CN109881226B - Device for quickly preparing high-conductivity microcircuit by uniform droplet printing and electroplating - Google Patents
Device for quickly preparing high-conductivity microcircuit by uniform droplet printing and electroplating Download PDFInfo
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- CN109881226B CN109881226B CN201910264406.3A CN201910264406A CN109881226B CN 109881226 B CN109881226 B CN 109881226B CN 201910264406 A CN201910264406 A CN 201910264406A CN 109881226 B CN109881226 B CN 109881226B
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Abstract
The invention provides a device for rapidly preparing a high-conductivity microcircuit by uniform droplet printing and electroplating, which realizes the accurate controllable formation of a uniform metal droplet printing microcircuit under the synergistic action of modules such as motion control, heating control, jet control and the like; after the printing of the microelectronic circuit is finished, the microelectronic circuit forming area is directly converted into an electroplating area without moving, and in a system formed by an electroplating liquid supply system, an electroplating cathode, an electroplating anode and an electroplating power supply device, the electroplating post-treatment of high-conductivity plating metal such as gold plating, silver and the like on the surface of the microelectronic circuit is realized, so that the low-cost high-conductivity microelectronic circuit is quickly prepared. The printed tin alloy microelectronic circuit structure has a smooth and clean surface, and can realize the rapid preparation of a high-conductivity microcircuit; the mechanical property and the conductivity property of the printed circuit are easy to obtain, and the printed circuit has the advantages of low cost, few processes and environmental protection.
Description
Technical Field
The invention relates to the field of microcircuit rapid printing, in particular to a low-cost high-conductivity microcircuit rapid preparation device combining uniform metal droplet printing and electroplating.
Background
With the rapid development of microelectronic technology, the requirements of personalization, flexibility and rapid production of microelectronic circuits are increased dramatically, and the conventional microelectronic preparation technology is difficult to meet the rapid preparation of advanced microelectronics such as an MENS sensor, a flexible circuit, an organic photoelectric circuit and the like. The micro-electronic circuit printing technology based on 3D printing, which is developed rapidly in recent years, has huge development prospect in the micro-electronic field due to the technical characteristics of short process, compatible design and manufacture, unlimited structural complexity and the like. If the uniform droplet 3D printing technology can be used for accurately controlling the point-by-point deposition of the molten conductive material on the insulating substrate, the rapid printing of the personalized microelectronic circuit can be realized, and then the electroplating post-treatment process is used for directly plating gold, silver and other high-conductivity coatings on the surface of the printed microelectronic circuit, so that the conductivity of the printed electronic circuit is further improved, and the rapid preparation of the personalized, high-conductivity and flexible microcircuits can be met.
The document "Paulsen J A, Renn M, Christenson K, et al printing electronics on 3D structures with Aerosol jet technology [ M ]. 2012" proposes a device for printing flexible microcircuits based on a nano-slurry atomization technology, and the method is adopted to realize the manufacturing of a plurality of space complex surface microcircuits, and proves that the non-contact direct forming parts and circuits of the flexible microcircuit printing device have the advantages of rapidness, high flexibility and individuation. However, the spraying raw material is nano slurry, and has the defects of special preparation of the raw material, low conductivity and high material price, so that the quick printing of a low-cost and high-conductivity microcircuit cannot be realized.
The document "Dickey, Michael d.stretchable and Soft Electronics using Liquid Metals [ J ]. Advanced Materials,2017: 1606425" proposes a device based on a low-melting-point metal droplet for rapidly printing a spatial structure and a flexible circuit, and the method realizes rapid manufacturing of a plurality of simple microcircuits, but printing Materials used in the technology are all low-melting-point even Liquid Metals at room temperature, and have the defects of low melting point, poor strength, low electric conductivity and high price, and meanwhile, the metal Materials used in the technology are different from Materials used in the existing mature electronic industry, and the evaluation standards of strength, electric conductivity and the like are lacked, and rapid industrialization is difficult to realize.
