CN108022942B - Array substrate and organic light-emitting display panel - Google Patents
Array substrate and organic light-emitting display panel Download PDFInfo
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- CN108022942B CN108022942B CN201610929519.7A CN201610929519A CN108022942B CN 108022942 B CN108022942 B CN 108022942B CN 201610929519 A CN201610929519 A CN 201610929519A CN 108022942 B CN108022942 B CN 108022942B
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The embodiment of the invention discloses an array substrate and an organic light-emitting display panel, wherein the array substrate comprises: a substrate; the inorganic insulating layer is positioned on the substrate, and a plurality of protruding structures are arranged on one surface of the inorganic insulating layer, which is far away from the substrate; and a metal wire layer on a side of the inorganic insulating layer facing away from the substrate. According to the array substrate provided by the embodiment of the invention, the plurality of protruding structures are formed on the surface of the inorganic insulating layer, which is far away from the substrate, and the metal wire layer extends along with the climbing of the protruding structures, so that the extending length of the metal wire layer can be obviously increased due to the arrangement of the plurality of protruding structures; compared with the prior art, the array substrate provided by the embodiment of the invention has the advantages that the extending length of the metal wire layer in the bending direction is increased through phase transformation, so that the bending radius of the metal wire layer is smaller, the metal wire layer can bear the smaller bending radius without cracking, and the problem that the metal wire is easy to crack when being bent in the prior art is solved.
Description
Technical Field
The embodiment of the invention relates to a flexible panel technology, in particular to an array substrate and an organic light-emitting display panel.
Background
An Active Matrix Oled (AMOLED) is a self-luminous display device, which has better picture quality than a liquid crystal display, and is also a thin film solid state device, thus making it easier to use for flexible displays.
Fig. 1 is a partial structure diagram of a conventional flexible AMOLED, and includes a glass substrate 10, a flexible PI film 11, an inorganic film layer 12, and metal traces 13. When the flexible AMOLED is bent, the inorganic film 12 therein is prone to crack based on the characteristics of internal stress, density, and the like, and the corresponding metal trace 13 on the inorganic film 12 may also be broken or disconnected. In addition, the fracture strain limit of the metal itself is about 1%, and when the flexible AMOLED is bent, the metal trace 13 extends beyond the limit, and the metal trace 13 may crack.
Disclosure of Invention
The embodiment of the invention provides an array substrate and an organic light-emitting display panel, and aims to solve the problem that metal wires of an existing AMOLED are prone to cracking when bent.
In a first aspect, an embodiment of the present invention provides an array substrate, including:
a substrate;
the inorganic insulating layer is positioned on the substrate, and a plurality of protruding structures are arranged on one surface of the inorganic insulating layer, which is far away from the substrate; and
a metal wire layer on a side of the inorganic insulating layer facing away from the substrate.
Further, the convex structure is of a regular trapezoid structure, a semicircular structure or a semi-elliptical structure.
Further, the material of the substrate is selected from at least one of polyimide, polycarbonate and polyethylene terephthalate.
Further, the thickness of the substrate is greater than or equal to 10 μm and less than or equal to 50 μm; the density of the substrate is more than or equal to 1.4g/cm3And less than or equal to 1.6g/cm3。
Further, the material of the inorganic insulating layer is selected from any one of silicon oxide, aluminum oxide, and titanium oxide.
Further, the inorganic insulating layer has a thickness of 50nm or more and 1000nm or less.
Further, the thickness of the inorganic insulating layer is 100 nm.
Further, the density of the inorganic insulating layer is more than or equal to 2.00g/cm3And is less than or equal to 2.66g/cm3。
Further, the inorganic insulating layer includes: the inorganic layer structure comprises a first inorganic layer and a second inorganic layer, wherein the first inorganic layer is positioned on the substrate, the second inorganic layer is positioned on one side of the first inorganic layer, which deviates from the substrate, a plurality of protruding structures are arranged on one surface of the second inorganic layer, which deviates from the first inorganic layer, and the density of the first inorganic layer is greater than that of the second inorganic layer.
Further, the density of the first inorganic layer is greater than or equal to 2.34g/cm3And is less than or equal to 2.66g/cm3(ii) a The density of the second inorganic layer is greater than or equal to 2.00g/cm3And is less than or equal to 2.34g/cm3。
Further, the thickness of the first inorganic layer is greater than or equal to 50nm and less than or equal to 1000 nm; the second inorganic layer has a thickness of 10nm or more and 500nm or less.
Further, the thickness of the first inorganic layer is greater than or equal to 90nm and less than or equal to 110 nm; the second inorganic layer has a thickness of greater than or equal to 20nm and less than or equal to 50 nm.
Further, the material of the first inorganic layer is selected from any one of silicon oxide, aluminum oxide, and titanium oxide; the material of the second inorganic layer is selected from any one of silicon oxide, aluminum oxide and titanium oxide.
Further, the second inorganic layer comprises a plurality of protruding structures arranged at intervals.
Further, the first inorganic layer has a plurality of grooves on a side facing away from the substrate; the second inorganic layer comprises a plurality of inorganic membrane blocks which are in one-to-one correspondence with the grooves, the inorganic membrane blocks are positioned in the grooves, and the parts of the inorganic membrane blocks, which exceed the first inorganic layer, are of convex structures.
Further, the groove is an inverted trapezoidal groove, a semicircular groove or a semi-elliptical groove.
In a second aspect, embodiments of the present invention also provide an organic light emitting display panel, including: the array substrate is arranged on the substrate, and the cover plate is arranged opposite to the array substrate.
According to the array substrate provided by the embodiment of the invention, the plurality of protruding structures are formed on the surface of the inorganic insulating layer, which is far away from the substrate, and the metal wire layer extends along with the climbing of the protruding structures, so that the arrangement of the plurality of protruding structures can obviously increase the line length of the metal wire layer; compared with the prior art, the array substrate provided by the embodiment of the invention has the advantages that the line length of the metal line layer in the bending direction is increased through phase transformation, so that the bending radius of the metal line layer is smaller, the metal line layer can bear the smaller bending radius without cracking, and the problem that the metal line is easy to crack when being bent in the prior art is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the technical solutions in the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a partial structural view of a flexible AMOLED provided in the prior art;
fig. 2A is a schematic view of an array substrate according to an embodiment of the invention;
FIG. 2B is a cross-sectional view taken along A-A' of FIG. 2A;
fig. 3A is a schematic view of another array substrate according to an embodiment of the invention;
fig. 3B is a schematic view of another array substrate according to an embodiment of the invention;
fig. 3C is a schematic view of another array substrate according to an embodiment of the invention;
fig. 4 is a schematic view of an array substrate according to a second embodiment of the present invention;
fig. 5 is a schematic view of an array substrate according to a third embodiment of the present invention;
fig. 6 is a schematic view of an array substrate according to a fourth embodiment of the present invention;
fig. 7 is a schematic view of an array substrate according to a fifth embodiment of the present invention;
fig. 8 is a schematic view of an organic light emitting display panel according to a sixth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described through embodiments with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 2A is a schematic view of an array substrate according to an embodiment of the invention, and fig. 2B is a cross-sectional view taken along a-a' of fig. 2A. The array substrate of the embodiment is suitable for an organic light emitting display panel. The array substrate provided by the embodiment comprises: a substrate 110; an inorganic insulating layer 120 located on the substrate 110, wherein a plurality of protruding structures 130 are arranged on a surface of the inorganic insulating layer 120 facing away from the substrate 110; and a metal wire layer 140 on a side of the inorganic insulating layer 120 facing away from the substrate 110. It can be understood by those skilled in the art that the present embodiment only illustrates a partial structure of the array substrate, and other structures of the array substrate are similar to the existing structure, and are not described and illustrated herein.
As will be understood by those skilled in the art, the array substrate includes a display area, and the metal line layer may be located at the periphery of the display area, for example, in this embodiment, the metal line layer 140 is located at the periphery of the display area AA and includes at least two metal lines 141, or in other embodiments, the metal line layer may be located at the periphery of the display area AA and is in a closed shape surrounding the display area; one skilled in the art will also appreciate that the metal line layer may also be located within the display area, and that the optional metal line layer may include a plurality of metal lines in order to ensure the light-transmissive type of the display area. The structure of the metal wire layer is not limited in the present invention, and a person skilled in the art can set the structure of the metal wire layer by himself or herself according to the needs of the product.
The inorganic insulating layer 120 has a plurality of protruding structures 130 on a side facing away from the substrate 110, and tops of the protruding structures 130 extend beyond a plane of the inorganic insulating layer 120. In this embodiment, the metal line layer 140 is located at the periphery of the display area (AA) of the array substrate, the metal line layer 140 includes at least two metal lines 141, the maximum size of the protrusion structure 130 (covered in fig. 2A) is equal to the line width of the metal line 141 in the line width direction (X direction) of the metal line 141, the projection of the metal line 141 covers the projection of the protrusion structure 130 in the direction perpendicular to the array substrate, and the thickness of the optional metal line layer 140 in the direction perpendicular to the array substrate is 10nm to 1000nm in this embodiment. Accordingly, when the metal wire layer 140 is prepared, the metal wire layer 140 extends along with the climbing of the protruding structures 130, and thus the arrangement of a plurality of protruding structures 130 can significantly increase the extending length of the metal wire layer 140. In the bending direction of the array substrate, compared with the prior art, the array substrate provided by the embodiment changes the phase to increase the extension length of the metal wire layer 140 in the bending direction, so that the metal wire layer 140 in the embodiment can bear a smaller bending radius without cracking.
In the present embodiment, the optional protrusion structure 130 is a regular trapezoid structure. It will be understood by those skilled in the art that the protrusion structure 130 may be a semicircular structure (as shown in fig. 3A), a semi-elliptical structure (as shown in fig. 3B), or a triangular structure (as shown in fig. 3C) in other embodiments of the present invention, and the shape of the protrusion structure is not limited in the embodiments of the present invention, and any protrusion structure beyond the plane of the inorganic insulating layer falls within the scope of the present invention.
The material of the optional substrate 110 is selected from at least one of polyimide, polycarbonate and polyethylene terephthalate, and the optional substrate 110 is polyimide in this embodiment. The polyimide has excellent mechanical performance, the tensile strength is more than 100Mpa, and the impact strength can also reach 200KJ/m2(ii) a Polycarbonate is a tough thermoplastic resin with high strength, high coefficient of elasticity and high impact strength; the polyethylene terephthalate has good mechanical property, the impact strength is 3-5 times that of other films, and the folding resistance is good. Thus any one or more of polyimide, polycarbonate and polyethylene terephthalate may be used as the flexible substrate. It will be understood by those skilled in the art that the materials of the flexible substrate include, but are not limited to, the above three and their compounds, and for example, at least one of polyacrylate, polyetherimide, polyethersulfone and polyethylene naphthalate may also be included, and any flexible bendable flexible substrate falls within the scope of the present invention, and the materials of the substrate are not particularly limited in the present invention.
The thickness of the optional substrate 110 in this embodiment is greater than or equal to 10 μm and less than or equal to 50 μm; the density of the substrate 110 is greater than or equal to 1.4g/cm3And less than or equal to 1.6g/cm3. It can be understood by those skilled in the art that when the array substrate is applied to different display devices, the thickness and the density of the substrate are different, so that relevant practitioners can set or select parameters such as the thickness and the density of the substrate according to the needs of the product, and the invention is not limited specifically.
The material of the optional inorganic insulating layer 120 herein is selected from any one of silicon oxide, aluminum oxide, and titanium oxide. The thickness of the inorganic insulating layer 120 is 50nm or more and 1000nm or less. The density of the inorganic insulating layer 120 is greater than or equal to 2.00g/cm3And is less than or equal to 2.66g/cm3. In this embodiment, the inorganic insulating layer 120 may be formed on the substrate 110 by a vapor deposition or sputtering process, and the plurality of protruding structures 130 may be formed on a surface of the inorganic insulating layer 120 away from the substrate 110 by a photolithography process through exposure, development and etching. In this embodiment, the thickness of the inorganic insulating layer 120 may be greater than or equal to 90nm and less than or equal to 110nm, and the thickness of the inorganic insulating layer 120 is preferably 100 nm. It will be understood by those skilled in the art that the material, thickness, compactness, formation process, process for forming the protruding structure, and the like of the inorganic insulating layer include, but are not limited to, the above examples, and relevant parameters and processes can be set by relevant practitioners according to the needs of products.
According to the array substrate provided by the embodiment, the plurality of protruding structures are formed on the surface, away from the substrate, of the inorganic insulating layer, and the metal wire layer extends along with the climbing of the protruding structures, so that the extending length of the metal wire layer can be remarkably increased due to the arrangement of the plurality of protruding structures. Compared with the prior art, the array substrate that this embodiment provided becomes looks and has increased the length of metal wire layer on the direction of buckling, and then makes the radius of buckling of metal wire layer littleer, and the metal wire layer can bear littleer radius of buckling and can not take place the fracture from this, has solved the problem that the metal wire is easy to crack when buckling among the prior art.
Fig. 4 is a schematic view of an array substrate according to a second embodiment of the present invention. The difference between the array substrate provided in this embodiment and the foregoing embodiments is that, in the array substrate of this embodiment, the optional inorganic insulating layer 120 includes: the organic light emitting diode comprises a first inorganic layer 121 and a second inorganic layer 122, wherein the first inorganic layer 121 is located on the substrate 110, the second inorganic layer 122 is located on one side, away from the substrate 110, of the first inorganic layer 121, a plurality of protruding structures 130 are arranged on one side, away from the first inorganic layer 121, of the second inorganic layer 122, and the density of the first inorganic layer 121 is greater than that of the second inorganic layer 122. In the present embodiment, the optional protrusion structure 130 is a regular trapezoid structure. The present embodiment follows the same structural reference numerals as the above embodiments.
In the embodiment, the second inorganic layer 122 covers the first inorganic layer 121, and a side of the second inorganic layer 122 facing away from the first inorganic layer 121 has a plurality of protruding structures 130, and tops of the protruding structures 130 exceed a plane of the second inorganic layer 122. The maximum size of the protruding structure 130 is equal to the line width of the metal line 141 in the line width direction of the metal line 141, and the projection of the metal line 141 covers the projection of the protruding structure 130 in the direction perpendicular to the array substrate. Accordingly, when the metal wire layer 140 is prepared, the metal wire layer 140 extends along with the climbing of the protruding structures 130, so that the extending length of the metal wire layer 140 can be increased significantly by the arrangement of the protruding structures 130, and the bending radius of the metal wire layer 140 is smaller, so that the metal wire layer 140 can bear the smaller bending radius without cracking.
In addition, a first inorganic layer 121 is positioned on the substrate 110, a second inorganic layer 122 is positioned on the first inorganic layer 121, and a metal wire layer 140 is positioned on the second inorganic layer. Because the density of the second inorganic layer 122 is smaller than that of the first inorganic layer 121, when the array substrate is bent and deformed, the amount of deformation absorbed by the second inorganic layer 122 with lower density under the metal wire layer 140 is more than that absorbed by the first inorganic layer 121, the internal stress received by the second inorganic layer 122 is also smaller than that received by the first inorganic layer 121, and the second inorganic layer 122 with lower density reduces the possibility of cracking, thereby reducing the possibility of cracking of the metal wire layer 140. In addition, when the denser first inorganic layer 121 cracks, the second inorganic layer 122 having a relatively lower density can also reduce the possibility that the crack source of the first inorganic layer 121 diffuses into the metal wire layer 140, and reduce the possibility that the metal wire layer 140 cracks.
The density of the optional first inorganic layer 121 here is greater than or equal to 2.34g/cm3And is less than or equal to 2.66g/cm3(ii) a The density of the second inorganic layer 122 is greater than or equal to 2.00g/cm3And is less than or equal to 2.34g/cm3. The thickness of the first inorganic layer 121 is 50nm or more and less than or equal toAt 1000 nm; the thickness of the second inorganic layer 122 is greater than or equal to 10nm and less than or equal to 500 nm. The thickness of the first inorganic layer 121 in this embodiment is optionally greater than or equal to 90nm and less than or equal to 110 nm; the thickness of the second inorganic layer 122 is greater than or equal to 20nm and less than or equal to 50nm, and preferably, the thickness of the first inorganic layer 121 is 100 nm; the thickness of the second inorganic layer 122 is 40 nm. It will be understood by those skilled in the art that the density and thickness parameters of the first inorganic layer and the second inorganic layer include, but are not limited to, the above ranges, and the related practitioner can set the density and thickness parameters of the first inorganic layer and the second inorganic layer appropriately according to the needs of the product, and the invention is not limited in particular.
The material of the optional first inorganic layer 121 in this embodiment is selected from any one of silicon oxide, aluminum oxide, and titanium oxide; the material of the second inorganic layer 122 is selected from any one of silicon oxide, aluminum oxide, and titanium oxide. However, the material of the first inorganic layer and the second inorganic layer is not particularly limited in the present invention.
In this embodiment, when the array substrate is bent and deformed, the second inorganic layer with lower density can absorb more deformation and receives less internal stress, so that the possibility of cracking of the second inorganic layer is reduced; the second inorganic layer with lower density can also reduce the possibility that the cracking source of the first inorganic layer with higher density diffuses to the metal wire layer; and the plurality of protruding structures disposed on the second inorganic layer also significantly increase the extended length of the metal wire layer. Therefore, the array substrate provided by the embodiment effectively reduces the possibility of cracking of the metal wire layer, so that the metal wire layer can bear smaller bending radius without cracking.
Fig. 5 is a schematic view of an array substrate according to a third embodiment of the present invention. The difference between the array substrate provided in this embodiment and the second embodiment is that, in the array substrate of this embodiment, the second inorganic layer 122 includes a plurality of protruding structures 130 arranged at intervals, that is, the second inorganic layer 122 is composed of a plurality of protruding structures 130. The optional protrusion structure 130 is a regular trapezoid structure, a semi-circular structure or a semi-elliptical structure, and in this embodiment, the optional protrusion structure 130 is a regular trapezoid structure. Those skilled in the art can understand that the relevant structural dimensions of the protrusion structure 130 in this embodiment are similar to those of the protrusion structure described in any of the above embodiments, and are not described herein again, and the shape structure of the protrusion structure includes but is not limited to the above examples, and is not described herein again. The present embodiment follows the same structural reference numerals as the above embodiments.
Specifically, a second inorganic layer 122 with relatively low density is prepared above the first inorganic layer 121, and the second inorganic layer 122 is composed of a plurality of protruding structures 130. Subsequently, the preparation of the metal wire layer 140 is performed, and the metal wire layer 140 extends along with the climbing of the protruding structure 130, so that the extending length of the metal wire layer 140 in the bending direction of the array substrate can be increased by changing phases. Meanwhile, because the second inorganic layer 122 with lower density is arranged below the metal wire layer 140, the second inorganic layer 122 can absorb more deformation than the first inorganic layer 121 during bending deformation, and the internal stress applied to the second inorganic layer 122 is smaller than that of the first inorganic layer 121, so that the second inorganic layer 122 can bear a smaller bending radius without cracking. In addition, when the first inorganic layer 121 is cracked, the second inorganic layer 122 may also reduce the possibility that its cracking source diffuses toward the metal wire layer 140.
Fig. 6 is a schematic view of an array substrate according to a fourth embodiment of the present invention. The array substrate provided in this embodiment is different from any of the above embodiments in that, in the array substrate of this embodiment, a plurality of grooves 123 are formed on a side of the first inorganic layer 121 facing away from the substrate 110; the second inorganic layer 122 includes a plurality of inorganic film blocks 132 corresponding to the plurality of grooves 123, and the inorganic film blocks 132 are located in the grooves 123 and the portions of the inorganic film blocks 132 that exceed the first inorganic layer 110 are protrusion structures. The present embodiment follows the same structural reference numerals as the above embodiments.
The optional groove 123 here is an inverted trapezoidal groove, a semi-circular groove or a semi-elliptical groove. The convex structure of the inorganic membrane 132 is a regular trapezoid structure, a semicircular structure or a semi-elliptical structure. In this embodiment, the optional groove 123 is an inverted trapezoid groove, the inorganic film block 132 is formed in the groove 123, the inorganic film block 132 extends beyond the surface of the first inorganic layer 121, and the portion of the inorganic film block 132 extending beyond the first inorganic layer 121 is in a regular trapezoid structure. It can be understood by those skilled in the art that the relevant structure size of the protrusion structure of the inorganic film block 132 in this embodiment is similar to the protrusion structure described in any of the above embodiments, and is not described herein again, and the shape structure of the protrusion structure of the inorganic film block includes but is not limited to the above examples, and is not described herein again.
The array substrate provided in this embodiment is different from the embodiments described above in that the position of the low-density second inorganic layer 122 is different from that of the embodiments described above, and accordingly, when the array substrate is bent, the position of the neutral plane of bending in this embodiment is different from that of any of the embodiments described above, and the position of the neutral plane of bending in this embodiment is closer to the first inorganic layer 121. It is obvious that in the array substrate of the present embodiment, the second inorganic layer 122 is more beneficial to reduce the internal stress and prevent the diffusion of the crack source. As will be understood by those skilled in the art, the neutral plane refers to a state where equilibrium stress, i.e., no stress or little stress, occurs at a certain position of the overall film layer due to the difference in stress experienced between different layers during bending.
On the basis of any of the above embodiments, a fifth embodiment of the present invention further provides an array substrate, further including: and the glass substrate or the rigid substrate is positioned on one surface of the substrate, which is far away from the inorganic insulating layer. The present embodiment is described on the basis of the array substrate shown in the first embodiment, and as shown in fig. 7, the array substrate in the present embodiment further includes a glass substrate 150. As the substrate 110 in the known array substrate can be selected as a flexible substrate, in order to support the flexible substrate, a glass substrate 150 is attached to a surface of the substrate 110 facing away from the inorganic insulating layer 120. In other embodiments, a rigid substrate or a rigid support film may be attached to a surface of the substrate facing away from the inorganic insulating layer, and the substrate material of the support substrate is not particularly limited in the present invention.
The required array substrate is prepared on the glass substrate or the rigid substrate, and the organic light-emitting display device is prepared, and after the preparation of the organic light-emitting display device is finished, the organic light-emitting display device can be detached from the glass substrate or the rigid substrate, so that the glass substrate and the rigid substrate only have the functions of providing support and assisting in preparing the display device in the preparation process.
Those skilled in the art will understand that the metal line layer may be selected as a gate metal layer or a source/drain metal layer in the array substrate or other metal layers in the array substrate, and the metal line layers with different functions are located at different positions in the array substrate. In the present embodiment, only the structures of the substrate, the inorganic insulating layer and the metal wire layer in the array substrate are simply illustrated, and other film layer structures in the array substrate, such as the interlayer insulating layer, the passivation layer, the planarization layer, the pixel defining layer, etc., are not illustrated here.
On the basis of any of the above embodiments, an embodiment of the present invention further provides an organic light emitting display panel, as shown in fig. 8, including: an array substrate 100 according to any of the embodiments described above, and a cover plate 200 disposed opposite to the array substrate 100. In this embodiment, the organic light emitting display panel may be selected as a flexible AMOLED having a bending function, or may be selected as a flexible AMOLED having a fixed curved surface. It can be understood by those skilled in the art that fig. 8 only shows a partial structure of the organic light emitting display panel, and the organic light emitting display panel further includes other structures such as a light emitting layer, and thus, the description and illustration are omitted.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (15)
1. An array substrate, comprising:
a substrate;
the inorganic insulating layer is positioned on the substrate, and a plurality of protruding structures are arranged on one surface of the inorganic insulating layer, which is far away from the substrate; and
a metal wire layer on a side of the inorganic insulating layer facing away from the substrate;
the inorganic insulating layer includes: the inorganic layer structure comprises a first inorganic layer and a second inorganic layer, wherein the first inorganic layer is positioned on the substrate, the second inorganic layer is positioned on one side of the first inorganic layer, which is far away from the substrate, a plurality of protruding structures are arranged on one surface of the second inorganic layer, which is far away from the first inorganic layer, and the density of the first inorganic layer is greater than that of the second inorganic layer;
the first inorganic layer has a plurality of grooves on a side facing away from the substrate; the second inorganic layer comprises a plurality of inorganic membrane blocks which are in one-to-one correspondence with the grooves, the inorganic membrane blocks are positioned in the grooves, and the parts of the inorganic membrane blocks, which exceed the first inorganic layer, are of convex structures.
2. The array substrate of claim 1, wherein the protruding structures are regular trapezoid structures, semi-circular structures or semi-elliptical structures.
3. The array substrate of claim 1, wherein the substrate is made of at least one material selected from the group consisting of polyimide, polycarbonate, and polyethylene terephthalate.
4. The array substrate of claim 1, wherein the substrate has a thickness greater than or equal to 10 μ ι η and less than or equal to 50 μ ι η; the density of the substrate is more than or equal to 1.4g/cm3And less than or equal to 1.6g/cm3。
5. The array substrate of claim 1, wherein the inorganic insulating layer is made of a material selected from the group consisting of silicon oxide, aluminum oxide, and titanium oxide.
6. The array substrate of claim 1, wherein the inorganic insulating layer has a thickness greater than or equal to 50nm and less than or equal to 1000 nm.
7. The array substrate of claim 6, wherein the inorganic insulating layer has a thickness of 100 nm.
8. The array substrate of claim 1, wherein the inorganic insulating layer has a density of 2.00g/cm or more3And is less than or equal to 2.66g/cm3。
9. The array substrate of claim 1, wherein the density of the first inorganic layer is greater than or equal to 2.34g/cm3And is less than or equal to 2.66g/cm3(ii) a The density of the second inorganic layer is greater than or equal to 2.00g/cm3And is less than or equal to 2.34g/cm3。
10. The array substrate of claim 1, wherein the first inorganic layer has a thickness greater than or equal to 50nm and less than or equal to 1000 nm; the second inorganic layer has a thickness of 10nm or more and 500nm or less.
11. The array substrate of claim 10, wherein the thickness of the first inorganic layer is greater than or equal to 90nm and less than or equal to 110 nm; the second inorganic layer has a thickness of greater than or equal to 20nm and less than or equal to 50 nm.
12. The array substrate of claim 1, wherein the material of the first inorganic layer is selected from any one of silicon oxide, aluminum oxide and titanium oxide; the material of the second inorganic layer is selected from any one of silicon oxide, aluminum oxide and titanium oxide.
13. The array substrate of claim 1, wherein the second inorganic layer comprises a plurality of raised structures spaced apart from each other.
14. The array substrate of claim 1, wherein the groove is an inverted trapezoidal groove, a semicircular groove, or a semi-elliptical groove.
15. An organic light emitting display panel, comprising: an array substrate as claimed in any one of claims 1 to 14, a cover plate disposed opposite the array substrate.
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| CN108682303B (en) * | 2018-05-14 | 2020-05-19 | 云谷（固安）科技有限公司 | Flexible display substrate, flexible display screen and electronic terminal equipment |
| CN108598144A (en) * | 2018-06-28 | 2018-09-28 | 武汉华星光电半导体显示技术有限公司 | Oled display panel |
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Address after: 201506 No. nine, No. 1568 engineering road, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506 No. nine, No. 1568 engineering road, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |