CN108149282A - A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming - Google Patents
A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming Download PDFInfo
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- CN108149282A CN108149282A CN201711387048.2A CN201711387048A CN108149282A CN 108149282 A CN108149282 A CN 108149282A CN 201711387048 A CN201711387048 A CN 201711387048A CN 108149282 A CN108149282 A CN 108149282A
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- electroforming
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- mould
- substrate surface
- nozzle
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of substrate surface metallization molding micro-mould manufacturing methods of jet flow electroforming, include the following steps：Step 1 carries out metalized to substrate surface using modes such as magnetron sputtering or metal sprayings；Step 2, electroforming nozzle connect the anode of the pulse power, and metal layer connects pulse power cathode, and pulse power output is the impulse waveform with negative sense potential, and electroforming nozzle is moved along the mobile route of planning, and electroforming solution is sprayed from electroforming nozzle to metal layer；Step 3, with reference to step 2, mobile electroforming nozzle is simultaneously moved along another mobile route of planning；Step 4 repeats above step two, three, obtains wanted micro-mould；Electroforming micro-mould service life and intensity, and the method that can be copied to existing micro-fluidic product are improved the present invention provides a kind of.
Description
Technical field
The present invention relates to micro-mould manufacturing fields, and in particular to a kind of substrate surface metallization molding micro- mould of jet flow electroforming
Has manufacturing method.
Background technology
With the progress of society, mold has derived micro-mould, the appearance of micro-mould by traditional mold
The progress of science and technology is promoted, has been also convenient for people’s lives, and the method for manufacturing micro-mould is also more various, but these methods
Generally all deposit defect, it is difficult to produce accurate, high intensity micro-mould.As Chinese Patent Application No. is
The method of 201610772529.4 raising electroforming micro-fluidic nickel die life and the micro-fluidic nickel mold of electroforming, the invention are mainly
It carries out that grinding process is thinned for the nickel mold after eletroforming, enhances the mechanical strength of nickel mold, increase the longevity of mold
Life, but in this method electroforming solution be difficult in the space of reduced size enter with update, electroforming is caused not carry out for a long time,
Rejection rate is higher, and the compactness of the micro-mould structure obtained by electroforming, intensity can not ensure, can only be by subsequent processing
Increase service life, and can not be electroformed in nonmetallic or semiconductor surface.
Such as a kind of microjet electroforming nozzle that Chinese Patent Application No. is 201210385439.1, which provides a kind of energy
Obtain beam diameter as low as a few micrometers, the microjet electroforming nozzle of big isometrical range, high flow velocities, more preferable processing quality, but electroforming
Micro-mould is limited by nozzle, can not electroforming go out size be much smaller than jet diameters structure, can not also obtain being much larger than jet diameters
Structure.
Invention content
In view of the deficiencies of the prior art, the present invention provides a kind of substrate surface metallization molding micro-moulds of jet flow electroforming
Manufacturing method, in view of the deficiencies of the prior art, this method can improve electroforming micro-mould service life and intensity, also can be to existing
Micro-fluidic product is copied.
To achieve the above object, the present invention adopts the following technical scheme that：
A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming, includes the following steps：
Step 1 carries out metalized to substrate surface, obtains metal layer, and pedestal can be nonmetallic or semiconductor etc.
Material；
Step 2, electroforming nozzle connect the pulse power with metal layer, and electroforming nozzle is moved along the mobile route of planning, electroforming
Liquid is sprayed from electroforming nozzle to metal layer, obtains part micro-mould；
Step 3, with reference to step 2, mobile electroforming nozzle is simultaneously moved along another mobile route of planning, obtains another part
Micro-mould；
Step 4 repeats Step 2: three, obtains desired micro-mould.
Preferably, the step 1 is carried out at metallization substrate surface using a kind of mode in magnetron sputtering or metal spraying
Reason.
Preferably, in the step 2 electroforming nozzle connection pulse power anode, metal layer connect the pulse power the moon
Pole.
Preferably, pulse power output is the impulse waveform with negative sense potential in the step 2.
Preferably, the substrate stated in step 1 selectes scale according to the micro-mould size of casting.
A kind of advantageous effect of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming provided by the invention
It is：
1) by the way of due to being molded this strong convection using jet flow electroforming, and the movement of electroforming nozzle is combined, can generated certain
Stirring action in degree, so as to make electroforming solution in narrow space be easier update, electrotyping forming process it is more stable into
Row；
2) using the pulse power with negative sense potential, can while electroforming is carried out, to the structure that has been electroformed into
The micro removal of row, so as to obtain intensity higher, micro-mould finer and close, service life is longer；
3) it using processing such as magnetron sputtering, metal sprayings, can be electroformed in nonmetallic, semiconductor surface；
4) it being not required to consider the manufacture of micro electroforming nozzle, assembly problem, molding size is determined by substrate rather than nozzle, from
And the structure much smaller than electroforming jet diameters can be obtained；
5) using mobile electroforming nozzle, by reasonably planning mobile route, larger area micro-mould is can obtain, and
And the electric field distribution in forming process is more uniform, can obtain the good large area micro-mould of consistency.
Description of the drawings
Fig. 1 is step one design sketch of the present invention；
Fig. 2 is step two procedure chart of the present invention；
Fig. 3 is step three procedure chart of the present invention；
Fig. 4 is molding micro-mould.
In figure：1st, metal layer；2nd, substrate；3rd, pulse power anode；4th, pulse power cathode；5th, electroforming nozzle；6th, electroforming
Product；7th, the pulse power；8th, the impulse waveform with negative sense potential；9th, ground potential；10th, electroforming solution；11st, electroforming nozzle movement road
Diameter；12nd, electroforming solution jet area A；13rd, electroforming solution jet area B.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Whole description, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Ability
Domain ordinary person all other embodiments obtained without making creative work belong to the protection of the present invention
Range.
Embodiment：A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming.
Referring to figs. 1 to shown in Fig. 3, a kind of substrate surface metallizes the molding micro-mould manufacturing method of jet flow electroforming, including
Following steps：
Step 1 is carried out metalized to 2 surface of substrate by the way of magnetron sputtering, obtains metal layer 1, magnetic control splashes
Penetrate general sputtering method have many advantages, such as that equipment is simple, easily controllable, plated film area is big and strong adhesive force on the basis of realize
High speed, low temperature, low damage effect, which, which breaches electroforming, can only act on limitation on the metal material；
Step 2, electroforming nozzle 5 connect pulse power anode 3, and metal layer 1 connects pulse power cathode 4, the pulse power 7
It exports as the impulse waveform 8 with negative sense potential, electroforming solution 10 is by 5 directive metal layer 1 of electroforming nozzle, 10 fluidic vectoring thrust of electroforming solution electricity
Liquid jet area A12 is cast, the micro-mould of electroforming product 6, i.e. part is obtained on 1 surface of metal layer；
Step 3, with reference to step 2, mobile electroforming nozzle 5 is simultaneously moved along another mobile route of planning, and electroforming solution 10 is penetrated
Stream forms electroforming solution jet area B13, and the micro-mould of electroforming product 6, i.e. another part is obtained on 1 surface of metal layer；
Step 4 is repeated Step 2: three, i.e., the micro-mould of complete compactness is obtained in substrate 2.
In the present embodiment, micro- mould much larger than 5 diameter of electroforming nozzle can be obtained by mobile 5 jet flow electroforming of electroforming nozzle
Tool, overcome due to 5 diameter of electroforming nozzle limit cannot arbitrary size micro-mould the defects of.In order to preferably control electroforming
The nucleation of metal, crystallization process, the pulse power 7 of use are the impulse waveforms for having negative sense potential, can make core smaller, brilliant
Body smaller, the structure that electroforming comes out are stronger more stable.The microprocess of electroforming is exactly, during nucleation, negative sense current potential processing removal one
Part, core smaller；During crystallization, a removal part, the crystal smaller obtained are processed by negative sense current potential；Smaller core and crystal will
So that the micro-mould that electroforming comes out is finer and close in structure, intensity higher, service life can also extend.
The above is presently preferred embodiments of the present invention, but the present invention should not be limited to embodiment and attached drawing institute public affairs
The content opened so every do not depart from the lower equivalent or modification completed of spirit disclosed in this invention, both falls within protection of the present invention
Range.
Claims (5)
- The molding micro-mould manufacturing method of jet flow electroforming 1. a kind of substrate surface metallizes, which is characterized in that include the following steps：Step 1 carries out metalized to substrate surface, obtains metal layer；Step 2, electroforming nozzle connect the pulse power with metal layer, and electroforming nozzle is moved along the mobile route of planning, electroforming solution by Electroforming nozzle is sprayed to metal layer, obtains part micro-mould；Step 3, with reference to step 2, mobile electroforming nozzle is simultaneously moved along another mobile route of planning, obtains the micro- mould of another part Tool；Step 4 repeats Step 2: three, obtains desired micro-mould.
