CN107993942B - Manufacturing process of lead frame - Google Patents
Manufacturing process of lead frame Download PDFInfo
- Publication number
- CN107993942B CN107993942B CN201711191549.3A CN201711191549A CN107993942B CN 107993942 B CN107993942 B CN 107993942B CN 201711191549 A CN201711191549 A CN 201711191549A CN 107993942 B CN107993942 B CN 107993942B
- Authority
- CN
- China
- Prior art keywords
- supporting
- lead frame
- lead
- frame body
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims 2
- 239000000047 product Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a lead frame manufacturing process which comprises a stamping process, wherein the stamping process comprises the steps of processing a metal plate into a frame body, processing a plurality of pin parts in the frame body side by side, connecting a supporting part with the tail ends of the pin parts, processing at least two supporting feet on the supporting part, connecting one end of each supporting foot with the supporting part, and connecting the other end of each supporting foot with the frame body. By applying the invention, the lead part can be effectively supported in the subsequent process, and the product reject ratio caused by the deformation of the lead part is greatly reduced.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a lead frame manufacturing process.
[ background of the invention ]
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
In the prior art, the manufacturing method of the lead frame is generally a die stamping method or a chemical etching method, a plurality of lead parts are arranged in part of the lead frame, and the lead parts are generally in a slender shape which is easy to deform.
[ summary of the invention ]
In order to solve the problem that the pin part of the lead frame is easy to deform to cause higher reject ratio in the manufacturing process of a product in the prior art, the invention ensures the coplanarity of the lead frame by optimizing the stamping procedure in the manufacturing process and can greatly reduce the reject ratio of the product caused by the deformation of the pin part.
The invention is realized by the following technical scheme:
the manufacturing process of the lead frame comprises a stamping process, wherein the stamping process comprises the steps of processing a metal plate into a frame body, processing a plurality of pin parts in the frame body side by side, connecting a supporting part with the tail ends of the plurality of pin parts, processing at least two supporting legs on the supporting part, connecting one ends of the supporting legs with the supporting part, and connecting the other ends of the supporting legs with the frame body.
In the manufacturing process of the lead frame, the stamping step further includes processing two supporting legs, which are respectively processed at two ends of the supporting portion.
In the manufacturing process of the lead frame, the support leg is punched into an L shape having both ends respectively connected to the frame body and the support portion in the punching step.
The above-described lead frame manufacturing process includes processing a connecting portion between the two support legs in the pressing step.
In the manufacturing process of the lead frame, when the connecting part is processed, the connecting part is processed into a rectangular sheet with two ends respectively connected with the two supporting legs.
In the manufacturing process of the lead frame, the metal plate is a copper strip.
In the manufacturing process of the lead frame, the subsequent steps of the stamping step are a heat treatment step, an electroplating step, a tape attaching step, a pin cutting step, a cutting step and a packaging step.
In the lead frame manufacturing process, the step of cutting the lead frame includes cutting the supporting portion.
In the above-described lead frame manufacturing process, the plating layer in the plating step is at least one of the group consisting of nickel, palladium, gold, silver, and an alloy thereof.
Compared with the prior art, the invention has the following advantages:
the invention provides a manufacturing process of a lead frame, which is characterized in that in the stamping process, a plurality of pin parts are processed in the frame body side by side, a supporting part is connected with the tail ends of the pin parts, at least two supporting feet are processed on the supporting part, one end of each supporting foot is connected with the supporting part, and the other end of each supporting foot is connected with the frame body. The lead parts can be effectively supported in the subsequent process, the coplanarity of the lead frame is ensured, and the product reject ratio caused by the deformation of the lead parts is greatly reduced.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a drawing of a workpiece after the stamping operation in a preferred embodiment of the present invention;
fig. 2 is a diagram of the finished lead frame of the preferred embodiment of the present invention.
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a manufacturing process of a lead frame, and as shown in figure 2, the manufacturing process of the lead frame comprises a stamping process, a heat treatment process, an electroplating process, a tape sticking process, a pin cutting process, a cutting process and a packaging process;
as shown in fig. 1, the workpiece after the stamping process in the preferred embodiment of the present invention is shown, the stamping process includes processing a metal plate into a frame body 1, specifically, the metal plate is a copper strip, a plurality of lead portions 12 are processed in the frame body 1 side by side, a gap is provided between two adjacent lead portions 12, the supporting portion 13 is connected to the ends of the plurality of lead portions 12, at least two supporting legs 131 are processed on the supporting portion 13, one end of each supporting leg 131 is connected to the supporting portion 13, and the other end of each supporting leg 131 is connected to the frame body 1. The lead parts 12 are of elongated structures, and the lead parts 12 can be effectively supported in subsequent processes by the aid of the processing technology, coplanarity of lead frames is guaranteed, namely the lead parts 12 and the whole frame body 1 can be guaranteed to be in the same plane to the greatest extent, and product reject ratio caused by deformation of the lead parts 12 is greatly reduced.
In this embodiment, in the pressing step, two support legs 131 are specifically formed, and are respectively formed at both ends of the support portion 13. In addition, when the punching process is performed, the supporting legs 131 are punched into an L shape with two ends respectively connected with the frame body 1 and the supporting part 13, so that the cutting performance of the L-shaped supporting legs 131 is better, and the difficulty in manufacturing the cutting edge is reduced; and a connecting part is processed between the two supporting legs 131, and when the connecting part is processed, the connecting part is processed into a rectangular sheet shape with two ends respectively connected with the two supporting legs 131, so that the supporting strength of the supporting legs 131 is further enhanced.
The heat treatment process adopts an annealing furnace for annealing, so that the hardness is reduced, and the cutting processability is improved; the residual stress is eliminated, the size is stabilized, and the deformation and crack tendency is reduced; refining grains, adjusting the structure and eliminating the structure defects.
In the electroplating step, the plating layer is at least one of nickel, palladium, gold, silver or an alloy thereof. Through electroplating, the chip mounting and bonding performance of the lead frame in the packaging process can be ensured, and the chip, the welding wire and the lead frame form good diffusion welding.
The tape pasting process comprises the step of pasting a protective tape to the workpiece in the previous process so as to protect the surface of the workpiece and ensure the surface quality.
The step of cutting the leg includes cutting the support portion 13. Since the supporting portion 13 is to improve the processing performance of the product, reduce the deformation rate of the workpiece in the previous process, and improve the final yield of the product, the supporting portion 13 needs to be cut off in the corner cutting process to form the final product shape.
The subsequent steps of the pin cutting step are a cutting step of cutting a plurality of lead frames obtained by the previous continuous stamping into independent single bodies, and are followed by a packaging step of packaging the finished lead frames.
In summary, the present invention provides a manufacturing process of a lead frame, in the stamping process, a plurality of lead parts 12 are processed in the frame body 1 side by side, the supporting part 13 is connected to the ends of the plurality of lead parts 12, at least two supporting legs 131 are processed on the supporting part 13, and one end of each supporting leg 131 is connected to the supporting part 13, and the other end is connected to the frame body 1. The lead part 12 can be effectively supported in the subsequent process, and the product reject ratio caused by the deformation of the lead part 12 is greatly reduced.
The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the practice of the invention to the particular forms disclosed. Similar or identical methods, structures and the like, or several technical deductions or substitutions on the premise of the conception of the invention, are considered to be the protection scope of the invention.
Claims (8)
1. The manufacturing process of the lead frame is characterized by comprising a stamping process, wherein the stamping process comprises the steps of processing a metal plate into a frame body (1), processing a plurality of pin parts (12) in the frame body (1) side by side, connecting a supporting part (13) with the tail ends of the plurality of pin parts (12), processing at least two supporting legs (131) on the supporting part (13), connecting one end of each supporting leg (131) with the supporting part (13), and connecting the other end of each supporting leg (131) with the frame body (1);
and in the stamping process, the supporting legs (131) are punched into an L shape with two ends respectively connected with the frame body (1) and the supporting part (13).
2. The lead frame manufacturing process according to claim 1, wherein the stamping process further comprises machining two supporting legs (131) at two ends of the supporting portion (13).
3. The lead frame manufacturing process according to claim 1, wherein the punching process includes machining a connecting portion between the two support legs (131).
4. The manufacturing process of the lead frame according to claim 3, wherein the connecting portion is formed into a rectangular sheet shape having two ends respectively connected to the two supporting legs (131).
5. The process for manufacturing lead frames according to claim 1, wherein the metal plate material is a copper strip.
6. The lead frame manufacturing process according to any one of claims 1 to 5, wherein the punching process is followed by a heat treatment process, a plating process, a taping process, a pin cutting process, a cutting process, and a packaging process.
7. The process for manufacturing lead frames according to claim 6, wherein the step of cutting the legs comprises cutting away the support (13).
8. The process for manufacturing lead frames according to claim 7, wherein the plating layer of the plating process is at least one of the group consisting of nickel, palladium, gold, silver or alloys thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711191549.3A CN107993942B (en) | 2017-11-24 | 2017-11-24 | Manufacturing process of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711191549.3A CN107993942B (en) | 2017-11-24 | 2017-11-24 | Manufacturing process of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107993942A CN107993942A (en) | 2018-05-04 |
| CN107993942B true CN107993942B (en) | 2019-12-24 |
Family
ID=62032936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711191549.3A Active CN107993942B (en) | 2017-11-24 | 2017-11-24 | Manufacturing process of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107993942B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252330A (en) * | 1993-02-23 | 1994-09-09 | Dainippon Printing Co Ltd | Lead frame for wiring board |
| JPH0766350A (en) * | 1993-08-23 | 1995-03-10 | Mitsui High Tec Inc | Lead frame for semiconductor device |
| JP2959521B2 (en) * | 1997-05-21 | 1999-10-06 | 日本電気株式会社 | Semiconductor device manufacturing method, lead frame |
| US6686258B2 (en) * | 2000-11-02 | 2004-02-03 | St Assembly Test Services Ltd. | Method of trimming and singulating leaded semiconductor packages |
| US6797540B1 (en) * | 2002-11-18 | 2004-09-28 | National Semiconductor Corporation | Dap isolation process |
| US7154165B2 (en) * | 2004-07-21 | 2006-12-26 | Linear Technology Corporation | Flashless lead frame with horizontal singulation |
| JP2009194027A (en) * | 2008-02-12 | 2009-08-27 | Mitsui High Tec Inc | Method and apparatus for manufacturing matrix-like lead frame |
-
2017
- 2017-11-24 CN CN201711191549.3A patent/CN107993942B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107993942A (en) | 2018-05-04 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing process of lead frame Effective date of registration: 20211227 Granted publication date: 20191224 Pledgee: China Co. truction Bank Corp Zhongshan branch Pledgor: ZHONGSHAN FUSHENG ELECTROMECHANICAL Co.,Ltd. Registration number: Y2021980016611 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |