CN108156800B - Clamping system, material taking device thereof and inserting method of electronic element and circuit board - Google Patents
Clamping system, material taking device thereof and inserting method of electronic element and circuit board Download PDFInfo
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- CN108156800B CN108156800B CN201711489533.0A CN201711489533A CN108156800B CN 108156800 B CN108156800 B CN 108156800B CN 201711489533 A CN201711489533 A CN 201711489533A CN 108156800 B CN108156800 B CN 108156800B
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- 239000000463 material Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000001514 detection method Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a clamping system, a material taking device thereof and an inserting method of an electronic element and a circuit board. The extracting device is used for clamping pins connected with a body of an electronic element so as to insert the pins into connecting holes of a circuit board, and comprises: a collet assembly; the forward movement assembly is connected with the chuck assembly and used for adjusting the interval between the chuck assembly and the electronic element; the rotating assembly is connected with the chuck assembly and used for driving the chuck assembly to rotate; the clamping head assembly comprises two clamping heads with adjustable spacing, and pins of the electronic element are clamped by changing the spacing between the two clamping heads. Because the electronic components are all provided with the pin, the material taking device can clamp different types of electronic components without replacing the chuck assembly, and has universality.
Description
Technical Field
The invention relates to the technical field of component inserting machines, in particular to a clamping system, a material taking device thereof and a method for inserting electronic components and circuit boards.
Background
Circuit boards are carriers for various electronic components that are typically assembled to the circuit board using a card engine. Specifically, with the help of a positioning device (a camera positioning device such as a CCD) of the component inserter, a clamping device of the component inserter clamps the electronic component and conveys the electronic component to the upper part of the circuit board, and then the clamping device moves downwards to insert pins of the electronic component into connecting holes of the circuit board. The electronic component which has been inserted is left on the circuit board and enters the next station along with the circuit board to weld and strengthen the connection of the pins of the electronic component and the circuit board. The clamping jaw assembly of the traditional clamping device is of a fixed structure, one type of electronic component can only be clamped by one clamping jaw assembly, if one type of electronic component is replaced, the clamping jaw assembly of another type must be replaced, and the process of replacing the clamping jaw assembly is very tedious, time-consuming and labor-consuming.
Disclosure of Invention
Based on this, it is necessary to provide a clamping system with versatility, a material taking device thereof, and an inserting method of electronic components and circuit boards.
A pick-up device for holding pins connected to a body of an electronic component to insert the pins into connection holes of a circuit board, comprising:
a collet assembly;
the forward movement assembly is connected with the chuck assembly and used for adjusting the interval between the chuck assembly and the electronic element; and
the rotating assembly is connected with the chuck assembly and used for driving the chuck assembly to rotate;
the clamping head assembly comprises two clamping heads with adjustable spacing, and pins of the electronic element are clamped by changing the spacing between the two clamping heads.
When the material taking device works, the electronic element is firstly positioned below the chuck assembly, the pins of the electronic element are back to the circuit board, then the spacing between the chuck assembly and the electronic element is adjusted through the forward movement assembly, one pin of the electronic element is positioned between two chucks of the chuck assembly, the spacing between the two chucks of the chuck assembly is adjusted, the chuck assembly clamps the pin, the chuck assembly is controlled to rotate by a certain angle through the rotation assembly, and all pins of the electronic element (usually each electronic element comprises two pins) are inserted into the connecting holes of the circuit board. Because the electronic components are all provided with the pin, the material taking device can clamp different types of electronic components without replacing the chuck assembly, and has universality.
In one embodiment, the rotating assembly comprises a rotating table fixing plate and a rotating cylinder arranged on the rotating table fixing plate, the advancing motion assembly comprises a front air inlet cylinder connecting plate connected with the rotating cylinder and a front air inlet cylinder arranged on the front air inlet cylinder connecting plate, the chuck assembly further comprises a chuck fixing piece, a reset spring and a clamping cylinder, the chuck fixing piece is connected with the front air inlet cylinder, one end of the chuck is arranged on the chuck fixing piece in a penetrating mode, the other end of the chuck is used for clamping the pin, the reset spring is arranged in the chuck fixing piece and connected with two chucks, and the clamping cylinder is arranged on the chuck fixing piece and connected with one chuck to drive the chuck to be close to the other chuck.
In one embodiment, the rotary table fixing plate comprises a first fixing plate and a second fixing plate which are connected and are arranged at an obtuse angle, the rotary cylinder is arranged on the outer side face of the second fixing plate, the front air inlet cylinder connecting plate comprises a first connecting plate, a second connecting plate which is connected with the first connecting plate and is arranged at an obtuse angle, and a third connecting plate which is vertically connected with the second connecting plate, the first connecting plate is connected with the rotary cylinder and is arranged parallel to the second fixing plate, the front air inlet cylinder is arranged on the third connecting plate, and the chuck fixing piece and the front air inlet cylinder are arranged at an obtuse angle;
when the clamping head is used for clamping the electronic element, the third connecting plate is arranged in parallel with the first fixing plate, and the direction of a connecting line between the clamping head assembly and the electronic element is parallel to the third connecting plate;
when the clamping head inserts the electronic element into the circuit board, the third connecting plate is perpendicular to the first fixing plate, and the direction of connecting lines between the clamping head assembly and the electronic element is perpendicular to the third connecting plate.
In one embodiment, the collet includes a first section and a second section connected to each other and disposed at an obtuse angle, the second section being connected to the forward motion assembly; wherein the first section faces the electronic component when the clamping head is ready to clamp the electronic component; the second section faces away from the circuit board when the collet inserts the electronic component into the circuit board.
In one embodiment, the material taking device further comprises a change-over plate which is connected with the rotating assembly and can be connected with the lower end of the connecting cylinder in a matching way.
A clamping system, comprising:
the material taking device; and
the pressing device comprises a pressing component which can move towards or back to the circuit board;
after the pins of the electronic component are inserted into the connecting holes of the circuit board, the pressing component is pressed down on the electronic component so as to press the electronic component.
In one embodiment, the clamping system further comprises a mounting plate and a material grabbing device, the material taking device and the material pressing device are arranged on the same side of the mounting plate, the material grabbing device comprises a first pressure sensor arranged on the mounting plate and a clamping jaw assembly connected with the first pressure sensor, the clamping jaw assembly comprises two clamping jaws with adjustable intervals, the electronic element body is clamped by changing the interval between the two clamping jaws, and the first pressure sensor is used for detecting the clamping pressure of the two clamping jaws.
In one embodiment, the press device further comprises a detection assembly for detecting the lowering height of the pressing assembly so as to detect misplaced insertion.
In one embodiment, the clamping system further comprises a mounting plate, and the material taking device and the material pressing device are arranged on the same side of the mounting plate;
the pressing component comprises a pushing-down cylinder arranged on the mounting plate, an adjusting rod connected with one end of the pushing-down cylinder far away from the mounting plate, and a pressing head connected with one end of the adjusting rod far away from the pushing-down cylinder;
the detection assembly comprises a light sensing sensor arranged on the mounting plate, a second pressure sensor used for detecting the pressure of the pressure head, a limiting plate penetrating through the adjusting rod and a limiting column arranged on the limiting plate, and the limiting column extends towards the direction of the mounting plate;
when the pressure of the pressure head reaches a preset value, the light sensing sensor cannot sense the limit post, then the electronic element is accurately inserted into the circuit board, otherwise, when the pressure of the pressure head reaches the preset value, the light sensing sensor can sense the limit post, then the electronic element is not accurately inserted into the circuit board.
An inserting method of an electronic element and a circuit board comprises the following steps:
providing an electronic element comprising a body, pins arranged on the body and a circuit board with connecting holes, placing the electronic element below the chuck assembly, and enabling the pins of the electronic element to face away from the circuit board;
adjusting the spacing between the collet assembly and the electronic component such that one pin of the electronic component is located between two collets of the collet assembly;
adjusting the interval between two chucks of the chuck assembly so that the chuck assembly clamps pins positioned between the two chucks of the chuck assembly; and
the chuck assembly is controlled to rotate by a certain angle, so that all pins of the electronic component are inserted into the connecting holes of the circuit board.
In one embodiment, in the step of inserting all pins of the electronic component into the connection holes of the circuit board: the pins of the electronic component which are not clamped by the clamping head assembly are obliquely inserted into the connecting holes of the circuit board, and finally the pins which are clamped by the clamping head assembly are inserted into the connecting holes of the circuit board.
Drawings
FIG. 1 is a schematic structural view of a clamping system according to an embodiment;
FIG. 2 is a schematic view of the take-off device of FIG. 1;
FIG. 3 is a schematic view of the material grabbing device in FIG. 1;
FIG. 4 is a schematic structural view of the pressing device in FIG. 1;
FIG. 5 is a schematic view of the clamping system in an initial state;
fig. 6 is a schematic diagram of a state of the clamping system corresponding to step S920;
fig. 7 is a schematic diagram of the state of the clamping system corresponding to step S940;
FIG. 8 is a schematic view of the clamping system corresponding to step S950;
FIG. 9 is a schematic view of the clamping system of FIG. 8 with the front intake cylinder retracted into place;
FIG. 10 is a schematic view of the clamping system of FIG. 9 with the push down cylinder retracted to the home position;
fig. 11 is a schematic view of a state of the take-out device of the replacement clamping system.
Detailed Description
The clamping system, the material taking device thereof and the method for inserting the electronic component and the circuit board are further described below with reference to the accompanying drawings and the specific embodiments.
As shown in fig. 1, a clamping system 10 according to an embodiment includes a material extracting device 12, a material grabbing device 14, a material pressing device 16, and a mounting plate 18. The material taking device 12 and the material grabbing device 14 are both used for grabbing electronic components, pins of the grabbed electronic components are inserted into connecting holes of the circuit board, and the difference is that positions of the material taking device 12 and the material grabbing device 14 for grabbing the electronic components are different, the material taking device 12 grabs the pins of the electronic components, and the material grabbing device 14 grabs a body of the electronic components. As such, either the pick up device 12 or the pick up device 14 may be selected for gripping electronic components according to actual needs, for example, the pick up device 12 may be employed to grip delicate types of electronic components.
After the pick-up device 12 or the grabbing device 14 inserts the pins of the grabbed electronic component into the connection holes of the circuit board, the pressing device 16 drops down on the electronic component to press the electronic component, that is, the electronic component is tightly attached to the circuit board. In this embodiment, the material taking device 12, the material grabbing device 14 and the material pressing device 16 are all disposed on the mounting plate 18, that is, the material taking device 12, the material grabbing device 14 and the material pressing device 16 are integrated together. It will be appreciated that in other embodiments, the mounting plate 18 may be omitted, and the reclaimer device 12, the grabber device 14, and the swager device 16 may be independent.
Further, in the present embodiment, the attachment cylinder 19 is provided on the attachment plate 18, and the upper end 19a of the attachment cylinder 19 is connected to the attachment plate 18. Meanwhile, the material taking device 12 and the material grabbing device 14 are respectively provided with a material exchanging plate which can be in matched connection with the lower end 19b of the connecting air cylinder 19, wherein the material exchanging plate arranged on the material taking device 12 is a first material exchanging plate 100, and the material exchanging plate arranged on the material grabbing device 14 is a second material exchanging plate 14a. The material taking device 12 and the material grabbing device 14 are very disassembled and assembled, and two material taking devices 12 (namely, a second material taking device 12 is adopted to replace the material grabbing device 14) can be arranged on the mounting plate 18 according to actual needs, and two material grabbing devices 14 (namely, a second material grabbing device 14 is adopted to replace the material taking device 12) can also be arranged on the mounting plate 18.
As shown in fig. 2, the reclaimer device 12 includes a first exchange plate 100, a rotating assembly 200, an advancing motion assembly 300, and a collet assembly 400, which are connected in sequence.
The first exchanging plate 100 can be connected with the lower end 19b of the connecting cylinder 19 in a matching manner, and the material taking device 12 is arranged on the mounting plate 18 through the first exchanging plate 100 and the connecting cylinder 19. It will be appreciated that in other embodiments, the first adapter plate 100 and the connecting cylinder 19 may be omitted and the rotating assembly 200 may be directly disposed on the mounting plate 18.
The rotation assembly 200 is coupled to the collet assembly 400 for driving the collet assembly 200 in rotation. In this embodiment, the rotation assembly 200 can drive the chuck assembly 400 to rotate within 180 °, that is, the chuck assembly 400 can freely rotate under the driving of the rotation assembly 200. It will be appreciated that in other embodiments, the rotation angle at which the rotation assembly 200 drives the chuck assembly 400 to rotate may be set according to actual needs, for example, the rotation angle at which the rotation assembly 200 drives the chuck assembly 400 to rotate may be 360 °.
The forward motion assembly 300 is coupled to the collet assembly 400 for adjusting the spacing between the collet assembly 400 and the electronic component. When the collet assembly 400 is positioned over an electronic component, the forward motion assembly 300 drives the collet assembly 400 down adjacent the electronic component.
The collet assembly 400 includes two collets 420 with adjustable spacing to clamp the pins of the electronic component by varying the spacing between the two collets 420.
When the material taking device 12 works, the electronic component is firstly located below the chuck assembly 400, the pins of the electronic component face away from the circuit board, then the spacing between the chuck assembly 400 and the electronic component is adjusted by the forward movement assembly 300, one pin of the electronic component is located between two chucks 420 of the chuck assembly 400, the spacing between the two chucks 420 of the chuck assembly 400 is adjusted, the chuck assembly 400 clamps the pin, and the chuck assembly 400 is controlled to rotate by a certain angle by the rotation assembly 200, so that all pins of the electronic component (usually each electronic component comprises two pins) are inserted into the connecting holes of the circuit board. Because the electronic components are provided with pins, the pick-up device 12 can clamp different types of electronic components without replacing the chuck assembly 400, and has universality.
Typically, the collet assembly 400 is controlled to rotate 180 ° by the rotation assembly 200, such that all pins of the electronic components (typically each electronic component includes two pins) face the circuit board and are inserted into the connection holes of the circuit board. Because of processing errors, the pins of the electronic element are easy to deviate, so that the connection holes of the pins and the circuit board are deviated in alignment, and poor insertion is easy to occur. Further, in the present embodiment, the rotation angle of the collet assembly 400 is controlled to be slightly greater or slightly less than 180 ° by the rotation assembly 200, so that the pins of the electronic component, which are not clamped by the collet assembly 400, are inserted into the connection holes of the circuit board at an inclination (in the present embodiment, an inclination with respect to the vertical direction) and finally the pins, which are clamped by the collet assembly 400, are inserted into the connection holes of the circuit board. Therefore, the deviation of the pins caused by machining errors can be corrected, and the success rate of the insertion is ensured.
In the present embodiment, the rotation assembly 200, the forward movement assembly 300, and the collet assembly 400 are sequentially connected. It is understood that in other embodiments, the rotation assembly 200 and the forward motion assembly 300 may be coupled to the collet assembly 400 independently.
Specifically, in the present embodiment, the rotary assembly 200 includes a rotary table fixing plate 210 and a rotary cylinder 220. The rotary table fixing plate 210 is connected to one end of the first exchange plate 100 away from the connection cylinder 19, and the rotary cylinder 220 is provided on the rotary table fixing plate 210. The forward moving assembly 300 includes a front intake cylinder connecting plate 310 connected to the rotary cylinder 220 and a front intake cylinder 320 provided on the front intake cylinder connecting plate 310. The collet assembly 400 further includes a collet fixture 410, a return spring (not shown) and a clamping cylinder (not shown), wherein the collet fixture 410 is connected with the front air inlet cylinder 320, one end of the collet 420 is arranged on the collet fixture 410 in a penetrating manner, the other end is used for clamping pins, and the return spring is arranged in the collet fixture 410 and is connected with the two collets 420. A clamping cylinder is provided on the collet fixture 410 and is connected to one of the collets 420 to drive the collet 420 closer to the other collet 420, thereby changing the spacing between the two collets 420. When the clamping cylinder is energized, the compressed return spring returns, thereby restoring the two grippers 420 to the original state.
Further, in the present embodiment, the rotary table fixing plate 210 includes a first fixing plate 212 and a second fixing plate 214 which are connected and disposed at an obtuse angle, the first fixing plate 212 is disposed perpendicular to the mounting plate 18, the outer side surface of the first fixing plate 212 is connected to the outer side surface of the first exchange plate 100, and the rotary cylinder 220 is disposed on the outer side surface of the second fixing plate 214. The front intake cylinder connecting plate 310 includes a first connecting plate 312, a second connecting plate 314 connected to the first connecting plate 312 and disposed at an obtuse angle, and a third connecting plate 316 connected to the second connecting plate 314 perpendicularly, the first connecting plate 312 is connected to the rotary cylinder 220 and disposed parallel to the second fixing plate 214, and the front intake cylinder 320 is disposed on the third connecting plate 316. The collet fixture 410 is disposed at an obtuse angle to the front intake cylinder 320. When the chuck 420 is ready to clamp the electronic component, the third connecting plate 316 is disposed parallel to the first fixing plate 212, and the direction of the connection line between the third connecting plate 316 and the chuck assembly 400 and the electronic component is parallel; when the collet 420 inserts the electronic component into the circuit board, the third connecting plate 316 is disposed perpendicular to the first fixing plate 212, and the third connecting plate 316 is perpendicular to the direction of the connection line between the collet assembly 400 and the electronic component.
Further, in the present embodiment, the collet 420 includes a first section 422 and a second section 424 connected and disposed at an obtuse angle, the second section 424 being connected to the collet fixture 410. Wherein, when the chuck 420 is ready to chuck the electronic component, the first section 422 faces the electronic component; the first section 422 faces away from the circuit board when the collet 420 inserts the electronic component into the circuit board.
As shown in fig. 3, the gripping device 14 is disposed on the mounting plate 18 on the same side as the take out device 12. The material handling apparatus 14 includes a jaw assembly 500, the jaw assembly 500 including two jaws 510 with adjustable spacing, and a body for clamping an electronic component by varying the spacing between the two jaws 510. When the two clamping jaws 510 are in the middle of the clamped electronic component, the spacing between the two clamping jaws 510 is adjusted to clamp the body of the electronic component. And then the circuit board is moved to the lower part of the electronic component, after the pin and the connecting hole are aligned, the clamping jaw 510 releases the electronic component, and the pin is stably inserted into the connecting hole.
Further, in this embodiment, the jaw assembly 500 further includes a clamping cylinder 520 for varying the spacing between the two jaws 510, the end of the clamping cylinder 520 remote from the jaws 510 being disposed on the mounting plate 18. Specifically, in the present embodiment, the jaw 510 is a claw-holding jaw.
Further, in the present embodiment, the material grabbing device 14 further includes a first pressure sensor 600 disposed on the mounting plate 18, where the first pressure sensor 600 is located away from the clamping cylinder 520 connected to one end of the mounting plate 18, and the first pressure sensor 600 is used to detect the clamping pressure of the two clamping jaws 510, so as to avoid the body of the electronic component from being crushed.
As shown in fig. 4, the pressing device 16 includes a pressing assembly 700 that can move toward or away from the circuit board, and after the pins of the electronic component are inserted into the connection holes of the circuit board, the pressing assembly 700 presses down on the electronic component to press the electronic component. Therefore, the electronic element can be effectively prevented from falling off the circuit board.
In the process of inserting the electronic component into the circuit board, there may be misplaced insertion, for example, a certain electronic component should be inserted into an edge area of the circuit board, and the electronic component is actually inserted into a central area of the circuit board. The traditional clamping system cannot judge whether the inserting is misplaced or not. To solve the above problem, in the present embodiment, the pressing device 16 further includes a detection assembly 800 for detecting the lowering height of the pressing assembly 700 to check for misplaced insertion. So that the clamping system 10 can automatically judge whether the inserting is misplaced or not.
