CN104981096A - Processing method of suspended gold finger, and circuit board - Google Patents
Processing method of suspended gold finger, and circuit board Download PDFInfo
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- CN104981096A CN104981096A CN201410147883.9A CN201410147883A CN104981096A CN 104981096 A CN104981096 A CN 104981096A CN 201410147883 A CN201410147883 A CN 201410147883A CN 104981096 A CN104981096 A CN 104981096A
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- golden finger
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Abstract
The invention discloses a processing method of a suspension-structure gold finger, and a circuit board, for solving the technical problems of quite high restrictions, very poor versatility and high proneness to waste of resources and increase of the cost existing in a conventional gold finger circuit board. The method comprises the following steps: pressing gold finger copper-clad boards with gold finger patterns at the internal layer of a multilayer board; processing a group of conduction holes outside a formation area of the multilayer board, wherein the conduction holes are connected with the gold finger patterns through large copper sheets on the gold finger copper-clad boards; exposing the gold finger patterns through controlled depth milling; gilding the gold finger patterns; and removing a non gold finger pattern portion apart from the formation area of the multilayer board through controlled depth milling to form the gold fingers and prepare a circuit board with the suspension-structure gold fingers.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of processing method and circuit board of unsettled golden finger.
Background technology
At present, printed circuit board (PCB) (PCB) plate of band golden finger, its structural design generally adopts the mode related to by golden finger within shaping area, wiring board top layer.And the golden finger of plug function is provided, should mate with the size of connecting-disconnecting interface, the thickness of golden finger circuit board should be consistent with the open height of connecting-disconnecting interface, and when the open height of connecting-disconnecting interface is fixed, therefore the circuit board thickness at golden finger place also just fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment will do whole conversion, very wastes resource and cost; Golden finger circuit board is fixed due to thickness, can not be applied to the connecting-disconnecting interface of different size, cause the versatility of golden finger circuit board very poor; When same equipment has multiple connecting-disconnecting interface, the golden finger circuit board of multiple corresponding thickness must be designed, the assembly space of product can be affected, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost.
Summary of the invention
The embodiment of the present invention provides a kind of processing method and circuit board of unsettled golden finger, and to solve, existing golden finger circuit board exists, and limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of unsettled golden finger, can comprise:
There is provided golden finger copper-clad plate, the golden finger area of described golden finger copper-clad plate one end has multiple golden finger figure and large copper sheet, described golden finger figure be divided into be connected with described large copper sheet appear district and the pressing district away from described large copper sheet;
Pressing multi-layer sheet, wherein, is pressed on described multiple-plate internal layer by described golden finger copper-clad plate, make described golden finger figure appear district and described large copper sheet is positioned at beyond multiple-plate shaping area;
Beyond described multiple-plate shaping area, process one group of via, described via is connected with the large copper sheet in described golden finger copper-clad plate;
Dark milling is controlled to described multiple-plate part corresponding to described golden finger figure, manifests described golden finger figure;
The multiple-plate surface metal-layer of part retained with described large copper sheet region is for electroplate lead wire, gold-plated to described golden finger figure;
Non-golden finger visuals control beyond described multiple-plate shaping area is milled deeply and removes, form the multiple golden fingers extended beyond described multiple-plate body, the obtained circuit board with unsettled golden finger.
Second aspect present invention provides a kind of circuit board with unsettled golden finger, can comprise:
Circuit board body and at least one unsettled golden finger, one end of described unsettled golden finger embeds in described circuit board body, and the other end extends from a sidewall of described circuit board body, and described golden finger is gold-plated structure for covering copper plate.
Therefore, the embodiment of the present invention adopts and the golden finger copper-clad plate with golden finger figure is pressed on multi-layer sheet internal layer, and control dark milling and manifest golden finger figure so that gold-plated, finally control the technical scheme that dark Milling Machining goes out unsettled golden finger, achieve following technique effect:
Golden finger Thickness Design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the processing method of a kind of hanging structure golden finger that the embodiment of the present invention provides;
Fig. 2 a to 2e is the schematic diagram in each stage adopting embodiment of the present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and circuit board of unsettled golden finger, and to solve, existing golden finger circuit board exists, and limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of unsettled golden finger, can comprise:
110, provide golden finger copper-clad plate, the golden finger area of described golden finger copper-clad plate one end has multiple golden finger figure and large copper sheet, described golden finger figure be divided into be connected with described large copper sheet appear district and the pressing district away from described large copper sheet.
In the embodiment of the present invention, the golden finger copper-clad plate provided as shown in Figure 2 a, this golden finger copper-clad plate 20 comprises middle dielectric and the metal level on two sides, its one end is designed with golden finger area, the large copper sheet 204 that the metal level of golden finger area is processed into multiple golden finger figure 203 and is connected with multiple golden finger figure, the metal level beyond golden finger area is then removed by etching.Golden finger figure 203 can be divided near large copper sheet 204 appear district 2031 and the pressing district 2302 away from large copper sheet 204.In a kind of execution mode, the manufacture method of this golden finger copper-clad plate 20 is as follows: according to the open height of equipment connecting-disconnecting interface, prepares the copper-clad plate of respective thickness; According to the golden finger figure designed, carry out Graphic transitions and etching, process the golden finger figure 203 needed and the large copper sheet 204 be connected with multiple golden finger figure in golden finger area.In preferred embodiment, golden finger copper-clad plate is double face copper, and the figure on two sides is identical symmetrical.
In the embodiment of the present invention, follow-up being revealed in outside multi-layer sheet body in district that appear of described golden finger figure 203 becomes golden finger, and pressing district is follow-up will be pressed together on multiple-plate internal layer, plays conducting and connection function; Described large copper sheet 204 just helps out in manufacturing process, owing to being connected with golden finger figure, follow-uply will become a part for golden finger gold plated lead, is used for conduction, assists golden finger figure gold-plated; Gold-plated complete after, controlled deeply milling is removed by whole large copper sheet 204 region.
120, pressing multi-layer sheet, wherein, is pressed on described multiple-plate internal layer by described golden finger copper-clad plate, make described golden finger figure appear district and described large copper sheet is positioned at beyond multiple-plate shaping area.
As shown in Figure 2 b, this step middle level laminates closes multi-layer sheet 30, and this multi-layer sheet 30 can comprise said golden finger copper-clad plate 20, and is layered in other line layer and the dielectric layer on golden finger copper-clad plate two sides, and is positioned at outermost outer layer metal layer 33.Wherein, make the major part of the golden finger area of described golden finger copper-clad plate 20, that is, golden finger figure 203 appear district and large copper sheet 204, be positioned at beyond multiple-plate shaping area, the pressing district of golden finger figure 203 is then positioned within shaping area.Further, in order to protect golden finger, at the double spreading band 301 of described golden finger figure 203, pad 302 can be set at the golden finger figure 203 of having taped.Said pad can be false central layer (namely being removed the copper-clad plate of copper foil layer by etching) or duroplasts or Teflon etc.Said adhesive tape 301 can be double faced adhesive tape.
The pad of golden finger figure one side adds the thickness >=0.1mm of adhesive tape.The fixing bonding of pad, a part is by adhesive tape bonding, and a part bonds by the prepreg (i.e. PP sheet) of dielectric layer.Dielectric layer can comprise multilayer PP sheet, can slot, in advance to hold pad 302 in the position corresponding to pad 302 of dielectric layer.
130, beyond described multiple-plate shaping area, process one group of via, described via is connected with the large copper sheet in described golden finger copper-clad plate.
Still as shown in Figure 2 b, this step is drill process.In this step, can process one group of via 34 beyond the shaping area of multi-layer sheet 30, described via 34 is connected with the large copper sheet 204 of described golden finger copper-clad plate 20.Be connected with large copper sheet 204 and golden finger figure 203 by outer layer metal layer 33 by via 34, make, the follow-up outer layer metal layer 33 that can utilize, as electroplate lead wire, carries out gold-plated to golden finger figure 203.
In this step, also can process one group of plated-through hole 35 within the shaping area of described multi-layer sheet 30, each plated-through hole 35 is connected with the pressing district of a golden finger figure 203.By plated-through hole 35, golden finger figure 203 can be connected with one or more layers line layer multiple-plate, realizing circuit plate function.
The step of processing via 34 and plated-through hole 35 comprises: first get out through hole, then metallize, that is, carry out heavy copper and plating.
140, dark milling is controlled to described multiple-plate part corresponding to described golden finger figure, manifest described golden finger figure.
