CN108134309B - Micro-groove group heat sink fluid supplementing device - Google Patents
Micro-groove group heat sink fluid supplementing device Download PDFInfo
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- CN108134309B CN108134309B CN201810144000.7A CN201810144000A CN108134309B CN 108134309 B CN108134309 B CN 108134309B CN 201810144000 A CN201810144000 A CN 201810144000A CN 108134309 B CN108134309 B CN 108134309B
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- 239000012530 fluid Substances 0.000 title claims abstract description 27
- 230000001502 supplementing effect Effects 0.000 title abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 238000001704 evaporation Methods 0.000 claims abstract description 27
- 230000008020 evaporation Effects 0.000 claims abstract description 27
- 238000001802 infusion Methods 0.000 claims abstract description 24
- 238000009736 wetting Methods 0.000 claims abstract description 10
- 230000005684 electric field Effects 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000002637 fluid replacement therapy Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 4
- 230000002028 premature Effects 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 24
- 230000004907 flux Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000009833 condensation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
Abstract
The present disclosure provides a micro-groove group heat sink fluid infusion device, comprising: the evaporation micro-channel group heat sink comprises a plurality of micro-channels, wherein the micro-channels are positioned on the side surface or the bottom surface of a cavity structure of a radiator or an evaporator, and each micro-channel extends on the side surface or the bottom surface of the cavity structure according to an extending direction; and a plurality of electrodes including a high voltage electrode and a ground electrode for applying a directional driving force in the extending direction to the liquid in the micro channel to increase the liquid wetting length in the micro channel. The micro-groove group heat sink liquid supplementing device avoids heat transfer deterioration caused by premature drying in the micro-groove group heat sink, has the advantages of simple structure, stability, reliability, convenience in processing and installation, lower cost and good application value.
Description
Technical Field
The present disclosure relates to the field of heat dissipation and cooling technologies, and in particular, to a micro-groove group heat sink fluid infusion device, which can be applied to a heat dissipation and heat control system under high heat flux of electronic components and other optoelectronic devices.
Background
With the miniaturization, high power and high-speed development of large-scale integrated circuits of electronic devices, the heating value of the electronic devices in unit volume is greatly increased, and if the heating cannot be timely eliminated, the use of the electronic devices is greatly influenced, even the electronic devices are destructively damaged. The traditional heat dissipation modes such as air cooling and water cooling are gradually unable to meet the increasingly severe heat dissipation requirements due to the factors of low self efficiency, unsafe and the like. Therefore, development of a heat dissipation technology with high efficiency is urgent.
The micro-groove group composite phase change heat exchange technology becomes a current novel heat dissipation means by the characteristics of high heat exchange coefficient, stable work and the like. Taking an open rectangular capillary micro-groove heat sink as an example, the heat sink can realize high heat exchange capacity by utilizing a composite phase change mechanism of high-intensity evaporation of an evaporation thin liquid film region near a three-phase contact line in the micro-groove and nuclear boiling of a liquid working medium in a thick liquid film region.
Patent 200720103514.5 discloses a heat control system, in the traditional evaporation-condensation heat exchange system, micro-groove groups are arranged in an evaporator and a condenser, and the characteristics of high heat exchange intensity of the micro-groove group phase change heat exchange technology are utilized to enable evaporation heat exchange and condensation of working media to be more efficient, so that the heat exchange of the system is enhanced.
Patent 201310111572.2 discloses a micro-groove group composite phase change radiator, and a micro-groove group structure formed by a plurality of micro-groove channels on the order of micrometers is arranged on a radiating surface in an inner cavity.
However, the micro-groove group radiator is easy to dry up under the condition of higher heat flow density, so that the heat exchange condition is worsened.
Disclosure of Invention
First, the technical problem to be solved
In view of the technical problems, the present disclosure provides a micro-groove group heat sink fluid infusion device, which avoids heat transfer deterioration caused by premature drying in a micro-groove group heat sink, has a simple structure, is stable and reliable, is convenient to process and install, has low cost, and has good application value.
(II) technical scheme
The present disclosure provides a micro-groove group heat sink fluid infusion device, comprising: the evaporation micro-channel group heat sink comprises a plurality of micro-channels, wherein the micro-channels are positioned on the side surface or the bottom surface of a cavity structure of a radiator or an evaporator, and each micro-channel extends on the side surface or the bottom surface of the cavity structure according to an extending direction; and a plurality of electrodes including a high voltage electrode and a ground electrode for applying a directional driving force in the extending direction to the liquid in the micro channel to increase the liquid wetting length in the micro channel.
In some embodiments, the cavity structure is a cylinder, the plurality of microchannels are located on sides of the cavity structure, and the extending direction of each microchannel is parallel to the axial direction of the cavity structure; the high-voltage electrode is arranged on the top surface of the cavity structure, and the grounding electrode is arranged on the bottom surface of the cavity structure; or the high-voltage electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the top surface, and the grounding electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the bottom surface.
In some embodiments, the cavity structure is a cylinder, the micro channels are located on the bottom surface of the cavity structure, the extending direction of each micro channel is perpendicular to the axial direction of the cavity structure, the high-voltage electrode is arranged on the bottom surface of the cavity structure and located at one end of the micro channel, and the grounding electrode is arranged on the bottom surface of the cavity structure and located at the other end of the micro channel.
In some embodiments, the micro-channel is triangular, rectangular, trapezoidal, or U-shaped in cross-section; the width and depth of the micro-channels are both in the range of 0.01-10mm, and the spacing between adjacent micro-channels is in the range of 0.01-10 mm.
In some embodiments, the high voltage electrode is in the range of 1-100mm from the end of the micro-channel near the high voltage electrode, and the ground electrode is in the range of 1-100mm from the end of the micro-channel near the ground electrode.
In some embodiments, the high voltage electrode is a flat electrode, a cylindrical electrode, a needle electrode, or a wire electrode as the positive electrode, and the ground electrode is a flat electrode, a cylindrical electrode, a needle electrode, or a wire electrode as the negative electrode.
In some embodiments, the flat electrode is in the range of 1-100mm in length and width and 0.1-10mm in thickness; the radius of the columnar electrode is in the range of 1-50 mm; the curvature radius of the needle-shaped electrode needle point is in the range of 0.01-5 mm; the radius of the linear electrode is in the range of 0.01-1mm, and the length is in the range of 1-500 mm.
In some embodiments, the micro-groove group heat sink fluid infusion device further comprises an insulating device; wherein the high voltage electrode is insulated from the cavity structure by the insulating means.
In some embodiments, the micro-groove group heat sink fluid infusion device further comprises a high-voltage device connected with the high-voltage electrode for providing high voltage.
In some embodiments, the insulating device is made of ceramic or organic plastic; the high-voltage equipment is a high-voltage power supply or a transformer.
(III) beneficial effects
According to the technical scheme, the micro-groove group heat sink fluid infusion device has at least one of the following beneficial effects:
(1) The liquid supplementing device for the micro-groove group heat sink can prevent liquid in the micro-groove group heat sink from being blocked and gradually dried when the heat flux density is higher, improves the evaporation heat exchange capacity of the micro-groove group heat sink under the high heat flux density, and effectively avoids unstable heat exchange and deterioration of heat exchange conditions caused by evaporation drying.
(2) The micro-groove group heat sink fluid infusion device is light, simple, safe, reliable and low in cost.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent from the accompanying drawings. Like reference numerals designate like parts throughout the drawings, and the drawings are not intended to be drawn to scale, such as to actual dimensions, with emphasis instead being placed upon illustrating the principles of the disclosure.
Fig. 1 is a schematic structural diagram of a fluid infusion device according to an embodiment of the disclosure.
Fig. 2 is a schematic structural diagram of a fluid infusion device according to another embodiment of the disclosure.
Fig. 3 is a schematic structural diagram of a fluid infusion device according to another embodiment of the disclosure.
< Description of symbols >
The heat radiator comprises a cavity structure of a 1-radiator, a 2-grounding electrode, a 3-micro-groove group heat sink, a 4-micro-groove, a 5-high voltage electrode, a 6-heat preservation hose, a 7-condenser, an 8-condensation water return pipe, a 9-micro check valve and a cavity structure of a 10-evaporator.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
In the drawings or description, like or identical parts are provided with the same reference numerals. Implementations not shown or described in the drawings are forms known to those of ordinary skill in the art. Additionally, although examples of parameters including particular values may be provided herein, it should be appreciated that the parameters need not be exactly equal to the corresponding values, but may be approximated to the corresponding values within acceptable error margins or design constraints. Directional terms such as "upper", "lower", "front", "rear", "left", "right", etc. mentioned in the embodiments are merely directions referring to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is not intended to limit the scope of the disclosure.
The micro-groove group heat sink liquid supplementing device provided by the disclosure avoids the situation of heat transfer deterioration caused by premature drying in the micro-groove group heat sink, and has the advantages of simple structure, stability, reliability, convenience in processing and installation, low cost and good application value.
Specifically, the micro-groove group heat sink fluid infusion device of the present disclosure includes: the evaporation micro-channel group heat sink comprises a plurality of micro-channels, wherein the micro-channels are positioned on the side surface or the bottom surface of a cavity structure of a radiator or an evaporator, and each micro-channel extends on the side surface or the bottom surface of the cavity structure according to an extending direction; and a plurality of electrodes including a high voltage electrode and a ground electrode for applying a directional driving force in the extending direction to the liquid in the micro channel to increase the liquid wetting length in the micro channel.
By adopting the liquid supplementing device, the mechanism of liquid supplementing in the electric field enhanced micro-groove group heat sink is specifically as follows: when the heating power of the heating element is larger, the heat flux density applied to the heating surface of the micro-groove group heat sink is larger, the liquid in the micro-groove is heated and evaporated to be aggravated, the liquid film is gradually thinned, the flow resistance is increased, the wetting length is reduced, and the heat dissipation capacity is reduced. After the directional electric field parallel to the extending direction of the micro-groove group heat sink is applied, the electric field applies directional driving force to the liquid in the micro-groove channel, so that the wetting length of the liquid working medium in the micro-groove heat sink is increased under the same heat flux density, the liquid wages are continuously and timely supplemented, and the evaporation heat exchange intensity is improved.
More specifically, the cavity structure may be a cylinder, and the plurality of micro channels may be located on a side surface of the cavity structure, and an extension direction of each micro channel is parallel to an axial direction of the cavity structure; the high-voltage electrode is arranged on the top surface of the cavity structure, and the grounding electrode is arranged on the bottom surface of the cavity structure; or the high-voltage electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the top surface, and the grounding electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the bottom surface. In addition, the micro channels can be located on the bottom surface of the cavity structure, the extending direction of each micro channel is perpendicular to the axial direction of the cavity structure, the high-voltage electrode is arranged on the bottom surface of the cavity structure and located at one end of the micro channel, and the grounding electrode is arranged on the bottom surface of the cavity structure and located at the other end of the micro channel. According to the method, the directional high-voltage electric field is applied near the micro-groove group heat sink, and the liquid working medium in the micro-groove group heat sink can be continuously supplemented under the higher heat flux density by utilizing the electric field force effect, so that the evaporation heat dissipation capacity of the micro-groove group heat sink when the micro-groove group heat sink is used for coping with the higher heat flux density is enhanced.
It should be noted that, the cavity structure may also be a cuboid or a cube, and the arrangement mode of the micro-channel and the electrode may be similar to that when the cavity structure is a cylinder, and may also be properly adjusted, which is not described herein.
When the liquid is in boiling condition, the heat exchange coefficient is relatively high, but the liquid has instability, for example, when the liquid is boiled, sudden dryness is caused, and heat exchange is extremely bad due to great heat resistance. The present disclosure proposes a heat dissipation mode that can withstand higher heat flux densities in pure evaporation situations, enabling the heat exchange process to be within a controllable range. After the heat flux density is increased, the liquid film is gradually thinned, the thermal resistance is increased, and the wetting length is reduced. However, after the electric field is applied, directional driving force is applied to the fluid, so that the mass flow is increased, the thermal resistance is reduced, the wetting length in the micro-groove group heat sink is increased, and the effect of improving the pure evaporation heat exchange strength is achieved.
Specifically, the outer surface of the heating element is closely attached to or directly used as a part of one outer surface of the micro-groove group heat sink, a micro-groove channel is arranged on the inner wall surface of the micro-groove group heat sink heating surface, and one or two electrodes are arranged at two ends of the micro-groove group heat sink heating surface. Wherein the distance between the two electrodes and one end of the micro-groove group which is close to the two electrodes is in the range of 1-100 mm.
The section of the micro-channel on the micro-channel group heat sink heating surface is triangular, rectangular, trapezoidal or U-shaped, the channels are longitudinally and parallelly distributed and arranged, and the width and depth of the channels and the micro-channel spacing are all in the range of 0.01-10 mm.
The material of the micro-groove heating surface is metal and alloy with better heat conductivity.
The electrode consists of a high-voltage positive electrode or a high-voltage negative electrode and a grounding electrode. The electrode is a flat electrode or a cylindrical electrode or a needle electrode or a linear electrode. Wherein the length and width of the flat electrode are within the range of 1-100mm, and the thickness is within the range of 0.5-10 mm; the radius of curvature of the needle-shaped electrode needle tip is in the range of 0.01-5 mm; the radius of the columnar electrode is in the range of 1-50 mm; the radius of the linear electrode is in the range of 0.01-1mm, and the length is in the range of 1-500 mm.
The high-voltage electrode is fixed on the radiator through welding or mechanical connection or bonding, is insulated from the outer surface of the radiator through an insulating device, and is connected with high-voltage equipment after being led out of the radiator.
The grounding electrode is connected with the radiator cavity and grounded through a grounding wire.
The insulating device material is ceramic or organic plastic and other materials with good insulativity.
The high-voltage equipment is equipment such as a high-voltage power supply or a transformer and the like which can provide high voltage.
The disclosure is further described in detail below with reference to the attached drawings and examples:
Example 1
As shown in fig. 1, the cavity structure 1 of the radiator is approximately a cylinder, and the evaporation micro-groove group heat sink 3 is arranged on the side surface of the cavity structure (the side surface area where the evaporation micro-groove group heat sink 3 is positioned is a plane); specifically, the side surface of the fluid infusion device is used as a heat receiving surface of the micro-groove group heat sink to be tightly connected with a heating element, a rectangular micro-groove channel is formed on the heat receiving inner surface to form an evaporation micro-groove group heat sink 3, and the size of the groove channel is as follows: the groove width is 0.3mm, the groove depth is 0.7mm, and the groove spacing is 0.4mm. And a flat high-voltage electrode 5 and a grounding electrode 2 are arranged at the 5mm positions, which are respectively located above and below the micro-groove group heat sink heating surface 3 and are away from the two ends of the micro-groove, wherein the high-voltage electrode 5 is connected with a high-voltage power supply, the grounding electrode and the cathode of the high-voltage power supply are grounded together, and a high-voltage electric field along the axial direction of the micro-groove is generated between the two electrodes. When the heating element heats, the liquid working medium climbs in the micro channel 4 under the drive of the electric field force and the capillary force to form a certain wetting height, and the evaporation is increased along with the increase of the heating power, the liquid working medium continuously supplements the dryness of the evaporation section caused by the heated evaporation under the action of the electric field force and becomes steam under the high-intensity evaporation. The steam is condensed on the inner wall surface of the non-heating surface, and the condensate flows back to the liquid working medium. The heat of condensation of the steam is dissipated to the outside through natural convection or air cooling.
Example 2
As shown in fig. 2, the cavity structure 1 of the radiator is a cylinder, and the bottom surface of the cavity structure is provided with an evaporation micro-groove group heat sink 3; specifically, the heating element is closely attached to the outer surface of the bottom heating surface, a rectangular micro-channel 4 is arranged on the inner surface of the heating surface to form an evaporation surface of the evaporation micro-channel group heat sink 3, and the size of the channel is as follows: the groove width is 0.3mm, the groove depth is 0.6mm, and the groove spacing is 0.4mm. The high-voltage electrodes and the grounding electrodes are respectively arranged on the same surface of the micro-groove group heat sink heating surface along the two sides of the axial opening of the micro-groove and 5mm away from the two ends of the micro-groove, so that the micro-groove group heat sink heating surface is completely in the electric field range between the two electrodes. When the heating element heats, the liquid working medium is driven to flow in the channel by the electric field force, evaporation and boiling are enhanced, steam is condensed on the inner wall surface of the side face, and condensate flows back to the working medium. The heat of condensation of the steam is dissipated to the outside through natural convection or air cooling.
Example 3
As shown in fig. 3, a rectangular cavity is made of stainless steel to form a cavity structure 10 of the evaporator, a rectangular micro-channel is formed on a heating surface of one side surface in the cavity to form an evaporation micro-channel group heat sink 3, and the size of the channel is as follows: the groove width is 0.3mm, the groove depth is 0.7mm, and the groove spacing is 0.4mm. A flat high-voltage electrode 5 and a grounding electrode 2 are arranged at the 5mm positions, which are respectively away from the two ends of the micro-groove group heat sink, of the upper and lower heating surfaces of the micro-groove group heat sink 3, wherein the high-voltage electrode 5 is connected with a high-voltage power supply through a vacuum electrode arranged on an evaporator and is isolated from a metal cavity of the evaporator through a ceramic heat insulation element; the grounding electrode 2 is welded on the evaporator cavity and is grounded with the cathode of the high-voltage electrode, and a high-voltage electric field parallel to the micro-channel is generated between the two electrodes. And vacuumizing the cavity, wherein the liquid working medium is R123. When the heating element heats, the liquid working medium climbs in the micro channel under the drive of electric field force and capillary force to form a certain wetting height, and becomes steam under high-intensity evaporation and boiling. One end of 1 polyurethane heat-insulating hose 6 with inner diameter of 10mm is connected with the steam outlet of the evaporator, and the other end is connected with the steam inlet of the condenser. The steam enters the condenser 7 for condensation via the condenser steam inlet along the insulated hose 6. The condensate flows out of the condenser 7 and then enters the condensate return pipe 8 and returns to the liquid inlet of the cavity structure 10 of the evaporator through the micro check valve 9, and the cycle is repeated.
In summary, the micro-groove group heat sink fluid infusion device disclosed by the invention is efficient, safe and reliable, low in power consumption and small in occupied area, and solves the problems of insufficient evaporation heat exchange capacity, sudden dry boiling, unstable heat exchange process and the like of the conventional radiator.
Thus, embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. From the foregoing description, those skilled in the art will clearly recognize that the micro-groove group heat sink fluid infusion device of the present disclosure.
It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the elements and methods are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
Similarly, it should be appreciated that in the above description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A micro-groove group heat sink fluid infusion device comprises:
The evaporation micro-channel group heat sink comprises a plurality of micro-channels, wherein the micro-channels are positioned on the side surface or the bottom surface of a cavity structure of a radiator or an evaporator, and each micro-channel extends on the side surface or the bottom surface of the cavity structure according to an extending direction; and
And a plurality of electrodes, including a high-voltage electrode and a ground electrode, for generating an electric field parallel to the micro-channel, for applying a directional driving force along the extending direction to the liquid in the micro-channel so as to increase the liquid wetting length in the micro-channel.
2. The micro-channel group heat sink fluid replacement device of claim 1, wherein the cavity structure is a cylinder, the plurality of micro-channels are positioned on the side surface of the cavity structure, and the extending direction of each micro-channel is parallel to the axial direction of the cavity structure; the high-voltage electrode is arranged on the top surface of the cavity structure, and the grounding electrode is arranged on the bottom surface of the cavity structure; or the high-voltage electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the top surface, and the grounding electrode is arranged on the side surface of the cavity structure and is positioned in the area between the micro-channel and the bottom surface.
3. The micro-channel group heat sink fluid infusion device according to claim 1, wherein the cavity structure is a cylinder, the micro-channels are located on the bottom surface of the cavity structure, the extending direction of each micro-channel is perpendicular to the axial direction of the cavity structure, the high-voltage electrode is arranged on the bottom surface of the cavity structure and located at one end of the micro-channel, and the grounding electrode is arranged on the bottom surface of the cavity structure and located at the other end of the micro-channel.
4. The micro-channel group heat sink fluid infusion device of claim 1, wherein the cross section of the micro-channel is triangular, rectangular, trapezoidal or U-shaped; the width and depth of the micro-channels are both in the range of 0.01-10mm, and the spacing between adjacent micro-channels is in the range of 0.01-10 mm.
5. The micro-groove group heat sink fluid infusion device according to claim 1, wherein the distance between the high-voltage electrode and one end of the micro-groove close to the high-voltage electrode is in the range of 1-100mm, and the distance between the grounding electrode and one end of the micro-groove close to the grounding electrode is in the range of 1-100 mm.
6. The micro-groove group heat sink fluid infusion device according to claim 1, wherein the high-voltage electrode is a flat plate electrode, a cylindrical electrode, a needle electrode or a linear electrode as a positive electrode, and the grounding electrode is a flat plate electrode, a cylindrical electrode, a needle electrode or a linear electrode as a negative electrode.
7. The micro-groove group heat sink fluid infusion device according to claim 6, wherein the length and the width of the flat plate electrode are both in the range of 1-100mm, and the thickness is in the range of 0.1-10 mm; the radius of the columnar electrode is in the range of 1-50 mm; the curvature radius of the needle-shaped electrode needle point is in the range of 0.01-5 mm; the radius of the linear electrode is in the range of 0.01-1mm, and the length is in the range of 1-500 mm.
8. The micro-groove group heat sink fluid infusion device of claim 1, further comprising an insulating device; wherein the high voltage electrode is insulated from the cavity structure by the insulating means.
9. The micro-groove group heat sink fluid infusion device of claim 8, further comprising a high voltage device connected to the high voltage electrode for providing high voltage.
10. The micro-groove group heat sink fluid infusion device according to claim 9, wherein the insulating device is made of ceramic or organic plastic; the high-voltage equipment is a high-voltage power supply or a transformer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810144000.7A CN108134309B (en) | 2018-02-11 | 2018-02-11 | Micro-groove group heat sink fluid supplementing device |
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| CN201810144000.7A CN108134309B (en) | 2018-02-11 | 2018-02-11 | Micro-groove group heat sink fluid supplementing device |
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| CN108134309A CN108134309A (en) | 2018-06-08 |
| CN108134309B true CN108134309B (en) | 2024-04-26 |
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| CN201044554Y (en) * | 2007-02-07 | 2008-04-02 | 中国科学院工程热物理研究所 | Water cooling type microflute group and thermoelectricity composite laser thermal control system |
| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
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| CN201044554Y (en) * | 2007-02-07 | 2008-04-02 | 中国科学院工程热物理研究所 | Water cooling type microflute group and thermoelectricity composite laser thermal control system |
| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
| EP2896926A1 (en) * | 2014-01-17 | 2015-07-22 | Alcatel Lucent | A heat transfer apparatus |
| CN207884061U (en) * | 2018-02-11 | 2018-09-18 | 中国科学院工程热物理研究所 | Microflute group is heat sink liquid supply device |
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