Specifically, in the present embodiment, the pressing assembly 700 includes a pushing-down cylinder 710 provided on the mounting plate 18, an adjusting lever 720 connected to an end of the pushing-down cylinder 710 remote from the mounting plate 18, and a pressing head 730 connected to an end of the adjusting lever 720 remote from the pushing-down cylinder 710. The detection assembly 800 includes a light sensing sensor 810 disposed on the mounting plate 18, a second pressure sensor 820 for detecting the pressure of the pressure head 730, a limiting plate 830 disposed on the adjusting rod 720, and a limiting post 840 disposed on the limiting plate 830, where the limiting post 840 extends toward the direction of the mounting plate 18. When the pressure of the pressure head 730 reaches a preset value, the light sensing sensor 810 cannot sense the limit post 840, and the electronic component is accurately inserted into the circuit board, otherwise, when the pressure of the pressure head 730 reaches a preset value, the light sensing sensor 810 can sense the limit post 840, and the electronic component is not accurately inserted into the circuit board.
When the electronic component is accurately inserted into the circuit board, the pressing head 730 can be pressed on the electronic component after descending by a preset height and reaches a preset pressure, at the moment, the photosensitive sensor 810 and the limit post 840 are misplaced, the limit post 840 is positioned on the photosensitive sensor 810, no opposite part exists, and the photosensitive sensor 810 cannot sense the limit post 840; when the electronic component is not accurately inserted into the circuit board, the pressure head 730 is pressed against the electronic component after being lowered by a certain distance, and reaches a preset pressure, the distance is smaller than the preset distance, and at this time, the photosensitive sensor 810 is opposite to a part of the limit posts 840, and the photosensitive sensor 810 can sense the limit posts 840.
Further, in the present embodiment, the detection assembly 800 further includes a connection block 850. The mounting plate 18, the second pressure sensor 820, the connection block 850 and the push-down cylinder 710 are sequentially connected, and the limit post 840 is movably arranged on the connection block 850 in a penetrating manner.
In this embodiment, there is also provided a method for inserting an electronic component and a circuit board, including the steps of:
step S910, an electronic component including a body and pins disposed on the body and a circuit board with connection holes are provided, and the electronic component is placed under the chuck assembly such that the pins of the electronic component face away from the circuit board.
Specifically, as shown in fig. 5, fig. 5 shows the clamping system 10 in an initial state, where the third connecting plate 316 is disposed parallel to the first fixing plate 212, and the third connecting plate 316 is disposed perpendicular to the mounting plate 18, and the first section 422 of the collet 420 faces the electronic component.
In step S920, the spacing between the collet assembly and the electronic component is adjusted such that one pin of the electronic component is located between two collets of the collet assembly.
Specifically, as shown in fig. 6, the front air intake cylinder 320 controls the movement of the collet assembly 400 toward the electronic component, and the collet assembly 400 is lowered a distance such that one pin of the electronic component is positioned between two collets 420 of the collet assembly 400.
In step S930, the spacing between the two collets of the collet assembly is adjusted such that the collet assembly grips the pin located between the two collets of the collet assembly.
Specifically, the clamping cylinder drives the collet 420 connected thereto closer to the other collet 420, thereby clamping the pin between the two collets 420 of the collet assembly 400.
In step S940, the collet assembly is controlled to rotate a certain angle, so that all pins of the electronic component are inserted into the connection holes of the circuit board.
Specifically, as shown in fig. 7, the rotation assembly 200 controls the collet assembly 400 to rotate 180 ° when the third connecting plate 316 is disposed perpendicular to the first fixed plate 212 and the third connecting plate 316 is disposed parallel to the mounting plate 18 with the first section 422 of the collet 420 facing the circuit board.
Specifically, in the present embodiment, the rotation angle of the collet assembly 400 is slightly greater than or slightly less than 180 °, so that the pins of the electronic component that are not clamped by the collet assembly 400 are inserted into the connection holes of the circuit board in an inclined manner, and finally the pins that are clamped by the collet assembly 400 are inserted into the connection holes of the circuit board.
In step S950, the pressing assembly presses down on the electronic component to press the electronic component.