- The molding micro-mould manufacturing method of jet flow electroforming 2. substrate surface as described in claim 1 metallizes, it is characterised in that： The step 1 carries out metalized using a kind of mode in magnetron sputtering or metal spraying to substrate surface.
- The molding micro-mould manufacturing method of jet flow electroforming 3. substrate surface as described in claim 1 metallizes, it is characterised in that： The anode of the electroforming nozzle connection pulse power, metal layer connect the cathode of the pulse power in the step 2.
- The molding micro-mould manufacturing method of jet flow electroforming 4. substrate surface as described in claim 1 metallizes, it is characterised in that： Pulse power output is the impulse waveform with negative sense potential in the step 2.
- The molding micro-mould manufacturing method of jet flow electroforming 5. substrate surface as described in claim 1 metallizes, it is characterised in that： Substrate in the step 1 can select scale according to the micro-mould size of casting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387048.2A CN108149282A (en) | 2017-12-20 | 2017-12-20 | A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387048.2A CN108149282A (en) | 2017-12-20 | 2017-12-20 | A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming |
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| CN108149282A true CN108149282A (en) | 2018-06-12 |
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| CN201711387048.2A Pending CN108149282A (en) | 2017-12-20 | 2017-12-20 | A kind of substrate surface metallization molding micro-mould manufacturing method of jet flow electroforming |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059108A (en) * | 2021-12-20 | 2022-02-18 | 河南理工大学 | Scanning electroforming device and method implemented by alternately flushing liquid and electrodepositing different surfaces |
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|---|---|---|---|---|
| CN101205054A (en) * | 2007-12-11 | 2008-06-25 | 山东大学 | Minitype metal nickel mould producing method |
| CN103290436A (en) * | 2013-05-24 | 2013-09-11 | 燕山大学 | High-melting-point alloy sputtering electro-deposition rapid molding method |
| CN104152948A (en) * | 2014-08-12 | 2014-11-19 | 上海航天电子通讯设备研究所 | A precise electroforming method for making the subtle structure of a high frequency corrugation feed horn |
| CN104313654A (en) * | 2014-10-13 | 2015-01-28 | 中南大学 | Mold core with copied natural biological super-hydrophobic surface as well as preparation method and application of mold core |
| CN104985266A (en) * | 2015-07-09 | 2015-10-21 | 清华大学深圳研究生院 | Nano impression cylinder mould preparation device and preparation method |
| CN106222708A (en) * | 2016-08-30 | 2016-12-14 | 北京同方生物芯片技术有限公司 | Improve method and the electroforming micro-fluidic nickel mould of electroforming micro-fluidic nickel die life |
-
2017
- 2017-12-20 CN CN201711387048.2A patent/CN108149282A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101205054A (en) * | 2007-12-11 | 2008-06-25 | 山东大学 | Minitype metal nickel mould producing method |
| CN103290436A (en) * | 2013-05-24 | 2013-09-11 | 燕山大学 | High-melting-point alloy sputtering electro-deposition rapid molding method |
| CN104152948A (en) * | 2014-08-12 | 2014-11-19 | 上海航天电子通讯设备研究所 | A precise electroforming method for making the subtle structure of a high frequency corrugation feed horn |
| CN104313654A (en) * | 2014-10-13 | 2015-01-28 | 中南大学 | Mold core with copied natural biological super-hydrophobic surface as well as preparation method and application of mold core |
| CN104985266A (en) * | 2015-07-09 | 2015-10-21 | 清华大学深圳研究生院 | Nano impression cylinder mould preparation device and preparation method |
| CN106222708A (en) * | 2016-08-30 | 2016-12-14 | 北京同方生物芯片技术有限公司 | Improve method and the electroforming micro-fluidic nickel mould of electroforming micro-fluidic nickel die life |
Non-Patent Citations (2)
| Title |
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| 编辑部: "《中国电力百科全书：用电卷》", 30 November 1995 * |
| 赵剑峰 等: "精密模具电铸工艺研究", 《模具工业》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059108A (en) * | 2021-12-20 | 2022-02-18 | 河南理工大学 | Scanning electroforming device and method implemented by alternately flushing liquid and electrodepositing different surfaces |
| CN114059108B (en) * | 2021-12-20 | 2022-10-28 | 河南理工大学 | Scanning electroforming device and method implemented by alternatively flushing liquid and electrodepositing different surfaces |
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Application publication date: 20180612 |
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