Disclosure of Invention
In order to overcome the defects of the prior art and realize the rapid printing of microelectronic circuits with high conductivity and low cost, the invention provides a device for rapidly preparing high-conductivity microcircuits by uniform droplet printing/electroplating, which realizes the precise controllable forming of uniform metal droplet printing microcircuits under the synergistic action of modules such as motion control, heating control, ejection control and the like; after the printing of the microelectronic circuit is finished, the microelectronic circuit forming area is directly converted into an electroplating area without moving, and in a system formed by an electroplating liquid supply system, an electroplating cathode, an electroplating anode and an electroplating power supply device, the electroplating post-treatment of high-conductivity plating metal such as gold plating, silver and the like on the surface of the microelectronic circuit is realized, so that the low-cost high-conductivity microelectronic circuit is quickly prepared.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a device for rapidly preparing a high-conductivity microcircuit by uniform droplet printing and electroplating, comprising: the device comprises a motion control system, a three-dimensional motion platform, an injection pump, an electroplating solution supply system, a one-way valve, an anti-oxidation inert gas supply system, a circuit forming electroplating cabin, a metal smelting system, a jet control system, a micro-circuit printing spray head device, an electroplating cathode point contact system, an electroplating cathode, an electroplating power supply control device, an electroplating anode device, a circuit deposition platform, a substrate heating device, an electromagnetic valve, a liquid storage tank, a one-way valve and a fixed rod;
the three-dimensional motion platform is connected with the motion control system through a wire, and the motion control system is positioned on one side of the three-dimensional motion platform; the fixing rod is a metal round rod, external threads are arranged at two ends of the fixing rod, the lower end of the fixing rod is connected with the internal threads arranged at the central position of the upper panel of the three-dimensional motion platform in a screwing mode, and the fixing rod is vertically arranged right above the three-dimensional motion platform after being connected with the three-dimensional motion platform; the substrate heating device is connected with the upper end of the fixed rod in a screwing manner through threads, and the substrate heating device is positioned right above the fixed rod; the circuit deposition platform is horizontally arranged and located right above the substrate heating device, four side lines of the upper surfaces of the circuit deposition platform and the substrate heating device are respectively parallel to each other one by one, and the center lines of the surfaces of the four side lines are superposed, threaded holes are formed in four corners of the circuit deposition platform and the four corners of the substrate heating device, the center lines of the threaded holes of the corresponding corners of the circuit deposition platform and the corresponding corners of the substrate heating device are superposed with each other, the circuit deposition platform and the substrate heating device are connected through screwing of bolts, and high-temperature-resistant sealant is filled in the threaded joint; the lower panel of the circuit forming electroplating cabin is made of insulating heat conducting materials, four through holes are formed in the periphery of the central portion of the lower panel, the central lines of the four through holes are respectively overlapped with the central lines of threaded holes formed in four corners of the circuit deposition platform and the base plate heating device one by one, the lower panel is located between the circuit deposition platform and the base plate heating device, four bolts connected with the circuit deposition platform and the base plate heating device penetrate through the four through holes of the lower panel of the circuit forming electroplating cabin, clamping force generated by threaded connection of the lower panel of the circuit deposition platform and the upper panel of the base plate heating device is fixed, and high-temperature-resistant sealants are filled in the joints of the panels of the circuit forming electroplating cabin, the contact positions of the lower panel of the circuit forming electroplating cabin and the circuit deposition platform and the passing; a side panel of the circuit forming electroplating cabin is provided with a vent hole, and the outer surface of the side panel of the circuit forming electroplating cabin where the vent hole is located is connected with an anti-oxidation inert gas supply system through a gas path pipeline; a through hole is formed in one side, which is centered on the three-dimensional motion platform, of the lower panel of the circuit forming electroplating cabin and is provided with a water path interface, the through hole is externally connected with a water outlet of the one-way valve, and a through hole is formed in the lower panel of the circuit forming electroplating cabin on the other side, which is centered on the three-dimensional motion platform, of the lower panel of the circuit forming electroplating cabin and is connected with an inlet of the electromagnetic valve through a water; the electroplating solution supply system is connected with the injection pump and the electromagnetic valve through electric wires respectively and is positioned on one side of the three-dimensional motion platform;
