CN108174510A - A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger - Google Patents
A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger Download PDFInfo
- Publication number
- CN108174510A CN108174510A CN201711484750.0A CN201711484750A CN108174510A CN 108174510 A CN108174510 A CN 108174510A CN 201711484750 A CN201711484750 A CN 201711484750A CN 108174510 A CN108174510 A CN 108174510A
- Authority
- CN
- China
- Prior art keywords
- plank
- golden finger
- finger
- ink
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of grading connecting fingers, including upper golden finger, lower golden finger and lead, the upper golden finger, lower golden finger and lead are rectangle, it is characterized in that, the lead is set between golden finger and lower golden finger, the both sides up and down of the lead are fixedly connected respectively with upper golden finger and lower golden finger, and the width of the lead is less than golden finger finger beam.The invention also discloses a kind of production methods of the optic module PCB plate comprising the grading connecting finger, this method includes plank preparation, selects allelopathic light ink, electroplating gold and move back ink, secondary dry film, etch lead and move back dry film, is anti-welding, choosingization thermosetting ink, change gold, plank post-processing steps, this method combines the design feature of appeal grading connecting finger, it reduces finished product plate and the problem of anti-welding position comes off occurs so that the quality for the pcb board made is further improved.
Description
Technical field
The invention belongs to pcb board production field, more particularly to a kind of grading connecting finger and the optical module comprising the golden finger
The production method of pcb board.
Background technology
Be arranged in rows on printed circuit board close to the position of edges of boards there are many rectangular metal contact piece, metal contact piece be
One layer of nickel gold is electroplated on the copper face of printed circuit board to be formed.These metal contact pieces are a parts for printed circuit board, because of its surface
Plating nickel gold and shape is similar to finger, therefore it is referred to as golden finger.Golden finger is used for the connection between printed circuit board, can connect electricity
Road and transmission signal.The nickel-gold layer on golden finger surface can improve resistance to plug, electric conductivity and the inoxidizability at the position.Golden hand
Finger is generally divided into isometric golden finger, grading connecting finger and segmentation golden finger, and classification, segmentation golden finger breach original in design
Golden finger is designed as different in size or segmentation structure, the shape in this way in signals transmission by the golden finger design concept of beginning
Into the effective time difference, convenient for the transmission of high-frequency signal, and electrification hot-plugging technology can be realized, to subsequent upgrade maintenance
There is very big facility.
Design gold finger lead is usually required in plating golden finger processing, with by being powered gold finger lead come to gold
Finger carries out electroplating processes.It is electroplated after the completion of golden finger, gold finger lead is not allow remaining, removal side in finished product PCB
Formula generally has two kinds of physics mode and chemical mode.Wherein physics mode generally by the way of milling gong, cutting or drilling,
But it is big to the destructiveness of pcb board, and the problems such as be susceptible to deviation or burr burr, cause operation difficulty big.Chemical mode
Generally by the way of liquid medicine etching, yield rate can be improved while the gold finger lead on effectively removal PCB
For traditional grading connecting finger structure light module printed circuit board using at finger segmentation, lead and finger etc. are big, system
The method of lead makes grading connecting finger between etching finger after work electricity gold, dew copper is had after such etching, among finger, in visitor
During the use of head of a household's phase, it can be aoxidized in place of this dew copper, corrode, cause to be affected using function.
Invention content
To solve the above problems, the purpose of the present invention is to provide a kind of grading connecting fingers that can effectively reduce dew copper face product
And the production method of the optic module PCB plate comprising the golden finger；
A kind of optic module PCB plate it is another object of the present invention to provide grading connecting finger and comprising the golden finger
Production method, the present invention is easy to operate, cost is small and easy to spread.
To achieve the above object, technical scheme is as follows：
The production method that the present invention provides a kind of grading connecting finger and the optic module PCB plate comprising the grading connecting finger, tool
Body includes：
A kind of grading connecting finger, the grading connecting finger include upper golden finger, lower golden finger and lead, the upper golden hand
Referring to, lower golden finger and lead are rectangle, which is characterized in that the lead is set between golden finger and lower golden finger,
The both sides up and down of the lead are fixedly connected respectively with upper golden finger and lower golden finger, and the width of the lead refers to less than golden finger
It is wide.
Further, upper golden finger and lower golden finger is wide flushes setting, which is characterized in that the right edge of the lead
Edge is flushed with the right side edge of upper golden finger and lower golden finger.
Further, the width of lead is 6mil.In the prior art, lead and golden finger are wide together, and will draw in the present invention
Line width is reduced to 6mil, and after lead etching, dew copper region greatly reduces, and while cost is reduced, greatly improves production
The quality of product.
A kind of method for the optic module PCB plate for making the grading connecting finger comprising claim 1, includes the following steps：
Step 1：Plank preparation：Working process early period is carried out to initial plank, obtains the first plank；
Step 2：Select allelopathic light ink：Upper golden finger position, lower golden finger position and the first members inside are coated photosensitive
Ink is blocked, and photosensitive-ink is photonasty resist ink, which is 20-30 μm, exposure energy control
Exposure guide rule 8-10 lattice, obtain the second plank；
Step 3；Electroplating gold simultaneously moves back ink：Needed for upper golden finger position and lower golden finger position on the second plank plate
The nickel gold of thickness, during electronickelling gold, nickel thickness is 100-300 μm, and golden thickness is 1-3 μm, and photosensitive-ink of decorporating obtains third plank；
Step 4；Secondary dry film：Third plank internal wiring, upper golden finger and lower golden finger are covered up using dry film,
The thickness of dry film is 2.0mil, exposes wire locations, obtains the 4th plank；
Step 5：Etching lead simultaneously moves back dry film：Using alkali etching liquid, it is segmented to being located at upper golden finger and lower golden finger
Lead of the place without gold-plated region carries out stinging erosion, and dry film of decorporating, and obtains the 5th plank；
Step 6：It is anti-welding：On the 5th plate surface, specific region coated with resin is protected, which is served as absolutely
Edge position or mark position coat anti-solder ink on plank, and the thickness of anti-solder ink is 20-40 μm, obtains the 6th plank；
Step 7：Choosingization thermosetting ink：By the regional occlusion of golden finger position not needing to gold, exposingization gold solder disk simultaneously selects
Change thermosetting ink, thermo-cured ink is the heat curing type bronze ink of resistance to change, obtains the 7th plank；
Step 8：Change gold：By pad in the 7th plank by the nickel gold of thickness required on immersion process, nickel thickness is：100-
300 μm, golden thickness is 1-3 μm, and the decorporate anti-solder ink and thermosetting ink obtain the 8th plank；
Step 9：Plank post-processing：Post-production processing is carried out to the 8th plank, obtains qualified plank.
Further, plate thickness at golden finger of being subject to during design carries out substrate and folds structure design.
Further, " step 1：Plank preparation " includes following sub-step：
1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is obtained
To initial plank needed for processing；
1.2：Internal layer circuit is made on initial plank and is examined；
1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank coated with copper foil after hot pressing
Carry out increasing layer；
1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；
1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；
1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film figure is turned
It moves on on initial plank, processes the figure of needs, obtain the first plank.
Further, " step 9, post-processing：Post-production processing is carried out to plank " including following sub-step：
9.1：Printed text word：Using word ink, client's designated identification and symbol in printing mark on the 8th plank；
9.2：Molding：Using CNC numerical control forming machine platforms, the 8th plank after printing mark is cut into the shape that client specifies
Shape obtains molding 8th plank；
9.3：Electrical detection：Using detection machine and jig, the electrical detection of short circuit and open circuit is done to molding 8th plank,
Ensure the 8th board quality.
9.4：Artificial detection：Artificial detection screens the 8th plank, selects the plank to meet the requirements of the customers, is closed
Panel material.
Advantage of the invention is that：Compared with prior art, a kind of grading connecting finger structure provided by the invention is ensureing
Connection between upper golden finger and lower golden finger, ensure use during two-stage golden finger between electric current and signal normal biography
While passing, the width of lead is become smaller, the dew copper face product for greatly reducing lead position improves the quality of product.And this
Invention additionally provides a kind of production method of the optic module PCB plate comprising the grading connecting finger, and this method combines appeal classification gold
The design feature of finger relative to the prior art, after anti-welding procedue is adjusted to etching lead and moves back dry film processing procedure, is effectively kept away
Strong basicity is exempted from and has moved back attack of the washing lotion to anti-solder ink, strengthened the binding force at anti-welding position, reduced finished product plate and prevent
The problem of weldering position comes off so that the quality for the pcb board made is further improved.
