CN108145594A - The monitoring method and monitoring device of useful time of grinding pad - Google Patents
The monitoring method and monitoring device of useful time of grinding pad Download PDFInfo
- Publication number
- CN108145594A CN108145594A CN201711394144.XA CN201711394144A CN108145594A CN 108145594 A CN108145594 A CN 108145594A CN 201711394144 A CN201711394144 A CN 201711394144A CN 108145594 A CN108145594 A CN 108145594A
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- China
- Prior art keywords
- grinding pad
- grinding
- gasket
- service life
- adjuster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of monitoring method and monitoring device of useful time of grinding pad, this method is included by sensing gasket adjuster relative to curent change of the grinding pad with specific speed in motion process is ground, react change in friction force of the gasket adjuster relative to grinding pad, to represent the variation of the surface roughness state of grinding pad, the step of whether grinding pad reaches service life determined, when curent change reaches a certain specific current value, judge that grinding pad has reached the service life time limit, otherwise judge to be not up to the service life time limit.The monitoring device includes shaft, grinding table, grinding pad, grinding head, lapping liquid delivery pipe, gasket adjuster, current sensor.The present invention can improve the utilization rate of grinding pad, can accurate judgement grinding pad whether beyond the service life time limit, can judge whether grinding pad causes to damage to crystal column surface, the service life state of grinding pad can be timely feedbacked, with production efficiency is improved, reduce the effect of economic loss.
Description
Technical field
The present invention relates to chemical mechanical grinding field, more particularly to the monitoring method and prison of a kind of useful time of grinding pad
Measurement equipment.
Background technology
Chemical mechanical grinding (CMP) is a kind of manufacture being combined by chemical reaction process and mechanical lapping removal process
Technology is used to implement the planarization of crystal column surface.Grinding pad is a kind of critically important consumables in chemical mechanical planarization process, is ground
The quality that the property of mill pad will directly affect chemical mechanical grinding, main process requirements are with high morphology selection acquisition
Surface planarisation.Fig. 1 is the main structure diagram of the chemical-mechanical grinding device of the prior art；Fig. 2 is the change of the prior art
Learn the overlooking the structure diagram of mechanical grinding device.- 2 are please referred to Fig.1, chemical-mechanical grinding device of the prior art is ground
Pad 3 is set to 1 top of grinding table 2 and shaft, and the lapping liquid 7 that supply pipe 6 flows out flows to the table of grinding pad 3 with certain speed
Face, grinding head 5 apply certain pressure in wafer rear so that grinding pad 3 is close in the front of crystal 4, and grinding head 5 drives wafer
4 rotate along a direction, and grinding table 2 is rotated relative to the opposite direction of grinding head, and the front of wafer 4 is made to be generated with grinding pad 3
Mechanical friction, with reference to the collective effect of lapping liquid 7, the thin film on 4 positive surface of removal wafer, so as to make the table of wafer 4
Face achievees the purpose that planarization.In chemical mechanical planarization process, since the figure on 3 surface of grinding pad can become flat because of grinding
It is sliding, it is therefore desirable to which that the adjustment of gasket adjuster 8 re-establishes coarse pad surfaces.When grinding pad 3 is consumed to a certain degree,
Its surfacial pattern will become unobvious, can influence the grinding quality of product, and wafer is caused to damage, therefore cannot be further continued for making
With grinding pad 3 has reached the service life time limit at this time, needs replacing new grinding pad.Chemical mechanical planarization process is by crystalline substance
Come what is completed, the figure of grinding pad surface can provide the frictional force in process of lapping, work as grinding for the mechanical lapping of circle and grinding pad
When pad surfacial pattern becomes unobvious, grinding pad cannot provide enough frictional force, therefore can influence the grinding of wafer, at this time
Grinding pad reaches its service life.In the prior art for the monitoring method of useful time of grinding pad, include the following steps：
First, after more renewing grinding pad, the service life of grinding pad is set as by n hours, wherein n according to the result of wafer marathon test
It is to be calculated with chronomere, including hour, minute etc..2nd, a grinding pad was replaced after n hours.The monitoring method lacks
Putting is：Since situation of every grinding pad itself is different, n hours it cannot be guaranteed that grinding pad be fully utilized or whether
Exceeded the useful time of grinding pad time limit, can not accurate judgement grinding pad whether wafer is caused to damage.
Invention content
The technical problem to be solved by the invention is to provide a kind of monitoring methods of useful time of grinding pad and monitoring to set
It is standby, to improve the utilization rate of grinding pad, can accurate judgement grinding pad whether beyond the service life time limit, whether judge grinding pad
Crystal column surface is caused to damage, and the service life state of grinding pad can be timely feedbacked, improves production efficiency, is reduced economical
Loss.
In order to solve the above technical problem, the present invention provides a kind of monitoring methods of useful time of grinding pad, pass through sensing
It is opposite to react gasket adjuster relative to curent change of the grinding pad with specific speed in motion process is ground for gasket adjuster
In the change in friction force of grinding pad, to represent the variation of the surface roughness state of grinding pad, to determine whether grinding pad reaches
The step of service life；When gasket adjuster is reached relative to grinding pad with curent change of the specific speed in motion process is ground
During to a certain specific current value, judge that grinding pad has reached the service life time limit, otherwise judge to be not up to the service life time limit.
Further, the monitoring method of useful time of grinding pad provided by the invention, including setting specific current value
Step；According to the result of wafer marathon test and gasket adjuster with the variation of the electric current in specific speed motion process,
The service life of grinding pad is set as a specific current value.
Further, the monitoring method of useful time of grinding pad provided by the invention, when gasket adjuster is relative to grinding
The change in friction force of pad and gasket adjuster relative to grinding pad with curent change of the specific speed in motion process is ground into
During proportional relationship, when frictional force reduces, the surface roughness state of grinding pad is represented to reduce, when sensing gasket adjuster
Relative to grinding pad with specific speed when the curent change in grinding motion process is reduced to a certain specific current value, judge
Grinding pad has reached the service life time limit, otherwise judges to be not up to the service life time limit.
Further, the monitoring method of useful time of grinding pad provided by the invention, when gasket adjuster is relative to grinding
The change in friction force of pad and gasket adjuster relative to grinding pad with curent change of the specific speed in motion process is ground into
During inversely prroportional relationship, when frictional force reduces, the surface roughness state of grinding pad is represented to reduce, when sensing gasket adjuster
Relative to grinding pad with specific speed when the curent change in grinding motion process is increased to a certain specific current value, judge
Grinding pad has reached the service life time limit, otherwise judges to be not up to the service life time limit.
Further, the monitoring method of useful time of grinding pad provided by the invention, the step including setting current sensor
Suddenly, to sense gasket adjuster relative to curent change of the grinding pad with specific speed in motion process is ground.
Further, the monitoring method of useful time of grinding pad provided by the invention, including current sensor is arranged on
The step of gasket adjuster.
Further, the monitoring method of useful time of grinding pad provided by the invention further includes the step of setting controller,
For record current value and judge whether current value reaches a certain specific current value；And setting shows the step of equipment, uses
In real-time display current value.
The present invention be by the variation of the surface roughness state of grinding pad, gasket adjuster relative to grinding pad frictional force
Variation and gasket adjuster are built relative to grinding pad with specific speed between the curent change three in grinding motion process
It is vertical to contact to determine whether grinding pad reaches service life, when gasket adjuster is transported relative to grinding pad with specific speed in grinding
When curent change during dynamic reaches a certain specific current value, judge that grinding pad has reached the service life time limit, otherwise sentence
The disconnected not up to service life time limit.Due in process of lapping, during the variation of the surface roughness state of grinding pad, gasket adjustment
Device is also changing relative to the frictional force of grinding pad, is existed at this time by monitoring gasket adjuster relative to grinding pad with specific speed
The curent change in motion process is ground, so as to which surface roughness state, change in friction force and the curent change of grinding pad be built
Vertical relationship, and since curent change can be monitored in real time, real-time curent change is monitored for judging making for grinding pad
Judge more accurate, reliable by the way of the service life of grinding pad, energy using access times than in the prior art with life span
It enough avoids because in the access times of grinding pad and the judgment mode on the basis of the time, grinding pad excessively use causes crystal column surface
Damage and when overcoming the grinding pad to be not up to the service life time limit caused by the utilization rate of grinding pad wasting phenomenon.Therefore,
Whether the present invention has accurate judgement grinding pad beyond the service life time limit, improves the technique effect of the utilization rate of grinding pad.This
The monitoring method of invention, for the grinding pad of different batches, by monitoring patch adjuster relative to grinding pad with specific speed
Grind move when required electric current size monitor useful time of grinding pad, it is ensured that grinding pad be fully utilized and
It without departing from the useful time of grinding pad time limit, and can be timely feedbacked when encountering abnormal grinding pad, overcome the prior art
Caused process risk when can not monitor grinding pad unusual condition in real time during middle access times monitoring, has and improves production efficiency,
Reduce the technique effect of economic loss.
In order to solve the above-mentioned technical problem, the present invention also provides a kind of monitoring device of useful time of grinding pad, including turning
Axis, grinding table, grinding pad, grinding head, lapping liquid delivery pipe, gasket adjuster, further include current sensor, for sensing gasket
Adjuster is relative to the current variation value in grinding pad motion process.
Further, the monitoring device of useful time of grinding pad provided by the invention, the current sensor are set to pad
On piece adjuster.
Further, the monitoring device of useful time of grinding pad provided by the invention, further include for record current value and
The controller and the display equipment for real-time display current value whether current value reach a certain specific current value judged.
Monitoring device provided by the invention is to increase current sense on the basis of traditional chemical-mechanical grinding device
Device, for sensing gasket adjuster relative to the current variation value in grinding pad motion process.Thus by above-mentioned monitoring method,
The service life time limit of grinding pad is monitored, whether the service life with accurate judgement grinding pad reaches the time limit, improves
The utilization rate of grinding pad avoids access times from being damaged excessively caused by wafer, to grinding pad surface state Real-time Feedback, improves
Production efficiency reduces economic loss.
Description of the drawings
Fig. 1 is the main structure diagram of the chemical-mechanical grinding device of the prior art；
Fig. 2 is the overlooking the structure diagram of the chemical-mechanical grinding device of the prior art；
Fig. 3 is the main structure diagram of the monitoring device of the useful time of grinding pad of one embodiment of the invention；
Fig. 4 is the overlooking the structure diagram of the monitoring device of the useful time of grinding pad of one embodiment of the invention；
Fig. 5 is the schematic diagram of the surface state of grinding pad；
Fig. 6 is that the current sensor of one embodiment of the invention and the box of controller and the connection relation for showing equipment are illustrated
Figure.
Specific embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
Embodiment one
Fig. 3 is the main structure diagram of the monitoring device of the useful time of grinding pad of one embodiment of the invention.Fig. 4 is this
Invent the overlooking the structure diagram of the monitoring device of the useful time of grinding pad of an embodiment.Fig. 6 is one embodiment of the invention
Current sensor and controller and the block diagram for the connection relation for showing equipment.It please refers to Fig.3, Fig. 4, Fig. 6, the present embodiment
The monitoring device of one useful time of grinding pad provided, including shaft 10, grinding table 20, grinding pad 30, grinding head 40, lapping liquid
Delivery pipe 60, gasket adjuster 80, current sensor 90, for sensing gasket adjuster 80 relative to 30 motion process of grinding pad
In current variation value.In the present embodiment one, current sensor 90 is set on gasket adjuster 80, naturally it is also possible to set
It, must not be as the limitation of the present invention in other positions.
It please refers to Fig.3 to 6, the monitoring device that the present embodiment one provides, is the base in traditional chemical-mechanical grinding device
Current sensor 90 is increased on plinth, the grinding technics of the monitoring device is identical with chemical-mechanical grinding device, and wafer 40 is set
Between grinding head 40 and grinding pad 30, lapping liquid delivery pipe 60 is used to convey lapping liquid 70.
Current sensor 90 in the present embodiment one is used to sense gasket adjuster 80 relative to 30 motion process of grinding pad
In current variation value, so as to which by the variation of current value, reaction gasket adjuster 80 is relative to the frictional force of grinding pad 30
Variation, and the variation of 30 surface roughness of grinding pad has been reacted in the variation of frictional force, wherein, Fig. 5 is the surface shape of grinding pad
The schematic diagram of state.The contact between three is established, so as to be carried out using current value variation to the service life time limit of grinding pad 30
Whether monitoring, the service life with accurate judgement grinding pad 30 reach the time limit, improve the utilization rate of grinding pad 30, avoid making
With number excessively to damage caused by wafer 40, to 30 surface state Real-time Feedback of grinding pad, production efficiency is improved, is reduced economical
The technique effects such as loss.
Fig. 6 is please referred to, the monitoring device for 30 service life of grinding pad that the present embodiment one provides further includes to record electricity
Flow valuve and judge whether current value reaches the controller 100 of a certain specific current value and for real-time display current value
Show equipment 101.Wherein controller 100 and display equipment 101 can be integrated, such as industrial touch control computer, notebook electricity
Brain.Can also be split, such as device 100 and display are display equipment 101 to host computer in order to control.Controller 100 has
Immediately the effect of specific current value is set, can it is different to be adjusted according to the test case of the grinding pad 30 of different batches for setting
Specific current value, to improve the accuracy of the judgement of its 30 service life of grinding pad.Show that equipment 101 is used for real-time display
The variation of the current value, for analyzing and adjusting.
Embodiment two
It please refers to Fig.3 to 4, Fig. 6, the present embodiment two provides a kind of monitoring method of 30 service life of grinding pad, passes through sense
Gasket adjuster 80 is surveyed relative to curent change of the grinding pad 30 with specific speed in motion process is ground, reaction gasket adjustment
Device 80 relative to grinding pad 30 change in friction force, to represent the variation of the surface roughness state of grinding pad 30, to determine to grind
The step of whether mill pad 30 reaches service life；When gasket adjuster 80 is moved relative to grinding pad 30 with specific speed in grinding
When curent change in the process reaches a certain specific current value, judge that grinding pad 30 has reached the service life time limit, otherwise sentence
The disconnected not up to service life time limit.Wherein, Fig. 5 is the schematic diagram of the surface state of grinding pad.It is set in the present embodiment two specific
Current value the step of, be result and gasket adjuster 80 according to wafer marathon test in specific speed motion process
Electric current variation, the service life of grinding pad 30 is set as a specific current value.
The present embodiment is second is that by the variation of the surface roughness state of grinding pad 30, and gasket adjuster 80 is relative to grinding pad
30 change in friction force and gasket adjuster 80 is relative to electric current of the grinding pad 30 with specific speed in motion process is ground
Contact is established between variation three to determine whether grinding pad 30 reaches service life, when gasket adjuster 80 is relative to grinding pad
30 with specific speed when the curent change in grinding motion process reaches a certain specific current value, judge that grinding pad 30 reaches
Otherwise the service life time limit judges to be not up to service life time limit.Due in process of lapping, the rough surface of grinding pad 30
During the variation of degree state, gasket adjuster 80 is also changing relative to the frictional force of grinding pad 30, at this time by monitoring gasket tune
Whole device 80 is relative to curent change of the grinding pad 30 with specific speed in motion process is ground, thus by the surface of grinding pad 30
Roughness state, change in friction force and curent change opening relationships, and since curent change can be monitored in real time, prison
Real-time curent change is surveyed for judging that the service life time limit of grinding pad 30 is ground than in the prior art using access times judgement
The mode for grinding the service life of pad 30 is more accurate, reliable, can avoid because of the access times of grinding pad 30 and on the basis of the time
Judgment mode in, grinding pad 30 excessively use damaged caused by crystal column surface and grinding pad 30 not up to service life
During the time limit caused by the utilization rate of grinding pad 30 wasting phenomenon.Therefore, the present invention has whether accurate judgement grinding pad 30 surpasses
Go out the technique effect for the utilization rate that grinding pad 30 is improved using life span.
As the monitoring method for 30 service life of grinding pad that preferable embodiment, the present embodiment two provide, work as gasket
Adjuster 80 is being ground with gasket adjuster 80 relative to the change in friction force of grinding pad 30 relative to grinding pad 30 with specific speed
When grinding the curent change direct proportionality in motion process, when frictional force reduces, the surface roughness of grinding pad 30 is represented
State is reduces, when sensing gasket adjuster 80 is become relative to grinding pad 30 with electric current of the specific speed in motion process is ground
When change is reduced to a certain specific current value, judge that grinding pad 30 has reached the service life time limit, otherwise judge not up to use
Life span.
As the monitoring method for 30 service life of grinding pad that preferable embodiment, the present embodiment two provide, work as gasket
Adjuster 80 is being ground with gasket adjuster 80 relative to the change in friction force of grinding pad 30 relative to grinding pad 30 with specific speed
When grinding the inversely proportional relationship of curent change in motion process, when frictional force reduces, the surface roughness of expression grinding pad 30
State is reduces, when sensing gasket adjuster 80 is become relative to grinding pad 30 with electric current of the specific speed in motion process is ground
When change is increased to a certain specific current value, judge that grinding pad 30 has reached the service life time limit, otherwise judge not up to use
Life span.Such as in order to overcome when stablizing and avoiding interference of the current value of proportional relationship, in the electric current of proportional relationship
Being worth output terminal increases phase inverter, makes the inversely proportional relationship of roughness of current value and grinding pad 30, to overcome signal interference and electricity
Flow valuve stablizes the purpose of output.
As the monitoring method for 30 service life of grinding pad that preferable embodiment, the present embodiment two provide, including setting
The step of putting current sensor 90 is grinding motion process relative to grinding pad 30 to sense gasket adjuster 80 with specific speed
In curent change, i.e. current variation value.In the present embodiment two, current sensor 90 is preferably arranged on gasket adjuster 80
The step of, it is closer to the distance with easy for installation, when avoiding being mounted on other positions, caused by excessive line or device to grinding
Adverse effect caused by mill.Wherein, the setting of current sensor 90 is by the way of wired or wireless.In addition, electric current passes
Sensor 90 can also use other current inductor parts other such as current transformer to substitute.
Fig. 6 is please referred to, the monitoring method for 30 service life of grinding pad that the present embodiment two provides further includes setting controller
100 the step of, for record current value and judges whether current value reaches a certain specific current value；And setting shows equipment
101 the step of, for real-time display current value.Controller 100 has the effect for setting specific current value immediately, can basis
The test case of the grinding pad 30 of different batches, adjusts specific current value, to improve the judgement of its 30 service life of grinding pad
Accuracy.Variation of the equipment 101 for the real-time display current value is shown, for analyzing and adjusting.
The monitoring method of the present invention, for the grinding pad 30 of different batches, by monitoring patch adjuster 80 relative to grinding
Mill pad 30 with specific speed grind move when required electric current size monitor 30 service life of grinding pad, it is ensured that grinding
Pad 30 was fully utilized and without departing from the 30 service life time limit of grinding pad, and can be with when encountering abnormal grinding pad 30
It timely feedbacks, caused work when can not monitor 30 unusual condition of grinding pad in real time when overcoming access times monitoring in the prior art
Ethics and practice danger, has and improves production efficiency, reduces the technique effect of economic loss.
In technology present invention could apply to all chemical mechanical grindings of semiconductor, such as 90nm, 65nm, 45nm
Wait the production of the storage chips such as semiconductive logic devices, memory body.Monitoring device and monitoring method using the present invention, by
The current sensor 90 increased newly on gasket adjuster 80 is existed to sense gasket adjuster 80 relative to grinding pad 30 with specific speed
The size of required electric current is, it can be achieved that the accurate measurements in the service life time limit to grinding pad 30, effectively carry during grinding movement
The utilization rate of high grinding pad, and super number is damaged using grinding pad caused by wafer between avoiding time-out, is encountering abnormal grind
It can be timely feedbacked during mill pad, improve the production efficiency of technique, reduce economic loss.
In conclusion the above embodiment of the present invention one and embodiment two are respectively provided with following technique effect：
1st, the accurate measurements to useful time of grinding pad, i.e. accurate judgement can be achieved；
2nd, the utilization rate of grinding pad is improved；
3rd, it avoids and is damaged caused by wafer using grinding pad between time-out；
When the 4th, encountering abnormal grinding pad, it can timely feedback；
5th, plant-manufactured production efficiency is improved, reduces the economic loss being likely to occur.
The present invention is not limited to above-mentioned specific embodiment, all various changes made within the spirit and scope of the present invention
Change, within protection scope of the present invention.
Claims (10)
1. a kind of monitoring method of useful time of grinding pad, which is characterized in that by sensing gasket adjuster relative to grinding pad
With curent change of the specific speed in motion process is ground, change in friction force of the gasket adjuster relative to grinding pad is reacted,
To represent the variation of the surface roughness state of grinding pad, the step of whether grinding pad reaches service life determined；Work as gasket
Adjuster relative to grinding pad with specific speed when the curent change in grinding motion process reaches a certain specific current value,
Judge that grinding pad has reached the service life time limit, otherwise judge to be not up to the service life time limit.
2. the monitoring method of useful time of grinding pad as described in claim 1, which is characterized in that including setting specific electric current
The step of value；According to the result of wafer marathon test and gasket adjuster with the change of the electric current in specific speed motion process
Change, the service life of grinding pad is set as a specific current value.
3. the monitoring method of useful time of grinding pad as described in claim 1, which is characterized in that when gasket adjuster relative to
The change in friction force of grinding pad is become with gasket adjuster relative to grinding pad with electric current of the specific speed in motion process is ground
When being melted into proportional relationship, when frictional force reduces, the surface roughness state of grinding pad is represented to reduce, when sensing gasket tune
Whole device relative to grinding pad with specific speed when the curent change in grinding motion process is reduced to a certain specific current value,
Judge that grinding pad has reached the service life time limit, otherwise judge to be not up to the service life time limit.
4. the monitoring method of useful time of grinding pad as described in claim 1, which is characterized in that when gasket adjuster relative to
The change in friction force of grinding pad is become with gasket adjuster relative to grinding pad with electric current of the specific speed in motion process is ground
When being melted into inversely prroportional relationship, when frictional force reduces, the surface roughness state of grinding pad is represented to reduce, when sensing gasket tune
Whole device relative to grinding pad with specific speed when the curent change in grinding motion process is increased to a certain specific current value,
Judge that grinding pad has reached the service life time limit, otherwise judge to be not up to the service life time limit.
5. the monitoring method of useful time of grinding pad as described in claim 1, which is characterized in that including setting current sensor
The step of, to sense gasket adjuster relative to curent change of the grinding pad with specific speed in motion process is ground.
6. the monitoring method of useful time of grinding pad as claimed in claim 5, which is characterized in that including current sensor is set
It puts the gasket adjuster the step of.
7. the monitoring method of useful time of grinding pad as described in claim 1, which is characterized in that further include setting controller
Step for record current value and judges whether current value reaches a certain specific current value；And setting shows the step of equipment
Suddenly, for real-time display current value.
8. a kind of monitoring device of useful time of grinding pad, which is characterized in that including shaft, grinding table, grinding pad, grinding head,
Lapping liquid delivery pipe, gasket adjuster, which is characterized in that further include current sensor, for sense gasket adjuster relative to
Current variation value in grinding pad motion process.
9. the monitoring device of useful time of grinding pad as claimed in claim 8, which is characterized in that the current sensor setting
In on gasket adjuster.
10. the monitoring device of useful time of grinding pad as claimed in claim 8, which is characterized in that further include to record electricity
Flow valuve and judge controller and the display for real-time display current value that whether current value reach a certain specific current value
Equipment.
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| CN201711394144.XA CN108145594A (en) | 2017-12-21 | 2017-12-21 | The monitoring method and monitoring device of useful time of grinding pad |
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Application publication date: 20180612 |