As shown in Figure 2 c, in this step, the operation of first time milling profile is carried out to multi-layer sheet 30.The multi-layer sheet control appearing two sides, district of the golden finger figure 203 of described golden finger copper-clad plate 20 is milled deeply and removes, manifest described golden finger figure 203.In the outer layer operation of this milling, retain whole golden finger copper-clad plate 20, and the part multi-layer sheet 36 in large copper sheet 204 region, described via 34 to be positioned on described part multi-layer sheet 36.The operation of first time milling profile specifically can comprise: control dark milling to the region appearing district corresponding to described golden finger figure 203 of described multi-layer sheet 30, until manifest described pad 302, then remove described pad 302 and described adhesive tape 301, described golden finger figure 203 is revealed.
In embody rule, after the drilling step, before carrying out the operation of first time milling profile, first outer-layer circuit processing can be carried out to multi-layer sheet, comprise: adopt common process, make outer-layer circuit on the surface of described multi-layer sheet 30, and solder mask is set in described outer-layer circuit.
150, the multiple-plate surface metal-layer of part retained with described large copper sheet region is for electroplate lead wire, gold-plated to described golden finger figure.
In this step, gold-plated to the golden finger figure 203 revealed, what make golden finger figure 203 appears the golden finger that district becomes required.Time gold-plated, can adopt the plating resist films such as adhesive tape, by multiple-plate other region overlay protection, that exposes golden finger figure 203 appears district; Then, with the surface metal-layer 33 of part multi-layer sheet 36 for electroplate lead wire, electrogilding is carried out to the district that appears of golden finger figure 203.
160, the non-golden finger visuals control beyond described multiple-plate shaping area is milled deeply remove, form the multiple golden fingers extended beyond described multiple-plate body, the obtained circuit board with unsettled golden finger.
As shown in Figure 2 d, the operation of second time milling profile is carried out in this step.Non-golden finger visuals control beyond the shaping area of described multi-layer sheet 30 is milled deeply and removes, form the multiple golden fingers 37 extended beyond described multiple-plate body.Comprising: the control of large copper sheet 204 region is milled deeply and removes, and, the part between each golden finger figure 203 is removed; Described golden finger figure 203 is made to become the golden finger 37 of hanging structure, the obtained circuit board with unsettled golden finger 37.Control available adhesive tape in dark milling process to protect golden finger 37, control after dark milling terminates and adhesive tape is removed.
The final obtained vertical view with the circuit board of hanging structure golden finger 37 as shown in Figure 2 e.As can be seen from Fig. 2 d and 2e, multiple golden finger 37 is extended in a side of obtained circuit board.The width of multiple golden finger can be identical, also can be different.
Above, embodiments provide a kind of processing method of unsettled golden finger, the method adopts and the golden finger copper-clad plate with golden finger figure is pressed on multi-layer sheet internal layer, and control dark milling and manifest golden finger figure so that gold-plated, finally control the technical scheme that dark Milling Machining goes out unsettled golden finger, achieve following technique effect:
Carry out golden finger Thickness Design by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
Embodiment two,
Please refer to Fig. 2 d and 2e, the embodiment of the present invention provides a kind of circuit board with unsettled golden finger, and this circuit board can comprise:
Circuit board body 30 and at least one unsettled golden finger 37, one end of described unsettled golden finger 37 embeds in described circuit board body 30, and the other end extends from a sidewall of circuit board body 30, and described golden finger 37 is gold-plated structure for covering copper plate.
Described circuit board body can comprise multilayer line layer, and each golden finger 37 is connected with at least one deck in described multilayer line layer by plated-through hole 35.
The circuit board that the embodiment of the present invention provides can adopt embodiment one method to obtain.More detailed description please refer to embodiment one.