Specifically, as shown in fig. 8, the clamping cylinder is first energized and then the spring in the collet fixture 410 returns to release the collet 420. Then, the push-down cylinder 710 drives the ram 730, the limiting plate 830 and the limiting post 840 to descend synchronously. The pressure at which the ram 730 compresses the electronic components is measured by the second pressure sensor 820.
Step S960, reset to the initial position.
Specifically, as shown in fig. 9, the front intake cylinder 320 is retracted to the original position so that the collet 420 is withdrawn a certain distance, avoiding collision when the rotation is reset. During this time, the ram 730 is held stationary.
As shown in fig. 10, after the front air intake cylinder 320 is retracted to the original position, the push-down cylinder 710 is retracted to the original position, so that the ram 730, the limiting plate 830 and the limiting post 840 are returned to the original position, that is, the pressing device 16 is returned to the original position.
Finally, rotation assembly 200 controls chuck assembly 400 to rotate 180 ° such that reclaimer device 12 returns to the initial position shown in fig. 5.
In addition, as shown in fig. 11, the reclaimer device 12 may be replaced as needed.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A pick-up device for holding pins connected to a body of an electronic component to insert the pins into connection holes of a circuit board, comprising:
a collet assembly;
the forward movement assembly is connected with the chuck assembly and used for adjusting the interval between the chuck assembly and the electronic element; the forward motion assembly comprises a front air inlet cylinder connecting plate and a front air inlet cylinder arranged on the front air inlet cylinder connecting plate, and the front air inlet cylinder is connected with the chuck assembly; and
the rotating assembly comprises a rotating table fixing plate and a rotating cylinder arranged on the rotating table fixing plate, the rotating cylinder is obliquely arranged relative to the vertical direction and is connected with the front air inlet cylinder connecting plate, the rotating assembly is connected with the chuck assembly through the advancing motion assembly, the chuck assembly is obliquely arranged relative to the vertical direction, and the rotating assembly is used for driving the advancing motion assembly and the chuck assembly to rotate around the central axis of the rotating cylinder so as to enable the front air inlet cylinder to be parallel to the vertical direction or perpendicular to the vertical direction and change the inclination angle of the chuck assembly;
the clamping head assembly comprises two clamping heads with adjustable intervals, and pins of the electronic element are clamped by changing the intervals between the two clamping heads;
when the clamping head is used for clamping the electronic component, the front air inlet cylinder is parallel to the vertical direction;
when the clamping head inserts the electronic component into the circuit board, the front air inlet cylinder is perpendicular to the vertical direction.
2. The take out apparatus of claim 1, wherein said cartridge assembly further comprises a cartridge mount, a return spring and a clamping cylinder, said cartridge mount being connected to said front air intake cylinder, one end of said cartridge being disposed through said cartridge mount, the other end being adapted to hold said pin, said return spring being disposed within said cartridge mount and connecting two of said cartridges, said clamping cylinder being disposed on said cartridge mount and connected to one of said cartridges to drive said cartridge adjacent the other cartridge.
3. The material taking device according to claim 2, wherein the rotary table fixing plate comprises a first fixing plate and a second fixing plate which are connected and are arranged at an obtuse angle, the rotary cylinder is arranged on the outer side surface of the second fixing plate, the front air inlet cylinder connecting plate comprises a first connecting plate, a second connecting plate which is connected with the first connecting plate and is arranged at an obtuse angle, and a third connecting plate which is vertically connected with the second connecting plate, the first connecting plate is connected with the rotary cylinder and is arranged in parallel with the second fixing plate, the front air inlet cylinder is arranged on the third connecting plate, and the chuck fixing piece is arranged at an obtuse angle with the front air inlet cylinder;
when the clamping head is used for clamping the electronic element, the third connecting plate is arranged in parallel with the first fixing plate, and the direction of a connecting line between the clamping head assembly and the electronic element is parallel to the third connecting plate;
when the clamping head inserts the electronic element into the circuit board, the third connecting plate is perpendicular to the first fixing plate, and the direction of connecting lines between the clamping head assembly and the electronic element is perpendicular to the third connecting plate.
4. The take-off device of claim 1, further comprising at least one of the following features:
the chuck comprises a first section and a second section which are connected and are arranged at an obtuse angle, and the second section is connected with the forward motion assembly; wherein the first section faces the electronic component when the clamping head is ready to clamp the electronic component; when the clamping head inserts the electronic component into the circuit board, the second section faces away from the circuit board; and
the material taking device further comprises a change-over plate which is connected with the rotating assembly and can be connected with the lower end of the connecting cylinder in a matching way.
5. A clamping system, comprising:
the reclaimer device of any of claims 1-4; and
the pressing device comprises a pressing component which can move towards or back to the circuit board;
after the pins of the electronic component are inserted into the connecting holes of the circuit board, the pressing component is pressed down on the electronic component so as to press the electronic component.
6. The clamping system of claim 5, further comprising a mounting plate and a material grabbing device, wherein the material grabbing device, the material taking device and the material pressing device are arranged on the same side of the mounting plate, the material grabbing device comprises a first pressure sensor arranged on the mounting plate and a clamping jaw assembly connected with the first pressure sensor, the clamping jaw assembly comprises two clamping jaws with adjustable intervals, the body of the electronic component is clamped by changing the interval between the two clamping jaws, and the first pressure sensor is used for detecting clamping pressures of the two clamping jaws.
7. The clamping system of claim 5, wherein the swage device further comprises a detection assembly for detecting a lowering level of the hold down assembly to verify a misplaced cartridge.
8. The clamping system of claim 7, further comprising a mounting plate, wherein the material extracting device and the material pressing device are disposed on a same side of the mounting plate;
the pressing component comprises a pushing-down cylinder arranged on the mounting plate, an adjusting rod connected with one end of the pushing-down cylinder far away from the mounting plate, and a pressing head connected with one end of the adjusting rod far away from the pushing-down cylinder;
the detection assembly comprises a light sensing sensor arranged on the mounting plate, a second pressure sensor used for detecting the pressure of the pressure head, a limiting plate penetrating through the adjusting rod and a limiting column arranged on the limiting plate, and the limiting column extends towards the direction of the mounting plate;
when the pressure of the pressure head reaches a preset value, the light sensing sensor cannot sense the limit post, then the electronic element is accurately inserted into the circuit board, otherwise, when the pressure of the pressure head reaches the preset value, the light sensing sensor can sense the limit post, then the electronic element is not accurately inserted into the circuit board.
9. A method of plugging an electronic component with a circuit board, based on the pick-up device of any one of claims 1-4, comprising the steps of:
providing an electronic element comprising a body, pins arranged on the body and a circuit board with connecting holes, placing the electronic element below the chuck assembly, and enabling the pins of the electronic element to face away from the circuit board;
adjusting the spacing between the collet assembly and the electronic component such that one pin of the electronic component is located between two collets of the collet assembly;
adjusting the interval between two chucks of the chuck assembly so that the chuck assembly clamps pins positioned between the two chucks of the chuck assembly; and
the chuck assembly is controlled to rotate by a certain angle, so that all pins of the electronic component are inserted into the connecting holes of the circuit board.
10. The method of plugging an electronic component into a circuit board according to claim 9, wherein in the step of causing all pins of the electronic component to be plugged into connection holes of the circuit board: the pins of the electronic component which are not clamped by the clamping head assembly are obliquely inserted into the connecting holes of the circuit board, and finally the pins which are clamped by the clamping head assembly are inserted into the connecting holes of the circuit board.
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| CN109247008A (en) * | 2018-10-30 | 2019-01-18 | 重庆隆成电子设备有限公司 | A kind of soft or hard make-up machine and pasting method |
| CN110193842A (en) * | 2019-06-12 | 2019-09-03 | 无锡卓闻智能科技有限公司 | Intelligent clamping jaw |
| CN110342245B (en) * | 2019-07-05 | 2024-05-28 | 江门市蓬江区科技中心(江门市蓬江区生产力促进中心) | Element clamping mechanism for component inserter |
| CN110621148B (en) * | 2019-08-16 | 2020-11-24 | 南京乾兑电子科技有限公司 | Electronic component welding leg device of computer integrated system and plugging process thereof |
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