CN108063182B - A kind of piezo-composite element electrode preparation method - Google Patents
A kind of piezo-composite element electrode preparation method Download PDFInfo
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- CN108063182B CN108063182B CN201711200925.0A CN201711200925A CN108063182B CN 108063182 B CN108063182 B CN 108063182B CN 201711200925 A CN201711200925 A CN 201711200925A CN 108063182 B CN108063182 B CN 108063182B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
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Abstract
The invention belongs to advanced manufacturing technology fields, provide a kind of piezo-composite element electrode preparation method.Firstly, the method by mechanical lapping pre-processes piezo-composite element surface, with good flatness and suitable roughness.Secondly, it is modified to PZT piezo-composite element surface to increase its surface energy, composite component surface is specially irradiated using ultraviolet light, its surface is made to generate oxygen-containing polar functional group, improves the bond strength between piezo-composite element surface and metal layer.Finally, sputtering electrode of the micron-sized metallic film as piezo-composite element.The piezo-composite element surface electrode resistance that the present invention is prepared is low, bond strength is high, weldability is strong, is conducive to produce in enormous quantities and commercialization promotes and applies.
Description
Technical field
The invention belongs to advanced manufacturing technology fields, are related to a kind of piezo-composite element electrode preparation method.
Background technique
Piezo-composite element is combined by piezoelectric ceramics and polymer, has both high tension performance and the polymerization of piezoelectric ceramics
The low acoustic impedance feature of object is the key element of ship hydrophone, medical ultrasound probe, infrared detector, ultrasonic flowmeter etc..
Piezo-composite element electrode is most important to piezo-composite element performance, it is desirable that has low resistance, high bond strength and strong weld
Property, to meet the highly sensitive of piezoelectric element, anti-vibration, highly reliable contour performance requirement.
Piezoelectric ceramics electrode generallys use back silver process at present, silver paste is applied piezoelectric ceramics surface, through 700-800 DEG C of height
Temperature sintering forms electrode.But due in piezo-composite element polymer operating temperature be generally below 150 DEG C, carry on the back silver process
Pyroprocess will lead to the deterioration such as deformable polymer, carbonization, destroy piezo-composite element.
Summary of the invention
The invention solves technical problem be to overcome the shortcomings of above-mentioned technical method, invent a kind of piezo-composite element electricity
The method of pole production.
The technical solution of the present invention is as follows:
A kind of piezo-composite element electrode preparation method, firstly, by the method for mechanical lapping to piezo-composite element table
Face is pre-processed, with good flatness and suitable roughness.Secondly, changing to PZT piezo-composite element surface
Property with increase its surface can, composite component surface is specially irradiated using ultraviolet light, its surface is made to generate oxygen-containing polar functional group,
Improve the bond strength between piezo-composite element surface and metal layer.Finally, sputtering micron-sized metallic film as piezoelectricity
The electrode of composite component.Specific step is as follows:
1) piezo-composite element surface preparation
Firstly, being ground using automatic pressure polisher lapper to piezo-composite element, make its surface planarity
Lower than 1 μm, roughness is lower than 800nm, to meet the requirement of electrode layer sputtering；Secondly, using dehydrated alcohol, acetone, deionization
Water is cleaned by ultrasonic, the organic impurities of removal piezo-composite element surface attachment；Finally, using degreasing fluid to Piezoelectric anisotropy member
Part carries out oil removal treatment, removes saponified oil and mineral oil.
2) piezo-composite element surface is modified
Drying and processing is carried out to pretreated piezo-composite element, extra moisture etc. is removed, is irradiated using ultraviolet light
Machine is 8~16mW/cm in output power2Under conditions of irradiate 3~8min of composite component surface, so that its surface is generated oxygen-containing polarity
The metallic atom of functional group, functional group and electrode layer can generate strong interaction, so that composite component surface and metal
Strong chemical bond is generated between atom, and then obtains strong chemical bond force, and the combination improved between electrode and composite component surface is strong
Degree.
3) piezo-composite element electrode is prepared
Transition of the modified piezo-composite element surface splash-proofing sputtering metal layer 1 as piezo-composite element electrode on surface
The metal oxide that the oxygen atom on layer, the metallic atom of metal layer 1 and composite component surface is formed not only be conducive to transition zone after
Continuous growth, and the bond strength of metal layer 1 Yu piezo-composite element surface can be improved significantly.2 conduct of splash-proofing sputtering metal layer
The intermediate protective layer of piezo-composite element electrode, high-temperature fusion scolding tin is to the broken of metal layer 1 when metal layer 2 is effectively prevented from welding
It is bad.Sealer of the splash-proofing sputtering metal layer 3 as piezo-composite element electrode, metal layer 3 improve the weldability of electrode with
And inoxidizability.
The metal layer 1 is Ti electrode layer, and Ti electrode layer sputters at piezo-composite element surface, sputtering time is 10~
15min, Ti electrode layer thickness are 80~100nm.Metal layer 2 is Cu electrode layer, and Cu electrode layer sputters at the surface of Ti electrode layer,
Sputtering time is 30~45min, and Cu electrode layer thickness is 1500~2000nm.Metal layer 3 is Ag electrode layer, the sputtering of Ag electrode layer
In Cu electrode layer surface, sputtering time is 12~18min, and Ag electrode layer thickness is 300~500nm.
Beneficial effects of the present invention: the piezo-composite element surface electrode resistance that the present invention is prepared is low, bond strength
Height, weldability are strong, are conducive to produce in enormous quantities and commercialization promotes and applies.
Detailed description of the invention
Fig. 1 is PZT piezo-composite element technology for preparing electrode route map；In figure successively are as follows: A is PZT piezo-composite element；
B is the grinding of PZT piezo-composite element；C is the cleaning and oil removing of PZT piezo-composite element；D is ultraviolet treatment with irradiation；E is
The preparation of PZT piezo-composite element electrode.
Fig. 2 is PZT composite component electrode schematic diagram；
In figure: the Ag electrode layer of 1PZT piezo-composite element electrode；The Cu electrode layer of 2PZT piezo-composite element electrode；
The Ti electrode layer of 3PZT piezo-composite element electrode.
Specific embodiment
Below in conjunction with technical solution and the attached drawing specific embodiment that the present invention will be described in detail.
Firstly, successively being ground using automatic pressure polisher lapper to PZT piezo-composite element；Then carry out impurity elimination
Matter and oil removal treatment；Then, it is irradiated by ultraviolet light modified to PZT piezo-composite element surface；Finally, in PZT Piezoelectric anisotropy
Element surface sputters certain thickness Ti, Cu, Ag as PZT piezo-composite element electrode.
The specific implementation step of embodiment 1 is as follows:
1) PZT piezo-composite element is surface-treated
The size of PZT piezo-composite element is 10mm × 10mm × 3mm (length × width x thickness) in the present embodiment.According to following
Sequence carries out: it is ground using automatic pressure polisher lapper, revolving speed 50rpm, milling time 40min,
It is allowed to surface smoothness and roughness is respectively lower than 1 μm and 800nm；PZT piezo-composite element is successively put into acetone, anhydrous second
Respectively it is cleaned by ultrasonic 20min under room temperature in alcohol, deionized water, to remove the dust impurity of surface attachment；It is put into 40 DEG C of degreasing fluid
Middle oil removing 10min, to remove the saponified oil and mineral oil on surface；It is put into the baking oven that temperature is 60 DEG C and dries 35min；
2) PZT piezo-composite element surface is modified
The ultraviolet treatment with irradiation of 8min is carried out under conditions of output power is 8mW/cm2 to PZT composite component surface,
Composite component surface is set to generate oxygen-containing polar functional group, oxygen-containing polar functional group produces extensive chemical with metallic atom strong effect
Key and improve chemical bond force between metal layer and composite component surface, to improve metal electrode and composite component significantly
Between bond strength；
3) prepared by PZT piezo-composite element electrode
After the surface preparation for completing PZT piezo-composite element, the combination for increase electrode and PZT piezo-composite element is strong
Degree, first has to prepare electrode on PZT piezo-composite element surface by magnetically controlled sputter method, sputtering power 200w, and background is true
Reciprocal of duty cycle is 4 × 10-4Pa prepares the Ti electrode of 100nm thickness by the sputtering of 10min as PZT piezo-composite element electrode
Transition zone, Ti atom are mutually tied with the oxygen atom in the oxygen atom and ceramic oxide of PZT piezo-composite element Adsorption on Surface
The oxide for forming Ti is closed, the bond strength between Ti electrode layer and piezo-composite element surface is greatly improved, is passed through
30min sputter at Ti electrode surface prepare the Cu electrode of 1500nm thickness avoid welding when high temperature scolding tin Ti electrode layer is broken
It is bad, the Ag electrode of 300nm thickness is prepared as oxidation resistant PZT Piezoelectric anisotropy member using the Cu electrode surface that sputters at of 12min
The welding layer of part electrode, to obtain good solderable ability and low resistance.
It is 12mW/cm2, ultraviolet light to the modified output power in PZT composite component surface in step 2) in embodiment 2
Irradiation time 5min；The sputtering Ti electrode layer time in step 3) is 12min, and the sputtering Cu electrode layer time is 40min, sputters Ag
The electrode layer time is 15min；Other conditions are same as Example 1.
It is 16mW/cm2, ultraviolet light to the modified output power in PZT composite component surface in step 2) in embodiment 3
Irradiation time 3min；The sputtering Ti electrode layer time in step 3) is 15min, and the sputtering Cu electrode layer time is 45min, sputters Ag
The electrode layer time is 18min；Other conditions are same as Example 1.
Claims (5)
1. a kind of piezo-composite element electrode preparation method, it is characterised in that following steps:
1) piezo-composite element surface preparation,
Piezo-composite element is ground using automatic pressure polisher lapper, it is carried out using cleaning agent ultrasonic clear
It washes, the organic impurities of removal piezo-composite element surface attachment；Oil removal treatment is carried out to piezo-composite element using degreasing fluid；
2) piezo-composite element surface is modified
After carrying out drying and processing to pretreated piezo-composite element, composite component surface 3 is irradiated using ultraviolet irradiation machine
~8min makes its surface generate oxygen-containing polar functional group, improves the bond strength between electrode and composite component surface；
3) piezo-composite element electrode is prepared
On surface, transition zone of the modified piezo-composite element surface splash-proofing sputtering metal layer 1 as piezo-composite element electrode, splashes
Penetrate intermediate protective layer of the metal layer 2 as piezo-composite element electrode, table of the splash-proofing sputtering metal layer 3 as piezo-composite element electrode
Face protective layer；
The metal layer 1 is Ti electrode layer, and Ti electrode layer sputters at piezo-composite element surface, sputtering time is 10~
15min, Ti electrode layer thickness are 80~100nm；Metal layer 2 is Cu electrode layer, and Cu electrode layer sputters at the surface of Ti electrode layer,
Sputtering time is 30~45min, and Cu electrode layer thickness is 1500~2000nm；Metal layer 3 is Ag electrode layer, the sputtering of Ag electrode layer
In Cu electrode layer surface, sputtering time is 12~18min, and Ag electrode layer thickness is 300~500nm.
2. a kind of piezo-composite element electrode preparation method according to claim 1, which is characterized in that the step 2)
Described in ultraviolet irradiation machine output power be 8~16mW/cm2。
3. a kind of piezo-composite element electrode preparation method according to claim 1 or 2, which is characterized in that the step
It is rapid 1) in after milled processed the flatness on piezo-composite element surface be lower than 1 μm, roughness is lower than 800nm, meets electrode layer and splashes
The requirement penetrated.
4. a kind of piezo-composite element electrode preparation method according to claim 1 or 2, which is characterized in that the step
It is rapid 1) in cleaning agent be dehydrated alcohol, acetone or deionized water.
5. a kind of piezo-composite element electrode preparation method according to claim 3, which is characterized in that the step 1)
In cleaning agent be dehydrated alcohol, acetone or deionized water.
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| CN110957418A (en) * | 2018-09-27 | 2020-04-03 | 湖南嘉业达电子有限公司 | Method for improving electrode binding force of piezoelectric element |
| CN110961997A (en) * | 2018-09-27 | 2020-04-07 | 湖南嘉业达电子有限公司 | Surface treatment device for improving electrode bonding force of piezoelectric element |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1565078A (en) * | 2002-07-31 | 2005-01-12 | 株式会社村田制作所 | Piezoelectric component and production method therefor |
| DE102005046295A1 (en) * | 2005-09-28 | 2007-03-29 | Michael Johannes Jensen | Process for production of a piezoelectric heat converter metallizing of a piezoelectric material bonded to a ceramic layer useful miniature piezoelectric technology formation of troughs in the piezoelectric ceramic by UV laser treatment |
| KR101476742B1 (en) * | 2013-11-14 | 2014-12-29 | 포항공과대학교 산학협력단 | Method for manufacturing nano generator |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1565078A (en) * | 2002-07-31 | 2005-01-12 | 株式会社村田制作所 | Piezoelectric component and production method therefor |
| DE102005046295A1 (en) * | 2005-09-28 | 2007-03-29 | Michael Johannes Jensen | Process for production of a piezoelectric heat converter metallizing of a piezoelectric material bonded to a ceramic layer useful miniature piezoelectric technology formation of troughs in the piezoelectric ceramic by UV laser treatment |
| KR101476742B1 (en) * | 2013-11-14 | 2014-12-29 | 포항공과대학교 산학협력단 | Method for manufacturing nano generator |
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