Description of the drawings
Fig. 1 is a kind of structure diagram of grading connecting finger of the present invention.
Fig. 2 is the production method flow chart of optic module PCB plate of the present invention comprising grading connecting finger.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
To achieve the above object, technical scheme is as follows：
Referring to shown in Fig. 1-2, the present invention provides a kind of grading connecting finger and the optic module PCB plate comprising the grading connecting finger
Production method, specifically include：
A kind of grading connecting finger, the grading connecting finger include upper golden finger 1, lower golden finger 2 and lead 3, the upper gold
Finger 1, lower golden finger 2 and lead 3 are rectangle, which is characterized in that the lead 3 is set to golden finger 1 and lower golden hand
Between referring to 2, the both sides up and down of the lead 3 are fixedly connected respectively with upper golden finger 1 and lower golden finger 2, the width of the lead 3
Less than golden finger finger beam.
Further, upper golden finger 1 and lower golden finger 2 is wide flushes setting, which is characterized in that the right side of the lead 3
Lateral edges are flushed with the right side edge of upper golden finger 1 and lower golden finger 2.
Further, the width of lead 3 is 6mil.In the prior art, lead 3 and golden finger are wide together, and will in the present invention
3 width of lead is reduced to 6mil, and after lead 3 etches, dew copper region greatly reduces, and while cost is reduced, is greatly promoted
The quality of product.
A kind of method for the optic module PCB plate for making the grading connecting finger comprising claim 1, includes the following steps：
S1：Plank preparation：Working process early period is carried out to initial plank, obtains the first plank；
S2：Select allelopathic light ink：Upper golden finger position, lower golden finger position and the first members inside are coated into photosensitive-ink
It is blocked, photosensitive-ink is photonasty resist ink, which is 20-30 μm, exposure energy control exposure
Ruler 8-10 lattice, obtain the second plank；
S3；Electroplating gold simultaneously moves back ink：Upper golden finger position and lower golden finger position on the second plank plate required thickness
The nickel gold of degree, during electronickelling gold, nickel thickness is 100-300 μm, and golden thickness is 1-3 μm, and photosensitive-ink of decorporating obtains third plank；
S4；Secondary dry film：Third plank internal wiring, upper golden finger and lower golden finger are covered up using dry film, done
The thickness of film is 2.0mil, exposes wire locations, obtains the 4th plank；
S5：Etching lead simultaneously moves back dry film：Using alkali etching liquid, to being located at nothing at upper golden finger and lower golden finger segmentation
The lead in gold-plated region carries out stinging erosion, and dry film of decorporating, and obtains the 5th plank；
S6：It is anti-welding：On the 5th plate surface, specific region coated with resin is protected, which is served as into insulation
Position or mark position coat anti-solder ink on plank, and the thickness of anti-solder ink is 20-40 μm, obtains the 6th plank；
S7：Choosingization thermosetting ink：By the regional occlusion of golden finger position not needing to gold, exposingization gold solder disk and choosing heat
Gu ink, thermo-cured ink is the heat curing type bronze ink of resistance to change, obtains the 7th plank；
S8：Change gold：By pad in the 7th plank by the nickel gold of thickness required on immersion process, nickel thickness is：100-300
μm, golden thickness is 1-3 μm, and the decorporate anti-solder ink and thermosetting ink obtain the 8th plank；
S9：Plank post-processing：Post-production processing is carried out to the 8th plank, obtains qualified plank.
Further, plate thickness at golden finger of being subject to during design carries out substrate and folds structure design.
Further, " S1：Plank preparation " includes following sub-step：
1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is obtained
To initial plank needed for processing；
1.2：Internal layer circuit is made on initial plank and is examined；
1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank coated with copper foil after hot pressing
Carry out increasing layer；
1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；
1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；
1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film figure is turned
It moves on on initial plank, processes the figure of needs, obtain the first plank.
Further, " S9, post-processing：Post-production processing is carried out to plank " including following sub-step：
9.1：Printed text word：Using word ink, client's designated identification and symbol in printing mark on the 8th plank；
9.2：Molding：Using CNC numerical control forming machine platforms, the 8th plank after printing mark is cut into the shape that client specifies
Shape obtains molding 8th plank；
9.3：Electrical detection：Using detection machine and jig, the electrical detection of short circuit and open circuit is done to molding 8th plank,
Ensure the 8th board quality.
9.4：Artificial detection：Artificial detection screens the 8th plank, selects the plank to meet the requirements of the customers, is closed
Panel material.
Advantage of the invention is that：Compared with prior art, a kind of grading connecting finger structure provided by the invention is ensureing
Connection between upper golden finger and lower golden finger, ensure use during two-stage golden finger between electric current and signal normal biography
While passing, the width of lead is become smaller, the dew copper face product for greatly reducing lead position improves the quality of product.And this
Invention additionally provides a kind of production method of the optic module PCB plate comprising the grading connecting finger, and this method combines appeal classification gold
The design feature of finger relative to the prior art, after anti-welding procedue is adjusted to etching lead and moves back dry film processing procedure, is effectively kept away
Strong basicity is exempted from and has moved back attack of the washing lotion to anti-solder ink, strengthened the binding force at anti-welding position, reduced finished product plate and prevent
The problem of weldering position comes off so that the quality for the pcb board made is further improved.
Claims (7)
1. a kind of grading connecting finger, the grading connecting finger includes upper golden finger, lower golden finger and lead, the upper golden finger,
Lower golden finger and lead are rectangle, which is characterized in that the lead is set between golden finger and lower golden finger, described
The both sides up and down of lead are fixedly connected respectively with upper golden finger and lower golden finger, and the width of the lead is less than golden finger finger beam.
2. a kind of grading connecting finger as described in claim 1, the upper golden finger and lower golden finger is wide flushes setting, spy
Sign is that the right side edge of the lead is flushed with the right side edge of upper golden finger and lower golden finger.
3. a kind of grading connecting finger as described in claim 1, which is characterized in that the width of the lead is 6mil.
A kind of 4. method for the optic module PCB plate for making the grading connecting finger comprising claim 1, which is characterized in that the light
The making of module pcb board grading connecting finger includes the following steps：
Step 1：Plank preparation：Working process early period is carried out to initial plank, obtains the first plank；
Step 2：Select allelopathic light ink：Upper golden finger position, lower golden finger position and the first members inside are coated into photosensitive-ink
It is blocked, photosensitive-ink is photonasty resist ink, which is 20-30 μm, exposure energy control exposure
Ruler 8-10 lattice, obtain the second plank；
Step 3；Electroplating gold simultaneously moves back ink：Upper golden finger position and lower golden finger position on the second plank plate required thickness
Nickel gold, during electronickelling gold, nickel thickness is 100-300 μm, and golden thickness is 1-3 μm, and photosensitive-ink of decorporating obtains third plank；
Step 4；Secondary dry film：Third plank internal wiring, upper golden finger and lower golden finger are covered up using dry film, dry film
Thickness for 2.0mil, expose wire locations, obtain the 4th plank；
Step 5：Etching lead simultaneously moves back dry film：Using alkali etching liquid, to being located at nothing at upper golden finger and lower golden finger segmentation
The lead in gold-plated region carries out stinging erosion, and dry film of decorporating, and obtains the 5th plank；
Step 6：It is anti-welding：On the 5th plate surface, specific region coated with resin is protected, which is served as into insulation division
Position or mark position coat anti-solder ink on plank, and the thickness of anti-solder ink is 20-40 μm, obtains the 6th plank；
Step 7：Choosingization thermosetting ink：By the regional occlusion of golden finger position not needing to gold, exposingization gold solder disk and choosing heat
Gu ink, thermo-cured ink is the heat curing type bronze ink of resistance to change, obtains the 7th plank；
Step 8：Change gold：By pad in the 7th plank by the nickel gold of thickness required on immersion process, nickel thickness is：100-300μ
M, golden thickness are 1-3 μm, and the decorporate anti-solder ink and thermosetting ink obtain the 8th plank；
Step 9：Plank post-processing：Post-production processing is carried out to the 8th plank, obtains qualified plank.
5. a kind of method of optic module PCB plate for making the grading connecting finger comprising claim 1 as claimed in claim 4,
It carries out substrate it is characterized in that, being subject to plate thickness at golden finger during design and folds structure design.
6. a kind of method of optic module PCB plate for making the grading connecting finger comprising claim 1 as described in claim 1,
It is characterized in that, " the step 1：Plank preparation " includes following sub-step：
1.1：Material issuing：Material is selected according to customer requirement and selected materials are cut according to the layout that works in factory, is added
Initial plank needed for work；
1.2：Internal layer circuit is made on initial plank and is examined；
1.3：Pressing：Reinforcing material is soaked with resin, at least one side is pressed together on initial plank after hot pressing and carries out coated with copper foil
Increasing layer；
1.4：Drilling：Required hole is drilled out on initial plank after increasing layer；
1.5：Plating：Corresponding hole copper knead dough copper is electroplated out according to customer demand on the initial plank to have drilled；
1.6：Photographic film figure is drawn out by computer control light drawing by design program, photographic film pattern transfer is arrived
On initial plank, the figure of needs is processed, obtains the first plank.
7. a kind of method of optic module PCB plate for making the grading connecting finger comprising claim 1 as claimed in claim 4,
It is characterized in that, " step 9, the post-processing：Post-production processing is carried out to plank " including following sub-step：
9.1：Printed text word：Using word ink, client's designated identification and symbol in printing mark on the 8th plank；
9.2：Molding：Using CNC numerical control forming machine platforms, the 8th plank after printing mark is cut into the shape that client specifies,
Obtain molding 8th plank；
9.3：Electrical detection：Using detection machine and jig, the electrical detection of short circuit and open circuit is done to molding 8th plank, it is ensured that
8th board quality.
9.4：Artificial detection：Artificial detection screens the 8th plank, selects the plank to meet the requirements of the customers, obtains on-gauge plate
Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484750.0A CN108174510A (en) | 2017-12-29 | 2017-12-29 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484750.0A CN108174510A (en) | 2017-12-29 | 2017-12-29 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108174510A true CN108174510A (en) | 2018-06-15 |
Family
ID=62516294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711484750.0A Pending CN108174510A (en) | 2017-12-29 | 2017-12-29 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108174510A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| CN110049625A (en) * | 2019-04-24 | 2019-07-23 | 珠海中京电子电路有限公司 | It is a kind of with gold-plated and immersion process PCB plate production method |
| CN110418511A (en) * | 2019-07-23 | 2019-11-05 | 领跃电子科技（珠海）有限公司 | Without lead gold finger galvanizing production method |
| CN110493971A (en) * | 2019-08-22 | 2019-11-22 | 大连崇达电路有限公司 | A kind of method for manufacturing circuit board of turmeric and the golden blending surface processing of electricity |
| CN111031708A (en) * | 2019-12-19 | 2020-04-17 | 黄石沪士电子有限公司 | Method for improving gold hanging of long and short segmented gold fingers |
| CN111225510A (en) * | 2020-02-27 | 2020-06-02 | 惠州中京电子科技有限公司 | Manufacturing method of 5G optical module golden finger plate |
| CN113115520A (en) * | 2021-03-02 | 2021-07-13 | 广州广合科技股份有限公司 | Manufacturing method of high-order HDI (high Density interconnection) grading golden finger printing plate |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
| CN114942496A (en) * | 2022-06-22 | 2022-08-26 | 广东骏亚电子科技股份有限公司 | Method for manufacturing high-speed optical module board |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
| CN102264194A (en) * | 2010-05-25 | 2011-11-30 | 柏承科技(昆山)股份有限公司 | Processing technique for sectional golden finger |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN203722922U (en) * | 2014-02-17 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | PCB golden finger lead wire |
| CN104918421A (en) * | 2015-05-25 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for PCB golden finger |
| CN105430892A (en) * | 2015-10-29 | 2016-03-23 | 北大方正集团有限公司 | Gold finger manufacturing method and gold finger |
| CN205124126U (en) * | 2015-11-26 | 2016-03-30 | 深圳市迅捷兴电路技术有限公司 | Segmentation golden finger circuit board processing structure |
