CN108034973A - The direct electroplating hole metallization solution and preparation method of a kind of printed circuit board (PCB) - Google Patents
The direct electroplating hole metallization solution and preparation method of a kind of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN108034973A CN108034973A CN201711277707.7A CN201711277707A CN108034973A CN 108034973 A CN108034973 A CN 108034973A CN 201711277707 A CN201711277707 A CN 201711277707A CN 108034973 A CN108034973 A CN 108034973A
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- China
- Prior art keywords
- additive
- hole metallization
- metallization solution
- circuit board
- pcb
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Abstract
The embodiment of the present invention provides a kind of direct electroplating hole metallization solution and preparation method of printed circuit board (PCB), is related to printed-board technology field.Include the component of following mass fraction：Carbon black 1~5%, the first additive 0.1 1.5%, Second addition 0.2 0.8%, the 3rd additive 0.1 0.3%, alkaline buffer salt 0.5 3.5%, antiseptic 0.01 0.5% and water 90 99%, the skeleton symbol of first additive is R (OR ') nX, wherein R is alkyl or aryl, R' is alkyl, n is that 5 80, X is sulfate radical or phosphate radical, and the skeleton symbol of Second addition is R (OR ') n, wherein R is aryl, and R' is alkyl；N is 30 80, and the 3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.The hole metallization solution of the printed circuit board (PCB) can lift the performance of the hole metallization solution of printed circuit board (PCB), increase its service life.
Description
Technical field
The invention belongs to the directly plating hole metallization in printed-board technology field, more particularly to a kind of printed circuit board (PCB)
Solution and preparation method.
Background technology
Before being electroplated to printed circuit board (PCB), usually using dedicated circuit board printing hole metallization solution.Tradition
Hole metallization electroless copper is chemical reaction process, environment is harmful to containing formaldehyde in solution, and have carcinogenic risk.Complexing agent
It is not easy to carry out biodegradable, wastewater treatment difficulty.Chemical bronze plating liquid stability is poor at the same time, easily decomposes, and technological process is various, operation
It is difficult in maintenance.Circuit board, which prints direct electroplating hole metallization solution, not to be chemically reacted in physical in adsorption process,
Also the phenomenon of other components is consumed there is no chemical reaction.The operation and maintenance of this solution is simple and reliable.
The direct electroplating hole metallization solution of existing printed circuit board (PCB) generally includes high-purity, high carbon dust, surface-active
Agent, water-soluble high-molecular compound.But the carbon black of the hole metallization solution of existing printed circuit board (PCB) is difficult to disperse, easily roll into a ball
It is poly-, after placing a period of time, it will fail.
The content of the invention
The present invention provides a kind of the hole metallization solution and preparation method of printed circuit board (PCB), it is intended to solves existing printed circuit
The hole metallization solution of plate exist in carbon black be difficult disperse, easily reunite caused by printed circuit board (PCB) hole metallization solution it is easy
The problem of failure.
A kind of hole metallization solution for printed circuit board (PCB) that first aspect present invention provides, the hole metallization solution include
The component of following mass fraction：
Carbon black 1~5%, the first additive 0.1-1.5%, Second addition 0.2-0.8%, the 3rd additive 0.1-
0.3%th, alkaline buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-99%；
Wherein, the skeleton symbol that the first additive is is R (OR ') nX, and wherein R is alkyl or aryl；R' is alkyl, and n is
5-80, X are sulfate radical or phosphate radical；
The skeleton symbol that Second addition is is R (OR ') n, and wherein R is aryl, and R' is alkyl；N is 30-80；
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.Second aspect of the present invention provides one
The preparation method of the hole metallization solution of kind printed circuit board (PCB), this method include：
Following components is weighed respectively according to mass fraction：Carbon black 1~5%, the first additive 0.1-1.5%, the second addition
Agent 0.2-0.8%, the 3rd additive 0.1-0.3%, alkaline buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-
99%；
Carbon black and Second addition are added to the water and are configured to suspension；
When the first additive and small alkaline buffer salt grinding 0.5~4 are added in suspension, and it is point more in process of lapping
The 3rd additive of secondary addition, forms dispersion liquid, and the addition of alkaline buffer salt is the 50~70% of the first additive quality；
Alkaline buffer salt and antiseptic are added in dispersion liquid, obtains the hole metallization solution of printed circuit board (PCB)；
Wherein, the mass fraction of carbon black be the mass fraction of the 1~5%, first additive be 0.1-1.5%, second addition
The mass fraction of agent is 0.2-0.8%, and the mass fraction of the 3rd additive is 0.1-0.3%, the mass fraction of alkaline buffer salt
Mass fraction for 0.5-3.5%, antiseptic is 0.01-0.5% and the mass fraction of water is 90-99%；
The skeleton symbol that first additive is is R (OR ') nX, and wherein R is alkyl or aryl；R' is alkyl, n 5-80, X
For sulfate radical or phosphate radical；
The skeleton symbol that Second addition is is R (OR ') n, and wherein R is aryl, and R' is alkyl；N is 30-80；
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.
The hole metallization solution and preparation method of a kind of printed circuit board (PCB) provided by the invention, in the Kong Jin of printed circuit board (PCB)
The first additive used in categoryization solution belongs to more polyethers salt for anion surfactant, in water ionization formed it is cloudy from
Son, can be very good soluble in water, adsorbs carbon black built-in function group and the big pi bond of carbon black inner plane, disperses carbon black powder
Yu Shuizhong.In addition, the first additive belongs to long chain macromolecule polymer, carbon black granules steric hindrance can be strengthened, protect carbon black
Particle will not flocculate.Second addition all contains more aromatic rings for more benzene polyethers and carbon black, by forming relatively stronger big pi bond phase
Mutually attract, cooperate with stable dispersion carbon black to act on the first additive, then pass through the hydrogen bond action and dipole-idol between the 3rd additive
Pole acts on, and can strengthen the active force between first and second additive and solvent, additive is preferably dissolved into aqueous solvent, structure
The dispersion highly stable into one.The system is uniform, and suspendability increase, is not precipitated, whole system physico-chemical property is the same.
The service life of the hole metallization solution of printed circuit board (PCB) can thus be increased substantially.Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention.
Fig. 1 is the scanning electron microscope (SEM) photograph after the hole metallization solution drying for the printed circuit board (PCB) that the embodiment of the present invention 3 provides.
Fig. 2 is the hole metallization solution particle diameter test chart for the printed circuit board (PCB) that the embodiment of the present invention 3 is prepared.
Embodiment
Goal of the invention, feature, advantage to enable the present invention is more obvious and understandable, below in conjunction with the present invention
Attached drawing in embodiment, is clearly and completely described the technical solution in the embodiment of the present invention, it is clear that described reality
It is only part of the embodiment of the present invention to apply example, and not all embodiments.Based on the embodiments of the present invention, people in the art
Member's all other embodiments obtained without making creative work, belong to the scope of protection of the invention.
The present invention provides a kind of hole metallization solution of printed circuit board (PCB), includes the component of following mass fraction：
Carbon black 1~5%, the first additive 0.1-1.5%, Second addition 0.2-0.8%, the 3rd additive 0.1-
0.3%th, alkaline buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-99%；
Wherein, the skeleton symbol of the first additive is R (OR ') nX, and wherein R is alkyl or aryl；R' is alkyl；N is 5-
80；X is sulfate radical or phosphate radical；
The skeleton symbol that Second addition is is R (OR ') n, and wherein R is aryl；R' is alkyl；N sizes are 30-80.
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.
The hole metallization solution of printed circuit board (PCB) provided by the invention, in the hole metallization solution of printed circuit board (PCB)；
Specifically, the first additive is that more polyethers salt are anion surfactant, can be alkylpolyoxyethylene
At least one of sulfate, octadecyl polyoxypropylene ether phosphate and octyl group polyoxyethylene ether phosphate.For example, dodecane
Base polyethenoxy ether sodium sulfate, alkylpolyoxyethylene potassium sulfate, octadecyl polyethenoxy ether sodium phosphate, octyl group polyoxy
Vinethene potassium phosphate.The first additive is used as anion surfactant, is ionized in its water and forms anion, be dissolved in well
In water, carbon black built-in function group and the big pi bond of carbon black inner plane are adsorbed, is dispersed in water carbon black powder；On the other hand, it is more
Polyethers salt belongs to long chain macromolecule polymer, strengthens carbon black granules steric hindrance, and protection carbon black particle will not flocculate.
Preferably, first it is added to octyl group polyoxyethylene ether potassium phosphate.
Specifically, it is nonionic surfactant that Second addition, which belongs to more benzene polyethers, can be benzene butyl polyoxyethylene
At least one of ether, naphthalene ethyl polyethenoxy ether and phenethyl polyethenoxy ether.The more benzene polyethers of Second addition and carbon black are all
Containing more aromatic rings, attracted each other by forming relatively stronger big pi bond, cooperate with stable dispersion carbon black to act on the first additive.
Preferably, Second addition is benzene butyl polyoxyethylene ether.
In practical applications, acted on by the 3rd additive by the hydrogen bond action between cosolvent and dipole-dipole, can be with
Strengthen the active force between first and second additive and solvent, additive is preferably dissolved into aqueous solvent, it is steady to form a height
Fixed dispersion.The system is uniform, and suspendability increase, is not precipitated, whole system physico-chemical property is the same.Thus can be significantly
Improve the service life of the hole metallization solution of printed circuit board (PCB).
Specifically, alkaline buffer salt for potassium carbonate, sodium carbonate, potassium carbonate-bicarbonate, dipotassium hydrogen phosphate-biphosphate
One kind in potassium, borax-calcium chloride, borax-sodium carbonate, ammonium hydroxide-ammonium chloride.Preferably, alkaline buffer salt is potassium carbonate-carbon
Potassium hydrogen phthalate, 9.5~12.5 can be adjusted to after adding alkaline buffer salt by the pH value of solution, are preferably 11, are made carbon black particle table
Face is in electric charge negativity, so that carbon black particle absorption is on hole wall.
Specifically, antiseptic is at least one of imidazoles, isothiazolone and dodecyl dimethyl benzyl ammonium bromide.It is anti-
Microbial inoculum can reduce pollution of the microorganism to solution to avoid the growth and breeding of microorganism in water.
The present invention also provides a kind of preparation method of the hole metallization solution of printed circuit board (PCB),
Following components is weighed respectively according to mass fraction：Carbon black 1~5%, the first additive 0.1-1.5%, the second addition
Agent 0.2-0.8%, the 3rd additive 0.1-0.3%, alkaline buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-
99%；
Carbon black and Second addition are added to the water and are configured to suspension；
When the first additive and small alkaline buffer salt solution grinding 0.5~4 are added in suspension, and divide in process of lapping
The 3rd additive is repeatedly added, forms dispersion liquid；
The addition of alkaline buffer salt is the 50~70% of the first additive quality.Preferably, alkaline buffer salt is carbonic acid
Potassium or sodium carbonate, addition are the 60% of the first additive quality.
Remaining alkaline buffer salt and antiseptic are added in dispersion liquid, obtains the hole metallization solution of printed circuit board (PCB)；
Wherein, the skeleton symbol that the first additive is is R (OR ') nX, and wherein R is alkyl or aryl；R' is alkyl, and n is
5-80, X are sulfate radical or phosphate radical；
The skeleton symbol that Second addition is is R (OR ') n, and wherein R is aryl, and R' is alkyl；N is 30-80；
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.It should be noted that in this method
Used water be meet China laboratory with land that abounds in rivers and lakes family three-level water quality standard, primarily to prevent in water containing excess amount of Ca from
Son, Mg ions form incrustation scale, accelerate the reunion of carbon black, and then influence the stability of the hole metallization solution of printed circuit board (PCB).
Preferably, when the milling time in step 1 is 1~3 small, the number for adding cosolvent is 2~5 times.
Comparative example 1
20g carbon blacks, 20g Second addition benzene butyl polyoxyethylene ether are added in 938g water and are configured to suspension；
When addition 10g potassium carbonate powders grinding 3 is small in suspension, and 1.5g polypropylene glycols are added when 1 is small, formed dispersed
Liquid；
6g potassium carbonate-bicarbonates (can wiring solution-forming) and 3g imidazoles are added in dispersion liquid, stirs evenly to form printing
The hole metallization solution of circuit board.
Comparative example 2
20g carbon blacks, 20g naphthalene ethyl polyethenoxy ethers are added in 938g water and are configured to suspension；Add in suspension
Enter 10g hydrogen powdered sodium carbonate grinding 3 it is small when, and when 1 is small add 1.5g polypropylene glycols, formed uniform dispersion；
6g potassium carbonate-bicarbonates (can wiring solution-forming) and 3g imidazoles are added in dispersion liquid, stirs evenly to form printing
The hole metallization solution of circuit board.
Embodiment 1
20g carbon blacks, 10g phenethyl polyethenoxy ethers are added in 938g water and are configured to suspension；Add in suspension
When entering 10g octyl group polyoxyethylene ether sodium phosphates and small 6g potassium hydroxide powders grinding 3, and 1.5g poly- the third two is added when 1 is small
Alcohol, forms uniform dispersion；
6g dipotassium hydrogen phosphates-potassium dihydrogen phosphate (can wiring solution-forming) and 3g imidazoles are added in dispersion liquid, stirs evenly shape
Into the hole metallization solution of printed circuit board (PCB).
Embodiment 2
20g carbon blacks, 20g naphthalene ethyl polyethenoxy ethers are added in 938g water and are configured to suspension；Add in suspension
When entering 10g octadecyl polyethenoxy ether potassium phosphates and small 2g sodium hydroxide powders grinding 3, and add 1.5g when 1 is small and gather
Propane diols, forms uniform dispersion；
6g potassium carbonate-bicarbonates (can wiring solution-forming) and 3g imidazoles are added in dispersion liquid, stirs evenly to form printing
The hole metallization solution of circuit board.
Embodiment 3
20g carbon blacks, 18g benzene butyl polyoxyethylene ether are added in 1000g water and are configured to suspension；Add in suspension
When entering 10g dodecyl polyoxyethylene potassium sulfates and small 5g powdered sodium carbonates grinding 3, and 1.5g poly- the third two is added when 1 is small
Alcohol, forms uniform dispersion；
6g sodium carbonate (can wiring solution-forming) and 3g imidazoles are added in dispersion liquid, stirs evenly the hole to form printed circuit board (PCB)
Metallization solution.The hole metallization solution of the printed circuit board (PCB) prepared to comparative example 1~2, embodiment 1~3 is placed 300 days, is not had
Agglomeration is occurred, performance is stablized.Place 600 days, comparative example 1,2 bottoms are precipitated, and embodiment 1~3 does not occur still
Agglomeration, the hole metallization solution efficacy for showing to add the printed circuit board (PCB) of first and second additive preparation at the same time is better than independent
Add a kind of additive.In addition, after the hole metallization solution of the printed circuit board (PCB) prepared to embodiment 3 does particle diameter test and drying
Electronic Speculum test is scanned, as shown in the figure, the hole metallization for the printed circuit board (PCB) that Fig. 1 is prepared for the embodiment of the present invention 3 is molten
The electron microscope of liquid test, Fig. 2 are the hole metallization solution particle diameter test for the printed circuit board (PCB) that the embodiment of the present invention 3 is prepared
Figure.By finding out in figure, substance dispersibility is than more uniform in the hole metallization solution of printed circuit board (PCB).In addition, the average grain of carbon black
Footpath is less than 100nm, far below market matured product.Illustrate that this method can not only improve the hole metallization solution of printed circuit board (PCB)
Dispersiveness, the particle diameter of carbon black can also be reduced, and then possess more preferable stability.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. the hole metallization solution of a kind of printed circuit board (PCB), it is characterised in that the hole metallization solution includes following quality point
Several components：
Carbon black 1~5%, the first additive 0.1-1.5%, Second addition 0.2-0.8%, the 3rd additive 0.1-0.3%, alkali
Property buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-99%；
Wherein, the skeleton symbol of the first additive is R (OR ') nX, and wherein R is alkyl or aryl；R' is alkyl, n 5-80, X
For sulfate radical or phosphate radical；
The skeleton symbol of Second addition is R (OR ') n, and wherein R is aryl, and R' is alkyl；N is 30-80；
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.
2. hole metallization solution according to claim 1, it is characterised in that first additive is dodecyl polyoxy
At least one of oxyethylene sulfate, octadecyl polyoxypropylene phosphate and octyl group polyoxyethylene ether phosphate.
3. hole metallization solution according to claim 1, it is characterised in that the Second addition is benzene butyl polyoxy second
At least one of alkene ether, naphthalene ethyl polyethenoxy ether and phenethyl polyethenoxy ether.
4. hole metallization solution according to claim 1, it is characterised in that alkaline buffer salt is potassium carbonate, sodium carbonate, carbon
In sour potassium-saleratus, dipotassium hydrogen phosphate-potassium dihydrogen phosphate, borax-calcium chloride, borax-sodium carbonate and ammonium hydroxide-ammonium chloride
At least one.
5. hole metallization solution according to claim 1, it is characterised in that antiseptic is imidazoles, isothiazolone and 12
At least one of Alkyl dimethyl benzyl ammonium bromide antiseptic.
A kind of 6. preparation method of the hole metallization solution of printed circuit board (PCB), it is characterised in that the described method includes：
Following components is weighed respectively according to mass fraction：Carbon black 1~5%, the first additive 0.1-1.5%, Second addition
0.2-0.8%, the 3rd additive 0.1-0.3%, alkaline buffer salt 0.5-3.5%, antiseptic 0.01-0.5% and water 90-
99%；
Carbon black and Second addition are added to the water and are configured to suspension；
When the first additive and small alkaline buffer salt grinding 0.5~4 are added in suspension, and add several times in process of lapping
Enter the 3rd additive, form dispersion liquid, the addition of alkaline buffer salt is the 50~70% of the first additive quality；
Remaining alkaline buffer salt and antiseptic are added in dispersion liquid, obtains the hole metallization solution of printed circuit board (PCB)；
Wherein, the skeleton symbol that the first additive is is R (OR ') nX, and wherein R is alkyl or aryl, and R' is alkyl, n 5-80,
X is sulfate radical or phosphate radical；
The skeleton symbol that Second addition is is R (OR ') n, and wherein R is aryl, and R' is alkyl；N is 30-80；
3rd additive is at least one of polypropylene glycol, glycerine and polyethylene glycol.
7. hole metallization solution according to claim 1, it is characterised in that first additive is dodecyl polyoxy
At least one of oxyethylene sulfate, octadecyl polyoxypropylene phosphate and octyl group polyoxyethylene ether phosphate.
8. hole metallization solution according to claim 6, it is characterised in that the Second addition is benzene butyl polyoxy second
At least one of alkene ether, naphthalene ethyl polyethenoxy ether and phenethyl polyethenoxy ether.
9. hole metallization solution according to claim 6, it is characterised in that alkaline buffer salt for potassium carbonate-bicarbonate,
At least one of dipotassium hydrogen phosphate-potassium dihydrogen phosphate, borax-calcium chloride, borax-sodium carbonate and ammonium hydroxide-ammonium chloride.
10. hole metallization solution according to claim 6, it is characterised in that antiseptic is imidazoles, isothiazolone and 12
At least one of Alkyl dimethyl benzyl ammonium bromide antiseptic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711277707.7A CN108034973B (en) | 2017-12-06 | 2017-12-06 | Direct electroplating hole metallization solution for printed circuit board and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711277707.7A CN108034973B (en) | 2017-12-06 | 2017-12-06 | Direct electroplating hole metallization solution for printed circuit board and preparation method |
Publications (2)
| Publication Number | Publication Date |
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| CN108034973A true CN108034973A (en) | 2018-05-15 |
| CN108034973B CN108034973B (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867285A (en) * | 2020-12-29 | 2021-05-28 | 深圳市贝加电子材料有限公司 | Conductive graphite hole metallization solution and preparation method and application thereof |
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| US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
| CN101165820A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | Carbon black conductive fluid |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
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2017
- 2017-12-06 CN CN201711277707.7A patent/CN108034973B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
| CN101165820A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | Carbon black conductive fluid |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112867285A (en) * | 2020-12-29 | 2021-05-28 | 深圳市贝加电子材料有限公司 | Conductive graphite hole metallization solution and preparation method and application thereof |
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| CN108034973B (en) | 2020-04-28 |
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Denomination of invention: Direct plating hole metallization solution and preparation method for printed circuit board Effective date of registration: 20210622 Granted publication date: 20200428 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BAIKAL ELECTRONICS Co.,Ltd. Registration number: Y2021980005086 |
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