 100 parts by weight, the colorant for 1 parts by weight~ 50 parts by weight, the photo polymerization monomer are the parts by weight of 1 parts by weight~5, and the Photoepolymerizationinitiater initiater is the parts by weight of 1 parts by weight~3, The solvent is the parts by weight of 1 parts by weight~41.
An embodiment according to the present invention, the dyestuff be selected from oil-soluble dyes, acid dyes, base dyestuff, directly Dyestuff, mordant dye, the amine salt of acid dyes or acid dyes sulfamide derivative, azo dyes, cyanine dye, triphen Methylmethane dyestuff, oxa- green onion ketone dyes, phthalocyanine dye, naphthoquinone dyestuff, quinoneimine dye, methine dyes, azomethine dyes, The group that squaraine dye, acridine dye, styryl color, coumarine dye, quinoline dye and nitro dye are formed.
An embodiment according to the present invention, the dyestuff account for 0.1~50wt% of the photosensitive resin composition.
An embodiment according to the present invention, the photo polymerization monomer are selected from polymerism of the tool there are one ethylene unsaturated bond There are three the polymerizations of ethylene unsaturated bond for compound, the polymerizable compound with two ethylene unsaturated bonds and tool The group that property compound is formed;And/or
The Photoepolymerizationinitiater initiater is selected from O- acyl groups oxime compound, alkyl phenyl ketone compound, double imidazole compound, triazine Compound, acylphosphine oxide, benzoin compound, diphenylketone compound, oxime-based compound, 10- butyl -2- chloro-acridines The group of ketone, benzyl or phenyl formic acid methyl esters and cyclopentadiene titanium compound composition;And/or
It is molten that the solvent is selected from ester solvent, ether solvents, ether-ether solvent, ketone solvent, alcoholic solvent, aromatic hydrocarbon solvents, amide The group that agent and dimethyl sulfoxide (DMSO) are formed.
Wherein, the polymerizable compound of ethylene unsaturated bond is selected from nonylphenol acrylate phenyl carbitol there are one the tools Ester, acrylic acid 2- hydroxyl -3- phenoxy-propyls, acrylic acid 2- ethylhexyls carbitol ester, acrylic acid 2- hydroxy methacrylates, N- ethylene The group that base pyrrolones is formed;The polymerizable compound for having two ethylene unsaturated bonds is selected from two (methyl) propylene Sour 1,6- hexane diols ester, two (methyl) acrylic acid glycol esters, two (methyl) acrylic acid neopentyl glycol ester, two (methyl) propylene Triethylenetetraminehexaacetic acid diol ester, bis- (acryloyl-oxyethyl) ethers of bisphenol-A, two (methyl) acrylic acid -3- methylpentanes diol ester institute groups Into group;And the polymerizable compound of ethylene unsaturated bond is selected from three (methyl) acrylic acid, three hydroxyl first there are three the tools Base propane ester, three (methyl) acrylate, pentaerythritols, four (methyl) acrylate, pentaerythritols, two season of five (methyl) acrylic acid Doutrate, six (methyl) acrylic acid dipentaerythritol esters, eight (methyl) acrylic acid tripentaerythritol esters, tripentaerythritol seven (methyl) acrylate, ten (methyl) acrylic acid tetrapentaerythritol esters, nine (methyl) acrylic acid tetrapentaerythritol esters, three (2- (first Base) acryloyl-oxyethyl) isocyanates, the glycol-modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid Glycol-modified dipentaerythritol ester, the propylene glycol modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid the third two Alcohol is modified dipentaerythritol ester, four (methyl) caprolactones are modified pentaerythritol ester and six (methyl) acrylic acid in oneself The group that ester modified dipentaerythritol ester is formed.
According to another embodiment of the present invention, a kind of chromatic photoresist structure is proposed.Before this chromatic photoresist structure is by being, for example, The photosensitive resin composition stated is formed.
A more embodiment according to the present invention, proposes a kind of display.This display includes being, for example, aforementioned colourama Hinder structure.
Beneficial effects of the present invention:
The photosensitive resin composition of the present invention has good heat resistance and solvent resistance.
Specific embodiment
Various embodiments set forth below are described in detail, and embodiment can't limit this only to illustrate as example The range to be protected is invented, other features, element, method and parameter still can be used to be implemented in the present invention.Embodiment carries Go out, only to illustrate the technical characteristic of the present invention, be not limited to the claim of the present invention.In the technical field Those of ordinary skill, by can book according to the following instructions description, in the scope for not departing from the present invention, make impartial modification With variation.
Some embodiments of the present invention are about a kind of photosensitive resin composition.Such photosensitive resin composition includes Colorant (A), resin (B), photo polymerization monomer (C), Photoepolymerizationinitiater initiater (D) and solvent (E).Wherein, colorant (A) includes Pigment (A-1) and dyestuff (A-2).Resin (B) is including the first monomeric unit (B-1) with hydroxyl and with esters functional group's The summation of second comonomer unit (B-2), the first monomeric unit (B-1) and second comonomer unit (B-2) accounts for resin (B) More than 30mol%.
Here, the colorant (A), pigment (A-1), dyestuff (A-2), resin (B), the first monomeric unit (B-1), second The ingredients words such as monomeric unit (B-2), photo polymerization monomer (C), Photoepolymerizationinitiater initiater (D) and solvent (E), independently may include list One or more colorants (A), pigment (A-1), dyestuff (A-2), resin (B), the first monomeric unit (B-1), second comonomer list The situation of the ingredients such as member (B-2), photo polymerization monomer (C), Photoepolymerizationinitiater initiater (D) and solvent (E).
Photosensitive resin composition according to an embodiment of the invention, via the composition of adjustment resin (B), the first monomer list First hydroxyl of (B-1) and the esters functional group of second comonomer unit (B-2) can occur to be condensed (condensation) reaction so that Further cross-linked polymeric between first monomeric unit (B-1) and second comonomer unit (B-2), and it is higher and harder to form the degree of cross linking Solid resin structure, and enable to resin structure have higher heat resistance, and then can to avoid subsequent technique (such as TFT-LCD techniques) in high-temperature heat treatment (such as high-temperature baking) photosensitive resin composition is damaged.
In addition, in general, dye molecule has higher dissolubility in the solution, when dye molecule is from photoresist The phenomenon that causing to fade when being dissolved to external solution in the resin structure of constituent, and according to an embodiment of the invention, the Further cross-linked polymeric between one monomeric unit (B-1) and second comonomer unit (B-2), and it is higher and wrap to form 3 D cross-linked degree The preferable resin structure of the property covered, therefore dye molecule can be enabled to be crosslinked structure cladding wherein, and can be preferably It is fixed in this cross-linked structure, so that the photosensitive resin composition of the present invention has preferable solvent resistance and is not easy to send out Raw the phenomenon that fading, thus, can be to avoid the technique bath treatment (example in subsequent technique (such as TFT-LCD techniques) As chemical agent cleans processing) photosensitive resin composition is damaged.
Further, the hydroxyl of the first monomeric unit (B-1) can improve the dissolubility of resin structure, and cause photonasty Resin combination is remained to good heat resistance and when solvent resistance with good developability.
According to some embodiments, the first monomeric unit (B-1) has structure as described in chemical formula 1:
[chemical formula 1]
And
Second comonomer unit (B-2) has the structure as shown in chemical formula 2:
[chemical formula 2]
Wherein R1And R2It is separately the alkyl of carbon number 1 to 10, n and m are separately positive integer, R3Represent hydrogen The alkyl of atom or carbon number 1 to 2.
According to some embodiments, the summation of the first monomeric unit (B-1) and second comonomer unit (B-2) can account for resin (B) More than 30mol%, such as 30mol%~90mol%.
According to some embodiments, the first monomeric unit (B-1) can account for more than the 25mol% of resin (B), second comonomer unit (B-2) more than the 5mol% of resin (B) can be accounted for.When the first monomeric unit (B-1) and second comonomer unit (B-2) respectively account for tree When the 25mol% and more than 5mol% of fat (B), the condensation reaction of the hydroxyl and esters functional group of both this monomeric unit is provided Crosslinking degree can sufficiently achieve expected heat resistance and solvent resistance.When the first monomeric unit (B-1) and second comonomer When unit (B-2) accounts for resin (B) less than 30mol% respectively, then it can not make resin structure that there is enough crosslinking degrees, and can not Reach expected heat resistance and solvent resistance.
According to some embodiments, the first monomeric unit (B-1) account for the molar ratio of resin (B) such as may be greater than or The molar ratio of resin (B) is accounted in second comonomer unit (B-2);Preferably, the first monomeric unit (B-1) accounts for rubbing for resin (B) You for example may be greater than the molar ratio that second comonomer unit (B-2) accounts for resin (B) at ratio.Thus, the first monomer list The esters functional group in part of hydroxyl and second comonomer unit (B-2) in first (B-1) carries out condensation reaction and improves resin knot The degree of cross linking of structure, while remaining in the first monomeric unit (B-1) does not carry out the hydroxyl of cross-linking reaction can improve resin structure Dissolubility, and then improve photosensitive resin composition developability.
For example, according to some embodiments, the first monomeric unit (B-1) can account for the 25mol% of resin (B)~ 60mol%, second comonomer unit (B-2) can account for more than the 5mol% of resin (B), such as 5~65mol%.
According to some embodiments, resin (B) can further include Third monomer unit (B-3), and Third monomer unit (B-3) has N-phenylmaleimide functional group.For example, Third monomer unit (B-3) can account for the 10mol% of resin (B)~ 30mol% is preferably about 10mol%.
According to some embodiments, resin (B) can further include the 4th monomeric unit (B-4), and the 4th monomeric unit (B-4) has Methyl methacrylate.For example, the 4th monomeric unit (B-4) can account for 0mol%~50mol% of resin (B), preferably About 10mol%~20mol%.
According in some embodiments, there is no particular limitation for the pigment (A-1) of colorant (A), and well known pigment can be used, For example, it can illustrate as being classified into pigment in colour index (The Society of Dyers and Colourists publication) (pigment) compound.
For example, pigment (A-1) can be that C.I. pigment yellows 1 (hereinafter, omitting the record of C.I. pigment yellows, are only listed Number), 3,12,13,14,15,16,17,20,24,31,53,83,86,93,94,109,110,117,125,128,137, 138th, 139,147,148,150,153,154,166,173,194,214 etc. yellow uitramarine;C.I. pigment orange 13,31,36, 38th, 40,42,43,51,55,59,61,64,65,71,73 etc. orange pigment;C.I. Pigment Red 9,97,105,122,123, 144th, 149,166,168,175,176,177,180,192,209,215,216,224,242,254,255,264,265 etc. it is red Color pigment;C.I. pigment blue 15,15:3、15:4、15:6th, 60,80 etc. blue pigment;C.I. pigment violet 1,19,23,29,32, 36th, 38 etc. violet pigment;C.I. the viridine green of pigment Green 7,36,58 etc.;C.I. the brown of pigment brown 23,25 etc.; C.I. black pigment of pigment black 1,7 etc. etc..Aforesaid pigments can be used alone or can mix two or more and use.
According in some embodiments, the dyestuff (A-2) of colorant (A) can illustrate such as oil-soluble dyes, acid dyes, base Property dyestuff, direct dyes, mordant dye, the amine salt of acid dyes or acid dyes sulfamide derivative etc. dyestuff, can lift Such as the compound or dye of dyestuff are categorized into colour index (The Society of Dyers and Colourists publication) Well known dyestuff recorded in color notebook (Se Ran societies).Also, according to chemical constitution, can illustrate such as azo dyes, cyanine uniformly dyeing Expect (cyanine dye), triphenhlmethane dye (triphenylmethane dye), oxa- green onion ketone dyes (xanthene Dye), phthalocyanine dye (phthalocyanine dye), naphthoquinone dyestuff (naphthoquinone dye), quinoneimine dye (quinoneimine dye), methine dyes (methine dye), azomethine dyes (azomethine dye), side's acid Dyestuff (squarylium dye), acridine dye (acridine dye), styryl color (styryl dye), coumarine dye (coumarin dye), quinoline dye (quinoline dye) and nitro dye (nitro dye) etc..In abovementioned dyes, to have Solvent soluble dye is preferred.As long as abovementioned dyes may conform to the spectrophotometric spectra of desirable colored filter and suitable for selecting , abovementioned dyes can be used alone or be used together by two or more types.
According to some embodiments, dyestuff (A-2) accounts for 0.1~50wt% of photosensitive resin composition, and dyestuff (A-2) is preferable Ground can be oxa- green onion ketone dyes.
According to some embodiments, photo polymerization monomer (C) is can pass through the living radical of Photoepolymerizationinitiater initiater (D) generation And/or monomer that is sour and polymerizeing, such as the ethylene unsaturated bond with polymerizability is but not limited to, seem (methyl) propylene Ester compound.Here, the compound described using bracket, it is meant that including word in bracket exist with there is no feelings Condition, example (methyl) acrylate compounds as the aforementioned, includes the feelings of acrylate compounds and methacrylate compound Shape.For example, photo polymerization monomer (C) may include but be not only restricted in the group being made of the following option at least One:Nonylphenol acrylate phenyl carbitol ester, acrylic acid 2- hydroxyl -3- phenoxy-propyls, acrylic acid 2- ethylhexyl carbitols There are one the polymerizable compounds of ethylene unsaturated bond for the tool such as ester, acrylic acid 2- hydroxy methacrylates, N- vinyl pyrrole ketone;Two (methyl) acrylic acid 1,6- hexane diols ester, two (methyl) acrylic acid glycol esters, two (methyl) acrylic acid neopentyl glycol ester, two (methyl) acrylic acid triglycol ester, bis- (acryloyl-oxyethyl) ethers of bisphenol-A, two (methyl) acrylic acid 3- methylpentanes two Alcohol ester etc. has the polymerizable compound of two ethylene unsaturated bonds;And three (methyl) acrylic acid trihydroxymethylpropanyl esters, Three (methyl) acrylate, pentaerythritols, four (methyl) acrylate, pentaerythritols, five (methyl) acrylic acid dipentaerythritol esters, Six (methyl) acrylic acid dipentaerythritol esters, eight (methyl) acrylic acid tripentaerythritol esters, tripentaerythritol seven (methyl) propylene Acid esters, ten (methyl) acrylic acid tetrapentaerythritol esters, nine (methyl) acrylic acid tetrapentaerythritol esters, three (2- (methyl) acryloyls Oxygroup ethyl) isocyanates, the glycol-modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid are glycol-modified Dipentaerythritol ester, the propylene glycol modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid propylene glycol modified two seasons Doutrate, four (methyl) caprolactones are modified pentaerythritol ester, six (methyl) caprolactones were modified for two seasons penta 4 There are three the polymerizable compounds of ethylene unsaturated bond for the tool such as alcohol ester.In some embodiments, photo polymerization monomer (C) is preferable Ground is polymerizable compound of the tool there are three ethylene unsaturated bond.
According to some embodiments, Photoepolymerizationinitiater initiater (D) can generate activity to be any by the effect of light or heat Free radical, acid etc., so that the compound that polymerization starts.For example, Photoepolymerizationinitiater initiater (D) may include but be not only restricted to Selected from least one of group being made of the following option:O- acyl groups oxime (O-acyloxime) compound, alkyl phenyl Ketone compound, double imidazole compound, triaizine compounds, acylphosphine oxide (acyl phosphine oxide), sweetening treatment of resting in peace Close object, diphenylketone compound, oxime-based compound, 10- butyl -2- chloro-acridines ketone, benzyl or phenyl formic acid methyl esters and ring Pentadiene titanium (titanocene) compound.In some embodiments, Photoepolymerizationinitiater initiater (D) be preferably comprised selected from by At least one of group that the following option is formed:O- acyl groups oxime compound, alkyl phenyl ketone compound, double imidazoles chemical combination Object, triaizine compounds and acylphosphine oxide.For example, using O- acyl groups oxime compound as Photoepolymerizationinitiater initiater (D) Situation can be usedOXE-01 (BASF AG),OXE-02 (BASF AG), N-1919 (ADEKA Company) etc. commercial goods.
According to some embodiments, solvent (E) may include but be not only restricted in the group being made of the following option At least one:Ester solvent (referring to the solvent containing-COO- but without-O- in molecule at this), ether solvents (refer to herein Solvent in molecule containing-O- but without-COO-), ether-ether solvent (refers to molten containing-COO- and-O- in molecule at this Agent), ketone solvent (referring to the solvent containing-CO- but without-COO- in molecule at this), alcoholic solvent (refers at this in molecule Solvent containing OH but without-O- ,-CO- and-COO-), aromatic hydrocarbon solvents, amide solvent, dimethyl sulfoxide (DMSO) etc..
In some embodiments, relative to the resin of 100 parts by weight, the colorant is the parts by weight of 1 parts by weight~50, The photo polymerization monomer is the parts by weight of 1 parts by weight~5, and the Photoepolymerizationinitiater initiater is the parts by weight of 1 parts by weight~3, the solvent For the parts by weight of 1 parts by weight~41.
According to some embodiments, photosensitive resin composition may also include leveling agent, polymerization starting auxiliary agent, filler, close Other additives such as accelerating agent, antioxidant, light stabilizer, chain movement agent, but are not only restricted to this.
Another embodiment of the present invention be about a kind of chromatic photoresist structure, can be by the sense according to aforementioned any embodiment Photosensitiveness resin combination is formed.Specifically, light resistance structure of this chromatic photoresist structure for blue.For example, according to preceding The coloured silk can be formed by the methods of photolithography, ink-jet method or print process by stating the photosensitive resin composition of any embodiment Color light resistance structure, but it is not only restricted to this.
Example described below using photolithography.First, it will be formed according to the photoresist of aforementioned any embodiment Object is coated on substrate.According to some embodiments, the substrate can be the plate or film of the materials such as glass, metal or plastics Shape substrate, and it can be formed on other light resistance structures, various insulation or the elements such as conductive film, and/or driving circuit in advance. According to some embodiments, photosensitive resin composition can by spin coater, slit spin coater, slit coater ( Referred to as compression mod coating machine (die coater), curtain leaching coating machine (curtain flow coater) or non-rotating coating machine (spinless coater)) or the apparatus for coating such as ink jet printer be coated with.
Then, photosensitive resin composition is dry on substrate.Specifically, this step can be spontaneously dried, is logical Air-dry it is dry, be dried under reduced pressure, any one of drying modes such as heat drying (also referred to as prebake conditions) or various ways coordinate into Row.Dry temperature can be fallen in the range of 10 DEG C~120 DEG C, preferably fallen in the range of 25 DEG C~100 DEG C.If into Row heating, the time of heating can fall in the range of 10 seconds~60 minutes, preferably fall in the range of 30 seconds~30 minutes. If be dried under reduced pressure, the pressure and 20 DEG C~25 DEG C of temperature range of 50 pas (Pa)~150 pa can be used.At some In embodiment, dried photosensitive resin composition has 0.1 micron (μm)~20 micron, preferably 1 micron~6 microns Film thickness, and can be adjusted according to used material and purposes.
And then figure is obtained with exposed and developed, the chromatic photoresist structure can be used as.In some embodiments, It is to obtain figure by developing the unexposed part of removal after light shield is used to be exposed.In further embodiments, exist It is that figure is obtained by the part for removal exposure of developing after being exposed using light shield.
In the step of exposure, the light sources such as mercury vapor lamp, light emitting diode, metal halid lamp, halogen lamp can be used, and utilize E.g. wavelength falls the light in the range of 250 nanometers~450 nanometers.In some embodiments, it is sheared with wave filter and removes wave The long light less than 350 nanometers.In some embodiments, selectively taken out with bandpass filter wavelength 436 nanometers nearby, Light near 408 nanometers or near 365 nanometers.In some embodiments, the dresses such as light shield alignment exposure machine, stepper can be used It puts, equably to irradiate parallel rays to entire plane of exposure and/or be accurately aligned with shielding and base material.The pattern of light shield can be according to It is designed according to demand.
In the step of development, the developer solutions such as the aqueous solution of organic solvent, alkali compounds can be used so that scheduled portion Divide (such as unexposed part) dissolving, remove, thus obtain figure.In some embodiments, using the water of alkali compounds Solution is particularly helpful to obtain the good figure of shape as imaging liquid.According to some embodiments, developer solution can be inorganic alkaline The aqueous solution of compound or the aqueous solution of organic basic compound, concentration are, for example, the model fallen in 0.01wt%~10wt% In enclosing, preferably fall in the range of 0.03wt%~5wt%.The aqueous solution of the inorganic alkaline compound include but not by It is limited to the aqueous solution selected from least one of the group being made of the following option:Sodium hydroxide, potassium hydroxide, phosphoric acid hydrogen Disodium, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium metasilicate, potassium silicate, sodium carbonate, potassium carbonate, Sodium bicarbonate, saleratus, Boratex, potassium borate and ammonia.The aqueous solution of the organic basic compound includes but is not limited to Aqueous solution selected from least one of the group being made of the following option:Tetramethyl-ammonium hydroxide, 2- hydroxyethyls Trimethyl ammonium hydroxide, monomethyl amine, dimethyl amine, Trimethylamine, monoethylamine, diethylamide, triethylamine, single isopropyl Base amine, diisopropylamine, ethanol amine.In some embodiments, developer solution be preferably potassium hydroxide, sodium bicarbonate, and/or The aqueous solution of tetramethyl-ammonium hydroxide.In some embodiments, the aqueous solution of the alkali compounds may also include interface work Property agent, concentration be, for example, fall in the range of 0.01wt%~10wt%, preferably fall the model in 0.05wt%~8wt% In enclosing, fallen in the range of 0.1wt%~5wt%.The interfacial agent including but not limited to be selected from by At least one of group that the following option is formed:Polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyxyethylated virtue Base ether, other polyoxyethylene derivs, ethylene oxide/oxygroup propylene-based block copolymer, sorbitan carboxylic esters, polyoxyethylene mountain Pears alcohol acid anhydride aliphatic ester, polyoxyethylene sorbitol aliphatic ester, glycerol fatty acid ester, polyoxyethylene fatty acid ester, polyoxy The alcohol nonionic surfactants such as vinyl alkyl amine;Lauryl alcohol sodium sulfovinate, oleyl sulfate sodium, NaLS, the moon The anionic systems interfacial agents such as osmanthus base ammonium sulfate, dodecyl benzene sulfonic acid sodium salt, dodecyl sodium naphthalene sulfonate;And stearyl amine salt The cationic systems interfacial agents such as hydrochlorate, lauryl trimethyl ammonium chloride.Developer solution can by paddle paddling process, infusion process, The methods of spray-on process, is provided onto base material.It also, in some embodiments, can be by base material skewed at any angle during development.Root According to some embodiments, the step of can be washed after development.
One more embodiment of the present invention is about a kind of display, may include aforementioned chromatic photoresist structure.Citing comes It says, the display may include the colored filter being made of aforementioned chromatic photoresist structure, but be not only restricted to this.According to some Embodiment, the display can be the displays such as liquid crystal display, electroluminescent display or plasma display panel.
Hereinafter, the present invention will provide several embodiments and comparative example, it is according to embodiments of the present invention to further illustrate The attainable effect of photosensitive resin composition.
[embodiment 1]
Account for 40mol% using aforementioned first monomeric unit (B-1), aforementioned second comonomer unit (B-2) accounts for 50mol%, with And the aforementioned Third monomer unit (BZMI) with N-phenylmaleimide functional group accounts for 10mol%.Use C.I. pigment blues 15:6 and aforementioned oxa- green onion ketone dyes as colorant (C.I. pigment blue 15s:6 and oxa- green onion ketone dyes weight ratio be 90: 10).Using six (methyl) acrylic acid dipentaerythritol esters (DPHA) as photo polymerization monomer.It usesOXE-01 (BASF AG) is as Photoepolymerizationinitiater initiater.Using propylene glycol methyl ether acetate (PGMEA) as solvent.It is accounted for colorant 50wt%, resin account for 1wt%, photo polymerization monomer accounts for 5wt%, Photoepolymerizationinitiater initiater accounts for 3wt%, solvent accounts for the ratio of 41wt% and matches Photosensitive resin composition is made.The photosensitive resin composition for preparing completion is coated on 5 centimeters * 5 centimeters with spin-coating method On glass substrate (Eagle2000, Corning company).In 100 DEG C of prebake conditions 3 minutes.After placing cooling, make substrate and quartz 100 microns of glass system light shield interval, using exposure machine (TME-150RSK, TOPCON (stock) make) under atmospheric environment atmosphere with 150mJ/cm2Light exposure (365nm benchmark) carry out light irradiation, wherein on the light shield have 100 microns of line widths and line-spacing The figure of (line and space).After light irradiation, containing alcohol nonionic surfactant 0.12% and potassium hydroxide In 24 DEG C of immersion developments 60 seconds in 0.04% water system developer solution, then wash.Then 30 points are toasted after 230 DEG C in an oven Clock obtains the sample of chromatic photoresist structure.By it is aforementioned prepare complete amount of glass colour examining degree after, be then dipped to 65 DEG C, 100% N- N-methyl 2-pyrrolidone Ns (NMP) solution in after five minutes, then measure with chroma plane the coloration of glass, and calculate impregnate it is front and rear The Δ Eab of coloration.(Δ Eab=((L*-L*) ^2+ (a*-a*) ^2+ (b*-b*) ^2) ^ (1/2))
[embodiment 3]
35mol% is accounted for using aforementioned first monomeric unit (B-1), aforementioned second comonomer unit (B-2) accounts for 35mol%, preceding It states the Third monomer unit (BZMI) with N-phenylmaleimide functional group and accounts for 10mol% and aforementioned with methyl-prop 4th monomeric unit (MAA) of e pioic acid methyl ester accounts for the resin of 20mol%.Other conditions are such as embodiment 1, as described according to embodiment 1 Method sample is made and is observed.
[embodiment 2], [embodiment 4]~[embodiment 10]
Use aforementioned first monomeric unit (B-1) of the molar ratio according to table 1, aforementioned second comonomer unit (B-2), preceding State Third monomer unit (BZMI) with N-phenylmaleimide functional group and/or aforementioned with methyl methacrylate The 4th monomeric unit (MAA) resin.Other conditions such as embodiment 1 is made sample according to method described in embodiment 1 and goes forward side by side Row observation.
[comparative example 1]
10mol% is accounted for using the monomeric unit (BZMI) with N-phenylmaleimide functional group, with acrylic acid official The monomeric unit (AA) of energy base accounts for 10mol%, has third (from acrylic acid (AA)/methylglycidyl esters (GMA) copolymer) The monomeric unit (AA+GMA) of olefin(e) acid functional group/methylglycidyl esters functional group accounts for 50mol% and with vinyltoluene The monomeric unit (VT) of functional group accounts for the resin of 30mol%.Other conditions such as embodiment 1.According to method system described in embodiment 1 Into sample and observed.
[comparative example 2]
10mol% is accounted for using the monomeric unit (BZMI) with N-phenylmaleimide functional group, (from metering system Sour hexamethylene ester monomer) monomeric unit (CHMA) with cyclohexyl methacrylate functional group accounts for 55mol%, (from methyl-prop E pioic acid methyl ester (MAA)/methylglycidyl esters (GMA) copolymer) there is methyl methacrylate/methylglycidyl esters function The monomeric unit (MAA+GMA) of base accounts for 20mol% and the monomeric unit (MAA) with methyl methacrylate accounts for 15mol% Resin.Other conditions such as embodiment 1.Sample is made according to method described in embodiment 1 and is observed.
[comparative example 3]
10mol% is accounted for using the monomeric unit (TCDMA) with methacrylic acid tricyclic functional group, with methacrylic acid The monomeric unit (BZMA) of benzyl ester functional group accounts for 45mol% and with methyl methacrylate/methylglycidyl esters function The monomeric unit (MAA+GMA) of base accounts for the resin of 50mol%.Other conditions such as embodiment 1.According to method described in embodiment 1 Sample is made and is observed.
[result and evaluation]
Each embodiment and the component ratio and coloration of comparative example observe result as listed in table 1, " Δ Eab<3.5 " represent resistance to molten Agent is good, " Δ Eab>3.5 " represent that solvent resistance is bad.As shown in table 1, each photosensitive resin composition by embodiment The sample of chromatic photoresist structure formed, all with good solvent resistance.
Table 1
1 (Continued) of table
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe Various corresponding changes and deformation, but these corresponding changes and deformation can be made according to the present invention by knowing those skilled in the art The protection domain of the claims in the present invention should all be belonged to.

Claims (14)

1. a kind of photosensitive resin composition, which is characterized in that the photosensitive resin composition includes:
Colorant, including pigment and dyestuff;
Resin, including:
The summation of first monomeric unit and second comonomer unit, first monomeric unit and the second comonomer unit accounts for described More than the 30mol% of resin, first monomeric unit have structure as described in chemical formula 1:
Chemical formula 1
And
The second comonomer unit has the structure as shown in chemical formula 2:
Chemical formula 2
Wherein R1And R2It is separately the alkyl of carbon number 1 to 10, n and m are separately positive integer, R3Represent hydrogen atom Or the alkyl of carbon number 1 to 2;
Photo polymerization monomer;
Photoepolymerizationinitiater initiater;And
Solvent.
2. photosensitive resin composition as described in claim 1, which is characterized in that first monomeric unit and described second The summation of monomeric unit accounts for 30mol%~90mol% of the resin.
3. photosensitive resin composition as described in claim 1, which is characterized in that first monomeric unit accounts for the resin 25~60mol%, the second comonomer unit accounts for more than the 5mol% of the resin.
4. photosensitive resin composition as described in claim 1, which is characterized in that the resin further includes Third monomer list Member, the Third monomer unit have N-phenylmaleimide functional group.
5. photosensitive resin composition as claimed in claim 4, which is characterized in that the Third monomer unit accounts for the tree 10mol%~30mol% of fat.
6. photosensitive resin composition as described in claim 1, which is characterized in that the resin further includes the 4th monomer list Member, the 4th monomeric unit have methyl methacrylate.
7. photosensitive resin composition as claimed in claim 6, which is characterized in that the 4th monomeric unit accounts for the tree 0mol%~50mol% of fat.
8. photosensitive resin composition as described in claim 1, which is characterized in that relative to the resin of 100 parts by weight, The colorant is the parts by weight of 1 parts by weight~50, and the photo polymerization monomer is the parts by weight of 1 parts by weight~5, and the photopolymerization causes Agent is the parts by weight of 1 parts by weight~3, and the solvent is the parts by weight of 1 parts by weight~41.
9. photosensitive resin composition as described in claim 1, which is characterized in that the dyestuff is selected from oil-soluble dyes, acid Property dyestuff, base dyestuff, direct dyes, mordant dye, the amine salt of acid dyes or acid dyes sulfamide derivative, idol It is nitrogen dyestuff, cyanine dye, triphenhlmethane dye, oxa- green onion ketone dyes, phthalocyanine dye, naphthoquinone dyestuff, quinoneimine dye, secondary Methyl dyestuff, azomethine dyes, squaraine dye, acridine dye, styryl color, coumarine dye, quinoline dye and nitro The group that dyestuff is formed.
10. photosensitive resin composition as claimed in claim 9, which is characterized in that the dyestuff accounts for the photoresist 0.1~50wt% of constituent.
11. photosensitive resin composition as described in claim 1, which is characterized in that the photo polymerization monomer, which is selected from, has one The polymerizable compound of a ethylene unsaturated bond, the polymerizable compound with two ethylene unsaturated bonds and with The group that the polymerizable compound of three ethylene unsaturated bonds is formed;And/or
The Photoepolymerizationinitiater initiater is selected from O- acyl groups oxime compound, alkyl phenyl ketone compound, double imidazole compound, triazine chemical combination Object, acylphosphine oxide, benzoin compound, diphenylketone compound, oxime-based compound, 10- butyl -2- chloro-acridines ketone, benzyl The group of base or phenyl formic acid methyl esters and cyclopentadiene titanium compound composition;And/or
The solvent be selected from ester solvent, ether solvents, ether-ether solvent, ketone solvent, alcoholic solvent, aromatic hydrocarbon solvents, amide solvent and The group that dimethyl sulfoxide (DMSO) is formed.
12. sensing optical activity resin combination as claimed in claim 11, which is characterized in that there are one ethylene insatiable hungers for the tool Nonylphenol acrylate phenyl carbitol ester, acrylic acid 2- hydroxyl -3- phenoxy-propyls, acrylic acid are selected from the polymerizable compound of key The group that 2- ethylhexyls carbitol ester, acrylic acid 2- hydroxy methacrylates, N- vinyl pyrrole ketone are formed;
The polymerizable compound that there is two ethylene unsaturated bonds be selected from two (methyl) acrylic acid 1,6- hexane diols esters, Two (methyl) acrylic acid glycol esters, two (methyl) acrylic acid neopentyl glycol ester, two (methyl) acrylic acid triglycol esters, bis-phenol The group that bis- (acryloyl-oxyethyl) ethers of A, two (methyl) acrylic acid -3- methylpentane diol esters are formed;And
The tool there are three ethylene unsaturated bond polymerizable compound be selected from three (methyl) acrylic acid trihydroxymethylpropanyl esters, Three (methyl) acrylate, pentaerythritols, four (methyl) acrylate, pentaerythritols, five (methyl) acrylic acid dipentaerythritol esters, Six (methyl) acrylic acid dipentaerythritol esters, eight (methyl) acrylic acid tripentaerythritol esters, tripentaerythritol seven (methyl) propylene Acid esters, ten (methyl) acrylic acid tetrapentaerythritol esters, nine (methyl) acrylic acid tetrapentaerythritol esters, three (2- (methyl) acryloyls Oxygroup ethyl) isocyanates, the glycol-modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid are glycol-modified Dipentaerythritol ester, the propylene glycol modified pentaerythritol ester of four (methyl) acrylic acid, six (methyl) acrylic acid propylene glycol modified two seasons Doutrate, four (methyl) caprolactones are modified pentaerythritol ester and six (methyl) caprolactones were modified for two seasons The group that Doutrate is formed.
13. a kind of chromatic photoresist structure, which is characterized in that the chromatic photoresist structure is by claim 1~12 any one of them Photosensitive resin composition is formed.
14. a kind of display, which is characterized in that the display includes the chromatic photoresist structure described in claim 13.
CN201810047769.7A 2017-12-29 2018-01-18 Photosensitive resin composition, and color photoresist structure and display using same Withdrawn CN108196427A (en)

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