| CN106852025A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of preparation method of golden finger |
-
2017
- 2017-12-29 CN CN201711484750.0A patent/CN108174510A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
| CN102264194A (en) * | 2010-05-25 | 2011-11-30 | 柏承科技(昆山)股份有限公司 | Processing technique for sectional golden finger |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN203722922U (en) * | 2014-02-17 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | PCB golden finger lead wire |
| CN104918421A (en) * | 2015-05-25 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for PCB golden finger |
| CN105430892A (en) * | 2015-10-29 | 2016-03-23 | 北大方正集团有限公司 | Gold finger manufacturing method and gold finger |
| CN205124126U (en) * | 2015-11-26 | 2016-03-30 | 深圳市迅捷兴电路技术有限公司 | Segmentation golden finger circuit board processing structure |
| CN106852025A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of preparation method of golden finger |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| CN110049625A (en) * | 2019-04-24 | 2019-07-23 | 珠海中京电子电路有限公司 | It is a kind of with gold-plated and immersion process PCB plate production method |
| CN110418511A (en) * | 2019-07-23 | 2019-11-05 | 领跃电子科技（珠海）有限公司 | Without lead gold finger galvanizing production method |
| CN110493971A (en) * | 2019-08-22 | 2019-11-22 | 大连崇达电路有限公司 | A kind of method for manufacturing circuit board of turmeric and the golden blending surface processing of electricity |
| CN111031708A (en) * | 2019-12-19 | 2020-04-17 | 黄石沪士电子有限公司 | Method for improving gold hanging of long and short segmented gold fingers |
| CN111225510A (en) * | 2020-02-27 | 2020-06-02 | 惠州中京电子科技有限公司 | Manufacturing method of 5G optical module golden finger plate |
| CN111225510B (en) * | 2020-02-27 | 2021-12-17 | 惠州中京电子科技有限公司 | Manufacturing method of 5G optical module golden finger plate |
| CN113115520A (en) * | 2021-03-02 | 2021-07-13 | 广州广合科技股份有限公司 | Manufacturing method of high-order HDI (high Density interconnection) grading golden finger printing plate |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
| CN114942496A (en) * | 2022-06-22 | 2022-08-26 | 广东骏亚电子科技股份有限公司 | Method for manufacturing high-speed optical module board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108174510A (en) | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger | |
| CN104918421B (en) | A kind of production method of PCB golden fingers | |
| CN108235590A (en) | A kind of golden grading connecting finger optic module PCB production method of plate internalization | |
| CN102143656B (en) | Manufacturing method of circuit board made of high-dielectric composite material | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| CN101616549B (en) | Method for manufacturing single-side thick copper stepped plate by electroplating addition method | |
| CN102638937A (en) | Preparation method of copper-base printed wiring board | |
| JP2006073984A (en) | Resistor built-in printed circuit board and its manufacturing method | |
| CN104768332A (en) | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board | |
| CN102159029A (en) | Method for making high-frequency aluminium-based circuit board | |
| CN105764269A (en) | Processing method of PCB, and PCB | |
| CN105430892B (en) | The production method and golden finger of golden finger | |
| CN112654160A (en) | PCB processing technology | |
| CN111417265A (en) | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB | |
| CN105188279B (en) | The production method for being segmented golden finger | |
| CN102905471A (en) | Method for manufacturing polytetrafluoroethylene high-frequency circuit board | |
| CN104582293A (en) | Manufacturing method of ceramic-based circuit board | |
| CN108207085A (en) | A kind of grading connecting finger optic module PCB plate surface treatment method | |
| CN103917052B (en) | A kind of method of use laser direct structuring technique processing circuit board | |
| CN102917546A (en) | Method for manufacturing polytetrafluoroethylene high-frequency circuit board | |
| CN105208777A (en) | Manufacturing method for circuit board with metallization back drilled hole | |
| CN110944454A (en) | Circuit board production process | |
| CN104981096A (en) | Processing method of suspended gold finger, and circuit board | |
| CN102159030A (en) | Making method of high-frequency ultrathin circuit board | |
| CN104968163A (en) | Golden finger processing method characterized by no lead wire residues |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180615 |