CN108063182A - A kind of piezo-composite element electrode preparation method - Google Patents
A kind of piezo-composite element electrode preparation method Download PDFInfo
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- CN108063182A CN108063182A CN201711200925.0A CN201711200925A CN108063182A CN 108063182 A CN108063182 A CN 108063182A CN 201711200925 A CN201711200925 A CN 201711200925A CN 108063182 A CN108063182 A CN 108063182A
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- piezo
- composite element
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- 239000002131 composite material Substances 0.000 title claims abstract description 88
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 125000000524 functional group Chemical group 0.000 claims abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 57
- 238000004544 sputter deposition Methods 0.000 claims description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000012459 cleaning agent Substances 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002480 mineral oil Substances 0.000 description 2
- 235000010446 mineral oil Nutrition 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention belongs to advanced manufacturing technology fields, provide a kind of piezo-composite element electrode preparation method.First, piezo-composite element surface is pre-processed by the method for mechanical lapping, with good flatness and suitable roughness.Secondly, to the surface modification of PZT piezo-composite elements to increase its surface energy, specially using ultraviolet light irradiation composite component surface, its surface is made to generate oxygen-containing polar functional group, improves the bond strength between piezo-composite element surface and metal layer.Finally, electrode of the micron-sized metallic film as piezo-composite element is sputtered.Piezo-composite element surface electrode resistance that the present invention is prepared is low, bond strength is high, weldability is strong, beneficial to producing in enormous quantities and commercialization promotes and applies.
Description
Technical field
The invention belongs to advanced manufacturing technology fields, are related to a kind of piezo-composite element electrode preparation method.
Background technology
Piezo-composite element is combined by piezoelectric ceramics and polymer, has both high tension performance and the polymerization of piezoelectric ceramics
The low acoustic impedance feature of object is the key element of ship hydrophone, medical ultrasound probe, infrared detector, ultrasonic flowmeter etc..
Piezo-composite element electrode pair piezo-composite element performance is most important, it is desirable that has low resistance, high bond strength and strong weld
Property, to meet the highly sensitive of piezoelectric element, anti-vibration, highly reliable contour performance requirement.
Silver paste is applied piezoelectric ceramics surface, through 700-800 DEG C of height by piezoelectric ceramics electrode generally using back of the body silver process at present
Temperature sintering forms electrode.But due in piezo-composite element polymer operating temperature be generally below 150 DEG C, carry on the back silver process
Pyroprocess will cause the deteriorations such as deformable polymer, carbonization, destroy piezo-composite element.
The content of the invention
The invention solves technical barrier be to overcome the shortcomings of above-mentioned technical method, invent a kind of piezo-composite element electricity
The method that pole makes.
The technical scheme is that:
A kind of piezo-composite element electrode preparation method, first, by the method for mechanical lapping to piezo-composite element table
Face is pre-processed, with good flatness and suitable roughness.Secondly, PZT piezo-composite elements surface is changed
Property with increase its surface can, specially using ultraviolet light irradiation composite component surface, its surface is made to generate oxygen-containing polar functional group,
Improve the bond strength between piezo-composite element surface and metal layer.Finally, micron-sized metallic film is sputtered as piezoelectricity
The electrode of composite component.It is as follows:
1) piezo-composite element surface preparation
First, processing is ground piezo-composite element using automatic pressure polisher lapper, makes its surface planarity
Less than 1 μm, roughness is less than 800nm, to meet the requirement of electrode layer sputtering;Secondly, using absolute ethyl alcohol, acetone, deionization
Water is cleaned by ultrasonic, and removes the organic impurities of piezo-composite element surface attachment;Finally, using degreasing fluid to Piezoelectric anisotropy member
Part carries out oil removal treatment, removes saponified oil and mineral oil.
2) piezo-composite element surface is modified
Drying and processing is carried out to pretreated piezo-composite element, extra moisture etc. is removed, is irradiated using ultraviolet light
Machine is 8~16mW/cm in output power2Under conditions of irradiate composite component 3~8min of surface, its surface is made to generate oxygen-containing polarity
The metallic atom of functional group, functional group and electrode layer can generate strong interaction so that composite component surface and metal
Strong chemical bond is generated between atom, and then obtains strong chemical bond force, the combination improved between electrode and composite component surface is strong
Degree.
3) piezo-composite element electrode is prepared
In modified piezo-composite element surface 1 transition as piezo-composite element electrode of splash-proofing sputtering metal layer in surface
The metal oxide that the oxygen atom on layer, the metallic atom of metal layer 1 and composite component surface is formed not only beneficial to transition zone after
Continuous growth, and the bond strength of metal layer 1 and piezo-composite element surface can be significantly increased.2 conduct of splash-proofing sputtering metal layer
The intermediate protective layer of piezo-composite element electrode, metal layer 2 are effectively prevented from high-temperature fusion scolding tin breaking to metal layer 1 during welding
It is bad.Sealer of the splash-proofing sputtering metal layer 3 as piezo-composite element electrode, metal layer 3 improve the weldability of electrode with
And inoxidizability.
The metal layer 1 is Ti electrode layers, and Ti electrode layers sputter at piezo-composite element surface, sputtering time for 10~
15min, Ti electrode layer thickness are 80~100nm.Metal layer 2 is Cu electrode layers, and Cu electrode layers sputter at the surface of Ti electrode layers,
Sputtering time is 30~45min, and Cu electrode layers thickness is 1500~2000nm.Metal layer 3 is Ag electrode layers, and Ag electrode layers sputter
In Cu electrode layer surfaces, sputtering time is 12~18min, and Ag electrode layers thickness is 300~500nm.
Beneficial effects of the present invention:Piezo-composite element surface electrode resistance that the present invention is prepared is low, bond strength
Height, weldability are strong, are promoted and applied beneficial to producing in enormous quantities and being commercialized.
Description of the drawings
Fig. 1 is PZT piezo-composite element technology for preparing electrode route maps;It is followed successively by figure:A is PZT piezo-composite elements;
B is the grinding of PZT piezo-composite elements;C is the cleaning and oil removing of PZT piezo-composite elements;D is ultraviolet treatment with irradiation;E is
The preparation of PZT piezo-composite element electrodes.
Fig. 2 is PZT composite component electrode schematic diagrames;
In figure:The Ag electrode layers of 1PZT piezo-composite element electrodes;The Cu electrode layers of 2PZT piezo-composite element electrodes;
The Ti electrode layers of 3PZT piezo-composite element electrodes.
Specific embodiment
Below in conjunction with technical solution and the attached drawing specific embodiment that the present invention will be described in detail.
First, successively PZT piezo-composite elements are ground using automatic pressure polisher lapper;Then carry out impurity elimination
Matter and oil removal treatment;Then, irradiated by ultraviolet light and PZT piezo-composite elements surface is modified;Finally, in PZT Piezoelectric anisotropies
Element surface sputters certain thickness Ti, Cu, Ag as PZT piezo-composite element electrodes.
The specific implementation step of embodiment 1 is as follows:
1) PZT piezo-composite elements are surface-treated
The size of PZT piezo-composite elements is 10mm × 10mm × 3mm (length × width x thickness) in the present embodiment.According to following
Order carries out:Processing is ground using automatic pressure polisher lapper to it, rotating speed 50rpm, milling time 40min,
It is allowed to surface smoothness and is respectively lower than 1 μm and 800nm with roughness;PZT piezo-composite elements are successively put into acetone, anhydrous second
Respectively it is cleaned by ultrasonic 20min under room temperature in alcohol, deionized water, to remove the dust impurity of surface attachment;It is put into 40 DEG C of degreasing fluid
Middle oil removing 10min, to remove the saponified oil on surface and mineral oil;It is put into the baking oven that temperature is 60 DEG C and dries 35min;
2) PZT piezo-composite elements surface is modified
The ultraviolet treatment with irradiation of 8min is carried out under conditions of output power is 8mW/cm2 to PZT composite components surface,
Composite component surface is made to generate oxygen-containing polar functional group, oxygen-containing polar functional group generates extensive chemical with metallic atom strong effect
Key and improve chemical bond force between metal layer and composite component surface, so as to considerably improve metal electrode and composite component
Between bond strength;
3) prepared by PZT piezo-composite elements electrode
It is strong to increase the combination of electrode and PZT piezo-composite elements after the surface preparation for completing PZT piezo-composite elements
Degree, first has to prepare electrode on PZT piezo-composite elements surface by magnetically controlled sputter method, sputtering power 200w, and background is true
Reciprocal of duty cycle is 4 × 10-4Pa, the Ti electrodes that 100nm thickness is prepared by the sputtering of 10min are used as PZT piezo-composite element electrodes
Transition zone, Ti atoms are mutually tied with the oxygen atom in the oxygen atom and ceramic oxide of PZT piezo-composite element Adsorption on Surface
The oxide for forming Ti is closed, drastically increases the bond strength between Ti electrode layers and piezo-composite element surface, is passed through
30min sputter at Ti electrode surfaces prepare the Cu electrodes of 1500nm thickness avoid welding when high temperature scolding tin Ti electrode layers are broken
It is bad, the Ag electrodes of 300nm thickness are prepared as oxidation resistant PZT Piezoelectric anisotropies member using the Cu electrode surfaces that sputter at of 12min
The welding layer of part electrode, to obtain good solderable ability and low resistance.
In embodiment 2, the output power being modified in step 2) to PZT composite components surface is 12mW/cm2, ultraviolet light
Irradiation time 5min;The sputtering Ti electrode layer times in step 3) are 12min, and the sputtering Cu electrode layer times are 40min, sputter Ag
The electrode layer time is 15min;Other conditions are same as Example 1.
In embodiment 3, the output power being modified in step 2) to PZT composite components surface is 16mW/cm2, ultraviolet light
Irradiation time 3min;The sputtering Ti electrode layer times in step 3) are 15min, and the sputtering Cu electrode layer times are 45min, sputter Ag
The electrode layer time is 18min;Other conditions are same as Example 1.
Claims (5)
- A kind of 1. piezo-composite element electrode preparation method, it is characterised in that following steps:1) piezo-composite element surface preparation,Processing is ground piezo-composite element using automatic pressure polisher lapper, it is carried out using cleaning agent ultrasonic clear It washes, removes the organic impurities of piezo-composite element surface attachment;Oil removal treatment is carried out to piezo-composite element using degreasing fluid;2) piezo-composite element surface is modifiedAfter carrying out drying and processing to pretreated piezo-composite element, ultraviolet irradiation machine irradiation composite component surface 3 is utilized ~8min makes its surface generate oxygen-containing polar functional group, improves the bond strength between electrode and composite component surface;3) piezo-composite element electrode is preparedIn modified piezo-composite element surface 1 transition zone as piezo-composite element electrode of splash-proofing sputtering metal layer in surface, splash Penetrate intermediate protective layer of the metal layer 2 as piezo-composite element electrode, table of the splash-proofing sputtering metal layer 3 as piezo-composite element electrode Face protective layer;The metal layer 1 is Ti electrode layers, and Ti electrode layers sputter at piezo-composite element surface, sputtering time for 10~ 15min, Ti electrode layer thickness are 80~100nm;Metal layer 2 is Cu electrode layers, and Cu electrode layers sputter at the surface of Ti electrode layers, Sputtering time is 30~45min, and Cu electrode layers thickness is 1500~2000nm;Metal layer 3 is Ag electrode layers, and Ag electrode layers sputter In Cu electrode layer surfaces, sputtering time is 12~18min, and Ag electrode layers thickness is 300~500nm.
- A kind of 2. piezo-composite element electrode preparation method according to claim 1, which is characterized in that the step 2) Described in ultraviolet irradiation machine output power be 8~16mW/cm2。
- A kind of 3. piezo-composite element electrode preparation method according to claim 1 or 2, which is characterized in that the step It is rapid 1) in after milled processed piezo-composite element surface flatness less than 1 μm, roughness is less than 800nm, meets electrode layer and splashes The requirement penetrated.
- A kind of 4. piezo-composite element electrode preparation method according to claim 1 or 2, which is characterized in that the step It is rapid 1) in cleaning agent be absolute ethyl alcohol, acetone or deionized water.
- A kind of 5. piezo-composite element electrode preparation method according to claim 3, which is characterized in that the step 1) In cleaning agent be absolute ethyl alcohol, acetone or deionized water.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110957418A (en) * | 2018-09-27 | 2020-04-03 | 湖南嘉业达电子有限公司 | Method for improving electrode binding force of piezoelectric element |
CN110961997A (en) * | 2018-09-27 | 2020-04-07 | 湖南嘉业达电子有限公司 | Surface treatment device for improving electrode bonding force of piezoelectric element |
Citations (3)
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CN1565078A (en) * | 2002-07-31 | 2005-01-12 | 株式会社村田制作所 | Piezoelectric component and production method therefor |
DE102005046295A1 (en) * | 2005-09-28 | 2007-03-29 | Michael Johannes Jensen | Process for production of a piezoelectric heat converter metallizing of a piezoelectric material bonded to a ceramic layer useful miniature piezoelectric technology formation of troughs in the piezoelectric ceramic by UV laser treatment |
KR101476742B1 (en) * | 2013-11-14 | 2014-12-29 | 포항공과대학교 산학협력단 | Method for manufacturing nano generator |
-
2017
- 2017-11-27 CN CN201711200925.0A patent/CN108063182B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1565078A (en) * | 2002-07-31 | 2005-01-12 | 株式会社村田制作所 | Piezoelectric component and production method therefor |
DE102005046295A1 (en) * | 2005-09-28 | 2007-03-29 | Michael Johannes Jensen | Process for production of a piezoelectric heat converter metallizing of a piezoelectric material bonded to a ceramic layer useful miniature piezoelectric technology formation of troughs in the piezoelectric ceramic by UV laser treatment |
KR101476742B1 (en) * | 2013-11-14 | 2014-12-29 | 포항공과대학교 산학협력단 | Method for manufacturing nano generator |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110957418A (en) * | 2018-09-27 | 2020-04-03 | 湖南嘉业达电子有限公司 | Method for improving electrode binding force of piezoelectric element |
CN110961997A (en) * | 2018-09-27 | 2020-04-07 | 湖南嘉业达电子有限公司 | Surface treatment device for improving electrode bonding force of piezoelectric element |
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