Above, embodiments provide a kind of circuit board with unsettled golden finger, adopt and the golden finger copper-clad plate with golden finger figure is pressed on multi-layer sheet internal layer, and control dark milling and manifest golden finger figure so that gold-plated, finally control the technical scheme that dark Milling Machining goes out unsettled golden finger, achieve following technique effect:
Carry out golden finger Thickness Design by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
Above the processing method of a kind of unsettled golden finger that the embodiment of the present invention provides and circuit board are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (7)
1. a processing method for unsettled golden finger, is characterized in that, comprising:
There is provided golden finger copper-clad plate, the golden finger area of described golden finger copper-clad plate one end has multiple golden finger figure and large copper sheet, described golden finger figure be divided into be connected with described large copper sheet appear district and the pressing district away from described large copper sheet;
Pressing multi-layer sheet, wherein, is pressed on described multiple-plate internal layer by described golden finger copper-clad plate, make described golden finger figure appear district and described large copper sheet is positioned at beyond multiple-plate shaping area;
Beyond described multiple-plate shaping area, process one group of via, described via is connected with the large copper sheet in described golden finger copper-clad plate;
Dark milling is controlled to described multiple-plate part corresponding to described golden finger figure, manifests described golden finger figure;
The multiple-plate surface metal-layer of part retained with described large copper sheet region is for electroplate lead wire, gold-plated to described golden finger figure;
Non-golden finger visuals control beyond described multiple-plate shaping area is milled deeply and removes, form the multiple golden fingers extended beyond described multiple-plate body, the obtained circuit board with unsettled golden finger.
2. method according to claim 1, is characterized in that:
In the multiple-plate step of described pressing, tape on the surface of described golden finger figure, and pad is set on the golden finger figure of having taped.
3. method according to claim 1, is characterized in that:
Process beyond described multiple-plate shaping area in the step of one group of via, also within described multiple-plate shaping area, process one group of plated-through hole, each plated-through hole is connected with a golden finger figure.
4. method according to claim 1, is characterized in that, before controlling dark milling, also comprises described multiple-plate part corresponding to described golden finger figure:
Make outer-layer circuit on described multiple-plate surface, and solder mask is set in described outer-layer circuit.
5. method according to claim 2, is characterized in that, controls dark milling comprise described multiple-plate part corresponding to described golden finger figure:
Dark milling is controlled to described multiple-plate region appearing district corresponding to described golden finger figure, until manifest described pad, then removes described pad and described adhesive tape, described golden finger figure is revealed.
6. there is a circuit board for unsettled golden finger, it is characterized in that, comprising:
Circuit board body and at least one unsettled golden finger, one end of described unsettled golden finger embeds in described circuit board body, and the other end extends from a sidewall of described circuit board body, and described golden finger is gold-plated structure for covering copper plate.
7. circuit board according to claim 6, is characterized in that:
Described circuit board body comprises multilayer line layer, and each unsettled golden finger is connected with at least one deck in described multilayer line layer by plated-through hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410147883.9A CN104981096B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging golden finger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410147883.9A CN104981096B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging golden finger |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793569A (en) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | A kind of manufacture craft of metallic terminals |
| CN106793578A (en) * | 2017-03-03 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of PCB preparation methods in electric thick gold hole |
| CN110881246A (en) * | 2019-12-04 | 2020-03-13 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN112312665A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US20030081387A1 (en) * | 2001-11-01 | 2003-05-01 | Jurgen Schulz | Module and connector having multiple contact rows |
| US20080168651A1 (en) * | 2007-01-12 | 2008-07-17 | Endicott Interconnect Technologies, Inc. | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit boards |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN104981112A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of gold finger, and gold finger circuit board |
| CN104981097A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of gold finger, and gold finger circuit board |
| CN104981114A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method for dangling gold fingers and circuit board |
-
2014
- 2014-04-14 CN CN201410147883.9A patent/CN104981096B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US20030081387A1 (en) * | 2001-11-01 | 2003-05-01 | Jurgen Schulz | Module and connector having multiple contact rows |
| US20080168651A1 (en) * | 2007-01-12 | 2008-07-17 | Endicott Interconnect Technologies, Inc. | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit boards |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN104981112A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of gold finger, and gold finger circuit board |
| CN104981097A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of gold finger, and gold finger circuit board |
| CN104981114A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method for dangling gold fingers and circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793569A (en) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | A kind of manufacture craft of metallic terminals |
| CN106793569B (en) * | 2016-11-28 | 2019-04-30 | 江门崇达电路技术有限公司 | A kind of manufacture craft of metallic terminals |
| CN106793578A (en) * | 2017-03-03 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of PCB preparation methods in electric thick gold hole |
| CN110881246A (en) * | 2019-12-04 | 2020-03-13 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN110881246B (en) * | 2019-12-04 | 2021-06-04 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN112312665A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112312665B (en) * | 2020-10-29 | 2021-11-09 | 惠州市特创电子科技股份有限公司 | Circuit board and manufacturing method thereof |
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|---|---|
| CN104981096B (en) | 2018-11-02 |
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