CN107996181B - LED system for promoting plant growth - Google Patents

LED system for promoting plant growth Download PDF

Info

Publication number
CN107996181B
CN107996181B CN201711210355.3A CN201711210355A CN107996181B CN 107996181 B CN107996181 B CN 107996181B CN 201711210355 A CN201711210355 A CN 201711210355A CN 107996181 B CN107996181 B CN 107996181B
Authority
CN
China
Prior art keywords
led
led module
layer
driving circuit
silica gel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711210355.3A
Other languages
Chinese (zh)
Other versions
CN107996181A (en
Inventor
左瑜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Sangrui Biotechnology Co., Ltd
Original Assignee
Shenzhen Sangrui Biotechnology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Sangrui Biotechnology Co Ltd filed Critical Shenzhen Sangrui Biotechnology Co Ltd
Priority to CN201711210355.3A priority Critical patent/CN107996181B/en
Publication of CN107996181A publication Critical patent/CN107996181A/en
Application granted granted Critical
Publication of CN107996181B publication Critical patent/CN107996181B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G7/00—Botany in general
    • A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
    • Y02P60/14—Measures for saving energy, e.g. in green houses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Botany (AREA)
  • Ecology (AREA)
  • Forests & Forestry (AREA)
  • Environmental Sciences (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an LED system for promoting plant growth, comprising: a controller; the first driving circuit, the second driving circuit and the third driving circuit are all electrically connected with the controller; the first LED module is electrically connected with the first driving circuit; the second LED module is electrically connected with the second driving circuit; the third LED module is electrically connected with the third driving circuit; wherein the first LED module, the second LED module and the third LED module respectively emit light with different wavelengths. The LED system for promoting the growth of plants, provided by the invention, can meet the growth requirements of different kinds of plants in different stages, is wide in application range and good in heat dissipation performance, and prolongs the service life.

Description

LED system for promoting plant growth
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to an LED system for promoting plant growth.
Background
With the continuous improvement of living standard and the progress of technology, the demand of people for high-quality plants is increasing. Whether edible vegetables or domestic green plants, proper illumination is a necessary condition for the robust growth of plants, and particularly for the vegetables, under natural conditions, in a low-temperature and low-light environment in winter, people often adopt a greenhouse and increase illumination to promote the growth of the plants.
The LED lamp is widely applied to the field of modern agricultural production, and has the advantages of low energy consumption, long service life, promotion of crop production and development, remarkable improvement of yield and quality, capability of emitting light with specific wavelength and good promotion effect on plant growth.
Research shows that under the condition of reasonable variation of different illumination time and intensity in different periods, the growth conditions of animals and plants are more ideal, the influence of light with different wavelengths on plant photosynthesis is different, and different plants have different requirements on the wavelength and the illumination intensity of light waves. Therefore, people are beginning to pay attention to the regulation of the ratio of various lights for different plants and the growth cycle of the plants so as to expect better growth effect.
The current LED system applied to plant growth adopts light with fixed wavelength to stably irradiate plants, and is difficult to meet the specific requirements of different types of plants and growth characteristics in different stages on illumination, so that the method for optimizing the required illumination environment for plant growth and improving the growth efficiency of the plants is a great deal of important solution.
Disclosure of Invention
In order to solve the problems of the prior art, the present invention provides an LED system for promoting plant growth, comprising:
a controller;
the first driving circuit, the second driving circuit and the third driving circuit are all electrically connected with the controller;
the first LED module is electrically connected with the first driving circuit;
the second LED module is electrically connected with the second driving circuit;
the third LED module is electrically connected with the third driving circuit;
wherein the first LED module, the second LED module and the third LED module respectively emit light with different wavelengths.
In an embodiment of the present invention, the first LED module is a red LED module, the second LED module is a blue LED module, and the third LED module is a yellow LED module.
In one embodiment of the present invention, the apparatus further comprises a memory electrically connected to the controller; the memory is used for storing a matching table, and the matching table is used for identifying illumination information required by a plant, so that the controller controls the on-off states of the first driving circuit, the second driving circuit and the third driving circuit according to the matching table, and the control of the red light LED module, the blue light LED module and the yellow light LED module is realized.
In an embodiment of the present invention, the matching table further includes air temperature information and soil humidity information, and correspondingly, the matching table is further configured to identify required illumination information corresponding to a growth stage of a specific plant under specific air temperature and specific soil humidity conditions.
In one embodiment of the invention, the system further comprises a temperature sensor and a soil humidity sensor which are both electrically connected with the controller, so that the controller acquires measurement data of the temperature sensor and the soil humidity sensor.
In an embodiment of the present invention, each of the first LED module, the second LED module, and the third LED module includes an LED package structure and a heat conduction pipeline, a first end of the heat conduction pipeline is connected to the LED package structure, and a second end of the heat conduction pipeline is connected to a plant root soil area.
In one embodiment of the present invention, the heat transfer pipeline is an annular circulation pipeline, and the heat transfer pipeline contains a heat transfer liquid therein.
In one embodiment of the invention, the heat conducting pipeline comprises a circulating pump for driving the heat transfer liquid to circulate in the heat conducting pipeline so as to realize the cyclic and reciprocating exchange of heat between the LED packaging structure and the plant root soil area.
In one embodiment of the invention, the red LED module comprises an LED chip and red phosphor; the blue LED module comprises an LED chip and blue fluorescent powder; the yellow LED module comprises an LED chip and yellow fluorescent powder.
In an embodiment of the present invention, each of the red LED module, the blue LED module, and the yellow LED module includes a plurality of silica gel layers, and the silica gel layer in contact with the LED chip does not contain phosphor.
The LED system for promoting the growth of the plants can automatically and intelligently realize science according to the types, the growth stages, the temperature and the humidity environment of the plants, the LED packaging structure of the LED system has good heat dissipation characteristics, the dissipated heat is used for providing heat for the roots of the plants, the probability of low-temperature damage is reduced, and the service life of the LED chip is longer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
FIG. 1 is a schematic diagram of an LED system for promoting plant growth according to the present invention;
FIG. 2 is a schematic diagram of an LED system for promoting plant growth according to the present invention;
FIG. 3 is a schematic diagram of a conduction liquid absorbing heat of the LED package structure and conducting the heat to soil at the root of a plant for warming according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an LED package structure according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an ultraviolet LED chip according to an embodiment of the present invention;
fig. 6 is a schematic view illustrating a process flow of an LED package according to an embodiment of the present invention;
fig. 7 is a flowchart of a process for forming a multi-layer silica gel layer on an LED chip according to an embodiment of the present invention;
fig. 8a to fig. 8e are schematic diagrams illustrating a process flow for generating a spherical silica gel layer on a chip according to an embodiment of the present invention;
FIGS. 9 a-9 b are schematic diagrams illustrating the distribution of a hemispherical silica gel layer according to an embodiment of the invention;
fig. 10 is a schematic flow chart of another LED packaging method according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
Referring to fig. 1, fig. 1 is a schematic structural diagram of an LED system for promoting plant growth according to the present invention, which includes:
a controller;
the first driving circuit, the second driving circuit and the third driving circuit are all electrically connected with the controller;
the first LED module is electrically connected with the first driving circuit;
the second LED module is electrically connected with the second driving circuit;
the third LED module is electrically connected with the third driving circuit;
wherein the first LED module, the second LED module and the third LED module respectively emit light with different wavelengths.
Further, on the basis of the above embodiment, the first LED module is a red LED module, the second LED module is a blue LED module, and the third LED module is a yellow LED module.
In one embodiment, the present invention provides an LED system, further comprising a memory electrically connected to the controller; the memory is used for storing a matching table, and the matching table is used for identifying illumination information required by a plant, so that the controller controls the on-off states of the first driving circuit, the second driving circuit and the third driving circuit according to the matching table, and the control of the red light LED module, the blue light LED module and the yellow light LED module is realized.
By adopting the embodiment, the defect that the proportion of the red, blue and yellow LED lamp beads of the LED plant illuminating lamp in the prior art is not adjustable is overcome, the proportions of red light, blue light and yellow light can be flexibly adjusted according to different illumination required by growing stages of plants and plants of different varieties, the application range of light is expanded, and the cost caused by replacing the lamp is reduced.
Further, on the basis of the above embodiment, the matching table further includes air temperature information and soil humidity information, and correspondingly, the matching table is further configured to identify required illumination information corresponding to a growth stage of a specific plant under a specific air temperature and a specific soil humidity condition. Specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of an LED system for promoting plant growth according to the present invention. The matching table provided by the embodiment of the invention can be formulated by plant experts in the field, so that the intellectualization and the scientification of plant light irradiation can be realized by adopting the matching table mode, the blind and unreasonable illumination caused by the lack of knowledge level of operators is avoided, and the scientific planting is realized.
Further, on the basis of the above embodiment, the LED system provided by the present invention further includes a temperature sensor and a soil humidity sensor, both of which are electrically connected to the controller, so that the controller acquires measurement data of the temperature sensor and the soil humidity sensor.
In the embodiment, the temperature, the humidity and the illuminance of the environment are comprehensively considered, so that the refined illumination in the specific temperature and humidity environment is realized, the proportions of red light, blue light and yellow light and the respective illumination time are more reasonably adjusted, the refinement of the illumination is further realized, and the planting efficiency is improved.
Further, on the basis of the above embodiment, each of the first LED module, the second LED module, and the third LED module includes an LED package structure and a heat conduction pipeline, a first end of the heat conduction pipeline is connected to the LED package structure, and a second end of the heat conduction pipeline is connected to a plant root soil area.
In the present embodiment, the LED for irradiating plants has a large light emission power, and the heat radiation state of the LED directly affects the life of the LED chip. In this embodiment, transmit a large amount of heats that LED packaging structure produced to plant root soil region through heat conduction pipeline, to maintaining the root zone suitable temperature, resist the low temperature harm that cold areas frequently takes place, produced fine effect. In this embodiment, if the heat conducting pipeline is not closed, for example, the heat conducting pipeline is line-segment-shaped, the first end and the second end of the heat conducting pipeline are two end points of the line-segment; if the heat conducting pipe is closed, for example, the heat conducting pipe is in the shape of a closed ring, the first end and the second end of the heat conducting pipe are understood to be one part and the other part of the ring.
In one embodiment, the heat transfer pipeline is an annular circulation pipeline, and the heat transfer pipeline contains heat transfer liquid inside.
Further, in order to accelerate the heat transfer effect of the conduction liquid, the heat conduction pipeline comprises a circulating pump for driving the heat transfer liquid to circulate in the heat conduction pipeline so as to realize the cyclic and reciprocating exchange of heat between the LED packaging structure and the plant root soil area. Specifically, referring to fig. 3, fig. 3 is a schematic view illustrating that the conduction liquid absorbs heat of the LED package structure and conducts the heat to the soil of the plant root for heating.
In one embodiment, the conducting liquid can be water, the specific heat of the water is large, the cost is low, the conducting liquid does not have obvious negative influence on the growth of plants even if leakage of the conducting liquid occurs, and the conducting liquid is suitable for the growth environment of the plants.
Further, on the basis of the above embodiment, the red LED module includes an LED chip and a red phosphor; the blue LED module comprises an LED chip and blue fluorescent powder; the yellow LED module comprises an LED chip and yellow fluorescent powder.
Further, on the basis of the above embodiment, the red LED module, the blue LED module, and the yellow LED module each include a plurality of silica gel layers, and the silica gel layer in contact with the LED chip does not contain phosphor.
The embodiment adopts the mode of separating the LED chip from the fluorescent powder, thereby solving the problem of the reduction of the quantum efficiency of the fluorescent powder caused by high temperature; preferably, the silica gel in contact with the LED chip is high-temperature-resistant silica gel, so that the problem of light transmittance reduction caused by aging and yellowing of the silica gel is solved.
The LED system for promoting the growth of the plants can automatically and intelligently realize science according to the types, the growth stages, the temperature and the humidity environment of the plants, the LED packaging structure of the LED system has good heat dissipation characteristics, the dissipated heat is used for providing heat for the roots of the plants, the probability of low-temperature damage is reduced, and the service life of the LED chip is longer.
Example two
In this embodiment, embodiments of the present invention are further defined or explained on the basis of the above embodiments.
Referring to fig. 4, fig. 4 is a schematic view of an LED package structure according to an embodiment of the present invention, the LED package structure includes:
an LED chip;
a first silicone layer (22) coated on the LED chip;
a first lens layer (23) prepared on the first silicone gel layer (22);
the second silica gel layer (24) and the third silica gel layer (25) are sequentially arranged on the first lens layer (23);
a second lens layer (26) arranged on the third silica gel layer (25);
and the fourth silica gel layer (27) is arranged on the second lens layer (26).
By adopting the embodiment, better light-gathering effect is realized through the multilayer lens, and the multilayer lens is very suitable for being used on plants and reduces illumination waste. Preferably, the LED chip provided by the invention is a high-power LED chip, namely, the LED chip has high luminous power, and the LED chip is matched with the heat dissipation device provided by the invention, so that the illumination requirement required by plant growth can be met, heat can be dissipated timely, and the service life of an LED lamp is prolonged.
Further, in the above embodiment, the first silicone gel layer (22) does not contain phosphor, and at least one of the first lens layer (23), the second silicone gel layer (24), the third silicone gel layer (25), the second lens layer (26), and the fourth silicone gel layer (27) contains phosphor.
Further, on the basis of the above-described embodiments, the following further description is made on the components of the LED package structure.
In one embodiment, the LED chip is an ultraviolet LED chip. Referring to fig. 5, fig. 5 is a schematic view of an ultraviolet LED chip according to an embodiment of the present invention. The ultraviolet LED chip sequentially comprises a sapphire substrate (211), an N-type AlGaN layer (212) and AlxGa1-xN/AlyGa1-yThe GaN-based light-emitting diode comprises an N stack layer (213), a P type AlGaN layer (214), a P type GaN layer (215) and metal electrodes (216, 217), wherein y is more than 0 and less than x is less than 0.5.
Further, in addition to the above embodiment, the refractive index of the first lens layer (23) is larger than the refractive index of the first silicone gel layer (22) and smaller than the refractive index of the second silicone gel layer (24); the refractive index of the second lens layer (26) is greater than the refractive index of the third silicone gel layer (25) and less than the refractive index of the fourth silicone gel layer (27); and the refractive index of the second silicone gel layer (24) is smaller than the refractive index of the third silicone gel layer (25).
By adopting the design of the refractive index, the improved light condensation effect can be realized, the total reflection of light can be effectively inhibited, and the heat radiation burden of the LED chip is reduced.
In one embodiment, the first lens layer (23) and the second lens layer (26) each include a plurality of ball lenses, and the ball lenses are all silica lenses. For example, in fig. 4, the first lens layer (23) comprises 5 ball lenses, the set of 5 ball lenses constituting said first lens layer (23). The second lens layer (26) also comprises 5 ball lenses, the set of 5 ball lenses constituting the second lens layer (26).
Further, in one embodiment, the spherical lenses in the first lens layer (23) and the second lens layer (26) each have a diameter of 10 to 500 microns.
Example four
The present embodiment further describes the LED package structure and the manufacturing method thereof.
Referring to fig. 6, fig. 6 is a schematic view of a process flow of an LED package according to an embodiment of the present invention, the method includes:
selecting an LED chip;
and forming a plurality of silica gel layers on the LED chip to realize the packaging of the LED chip, wherein the silica gel layer in the plurality of silica gel layers, which is in contact with the LED chip, does not contain fluorescent powder.
In this embodiment, the silica gel layer in direct contact with the LED chip does not contain the phosphor, and the phosphor is disposed in another silica gel layer not in direct contact with the LED chip, so that the direct contact between the phosphor and the LED chip is avoided, and the reason for adopting this embodiment is: the chip has an absorption effect on the back-scattered light, the light extraction efficiency can be reduced by directly coating the fluorescent powder on the LED chip, and the quantum efficiency of the fluorescent powder is remarkably reduced by the high temperature generated by the chip, so that the packaged lumen efficiency is influenced.
Further, referring to fig. 7, fig. 7 is a flowchart of a process for forming a multi-layer silica gel layer on an LED chip according to an embodiment of the present invention, where the process includes:
preparing a first lens layer (23) on the first silicone gel layer (22);
preparing a second silicone gel layer (24) on the first lens layer (23);
-preparing a third silicone gel layer (25) on the second silicone gel layer (24);
preparing a second lens layer (26) on the third silica gel layer (25);
preparing a fourth silicone gel layer (27) on the second lens layer (26).
Preferably, in the present embodiment, the refractive indices of the first silicone gel layer (22), the first lens layer (23), the second silicone gel layer (24), the third silicone gel layer (25), the second lens layer (26), and the fourth silicone gel layer (27) are increased in order. Adopt the silica gel of the different refractive indexes of multilayer, can guarantee that what LED chip can be more shines away through packaging material, have the light that sends the LED chip to have better gathering effect, satisfied the demand in the place that requires height to the spotlight to need not to adopt outside lens to carry out the secondary plastic, the cost is reduced.
Further, on the basis of the above embodiments, please refer to fig. 8a to 8e, and fig. 8a to 8e are schematic process flow diagrams of generating a spherical silica gel layer on a chip according to an embodiment of the present invention. Preparing a first lens layer (23) on the first silica gel layer (22), which may be specifically:
referring to fig. 8a, a first lens mold and a second lens mold are selected, the first lens mold and the second lens mold have the same shape and comprise a plurality of hemispherical grooves;
placing the plurality of hemispherical grooves of the first lens mold opposite to the plurality of hemispherical grooves of the second lens mold to form a plurality of hollow spherical grooves;
filling silica gel in the hollow spherical grooves and baking to form a plurality of spherical silica gel lenses;
removing the first lens mold; please refer to fig. 8b specifically;
pressing the plurality of spherical silica gel lenses on the first silica gel layer, specifically referring to fig. 8 c; and curing and removing the second lens mold to prepare a first lens layer on the first silica gel layer, as shown in fig. 8 d. Optionally, referring to fig. 8e, a second silicone layer is further formed on the first lens layer.
Further, on the basis of the above embodiment, preparing the second lens layer (26) on the third silicone gel layer (25) includes:
selecting a third lens mold and a fourth lens mold, the third lens mold and the fourth lens mold being identical in shape and each comprising a plurality of hemispherical grooves;
placing the plurality of hemispherical grooves of the third lens mold opposite to the plurality of hemispherical grooves of the fourth lens mold to form a plurality of hollow spherical grooves;
filling silica gel in the hollow spherical grooves and baking to form a plurality of spherical silica gel lenses;
subsequently removing the third lens mold;
and pressing the spherical silica gel lenses on the third silica gel layer (25), and curing and removing the fourth lens mould to prepare a second lens layer (26) on the third silica gel layer (25).
The process for preparing the second lens layer (26) on the third silica gel layer (25) is similar to the process for preparing the first lens layer (23) on the first silica gel layer (22), and is not repeated herein.
Further, in the above embodiment, at least one of the first lens layer (23), the second silicone rubber layer (24), the third silicone rubber layer (25), the second lens layer (26), and the fourth silicone rubber layer (27) contains a phosphor, and the silicone rubber layer in contact with the LED chip does not contain a phosphor.
In one embodiment, the material of the red phosphor may be Y2O2S:Eu3+The wavelength of the corresponding light wave is 626 nm; the material of the blue fluorescent powder can be Sr5(PO4)3Cl:Eu2+The wavelength corresponding to light is 447 nm.
This embodiment is through placing phosphor powder in the silica gel layer, rather than with phosphor powder direct coating on the LED chip, has avoided the LED chip to the absorption of backscatter light, has improved the efficiency of getting light of encapsulation. In addition, by adopting the embodiment, the problem that the quantum efficiency of the fluorescent powder is obviously reduced due to the high temperature generated by the LED chip is avoided, so that the damage of the lumen efficiency of the LED chip is avoided. Preferably, the first silica gel layer in contact with the LED chip is a high-temperature-resistant silica gel layer, so that the problem of light transmittance reduction caused by aging and yellowing of the silica gel is solved.
Referring to fig. 9 a-9 b, fig. 9 a-9 b are schematic diagrams illustrating the distribution of a hemispherical silica gel layer according to an embodiment of the present invention, in which the hemispherical silica gel layer in fig. 9a is uniformly distributed between a first silica gel layer and a third silica gel layer in a rectangular shape; the hemispherical silica gel layer in fig. 9b is uniformly distributed between the first silica gel layer and the third silica gel layer in a diamond shape. The hemispherical silica gel layers can be uniformly arranged in a rectangular shape or staggered in a rhombic shape; the light of light source can be guaranteed and evenly distributed in the concentration district.
In this embodiment, the upper and lower lenses may be aligned or staggered, and the two arrangements have the following advantages: when the lenses are aligned, light emitted from the first lens layer (23) is refracted and gathered to the second lens layer (26), and then the second lens layer (26) can reduce the previous gathering effect, so that the lenses are suitable for places with low requirements on the gathering effect. When the lens layers are arranged in a staggered mode, the second lens layers (26) can enhance the previous gathering effect (namely gather the lens layers once again) so as to be suitable for places with high requirements on the gathering effect.
The ball lens provided by the invention has the following advantages: the spherical lens changes the propagation direction of light, can effectively inhibit the total reflection effect, is beneficial to emitting more light to the outside of the fourth silica gel layer (27), increases the external quantum efficiency of the LED device and improves the luminous efficiency of the LED.
According to the LED packaging structure and the method thereof, the lens is formed in the silica gel by utilizing the characteristics of different silica gels and fluorescent powder gels that the refractive indexes are different, so that the problem of light emission dispersion of an LED chip is solved, and light emitted by a light source can be more concentrated; the LED chip can be ensured to be irradiated out through more transmission packaging materials by controlling the refractive index of each silica gel layer.
The present embodiment further describes the method for packaging the LED chip provided by the present invention.
The first lens layer (23) and the second lens layer (26) are both spherical, the radius r of each sphere is 5-100 micrometers, the distance between every two adjacent spheres is 10-200 micrometers, and the thickness of the first silica gel layer is larger than 3 micrometers. The distance between the two balls is as small as possible according to process conditions, and preferably, the distance between the two balls is 10 μm.
In the embodiment, the first lens layer (23) and the second lens layer (26) are spherical to form convex lenses, and in order to ensure that the light is in a convergent state rather than a divergent state after being emitted from the lenses, the distance between the two spherical lenses is less than twice of the focal length. The present embodiment provides a simple method for estimating a focal length: if the refractive indexes of the first silica gel layer (22) and the second silica gel layer (24) are both n1 and the refractive index of the first lens layer (23) is n2, the focal length f is R/2(n2-n1), then, in the embodiment, the distance between two spherical lenses is not less than 0 and not more than R/(n2-n1), and a better light gathering effect is achieved.
In this embodiment, the distance between two spherical lenses is the shortest distance between any point on the first lens layer (23) and any point on the second lens layer (26), that is, the distance between the upper vertex of the first lens layer (23) (the point closest to the first silicone rubber layer (22)) and the lower vertex of the second lens layer (26) (the point farthest from the first silicone rubber layer (22)).
In addition, as the shape of the fourth silicone gel layer (27), a flat shape, a hemispherical shape, or a parabolic shape can be adopted. Wherein, the hemispherical light-emitting angle is the largest, and the LED is suitable for common lighting application; the parabolic light-emitting angle is minimum, so that the method is suitable for local illumination application; and a flat shape between the first two, suitable for indicating illumination.
The first silica gel layer (22) can be made of epoxy resin or modified epoxy resin; the material of the first lens layer (23) may be polycarbonate; the material of the second silica gel layer (24) and the third silica gel layer (25) can be an organic silicon material. The material of the second lens layer (26) can be polymethyl methacrylate or glass; the material of the fourth silica gel layer (27) can be methyl silicone rubber (refractive index of 1.41) or phenyl silicone rubber (refractive index of 1.54).
Referring to fig. 10, fig. 10 is a schematic flow chart of another LED packaging method according to an embodiment of the present invention, in the packaging process, an LED chip and a support are prepared, a silica gel is configured, a phosphor gel is configured in advance in the silica gel, a phosphor with a corresponding color can be configured according to a specific LED lamp index requirement, and the phosphor is mixed with each silica gel, and a color test is performed after mixing to meet a color requirement of an LED lamp.
Subsequently, the rack is washed and, for encapsulation, the rack must be kept clean, and the stains, especially oil stains, thereon are washed clean and baked, keeping the rack dry.
And then, welding the chip, after the bracket is cleaned, welding the lead of the chip, wherein the welding adopts a standard reflow soldering process, and the specific process comprises the following steps: printing solder, die attach inspection and reflow soldering.
And then, in the stage of preparing the lens and encapsulating the silica gel, the silica gel layer is shaped by repeatedly coating the silica gel, pressing the mold, baking for a short time for fixing, removing the mold and baking for a long time. The short-time baking can be carried out within the range of 90-125 ℃ for 15-60 minutes; the baking time is long and the baking time is 4-12 hours within the range of 100-150 ℃.
Finally, the finished LED is inspected and packaged to complete its packaging.
In summary, the principle and embodiments of the present invention are explained herein by using specific examples, and the above descriptions of the examples are only used to help understanding the present invention and its core ideas; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention, and the scope of the present invention should be subject to the appended claims.

Claims (9)

1. An LED system for promoting plant growth, comprising:
a controller;
the first driving circuit, the second driving circuit and the third driving circuit are all electrically connected with the controller;
the first LED module is electrically connected with the first driving circuit;
the second LED module is electrically connected with the second driving circuit;
the third LED module is electrically connected with the third driving circuit;
wherein the first LED module, the second LED module and the third LED module respectively emit light with different wavelengths;
the first LED module, the second LED module and the third LED module respectively comprise an LED packaging structure and a heat conduction pipeline, wherein the first end of the heat conduction pipeline is connected with the LED packaging structure, and the second end of the heat conduction pipeline is connected with a plant root soil area;
the LED package structure includes:
an LED chip;
a first silicone layer (22) coated on the LED chip;
a first lens layer (23) prepared on the first silicone gel layer (22);
the second silica gel layer (24) and the third silica gel layer (25) are sequentially arranged on the first lens layer (23);
a second lens layer (26) arranged on the third silica gel layer (25);
a fourth silicone layer (27) disposed on the second lens layer (26);
the first lens layer (23) and the second lens layer (26) both comprise a plurality of spherical lenses, and the spherical lenses are all silica gel lenses;
the refractive index of the first lens layer (23) is greater than that of the first silica gel layer (22) and less than that of the second silica gel layer (24); the refractive index of the second lens layer (26) is greater than the refractive index of the third silicone gel layer (25) and less than the refractive index of the fourth silicone gel layer (27); and the refractive index of the second silicone gel layer (24) is smaller than the refractive index of the third silicone gel layer (25);
the first lens layer (23) and the second lens layer (26) include a plurality of spherical lenses; the radiuses of the spherical lenses are equal, and the distance between the two layers of spherical lenses is less than twice the focal length of the spherical lenses.
2. The LED system of claim 1, wherein the first LED module is a red LED module, the second LED module is a blue LED module, and the third LED module is a yellow LED module.
3. The LED system of claim 2, further comprising a memory electrically connected to the controller; the memory is used for storing a matching table, and the matching table is used for identifying illumination information required by a plant, so that the controller controls the on-off states of the first driving circuit, the second driving circuit and the third driving circuit according to the matching table, and the control of the red light LED module, the blue light LED module and the yellow light LED module is realized.
4. The LED system of claim 3, wherein the matching table further comprises air temperature information and soil humidity information, and accordingly, the matching table is further used for identifying the required illumination information corresponding to the growth stage of the specific plant under the specific air temperature and specific soil humidity conditions.
5. The LED system of claim 4, further comprising a temperature sensor and a soil moisture sensor, each electrically connected to the controller, such that the controller obtains measurement data from the temperature sensor and the soil moisture sensor.
6. The LED system of claim 5, wherein the heat conducting pipe is a circular circulating pipe and the heat conducting pipe contains a heat transfer fluid therein.
7. The LED system of claim 6, wherein the heat conducting conduit includes a circulation pump for driving the heat transfer fluid to circulate within the heat conducting conduit for cyclic back and forth exchange of heat between the LED package and the plant root soil area.
8. The LED system of claim 7, wherein the red LED module comprises an LED chip and a red phosphor; the blue LED module comprises an LED chip and blue fluorescent powder; the yellow LED module comprises an LED chip and yellow fluorescent powder.
9. The LED system of claim 8, wherein the red LED module, the blue LED module, and the yellow LED module each comprise a plurality of silicone layers, and wherein the silicone layer in contact with the LED chip does not contain phosphor.
CN201711210355.3A 2017-11-28 2017-11-28 LED system for promoting plant growth Active CN107996181B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711210355.3A CN107996181B (en) 2017-11-28 2017-11-28 LED system for promoting plant growth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711210355.3A CN107996181B (en) 2017-11-28 2017-11-28 LED system for promoting plant growth

Publications (2)

Publication Number Publication Date
CN107996181A CN107996181A (en) 2018-05-08
CN107996181B true CN107996181B (en) 2020-12-04

Family

ID=62054273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711210355.3A Active CN107996181B (en) 2017-11-28 2017-11-28 LED system for promoting plant growth

Country Status (1)

Country Link
CN (1) CN107996181B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112128A (en) * 2019-05-24 2019-08-09 温州大学新材料与产业技术研究院 A kind of preparation and application of full spectrum intelligence plant lamp

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201475731U (en) * 2009-08-25 2010-05-19 东莞市友美电源设备有限公司 LED plant lamp
CN103499080A (en) * 2013-10-21 2014-01-08 广州市松叶电子科技有限公司 Water cooling type high-power LED plant growth lamp and circulating system
CN103700654A (en) * 2013-12-20 2014-04-02 纳晶科技股份有限公司 LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1032775C2 (en) * 2006-10-30 2008-05-06 Hortilux Schreder B V Crop exposure device and greenhouse provided with a crop exposure device.
US8764504B2 (en) * 2011-02-25 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Lighting device and method for manufacturing the same
DE102015104220A1 (en) * 2015-03-20 2016-09-22 Osram Opto Semiconductors Gmbh Optoelectronic lighting device
CN206159837U (en) * 2016-08-30 2017-05-10 宣紫程 Multi -wavelength vegetation lamp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201475731U (en) * 2009-08-25 2010-05-19 东莞市友美电源设备有限公司 LED plant lamp
CN103499080A (en) * 2013-10-21 2014-01-08 广州市松叶电子科技有限公司 Water cooling type high-power LED plant growth lamp and circulating system
CN103700654A (en) * 2013-12-20 2014-04-02 纳晶科技股份有限公司 LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof

Also Published As

Publication number Publication date
CN107996181A (en) 2018-05-08

Similar Documents

Publication Publication Date Title
CN102168838B (en) One-step packaging LED (Light Emitting Diode) lens with free curve and design method of same
CN103629596B (en) A kind of laser instrument plant lamp and preparation method thereof
CN107996181B (en) LED system for promoting plant growth
CN107990267A (en) A kind of solar LED Lawn lamp
TW201507605A (en) Led lighting module for plant-culture factory, and led lighting apparatus for plant-culture factory using the same
CN208256718U (en) A kind of encapsulating structure of LED
CN107994113B (en) High-power blue light LED multilayer packaging structure
CN108011022B (en) LED lamp and LED packaging method
CN207674132U (en) Intelligent poultry cultivation lamp and intelligent farm
CN108011026B (en) Packaging process for high-power LED double-layer hemispherical structure
CN208093583U (en) High-power LED encapsulation structure
CN109315174A (en) A kind of LED plant lamp
CN108036243B (en) LED ground lamp
CN108050402B (en) Intelligent poultry breeding lamp and intelligent farm
CN208509895U (en) The bionical aquarium system of LED based
CN108011006B (en) White light LED packaging method
CN208028086U (en) High-power LED encapsulation structure
CN108019675B (en) Medical operating lamp
Wang et al. Novel application-specific LED packaging with compact freeform lens
Wang et al. Freeform lens for white LEDs with high angular color uniformity
CN108011019B (en) LED packaging method
CN107833951B (en) LED packaging method
CN208507726U (en) A kind of great power LED
CN105609495B (en) integrated quantum dot LED plant growth lamp and preparation method thereof
CN108011027A (en) LED encapsulation structure and its method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20201028

Address after: 518000 building B, Runfeng Industrial Park, 4197 Bao'an Avenue, Gushu community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province

Applicant after: Shenzhen Sangrui Biotechnology Co., Ltd

Address before: 710065 No. 86 Leading Times Square (Block B), No. 2, Building No. 1, Unit 22, Room 12202, No. 51, High-tech Road, Xi'an High-tech Zone, Shaanxi Province

Applicant before: Xi'an Cresun Innovation Technology Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant