CN108183075A - A kind of silver alloy bonding wire and its manufacturing method - Google Patents
A kind of silver alloy bonding wire and its manufacturing method Download PDFInfo
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- CN108183075A CN108183075A CN201711444061.7A CN201711444061A CN108183075A CN 108183075 A CN108183075 A CN 108183075A CN 201711444061 A CN201711444061 A CN 201711444061A CN 108183075 A CN108183075 A CN 108183075A
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- 229910001316 Ag alloy Inorganic materials 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 20
- 239000000654 additive Substances 0.000 claims abstract description 18
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 7
- 229910052738 indium Inorganic materials 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 5
- 238000000137 annealing Methods 0.000 claims description 97
- 238000005491 wire drawing Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 239000010931 gold Substances 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 6
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 230000035939 shock Effects 0.000 abstract description 11
- 238000005987 sulfurization reaction Methods 0.000 abstract description 11
- 238000012360 testing method Methods 0.000 abstract description 10
- 230000003712 anti-aging effect Effects 0.000 abstract description 7
- 230000032683 aging Effects 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 23
- 239000011575 calcium Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Abstract
A kind of silver alloy bonding wire, it is characterised in that by weight containing Au 3.5 10%, Pd 1 5%, trace additives 2 500 ppm, surplus Ag；The trace additives are combinations more than one kind or two of which in Ca, Cu, Be, In, Si and Ge.The present invention also provides a kind of manufacturing methods of above-mentioned silver alloy bonding wire.The silver alloy bonding wire of the present invention has the advantages that：（1）Sulfuration resistant is had excellent performance；（2）Anti-aging property is excellent, improves reliability of the encapsulating products in thermal shock test, under equal aging condition（‑40℃~100℃）, silver alloy bonding wire of the invention can be subjected to the thermal shock of 200 250 bouts, and conventional silver alloys bonding wire can only be subjected to the thermal shock of 100 bouts；（3）Routing operation window has greatly good workability；（4）FAB burning balls are good, and no sliding ball, the bond strength of solder joint is big, and reliability is high.
Description
Technical field
The present invention relates to the bonding wires of IC, LED encapsulation, and in particular to a kind of silver alloy bonding wire and its manufacturing method.
Background technology
Bonding wire（Bonding wire, also known as bonding line）It is connection chip and outer enclosure substrate（substrate）With/
Or multilayer circuit board（PCB）Main connection mode.The development trend of bonding wire, from the line of production, mainly line footpath is subtle
Change, the high workshop service life（floor life）And high spool length；Chemically on ingredient, mainly there is copper wire（Including bare copper wire, plating
Palladium copper wire dodges gold plating palladium copper wire）Significantly replace gold thread in semiconductor applications, and silver wire and silver alloy wire are in LED and part
IC package applies upper substitution gold thread.Due to miniaturization of electronic products and the demand for development of thin thinning, semicon industry passes through chip
Thickness be thinned (Wafer thinning), encapsulation using chip stack (Die stacking), flip-chip (flip chip),
Wafer-level packaging（wafer level packaging）, 2.5D and 3D the methods of encapsulating cope with, however traditional bonding packaging
（wire bonding）It is still mainstream packing forms.
Existing silver alloy bonding wire contains silver（Ag）, gold（Au）And palladium（Pd）, Pd（Palladium）The anti-aging of wire rod can be improved
Performance improves reliability of the encapsulating products in thermal shock test；Gold（Au）It can be with sulfur resistive, so as to have silver alloy bonding wire
Normal workability, it is good that FAB burns ball, it may have certain sulfuration resistant ability and ageing resistance.But this silver alloy key
The sulfuration resistant performance and anti-aging property of plying are still not ideal enough, influence the service life of product after encapsulation.
Invention content
The technical problems to be solved by the invention are to provide a kind of silver alloy bonding wire and this silver alloy bonding wire
Manufacturing method, this silver alloy bonding wire have excellent sulfuration resistant performance and anti-aging property, and with good workability with
Reliability.The technical solution of use is as follows：
A kind of silver alloy bonding wire, it is characterised in that by weight containing Au 3.5-10%, Pd 1-5%, trace additives 2-
500 ppm, surplus Ag；The trace additives are more than one kind or two of which in Ca, Cu, Be, In, Si and Ge
Combination.
It is preferred that the weight percent content of Ag is 86-90% in above-mentioned silver alloy bonding wire.
In a kind of preferred embodiment, the composition of above-mentioned trace additives is Ca 200-300ppm, Si 100-200ppm.
In another preferred embodiment, the composition of above-mentioned trace additives is Ca 50-100ppm, Be 1-50ppm, Cu
40-100ppm、In 40-60ppm。
In another preferred embodiment, the compositions of above-mentioned trace additives is Ca 100-200ppm, Si 40-60 ppm,
In 20-40ppm。
In another preferred embodiment, the compositions of above-mentioned trace additives is Ca 150-250ppm, Si 80-120 ppm,
Be 20-40ppm、Cu 40-60ppm。
In another preferred embodiment, the composition of above-mentioned trace additives is Ca 50-100ppm, Cu 130-150ppm.
It is preferred that a diameter of 15-40um of above-mentioned silver alloy bonding wire.
In the silver alloy bonding wire of the present invention, Ca（Calcium）Contribute to the raising of the recrystallization temperature of silver alloy bonding wire, increase
Add the structural stability and intensity of silver alloy bonding wire；Be（Beryllium）Help to promote the sulfuration resistant ability of silver alloy bonding wire and resist
Aging ability；Cu（Copper）The ageing resistance for promoting silver alloy bonding wire is helped, and increases the routing operation of silver alloy bonding wire
Window；In（Indium）There is wettability effect, two weldering pulling force and 1 weldering pulling force can be increased；Ge（Germanium）Help to promote silver alloy bonding wire
Oxidation resistance and sulfuration resistant ability, and improve the bond strength of solder joint；The addition of Si elements can promote silver alloy wire rod
Toughening and intensity.It, can by adding the element combinations such as suitable Ca, Be, Cu, In, Ge and Si on the basis of Ag, Au and Pd
Greatly improve the sulfuration resistant performance and anti-aging property of silver alloy bonding wire, at the same make the workability of silver alloy bonding wire with can
Also it is improved by property.
The present invention also provides a kind of manufacturing methods of above-mentioned silver alloy bonding wire, it is characterised in that includes the following steps：
（1）Founding：Au, Pd and trace additives are added in silver material in proportion, it is continuous by vacuum melting and orientation
Draw casting process, obtain wire rod 6-8 millimeters a diameter of；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 50-280um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-
120m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, and the silver for obtaining a diameter of 15-40um closes
Gold thread；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-120m/
min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 20-30 DEG C, obtains required silver alloy bonding wire.
The silver alloy bonding wire of the present invention has the advantages that：
（1）Sulfuration resistant is had excellent performance；
（2）Anti-aging property is excellent, improves reliability of the encapsulating products in thermal shock test；Under equal aging condition（-40
℃~100℃）, silver alloy bonding wire of the invention can be subjected to the thermal shock of 200-250 bouts, and conventional silver alloys bonding wire
It can only be subjected to the thermal shock of 100 bouts；
（3）Routing operation window has greatly good workability；
（4）FAB burning balls are good, and no sliding ball, the bond strength of solder joint is big, and reliability is high.
Specific embodiment
Embodiment 1
By weight containing Au 7%, Pd 2%, Ca 250ppm, Si 150ppm, surplus is the copper alloy bonding wire of the present embodiment
Silver.
The manufacturing method of above-mentioned silver alloy bonding wire includes the following steps：
（1）Founding：Au, Pd, Ca and Si are added in silver material in proportion, continuously draw foundry work by vacuum melting and orientation
Skill obtains a diameter of 6 millimeters of wire rod；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 200um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 1000mm, and annealing temperature is 400 DEG C, annealing rate 100m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, obtains a diameter of 15-40um（Such as 20
um）Silver alloy wire；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 600mm, and annealing temperature is 600 DEG C, annealing rate 90m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 20 DEG C, obtains required silver alloy bonding wire.
Embodiment 2
The copper alloy bonding wire of the present embodiment contains Au 9%, Pd 3%, Ca 70ppm, Be 45ppm, Cu50ppm by weight,
In 50ppm, surplus are silver.
The manufacturing method of above-mentioned silver alloy bonding wire includes the following steps：
（1）Founding：Au, Pd, Ca, Be, Cu and In are added in silver material in proportion, it is continuous by vacuum melting and orientation
Draw casting process, obtain a diameter of 8 millimeters of wire rod；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 150um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 800mm, and annealing temperature is 500 DEG C, annealing rate 80m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, obtains a diameter of 15-40um（Such as 20
um）Silver alloy wire；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 900mm, and annealing temperature is 400 DEG C, annealing rate 60m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 30 DEG C, obtains required silver alloy bonding wire.
Embodiment 3
The copper alloy bonding wire of the present embodiment is by weight containing Au 5%, Pd 1%, Ca 150ppm, Si 50 ppm, In
30ppm, surplus are silver.
The manufacturing method of above-mentioned silver alloy bonding wire includes the following steps：
（1）Founding：Au, Pd, Ca, Si and In are added in silver material in proportion, continuously drawn by vacuum melting and orientation
Casting process obtains a diameter of 8 millimeters of wire rod；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 280um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 600mm, and annealing temperature is 550 DEG C, annealing rate 60m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, obtains a diameter of 15-40um（Such as 20
um）Silver alloy wire；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 1000mm, and annealing temperature is 400 DEG C, annealing rate 80m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 20 DEG C, obtains required silver alloy bonding wire.
Embodiment 4
The copper alloy bonding wire of the present embodiment is by weight containing Au 10%, Pd 5%, Ca 200ppm, Si 100 ppm, Be
30ppm, Cu 50ppm, surplus are silver.
The manufacturing method of above-mentioned silver alloy bonding wire includes the following steps：
（1）Founding：Au, Pd, Ca, Si, Be and Cu are added in silver material in proportion, connected by vacuum melting and orientation
It is continuous to draw casting process, obtain a diameter of 6 millimeters of wire rod；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 60um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 700mm, and annealing temperature is 500 DEG C, annealing rate 70m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, obtains a diameter of 15-40um（Such as 20
um）Silver alloy wire；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 1000mm, and annealing temperature is 500 DEG C, annealing rate 80m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 30 DEG C, obtains required silver alloy bonding wire.
Embodiment 5
By weight containing Au 6%, Pd 4%, Ca 70ppm, Cu 140ppm, surplus is the copper alloy bonding wire of the present embodiment
Silver.
The manufacturing method of above-mentioned silver alloy bonding wire includes the following steps：
（1）Founding：Au, Pd, Ca and Cu are added in silver material in proportion, continuously draw foundry work by vacuum melting and orientation
Skill obtains a diameter of 8 millimeters of wire rod；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 120um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 600mm, and annealing temperature is 450 DEG C, annealing rate 60m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, obtains a diameter of 15-40um（Such as 20
um）Silver alloy wire；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as
Annealing atmosphere, annealing furnace effective length are 900mm, and annealing temperature is 300 DEG C, annealing rate 60m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 20 DEG C, obtains required silver alloy bonding wire.
The silver alloy bonding wire of 1-5 of the embodiment of the present invention is tested for the property, test method and test result is as follows：
1st, sulfuration resistant performance
Sulfuration resistant performance test methods：
LED lamp bead is packaged respectively with conventional silver alloys bonding wire, 1-5 silver alloy bonding wire of the embodiment of the present invention（Routing
Casting glue embedding is used afterwards）, every group takes 10 samples and makes marks.Each group LED lamp bead sample is all positioned over 3L closed containers
It is interior（A concentration of 2g/L of sublimed sulfur, 85 DEG C of constant temperature）, after vulcanizing 4 hours, each group LED lamp bead sample is taken out, tests luminous flux（10
Lamp bead sample test is averaged）And calculate light decay.Test result is as shown in table 1.
Table 1
| Sample sets | Average light decay |
| Conventional silver alloys bonding wire | 15% |
| 1 silver alloy bonding wire of embodiment | 8.5% |
| 2 silver alloy bonding wire of embodiment | 8.0% |
| 3 silver alloy bonding wire of embodiment | 9.0% |
| 4 silver alloy bonding wire of embodiment | 8.0% |
| 5 silver alloy bonding wire of embodiment | 8.5% |
Test result is shown：The sulfuration resistant performance of 1-5 silver alloy bonding wires of the embodiment of the present invention is substantially better than conventional silver alloys key
Plying.
2nd, anti-aging property
Embodiment 1-5 and conventional silver alloys bonding wire reliability difference mainly in thermal shock part.Specific degradation item
Part such as table 2.Experiment packing forms be LED encapsulation in SMD2835, BSOB routings, packaging silicon rubber use DOW CORNING OE6650,
Packaged sample sees whether to light after each thermal shock for completing 50 cycles, the number of the dead lamp of record failure.
Table 2
| Test condition | Duration (Hour)/bout (Cycle) |
| 8 warm area standard circumfluences weld (265 DEG C) | 1 |
| - 40 DEG C of * 30min-100 DEG C * 30min (conversion time is less than 20 seconds) | 50/100/…/500 |
Test result（As shown in table 3）：Embodiment 1-5 silver alloy bonding wires are all subjected to 200-250 bouts in senile experiment
Thermal shock, and conventional silver alloys bonding wire can only be subjected to the thermal shock of 100 bouts in senile experiment.
Table 3
| Sample sets | Aging rounds |
| Conventional silver alloys bonding wire | 100 |
| 1 silver alloy bonding wire of embodiment | 200 |
| 2 silver alloy bonding wire of embodiment | 250 |
| 3 silver alloy bonding wire of embodiment | 200 |
| 4 silver alloy bonding wire of embodiment | 250 |
| 5 silver alloy bonding wire of embodiment | 250 |
3rd, FAB burns ball
A.EFO electric currents：60mA
B.N2+H2(gas flow：0.3~0.6 L/min)
The FAB balls of the silver alloy bonding wire of the present invention, stability is good, no sliding ball, and is normal ball-type, unbiased bulbus cordis and different
Normal ball.
Claims (8)
1. a kind of silver alloy bonding wire, it is characterised in that by weight containing Au 3.5-10%, Pd 1-5%, trace additives
2-500 ppm, surplus Ag；The trace additives are more than one kind or two of which in Ca, Cu, Be, In, Si and Ge
Combination.
2. silver alloy bonding wire according to claim 1, it is characterized in that：The weight percent of Ag in the silver alloy bonding wire
It is 86-90% than content.
3. silver alloy bonding wire according to claim 1 or 2, it is characterized in that：The composition of the trace additives is Ca
200-300ppm、Si 100-200ppm。
4. silver alloy bonding wire according to claim 1 or 2, it is characterized in that：The composition of the trace additives is Ca
50-100ppm、Be 1-50ppm、Cu 40-100ppm、In 40-60ppm。
5. silver alloy bonding wire according to claim 1 or 2, it is characterized in that：The composition of the trace additives is Ca
100-200ppm、Si 40-60 ppm、In 20-40ppm。
6. silver alloy bonding wire according to claim 1 or 2, it is characterized in that：The composition of the trace additives is Ca
150-250ppm、Si 80-120 ppm、Be 20-40ppm、Cu 40-60ppm。
7. silver alloy bonding wire according to claim 1 or 2, it is characterized in that：The composition of the trace additives is Ca
50-100ppm、Cu 130-150ppm。
8. the manufacturing method of silver alloy bonding wire described in claim 1, it is characterised in that include the following steps：
（1）Founding：Au, Pd and trace additives are added in silver material in proportion, it is continuous by vacuum melting and orientation
Draw casting process, obtain wire rod 6-8 millimeters a diameter of；
（2）Wire drawing：To step（1）Obtained wire rod carries out wire drawing, obtains the silver alloy wire of a diameter of 50-280um；
（3）Intermediate annealing：Step（2）After the completion of wire drawing, intermediate annealing is carried out to silver alloy wire, N is used in annealing process2Come
As annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-
120m/min；
（4）To through step（3）The silver alloy wire of intermediate annealing process continues wire drawing, and the silver for obtaining a diameter of 15-40um closes
Gold thread；
（5）Finally anneal：To step（4）Obtained silver alloy wire is finally annealed, and N is used in annealing process2Come as moving back
Internal heat atmosphere, annealing furnace effective length are 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-120m/min；
（6）Cooling：After finally annealing, silver alloy wire is cooled to 20-30 DEG C, obtains required silver alloy bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444061.7A CN108183075B (en) | 2017-12-27 | 2017-12-27 | Silver alloy bonding wire and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444061.7A CN108183075B (en) | 2017-12-27 | 2017-12-27 | Silver alloy bonding wire and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108183075A true CN108183075A (en) | 2018-06-19 |
| CN108183075B CN108183075B (en) | 2020-05-19 |
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| CN108796285A (en) * | 2018-06-30 | 2018-11-13 | 汕头市骏码凯撒有限公司 | A kind of silver alloy bonding wire and its manufacturing method |
| CN109390309A (en) * | 2018-09-28 | 2019-02-26 | 汕头市骏码凯撒有限公司 | A kind of coated copper alloy wire in surface and its manufacturing method |
| CN109637993A (en) * | 2018-11-22 | 2019-04-16 | 汕头市骏码凯撒有限公司 | The coated copper bonding wire in surface and its manufacturing method |
| CN110106385A (en) * | 2019-05-16 | 2019-08-09 | 杭州辰卓科技有限公司 | One kind having the corrosion-resistant billon of resistance to brittle failure of this spot effect 18K and its technique |
| CN110284021A (en) * | 2019-06-27 | 2019-09-27 | 袁海 | Improve pure gold, intermediate alloy of pure silver hardness and the preparation method and application thereof |
| CN112342426A (en) * | 2020-11-10 | 2021-02-09 | 汕头市骏码凯撒有限公司 | Novel silver alloy bonding wire and manufacturing method thereof |
| CN114107724A (en) * | 2021-11-19 | 2022-03-01 | 江西蓝微电子科技有限公司 | Silver alloy bonding wire and preparation method thereof |
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