the injection pump is vertically fixed on one side of the central position of the upper panel of the three-dimensional motion platform, a water outlet on the upper surface of the injection pump is connected with a water inlet of the one-way valve through a waterway pipeline, a through hole is formed in a position 2cm away from the upper panel of the injection pump on the side cylinder body of the injection pump, and the through hole is connected with the water outlet of the one-way valve through the waterway pipeline; the liquid storage tank is fixed on the other side of the central position of the upper panel of the three-dimensional motion platform, a through hole is formed in the position, 2cm away from the bottom panel of the liquid storage tank, of the side cylinder body of the liquid storage tank, and is connected with the water inlet of the one-way valve through a waterway pipeline, and a through hole is formed in the upper panel of the liquid storage tank and is connected with the outlet end of the electromagnetic valve through a waterway pipeline; the electroplating anode device is fixed on the inner side surface of the side panel of the circuit forming electroplating cabin through a bolt, and the lower end of the electroplating anode device is in contact with the lower panel of the circuit forming electroplating cabin; the micro-circuit printing spray head device and the electroplating cathode point contact system are fixed on a cantilever beam above the circuit forming electroplating cabin through bolts; the metal smelting system and the injection control system are respectively connected with the microcircuit printing nozzle device through electric wires, and the metal smelting system and the injection control system are positioned on one side of the three-dimensional motion platform; the electroplating power supply control device is connected with the electroplating cathode through an electric wire, and the electroplating power supply control device is connected with the electroplating anode device through an electric wire and is positioned on the other side of the three-dimensional motion platform; the upper end of the electroplating cathode is vertically fixed on the lower end face of the electroplating cathode point contact system through a bolt, and the lower end of the electroplating cathode is suspended.
When the uniform droplet printing/electroplating rapid preparation high-conductivity microcircuit device prints a microcircuit, the injection pump and the electromagnetic valve are in an off state; introducing inert gas into the circuit forming electroplating cabin through an anti-oxidation inert gas supply system; heating the printing solid lump material filled in the microcircuit printing nozzle device through a metal melting system, and melting the printing solid lump material into a liquid state; the controllable ejection of uniform metal droplets is realized by regulating and controlling a pulse control signal sent to a microcircuit printing nozzle device by an ejection control system; the three-dimensional motion platform is controlled by the motion control system, the circuit deposition platform is driven to a position which is smaller than 15mm under the micro-circuit printing nozzle device, an electronic circuit clamped on the insulating substrate moves according to a pre-planned motion track, and metal molten drops are deposited on the substrate drop by drop to realize the printing of an expected circuit.
After the uniform droplet printing/electroplating rapid preparation high-conductivity microcircuit device is printed, electroplating treatment is carried out, and the metal smelting system, the injection control system and the microcircuit printing nozzle device are in a closed state; the motion of the three-dimensional motion platform is controlled by a motion control system, so that the circuit deposition platform moves to the position right below the electroplating cathode, and the printed microelectronic circuit is tightly connected with an elastic contact at the lower end of the electroplating cathode; the electroplating cathode and the electroplating anode device are electrified by regulating and controlling the electroplating power supply control device; the injection pump is controlled by the electroplating solution supply system to push upwards to output electroplating solution, the electroplating solution is injected into the circuit forming electroplating cabin through the one-way valve, meanwhile, the electromagnetic valve is in an open circuit state, the electroplating solution in the circuit forming electroplating cabin is ensured to submerge the printed microelectronic circuit, and the injection pump is closed to carry out electroplating; after electroplating is finished, the electromagnetic valve is controlled to be conducted by the electroplating solution supply system, electroplating solution in the circuit forming electroplating cabin flows into the liquid storage tank through the electromagnetic valve, and the electromagnetic valve is closed after the electroplating solution in the circuit forming electroplating cabin is discharged; the injection pump is controlled to retract downwards through the electroplating solution supply system, retraction adsorption force is generated in the cylinder body of the injection pump, electroplating solution in the liquid storage tank is sucked into the liquid storage cylinder body of the injection pump through the one-way valve, a compact high-conductivity coating is formed on the surface of the printed microelectronic circuit, and the high-conductivity microelectronic circuit is obtained.
The lower panel of the circuit forming electroplating cabin and the circuit deposition platform are made of ceramic materials.
The invention has the advantages that because the surface of the tin alloy microelectronic circuit structure printed in a low-oxygen environment is smooth and clean, the surface can be directly used for electroplating precious metals with good conductivity, such as gold, silver and the like, without the traditional complex pretreatment process of electroplating, the circuit does not need to move after being formed, and the electroplating treatment is directly carried out on the original printing position, thus realizing the rapid preparation of the high-conductivity microcircuit; the tin alloy solder which is common in the electronic industry is selected as the printing material, and the plating layer is prepared by utilizing the mature electroplating material and process in the electronic industry, so that the compatibility with the existing electronic industry is high, the mechanical property and the conductivity of a printing circuit are easy to obtain, and the method has the advantages of low cost, few processes and environmental friendliness.
Drawings
FIG. 1 is a schematic diagram of an apparatus for uniform droplet printing/electroplating for rapid fabrication of highly conductive microcircuits according to the present invention.
FIG. 2 is a schematic diagram of the electroplating state of the device for uniformly droplet printing/electroplating to rapidly fabricate highly conductive microcircuits according to the present invention.
Fig. 3 is a schematic diagram of a metal droplet printing highly conductive microcircuit on an insulating substrate according to the present invention, fig. 3(a) is a schematic diagram of microcircuit printing, fig. 3(b) is a schematic diagram of microcircuit electroplating process, and fig. 3(c) and fig. 3(d) are a front view and a side view of a cross-sectional profile of a highly conductive microcircuit.
The device comprises a motion control system 1, a three-dimensional motion platform 2, a syringe pump 3, an electroplating solution supply system 4, a one-way valve 5, an anti-oxidation inert gas supply system 6, a circuit forming electroplating cabin 7, a metal smelting system 8, a jet control system 9, a microcircuit printing spray head device 10, an electroplating cathode touch system 11, an electroplating cathode 12, an electroplating power supply control device 13, an electroplating anode device 14, a circuit deposition platform 15, a substrate heating device 16, an electromagnetic valve 17, a liquid storage tank 18, a one-way valve 19, a fixing rod 20, a metal molten drop 21, a microelectronic circuit 22, an insulating substrate 23 and a plating layer 24.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Referring to fig. 1-3, an embodiment prints highly conductive microcircuits on an insulating substrate for metal droplets.
A device for rapidly preparing a high-conductivity microcircuit by uniform droplet printing and electroplating, comprising: the device comprises a motion control system (1), a three-dimensional motion platform (2), an injection pump (3), an electroplating solution supply system (4), a one-way valve (5), an anti-oxidation inert gas supply system (6), a circuit forming electroplating cabin (7), a metal smelting system (8), an injection control system (9), a microcircuit printing spray head device (10), an electroplating cathode point contact system (11), an electroplating cathode (12), an electroplating power supply control device (13), an electroplating anode device (14), a circuit deposition platform (15), a substrate heating device (16), an electromagnetic valve (17), a liquid storage tank (18), a one-way valve (19) and a fixed rod (20);
the three-dimensional motion platform (2) is connected with the motion control system (1) through an electric wire, and the motion control system (1) is positioned on one side of the three-dimensional motion platform (2); the fixing rod (20) is a metal round rod, external threads are arranged at two ends of the fixing rod, the lower end of the fixing rod (20) is connected with the internal threads arranged at the central position of the upper panel of the three-dimensional motion platform (2) in a screwing mode, and the fixing rod (20) is vertically erected right above the three-dimensional motion platform (2) after being connected with the three-dimensional motion platform (2); the substrate heating device (16) is connected with the upper end of the fixing rod (20) in a screwing mode through threads, and the substrate heating device (16) is located right above the fixing rod (20); the circuit deposition platform (15) is horizontally arranged and located right above the substrate heating device (16), four side lines of the upper surfaces of the circuit deposition platform (15) and the substrate heating device (16) are respectively parallel to each other one by one, the center lines of the surfaces of the four side lines coincide, threaded holes are formed in four corners of the circuit deposition platform (15) and the substrate heating device (16), the center lines of the threaded holes of each corresponding corner of the circuit deposition platform (15) and the substrate heating device (16) coincide with each other, the circuit deposition platform (15) and the substrate heating device (16) are connected through screwing of bolts, and high-temperature-resistant sealant is filled in the threaded joint; the lower panel of the circuit forming electroplating cabin (7) is made of insulating and heat conducting materials, four through holes are formed around the central part of the lower panel, the central lines of the four through holes are respectively superposed with the central lines of threaded holes formed in four corners of the circuit depositing platform (15) and the base plate heating device (16) one by one, the lower panel is positioned between the circuit depositing platform (15) and the base plate heating device (16), four bolts connected with the circuit depositing platform (15) and the base plate heating device (16) penetrate through the four through holes of the lower panel of the circuit forming electroplating cabin (7), and clamping force generated by threaded connection of the lower panel of the circuit depositing platform (15) and the upper panel of the base plate heating device (16) is fixed, high-temperature-resistant sealants are filled at the joints of the panels of the circuit forming electroplating cabin (7), the contact part of the lower panel of the circuit forming electroplating cabin (7) and the circuit deposition platform (15) and the passing parts of the four bolts; a side panel of the circuit forming electroplating cabin (7) is provided with a vent hole, and the outer surface of the side panel of the circuit forming electroplating cabin (7) where the vent hole is positioned is connected with an anti-oxidation inert gas supply system (6) through a gas path pipeline; a through hole is formed in one side, which is centered on the three-dimensional moving platform (2), of a lower panel of the circuit forming electroplating cabin (7) and is provided with a water channel interface, the through hole is externally connected with a water outlet of the one-way valve (5), and a through hole is formed in the lower panel of the circuit forming electroplating cabin (7) on the other side, which is centered on the three-dimensional moving platform (2), and is connected with an inlet of the electromagnetic valve (17) through a water channel pipeline; the electroplating solution supply system (4) is respectively connected with the injection pump (3) and the electromagnetic valve (17) through electric wires, and the electroplating solution supply system (4) is positioned on one side of the three-dimensional moving platform (2);
the injection pump (3) is vertically fixed on one side of the central position of the upper panel of the three-dimensional motion platform (2), a water outlet on the upper surface of the injection pump (3) is connected with a water inlet of the one-way valve (5) through a water pipeline, a through hole is formed in the position, 2cm away from the upper panel of the injection pump (3), of the side cylinder body of the injection pump (3), and the through hole is connected with a water outlet of the one-way valve (19) through the water pipeline; the liquid storage tank (18) is fixed on the other side of the central position of the upper panel of the three-dimensional motion platform (2), a through hole is formed in the position, 2cm away from the bottom panel of the liquid storage tank (18), of the side cylinder body of the liquid storage tank (18) and is connected with a water inlet of the one-way valve (19) through a waterway pipeline, and a through hole is formed in the upper panel of the liquid storage tank (18) and is connected with the outlet end of the electromagnetic valve (17) through a waterway pipeline; the electroplating anode device (14) is fixed on the inner side surface of the side panel of the circuit forming electroplating cabin (7) through bolts, and the lower end of the electroplating anode device (14) is contacted with the lower panel of the circuit forming electroplating cabin (7); the microcircuit printing spray head device (10) and the electroplating cathode point contact system (11) are fixed on a cantilever beam above the circuit forming electroplating cabin (7) through bolts; the metal smelting system (8) and the injection control system (9) are respectively connected with the microcircuit printing nozzle device (10) through electric wires, and the metal smelting system (8) and the injection control system (9) are positioned on one side of the three-dimensional moving platform (2); the electroplating power supply control device (13) is connected with the electroplating cathode device (12) through an electric wire, and the electroplating power supply control device (13) is connected with the electroplating anode device (14) through an electric wire and is positioned on the other side of the three-dimensional motion platform (2); the upper end of the electroplating cathode (12) is vertically fixed on the lower end face of the electroplating cathode point contact system (11) through a bolt, and the lower end of the electroplating cathode is suspended.
When the device for rapidly preparing the high-conductivity microcircuit by uniform droplet printing/electroplating is used for printing the microcircuit, the injection pump (3) and the electromagnetic valve (17) are in an off state, so that the air tightness of the circuit forming electroplating cabin (7) is ensured; inert gas is introduced into the circuit forming electroplating cabin (7) through the anti-oxidation inert gas supply system (6) so as to prevent the surface oxidation from influencing the quality of the surface coating after electroplating during circuit forming and reduce the electrical performance of the printed circuit; heating the printing solid lump material filled in the microcircuit printing nozzle device (10) through a metal smelting system (8), and melting the printing solid lump material into a liquid state; the controllable ejection of uniform metal droplets is realized by regulating a pulse control signal sent to a microcircuit printing nozzle device (10) by an ejection control system (9); the three-dimensional motion platform (2) is controlled by the motion control system (1), the circuit deposition platform (15) is driven to a position which is smaller than 15mm under the micro-circuit printing spray head device (10), an electronic circuit clamped on an insulating substrate moves according to a pre-planned motion track, and metal molten drops (21) are deposited on the substrate drop by drop, so that printing of an expected circuit is realized.
After the uniform micro-droplet printing/electroplating rapid preparation high-conductivity microcircuit device is printed, electroplating treatment is carried out, and a metal smelting system (8), an injection control system (9) and a microcircuit printing nozzle device (10) are in a closed state; the motion of the motion platform 2 is controlled by the motion control system (1), so that the circuit deposition platform (15) moves to the position right below the electroplating cathode (12), the printed microelectronic circuit is tightly connected with an elastic contact at the lower end of the electroplating cathode (12), the elastic contact of the electroplating cathode (12) has a telescopic characteristic, the contact is tightly attached to the circuit through elastic force, the printed circuit is prevented from being damaged due to mistaken collision of the cathode contact, and the flexible interconnection of the microelectronic circuit (22) and the electroplating cathode (12) is ensured; electrifying the electroplating cathode (12) and the electroplating anode device (14) by regulating and controlling the electroplating power supply device 13; the injection pump (3) is controlled by the electroplating solution supply system (4) to push upwards to output electroplating solution, the electroplating solution is injected into the circuit forming electroplating cabin (7) through the one-way valve (5), meanwhile, the electromagnetic valve (17) is in an open circuit state, the printed microelectronic circuit (22) is immersed in the electroplating solution in the circuit forming electroplating cabin (7), and the injection pump (3) is closed to carry out electroplating; after the electroplating is finished, the electroplating solution supply system (4) controls the electromagnetic valve (17) to be conducted, the electroplating solution in the circuit forming electroplating cabin (7) flows into the liquid storage tank (18) through the electromagnetic valve (17), and after the electroplating solution in the circuit forming electroplating cabin (7) is discharged, the electromagnetic valve (17) is closed; the injection pump (3) is controlled to retract downwards through the electroplating solution supply system (4), retraction adsorption force is generated in the cylinder body of the injection pump (3), electroplating solution in the liquid storage tank is sucked into the liquid storage cylinder body of the injection pump (3) through the one-way valve (19), cyclic utilization of the electroplating solution is achieved, a dense high-conductivity plating layer (24) is formed on the surface of a printed microelectronic circuit (22), and the high-conductivity microelectronic circuit is obtained.
The lower panel of the circuit forming electroplating cabin (7) and the circuit deposition platform (15) are made of ceramic materials.
Claims (2)
1. The utility model provides an even droplet is printed and is electroplated and prepare high electrically conductive microcircuit device fast, includes motion control system, three-dimensional motion platform, the syringe pump, plating solution supply system, the check valve, anti-oxidation inert gas supply system, the cabin is electroplated in the circuit shaping, the metal smelting system, injection control system, microcircuit prints shower nozzle device, electroplates the system of touching of negative pole point, electroplates the negative pole, electroplates power control device, electroplates the positive pole device, circuit deposition platform, base plate heating device, the solenoid valve, the liquid reserve tank, check valve and dead lever, its characterized in that:
the three-dimensional motion platform is connected with the motion control system through a wire, and the motion control system is positioned on one side of the three-dimensional motion platform; the fixing rod is a metal round rod, external threads are arranged at two ends of the fixing rod, the lower end of the fixing rod is connected with the internal threads arranged at the central position of the upper panel of the three-dimensional motion platform in a screwing mode, and the fixing rod is vertically arranged right above the three-dimensional motion platform after being connected with the three-dimensional motion platform; the substrate heating device is connected with the upper end of the fixed rod in a screwing manner through threads, and the substrate heating device is positioned right above the fixed rod; the circuit deposition platform is horizontally arranged and located right above the substrate heating device, four side lines of the upper surfaces of the circuit deposition platform and the substrate heating device are respectively parallel to each other one by one, and the center lines of the surfaces of the four side lines are superposed, threaded holes are formed in four corners of the circuit deposition platform and the four corners of the substrate heating device, the center lines of the threaded holes of the corresponding corners of the circuit deposition platform and the corresponding corners of the substrate heating device are superposed with each other, the circuit deposition platform and the substrate heating device are connected through screwing of bolts, and high-temperature-resistant sealant is filled in the threaded joint; the lower panel of the circuit forming electroplating cabin is made of insulating heat conducting materials, four through holes are formed in the periphery of the central portion of the lower panel, the central lines of the four through holes are respectively overlapped with the central lines of threaded holes formed in four corners of the circuit deposition platform and the base plate heating device one by one, the lower panel is located between the circuit deposition platform and the base plate heating device, four bolts connected with the circuit deposition platform and the base plate heating device penetrate through the four through holes of the lower panel of the circuit forming electroplating cabin, clamping force generated by threaded connection of the lower panel of the circuit deposition platform and the upper panel of the base plate heating device is fixed, and high-temperature-resistant sealants are filled in the joints of the panels of the circuit forming electroplating cabin, the contact positions of the lower panel of the circuit forming electroplating cabin and the circuit deposition platform and the passing; a side panel of the circuit forming electroplating cabin is provided with a vent hole, and the outer surface of the side panel of the circuit forming electroplating cabin where the vent hole is located is connected with an anti-oxidation inert gas supply system through a gas path pipeline; a through hole is formed in one side, which is centered on the three-dimensional motion platform, of the lower panel of the circuit forming electroplating cabin and is provided with a water path interface, the through hole is externally connected with a water outlet of the one-way valve, and a through hole is formed in the lower panel of the circuit forming electroplating cabin on the other side, which is centered on the three-dimensional motion platform, of the lower panel of the circuit forming electroplating cabin and is connected with an inlet of the electromagnetic valve through a water; the electroplating solution supply system is connected with the injection pump and the electromagnetic valve through electric wires respectively and is positioned on one side of the three-dimensional motion platform;
the injection pump is vertically fixed on one side of the central position of the upper panel of the three-dimensional motion platform, a water outlet on the upper surface of the injection pump is connected with a water inlet of the one-way valve through a waterway pipeline, a through hole is formed in a position 2cm away from the upper panel of the injection pump on the side cylinder body of the injection pump, and the through hole is connected with the water outlet of the one-way valve through the waterway pipeline; the liquid storage tank is fixed on the other side of the central position of the upper panel of the three-dimensional motion platform, a through hole is formed in the position, 2cm away from the bottom panel of the liquid storage tank, of the side cylinder body of the liquid storage tank, and is connected with the water inlet of the one-way valve through a waterway pipeline, and a through hole is formed in the upper panel of the liquid storage tank and is connected with the outlet end of the electromagnetic valve through a waterway pipeline; the electroplating anode device is fixed on the inner side surface of the side panel of the circuit forming electroplating cabin through a bolt, and the lower end of the electroplating anode device is in contact with the lower panel of the circuit forming electroplating cabin; the micro-circuit printing spray head device and the electroplating cathode point contact system are fixed on a cantilever beam above the circuit forming electroplating cabin through bolts; the metal smelting system and the injection control system are respectively connected with the microcircuit printing nozzle device through electric wires, and the metal smelting system and the injection control system are positioned on one side of the three-dimensional motion platform; the electroplating power supply control device is connected with the electroplating cathode through an electric wire, and the electroplating power supply control device is connected with the electroplating anode device through an electric wire and is positioned on the other side of the three-dimensional motion platform; the upper end of the electroplating cathode is vertically fixed on the lower end surface of the electroplating cathode point contact system through a bolt, and the lower end of the electroplating cathode is suspended;
when the uniform droplet printing/electroplating rapid preparation high-conductivity microcircuit device prints a microcircuit, the injection pump and the electromagnetic valve are in an off state; introducing inert gas into the circuit forming electroplating cabin through an anti-oxidation inert gas supply system; heating the printing solid lump material filled in the microcircuit printing nozzle device through a metal melting system, and melting the printing solid lump material into a liquid state; the controllable ejection of uniform metal droplets is realized by regulating and controlling a pulse control signal sent to a microcircuit printing nozzle device by an ejection control system; controlling a three-dimensional motion platform through a motion control system, driving a circuit deposition platform to a position which is smaller than 15mm below a micro-circuit printing spray head device, enabling an electronic circuit clamped on an insulating substrate to move according to a pre-planned motion track, and depositing metal molten drops on the substrate drop by drop to realize the printing of an expected circuit;
after the uniform droplet printing/electroplating rapid preparation high-conductivity microcircuit device is printed, electroplating treatment is carried out, and the metal smelting system, the injection control system and the microcircuit printing nozzle device are in a closed state; the motion of the three-dimensional motion platform is controlled by a motion control system, so that the circuit deposition platform moves to the position right below the electroplating cathode, and the printed microelectronic circuit is tightly connected with an elastic contact at the lower end of the electroplating cathode; the electroplating cathode and the electroplating anode device are electrified by regulating and controlling the electroplating power supply control device; the injection pump is controlled by the electroplating solution supply system to push upwards to output electroplating solution, the electroplating solution is injected into the circuit forming electroplating cabin through the one-way valve, meanwhile, the electromagnetic valve is in an open circuit state, the electroplating solution in the circuit forming electroplating cabin is ensured to submerge the printed microelectronic circuit, and the injection pump is closed to carry out electroplating; after electroplating is finished, the electromagnetic valve is controlled to be conducted by the electroplating solution supply system, electroplating solution in the circuit forming electroplating cabin flows into the liquid storage tank through the electromagnetic valve, and the electromagnetic valve is closed after the electroplating solution in the circuit forming electroplating cabin is discharged; the injection pump is controlled to retract downwards through the electroplating solution supply system, retraction adsorption force is generated in the cylinder body of the injection pump, electroplating solution in the liquid storage tank is sucked into the liquid storage cylinder body of the injection pump through the one-way valve, a compact high-conductivity coating is formed on the surface of the printed microelectronic circuit, and the high-conductivity microelectronic circuit is obtained.
2. The device for uniformly droplet-printing and electroplating to rapidly prepare the highly conductive microcircuit according to claim 1, wherein:
the lower panel of the circuit forming electroplating cabin and the circuit deposition platform are made of ceramic materials.
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| CN201910264406.3A CN109881226B (en) | 2019-04-03 | 2019-04-03 | Device for quickly preparing high-conductivity microcircuit by uniform droplet printing and electroplating |
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| CN201910264406.3A CN109881226B (en) | 2019-04-03 | 2019-04-03 | Device for quickly preparing high-conductivity microcircuit by uniform droplet printing and electroplating |
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| CN100395374C (en) * | 2006-04-10 | 2008-06-18 | 南京航空航天大学 | Three-dimensional microstructure electroforming method and apparatus |
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