CN108055789A - Prevent the production technology of MIC dysfunctions - Google Patents
Prevent the production technology of MIC dysfunctions Download PDFInfo
- Publication number
- CN108055789A CN108055789A CN201810004227.1A CN201810004227A CN108055789A CN 108055789 A CN108055789 A CN 108055789A CN 201810004227 A CN201810004227 A CN 201810004227A CN 108055789 A CN108055789 A CN 108055789A
- Authority
- CN
- China
- Prior art keywords
- mic
- dysfunctions
- adagio
- printing
- production technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of production technologies for preventing MIC dysfunctions, are included in printed circuit board (PCB) assembling process and MIC elements are welded using closed-loop fashion, MIC closed loops are formed, so as to avoid the MIC elements dysfunction problem caused by abscission ring and bubble.Using technical solution of the present invention, the defects of traditional handicraft can be overcome, improve the abscission ring and bubble after welding, avoid due to MIC elements dysfunction and cause to form sound leakage in the circuit board, and then improve the stability of electronic product.
Description
Technical field
The present invention relates to flexible circuit board technical field, more particularly to a kind of production technology for preventing MIC dysfunctions.
Background technology
Microphone element, hereinafter referred to as MIC elements are common component in communication product, use Surface Mount
Technology (hereinafter referred to as SMT) technique completes assembling.In SMT techniques, often occur causing work(because of SMT process limitations
Can be bad, because the semicircular ring that paste solder printing must be disconnected by least two forms, cause the tin cream printed that cannot be formed
Closed loop at tin cream abscission ring and its surrounding, easily forms abscission ring (such as Fig. 1) and bubble (such as Fig. 2) after welding, so as to influence
MIC element functions.
The dysfunction problem for the MIC elements that existing SMT techniques cause so that entire SMT industries have put into a large amount of high
Expensive detection device and manpower is tested, but still has the problem of abscission ring and bubble to flow out to terminal client, is caused not
Appreciable loss.
The content of the invention
In view of the deficiencies of the prior art, due to abscission ring after being welded it is an object of the invention to provide a kind of solution MIC elements
With the production technology of dysfunction caused by bubble.
To realize aforementioned invention purpose, the technical solution adopted by the present invention includes：
MIC elements using closed-loop fashion are welded in printed circuit board (PCB) assembling process, form MIC closed loops.
Preferably, the closed-loop fashion is by tin cream or spraying tin cream, forms closed loop tin cream.
Preferably, the closed-loop fashion is connected MIC element tin creams abscission ring to be printed using SMT abscission rings, forms closed loop tin
Cream.
Preferably, described tin cream either sprays tin cream using equipment or is accomplished manually.
Preferably, small tin piece is mounted in the clearance position of the MIC elements tin cream abscission ring.
Preferably, in the clearance position spot printing weld-aiding cream of the MIC elements tin cream abscission ring.
Preferably, in the clearance position spot printing solder(ing) paste of the MIC elements tin cream abscission ring.
Preferably, the printed circuit board (PCB) assembling process includes：
Adagio as requested that need to print of taking, is fixed on printing fixture；
Printing stencil will be added to for the tin cream of printing；
The adagio being fixed on printing fixture is put into stencil printer, and passes through the printing stencil and paste solder printing exists
On the pad of adagio；
Adagio after print solder paste is put into SPI equipment together with printing fixture, to the volume of tin cream, area, height and print
It tests brush position；
Adagio through SPI unit checks qualification is put into component mounting machine, the MIC elements that needs weld are passed through patch
Installing is standby to be mounted on the corresponding pad locations of adagio；
The adagio for mounting MIC elements is put into the inspection of AOI equipment progress MIC attachment qualities；
Adagio through AOI unit checks qualification is put into reflow ovens, by tin cream reflow soldering adagio pad and MIC members
Part welds together.
Preferably, glass putty content is 88.75% in the tin cream ingredient, and scaling powder content is 11.25%.
Preferably, the parameter setting of the reflow soldering is：Oxygen content≤900PPM, 130 DEG C of -200 DEG C of temperature plus
The hot time is 90~110 seconds, and the time of 200~217 DEG C of temperature heating is 15~25 seconds, and 217 DEG C of temperature more than heating times are
50~60 seconds, reflow peak temperature was 235 DEG C~240 DEG C, and heat up slope≤2 DEG C/S.
Compared with prior art, advantages of the present invention includes：Closed loop weldering is improved to by the welding of abscission ring tin cream for MIC elements
It connects, so as to overcome the defects of traditional processing technology, improves abscission ring and bubble after welding, avoid causing due to abscission ring and bubble
MIC elements dysfunction and causing form sound leakage in the circuit board, and then improve the stability of electronic product.
Description of the drawings
Fig. 1 is the abscission ring schematic diagram that MIC elements occur after welding in the prior art；
Fig. 2 is the bubble schematic diagram that MIC elements occur after welding in the prior art；
Fig. 3 is tin cream abscission ring schematic diagram in the embodiment of the present invention；
Fig. 4 is to realize showing for MIC elements closed loop welding by a tin cream/spraying closed loop tin cream for first embodiment of the invention
It is intended to；
Fig. 5 is the schematic diagram for being connected abscission ring with mounting small tin piece based on the printing of SMT abscission rings for second embodiment of the invention；
Fig. 6 is to print the schematic diagram that abscission ring is connected with spot printing weld-aiding cream based on SMT abscission rings for third embodiment of the invention；
Fig. 7 is to print the schematic diagram that abscission ring is connected with spot printing solder(ing) paste based on SMT abscission rings for fourth embodiment of the invention；
Fig. 8 a are using the MIC element effect figures after technical solution of the embodiment of the present invention；
Fig. 8 b are using the MIC element effect figures after technical solution of the embodiment of the present invention；
Fig. 8 c are using the MIC element effect figures after technical solution of the embodiment of the present invention；
Fig. 9 is thermal reflow profile schematic diagram used by exemplary embodiments of the present invention.
Specific embodiment
In view of deficiency of the prior art, inventor is able to propose the present invention's through studying for a long period of time and largely putting into practice
Technical solution.The technical solution, its implementation process and principle etc. will be further explained as follows.
The present invention proposes a kind of production technology for preventing MIC dysfunctions, provide after a kind of solution MIC elements welding by
The method of dysfunction caused by abscission ring and bubble, specific technical solution are as described below：
MIC elements using closed-loop fashion are welded in printed circuit board (PCB) assembling process, form MIC closed loops.
Tin cream abscission ring schematic diagram as shown in Figure 3, first embodiment of the invention pass through a tin cream or spraying closed loop tin cream
Mode, substitution tradition SMT abscission rings printing, is welded so as to fulfill MIC elements closed loop, eliminates asking for abscission ring and bubble after welding
Topic, schematic diagram are as shown in Figure 4.
The method that above-mentioned tin cream either sprays closed loop tin cream can be used equipment or manually complete.
Production technology described in first embodiment abandons traditional SMT abscission ring typographies, if being printed based on SMT abscission rings
Technique, the method that can also solve the dysfunction caused by abscission ring and bubble after the welding of MIC elements, by being printed in SMT abscission rings
On the basis of brush, MIC element tin cream abscission rings are attached, form closed loop tin cream to solve.
Second embodiment of the invention discloses the method for being connected abscission ring with mounting small tin piece based on SMT abscission rings typography,
As shown in figure 5, after the printing of SMT abscission rings, small tin piece is mounted in MIC element soldering paste abscission rings clearance position, by the half of two disconnections
Annulus connects, and is welded so as to fulfill the closed loop of MIC elements.
The method that third embodiment of the invention is connected abscission ring based on SMT abscission rings typography with spot printing weld-aiding cream, such as Fig. 6 institutes
Show, after the printing of SMT abscission rings, in MIC element soldering paste abscission ring clearance position spot printing weld-aiding creams, the semicircular ring for equally disconnecting two
It connects, is welded so as to fulfill the closed loop of MIC elements.
The method that fourth embodiment of the invention is connected abscission ring based on SMT abscission rings typography with spot printing solder(ing) paste, such as Fig. 7 institutes
Show, after the printing of SMT abscission rings, in MIC element soldering paste abscission ring clearance position spot printing solder(ing) pastes, the semicircular ring for equally disconnecting two
It connects, forms closed loop tin cream, welded so as to fulfill the closed loop of MIC elements.
Fig. 8 a~8c are using the design sketch after the MIC elements closed loop welding after technical solution of the present invention, the technology of the present invention
Scheme overcomes the defects of traditional processing technology, closed loop welding is improved to by the welding of abscission ring tin cream, so as to improve disconnected after welding
Ring and bubble avoid MIC elements from forming the dysfunction of sound leakage in the circuit board.
As the preferred embodiment of the present invention, the assembling process and work of printed circuit board (PCB) in any embodiment of the present invention
Skill includes：
Adagio as requested that need to print of taking is fixed on printing fixture and is printed.
Need tin cream to be used is added on printing stencil as requested.
The adagio being fixed on printing fixture is put into stencil printer as requested, by printing stencil by paste solder printing
On the pad of adagio.
As requested the adagio after print solder paste together with printing fixture be put into SPI equipment, to the volume of tin cream, area,
Height and printing position are tested；
As requested the adagio after qualified print solder paste is examined to be put into component mounting machine, needs are welded
MIC elements are mounted on the corresponding pad locations of adagio by mounting device.
The adagio for having mounted MIC elements is put into as requested the inspection of AOI equipment progress MIC attachment qualities,
As requested qualified adagio is examined to be put into reflow ovens, after tin cream is melted by reflow soldering by adagio pad and
MIC elements weld together.
Wherein：
Adagio, i.e. flexible circuit board are provided with the installation region of installation electronic device；
Pad, around the installation region closed ring set；
Tin cream coated on the installation region, connects pad and electronic device after high temperature dissolves；
MIC, microphone element；
Printing stencil, according to the pad design coordinate of adagio, that designs carries out template opening in pad correspondence position, can
So that tin cream is accurately coated on pad；
Fixture is printed, for the fixture for positioning and supporting to flexible circuit board；
SPI, paste solder printing quality restriction equipment；
AOI, electronic component mount the inspection equipment of quality；
Reflow ovens melt tin cream by the conduction for being heated at high temperature hot wind.
In the reflow soldering and the use of tin cream that welding process is related to, it is preferred to use following parameter setting.
The ratio and parameter setting of tin cream ingredient are as follows：
Tin cream model：INDIUM8.9HF；
Tin cream component ratio：Sn (glass putty content) 88.75%, scaling powder content 11.25%.
The parameter settings such as reflow soldering time, temperature are as shown in the table：
| Return time | 6’28” |
| Oxygen content | ≤900PPM |
| 200 DEG C of -217 DEG C of times | 15S~25S |
| 130 DEG C of -200 DEG C of times | 90S~110S |
| Reflow peak temperature | 235 DEG C~240 DEG C |
| 217 DEG C or more times | 50S~60S |
| Heat up slope | ≤2℃/S |
Thermal reflow profile schematic diagram is as shown in figure 9, wherein：
Peak DEG C of temperature：It is peak temperature when carrying out MIC reflow solderings, it is necessary to reach 235~240 DEG C.
Time Above：To be more than 217 DEG C of temperatures above required times, it is necessary to reach 50~60 seconds.
200~217 DEG C of Time：It is needed for the product before welding by the time that 200~217 DEG C of temperature of flat-temperature zone heat
Reach 15~25 seconds.
30~130 DEG C：For product preheating zone by when the product temperature rate of rise be less than<3 DEG C/S speed.
220 DEG C~100：Drop angle rate at the temperature at which being cooled down after flowing back for Product jointing<-3℃/S.
By using technical solution of the present invention, not only solving MIC elements welding procedure improves dysfunction problem, and not
It needs to put into detection device and the manpower of a large amount of costlinesses to be detected, so as to reduce the production cost of manufacturer；Together
Shi Caiyong technical solution of the present invention can promote the stability of electronic product, be allowed to more competitive in the market.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all
The equivalent change or modification that Spirit Essence is made according to the present invention, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of production technology for preventing MIC dysfunctions, it is characterised in that including：It is right in printed circuit board (PCB) assembling process
MIC elements are welded using closed-loop fashion, form MIC closed loops.
2. the production technology according to claim 1 for preventing MIC dysfunctions, it is characterised in that：The closed-loop fashion is
By tin cream or spraying tin cream, closed loop tin cream is formed.
3. the production technology according to claim 1 for preventing MIC dysfunctions, it is characterised in that：The closed-loop fashion is
After being printed using SMT abscission rings, MIC element tin creams abscission ring is connected, forms closed loop tin cream.
4. the production technology according to claim 2 for preventing MIC dysfunctions, it is characterised in that：Described tin cream or
Spraying tin cream is using equipment or is accomplished manually.
5. the production technology according to claim 3 for preventing MIC dysfunctions, it is characterised in that：In the MIC elements tin
The clearance position of cream abscission ring mounts small tin piece.
6. the production technology according to claim 3 for preventing MIC dysfunctions, it is characterised in that：In the MIC elements tin
The clearance position spot printing weld-aiding cream of cream abscission ring.
7. the production technology according to claim 3 for preventing MIC dysfunctions, it is characterised in that：In the MIC elements tin
The clearance position spot printing solder(ing) paste of cream abscission ring.
8. the production technology for preventing MIC dysfunctions according to any one of claim 1-7, which is characterized in that described
Printed circuit board (PCB) assembling process includes：
Adagio as requested that need to print of taking, is fixed on printing fixture；
Printing stencil will be added to for the tin cream of printing；
The adagio being fixed on printing fixture is put into stencil printer, and passes through the printing stencil by paste solder printing in adagio
Pad on；
Adagio after print solder paste is put into SPI equipment together with printing fixture, to the volume of tin cream, area, height and printing position
It puts and tests；
Adagio through SPI unit checks qualification is put into component mounting machine, the MIC elements that needs weld are set by attachment
It is standby to be mounted on the corresponding pad locations of adagio；
The adagio for mounting MIC elements is put into the inspection of AOI equipment progress MIC attachment qualities；
Adagio through AOI unit checks qualification is put into reflow ovens, adagio pad and MIC elements are welded by tin cream reflow soldering
It is connected together.
9. the production technology according to claim 8 for preventing MIC dysfunctions, it is characterised in that：Glass putty in tin cream ingredient
Content is 88.75%, and scaling powder content is 11.25%.
10. the production technology according to claim 8 for preventing MIC dysfunctions, which is characterized in that the reflow soldering
Parameter setting is：Oxygen content≤900PPM, the heating time of 130 DEG C of -200 DEG C of temperature is 90~110 seconds, 200~217 DEG C of temperature
The time of degree heating, 217 DEG C of temperature more than heating times were 50~60 seconds for 15~25 seconds, reflow peak temperature for 235 DEG C~
240 DEG C, heat up slope≤2 DEG C/S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004227.1A CN108055789A (en) | 2018-01-03 | 2018-01-03 | Prevent the production technology of MIC dysfunctions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004227.1A CN108055789A (en) | 2018-01-03 | 2018-01-03 | Prevent the production technology of MIC dysfunctions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108055789A true CN108055789A (en) | 2018-05-18 |
Family
ID=62126175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810004227.1A Pending CN108055789A (en) | 2018-01-03 | 2018-01-03 | Prevent the production technology of MIC dysfunctions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108055789A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139501A (en) * | 2019-05-30 | 2019-08-16 | 苏州维信电子有限公司 | Prevent the undesirable production technology of microphone function |
| CN110996241A (en) * | 2019-12-12 | 2020-04-10 | 苏州市运泰利自动化设备有限公司 | Microphone testing device |
| CN115135003A (en) * | 2021-03-26 | 2022-09-30 | 广东小天才科技有限公司 | Welding method of patch microphone and PCB assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877778A (en) * | 1981-10-30 | 1983-05-11 | Nippon Kokan Kk <Nkk> | Welding method for steel pipe |
| CN101166402A (en) * | 2006-10-16 | 2008-04-23 | 宝星电子株式会社 | Mounting method for mounting microphone on flexible printed circuit board |
| US20140033528A1 (en) * | 2012-08-06 | 2014-02-06 | Li-Yu Lin | Method of fast device attachment |
| CN106944705A (en) * | 2017-04-07 | 2017-07-14 | 武汉比天科技有限责任公司 | A kind of visual identity closed loop control method of tin cream precision welding |
| CN107231762A (en) * | 2017-06-02 | 2017-10-03 | 江苏久正光电有限公司 | A kind of SMT system of processing and its technique |
| CN207235030U (en) * | 2017-08-21 | 2018-04-13 | 奇酷互联网络科技（深圳）有限公司 | Microphone and electronic equipment |
-
2018
- 2018-01-03 CN CN201810004227.1A patent/CN108055789A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877778A (en) * | 1981-10-30 | 1983-05-11 | Nippon Kokan Kk <Nkk> | Welding method for steel pipe |
| CN101166402A (en) * | 2006-10-16 | 2008-04-23 | 宝星电子株式会社 | Mounting method for mounting microphone on flexible printed circuit board |
| US20140033528A1 (en) * | 2012-08-06 | 2014-02-06 | Li-Yu Lin | Method of fast device attachment |
| CN106944705A (en) * | 2017-04-07 | 2017-07-14 | 武汉比天科技有限责任公司 | A kind of visual identity closed loop control method of tin cream precision welding |
| CN107231762A (en) * | 2017-06-02 | 2017-10-03 | 江苏久正光电有限公司 | A kind of SMT system of processing and its technique |
| CN207235030U (en) * | 2017-08-21 | 2018-04-13 | 奇酷互联网络科技（深圳）有限公司 | Microphone and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139501A (en) * | 2019-05-30 | 2019-08-16 | 苏州维信电子有限公司 | Prevent the undesirable production technology of microphone function |
| CN110996241A (en) * | 2019-12-12 | 2020-04-10 | 苏州市运泰利自动化设备有限公司 | Microphone testing device |
| CN115135003A (en) * | 2021-03-26 | 2022-09-30 | 广东小天才科技有限公司 | Welding method of patch microphone and PCB assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108055789A (en) | Prevent the production technology of MIC dysfunctions | |
| CN109362189A (en) | A kind of SMT patch packaging technology | |
| CN113068324A (en) | Method for manufacturing circuit board by using remelting solder as weldability protective layer | |
| CN107124835A (en) | Reflow Soldering paster technique | |
| CN106413281A (en) | Hybrid surface-mounting process of double-side board | |
| CN107222982A (en) | A kind of SMT paster techniques | |
| JP2002064265A (en) | Bga-mounting method | |
| CN109548313A (en) | A kind of FPC component paster technique | |
| CN107135614A (en) | Printed circuit board (PCB) paster processing technology | |
| CN102922070A (en) | Lead-free surface mounting technology (SMT) welding process for FR-1 paper printed circuit board (PCB) and special heat insulation fixture | |
| CN110248495A (en) | Tin cream Reflow Soldering and glue technique for fixing | |
| US20110139855A1 (en) | Residual oxygen measurement and control in wave soldering process | |
| CN111654981A (en) | SMT reflow soldering process of PCBA flexible circuit board | |
| CN105234516A (en) | Reflow soldering process for electronic component printed circuit board | |
| CN105234517B (en) | The saturating welding hole of double-sided PCB board welds saturating tin method | |
| CN203265821U (en) | Compact type selective welding system | |
| CN108581110A (en) | Prepare the circuit assembly welding method of high pressure welding point | |
| CN114258209B (en) | Solder paste fusion glue dispensing solidification welding method | |
| CN110139501B (en) | Production process for preventing microphone from poor function | |
| CN112888188A (en) | PCBA (printed circuit board assembly) paster processing technology | |
| Oláh et al. | Process parameter optimization of selective soldering | |
| KR100647880B1 (en) | Method of installing injection connectors to a pcb | |
| US20060086718A1 (en) | Soldering method and device | |
| CN110351962A (en) | A kind of secondary via hole reflow method | |
| JPS6391541A (en) | Method for inspecting soldered spot of printed circuit board device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180518 |
|
| RJ01 | Rejection of invention patent application after publication |