CN107993820A - A kind of embedded inductor coil and preparation method thereof - Google Patents
A kind of embedded inductor coil and preparation method thereof Download PDFInfo
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- CN107993820A CN107993820A CN201711434659.8A CN201711434659A CN107993820A CN 107993820 A CN107993820 A CN 107993820A CN 201711434659 A CN201711434659 A CN 201711434659A CN 107993820 A CN107993820 A CN 107993820A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- Coils Or Transformers For Communication (AREA)
Abstract
This application discloses a kind of embedded inductor coil and preparation method thereof, the embedded inductor coil includes dielectric material thin plate, at least one side offers a circle line slot and a through hole in the dielectric material thin plate front and back, in the coil groove and the through hole coil and its connecting path are formed filled with metal, the dielectric material thin plate front and back is respectively provided with dielectric layer, weight cloth metallic circuit and external metallization circuit are respectively arranged with positioned at the surface of the dielectric layer of front and back, the coil is exported to outside by the heavy cloth metallic circuit, ink protective layer is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit, and external connection mouth is offered in the ink protective layer.Above-mentioned embedded inductor coil and preparation method thereof, can eliminate breakable problem on the basis of low cost, improve service life, strengthen energy transmission efficiency.
Description
Technical field
The invention belongs to wireless charging technical field, more particularly to a kind of embedded inductor coil and preparation method thereof.
Background technology
Induction, magnetic field resonance type, wave radiation formula are most widely used three kinds of wireless charging technologies.Wherein,
Using in contactless induction wireless charging technology, key is the shape of transmitting coil and receiving coil, installation shape
The design of formula and specific inner parameter.From induction, inductance coefficent L and coil size, shape and surrounding medium
Magnetic conductivity be proportionate, can by improving the relative permeability of its magnetic core, increase in unit area its active coil number of turn with
And increase the parameter designings such as its area to realize the lifting of inductance coefficent, while can by varying induction coil cross sectional shape and
The making form of coil improves the deficiency in wireless charging technology.
Wireless charging coil of the prior art is directly by copper wire winding in a manner of glue or gummed paper etc. when making
Coil is adhered to Hard Magnetic on piece, to make transmitting and receiving terminal mutual inductor.But this used in Hard Magnetic piece and coil bonds
Mode, also there are many inferior positions：Glue aging occurs in use for a long time, and bonding is unstable, causes product service life not grown
And it is unstable, and coil and magnetic sheet superposition can increase its product thickness and its volume, be unfavorable for its lightening development, this is with the modern times
The pursuit such as smart mobile phone and other wearable electronics miniaturization, the direction of systematization development are misfitted, and hard magnetic sheet is easy
Broken, fragment can cause potential risk to wiring board, and existing spacing is unfit to do too small between coil and magnetic sheet, often spacing compared with
Greatly, the efficiency of transmission of its energy can be reduced.In addition, also have the straight forming mode in transmitting and receiving end shell, but it is relied on
Special composition metal plastic parts material, this material are just complicated enough in making in itself, it will so that the line finally made
Circle cost greatly improves, and is unfavorable for the industrialization of the coil.
The content of the invention
To solve the above problems, the present invention provides a kind of embedded inductor coil and preparation method thereof, can it is low into
Breakable problem is eliminated on the basis of this, improves service life, strengthens energy transmission efficiency.
A kind of embedded inductor coil provided by the invention, including dielectric material thin plate, the dielectric material thin plate front
A circle line slot and a through hole are offered with least one side in the back side, is filled with the coil groove and the through hole
Metal forms coil and its connecting path, the dielectric material thin plate front and back are respectively provided with dielectric layer, positioned at front and the back of the body
The surface of the dielectric layer in face is respectively arranged with weight cloth metallic circuit and external metallization circuit, the coil pass through the heavy cloth
Metallic circuit is exported to outside, and ink protection is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit
Layer, and external connection mouth is offered in the ink protective layer.
Preferably, in above-mentioned embedded inductor coil, the dielectric material thin plate is PET thin plates, PI thin plates, LCP are thin
Plate, FR-4 thin plates or BT thin plates, the line width and line-spacing scope of the coil are 1 micron to 10 millimeters.
Preferably, in above-mentioned embedded inductor coil, the heavy cloth metallic circuit and the external metallization circuit are copper
Line, silver wire or gold thread.
Preferably, in above-mentioned embedded inductor coil, the dielectric material thin plate is the magnetic doped with 0.1% to 99%
The dielectric material thin plate of property material.
Preferably, in above-mentioned embedded inductor coil, the magnetic material is feeromagnetic metal micro Nano material, iron-based is non-
Peritectic alloy material, iron-nickel-based amorphous alloy, iron cobalt base amorphous alloy, iron-base nanometer crystal alloy and at the same time containing the dilute of iron-cobalt-nickel
At least one of soil material.
A kind of production method of embedded inductor coil provided by the invention, including：
At least one side in the front and back of dielectric material thin plate opens up a circle line slot and a through hole；
Metal is filled in the coil groove and the through hole, forms coil and its connecting path；
Dielectric layer is covered in the dielectric material thin plate front and back, and is set respectively in the dielectric layer front and back
It is equipped with weight cloth metallic circuit and external metallization circuit, the coil is exported to outside by the heavy cloth metallic circuit；
Ink protective layer is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit, and in the oil
External connection mouth is opened up in black protective layer.
Preferably, in the production method of above-mentioned embedded inductor coil, the shape of the line slot is spiral rectangle, spiral shell
Rounding shape or spiral oval.
Preferably, in the production method of above-mentioned embedded inductor coil, the line width and line-spacing scope of the coil are 0.1
Micron is to 10 millimeters.
Preferably, it is described in the front of dielectric material thin plate and the back of the body in the production method of above-mentioned embedded inductor coil
At least one side in face opens up a circle line slot and a through hole is：
Utilize at least one side of laser grooving mode or etching mode in the front and back of the dielectric material thin plate
Open up a circle line slot and a through hole.
Preferably, in the production method of above-mentioned embedded inductor coil, the dielectric material thin plate is doped with 0.1%
To the dielectric material thin plate of 99% magnetic material.
By foregoing description, above-mentioned embedded inductor coil provided by the invention and preparation method thereof, since this is embedding
Entering formula inductance coil includes dielectric material thin plate, and at least one side offers an astragal in the dielectric material thin plate front and back
Road groove and a through hole, form coil and its connecting path, institute in the coil groove and the through hole filled with metal
Give an account of electric material thin plate front and back and be respectively provided with dielectric layer, set respectively positioned at the surface of the dielectric layer of front and back
There are heavy cloth metallic circuit and external metallization circuit, the coil is exported to outside by the heavy cloth metallic circuit, described heavy
The outer layer of cloth metallic circuit and the external metallization circuit also sets up ink protective layer, and is offered in the ink protective layer
External connection mouth, therefore breakable problem can be eliminated on the basis of low cost, service life is improved, strengthens energy transmission
Efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the first form schematic diagram of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 2 is second of form schematic diagram of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 3 is the top view of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 4 is the bottom view of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 5 is the schematic diagram of the production method of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 6 is the first step schematic diagram of the production method of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 7 is the second step schematic diagram of the production method of the first embedded inductor coil provided by the embodiments of the present application；
Fig. 8 is the 3rd step schematic diagram of the production method of the first embedded inductor coil provided by the embodiments of the present application.
Embodiment
The core concept of the present invention is to provide a kind of embedded inductor coil and preparation method thereof, can be in the base of low cost
Breakable problem is eliminated on plinth, improves service life, strengthens energy transmission efficiency.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
As depicted in figs. 1 and 2, Fig. 1 is implemented the first embedded inductor coil provided by the embodiments of the present application for the application
Example provide the first embedded inductor coil the first form schematic diagram, Fig. 2 for it is provided by the embodiments of the present application the first
Second of form schematic diagram of embedded inductor coil, including dielectric material thin plate 1, the front of dielectric material thin plate 1 and the back of the body
At least one side offers a circle line slot and a through hole in face, and metal is filled with the coil groove and the through hole
Coil 2 and its connecting path 3 are formed, is divided into two kinds of forms, the first form such as Fig. 1, it can be seen that in upper and lower part here
It is respectively provided with coil 2, and second of form such as Fig. 2, line slot and through hole are simply simultaneously opened up wherein, because this feelings
A coil is only formed under condition, 1 front and back of dielectric material thin plate is respectively provided with dielectric layer 4, and this dielectric layer 4 is utilized
Material can be identical with the dielectric material thin plate 1, can not also be same, be not limited herein, positioned at front and back
The surface of the dielectric layer 4 is respectively arranged with weight cloth metallic circuit 5 and external metallization circuit 6, and the coil 2 passes through the heavy cloth
Metallic circuit 5 is exported to outside, and also setting up ink in the outer layer of the heavy cloth metallic circuit 5 and the external metallization circuit 6 protects
Sheath 7, and external connection mouth 8 is offered in the ink protective layer 7, in addition, for further clear and definite coil shape, it is above-mentioned
The top view of embedded inductor coil as shown in figure 3, bottom view as shown in figure 4, Fig. 3 for it is provided by the embodiments of the present application the first
The top view of embedded inductor coil, Fig. 4 are the bottom view of the first embedded inductor coil provided by the embodiments of the present application, from
The two it can be seen from the figure thats coil is rectangular configuration, but this is only an example, can also actually use other lines
Coil structures, are not intended to limit herein.
By foregoing description, the first embedded inductor coil provided by the embodiments of the present application, due to including dielectric
Sheet of material, at least one side offers a circle line slot and a through hole, institute in the dielectric material thin plate front and back
State in coil groove and the through hole and to form coil and its connecting path filled with metal, the dielectric material thin plate front and
The back side is respectively provided with dielectric layer, and weight cloth metallic circuit and outside are respectively arranged with positioned at the surface of the dielectric layer of front and back
Metallic circuit, the coil is exported to outside by the heavy cloth metallic circuit, in the heavy cloth metallic circuit and the outside
The outer layer of metallic circuit also sets up ink protective layer, and external connection mouth is offered in the ink protective layer, therefore can
Breakable problem is eliminated on the basis of low cost, improves service life, strengthens energy transmission efficiency.
Second of embedded inductor coil provided by the embodiments of the present application, is in the first above-mentioned embedded inductor coil
On the basis of, further include following technical characteristic：
The dielectric material thin plate is PET thin plates, PI thin plates, LCP thin plates, FR-4 thin plates or BT thin plates, the coil
Line width and line-spacing scope are 1 micron to 10 millimeters.
In fact, line width provided herein and line-spacing are only preferred solutions, there can also be it according to being actually needed to make
The coil of his line width and line-spacing, and the size of the dielectric material thin plate is depending on the size for the electronics charging equipment applied
Depending on size, the dielectric material thin plate of these material and size not only avoid the frangible of the material of prior art use and lack
Point, also with good machinability, ensures the adjacent turn spacing smaller of coil made, so as to ensure transmitting terminal and receiving terminal
Energy transmission efficiency higher.
The third embedded inductor coil provided by the embodiments of the present application, is in the first above-mentioned embedded inductor coil
On the basis of, further include following technical characteristic：
The heavy cloth metallic circuit and the external metallization circuit are copper wire, silver wire or gold thread.
The metallic circuit electric conductivity of these materials is more preferable, these are preferred solutions certainly, can also be according to actual needs
Using the heavy cloth metallic circuit of other materials, it is not intended to limit herein.
4th kind of embedded inductor coil provided by the embodiments of the present application, be it is above-mentioned the first to the third embedded-type electric
On the basis of feeling any in coil, following technical characteristic is further included：
The dielectric material thin plate be doped with 0.1% to 99% magnetic material dielectric material thin plate.
Ccf layer of the doped magnetic material as intermediate arrangement coil among in the dielectric material thin plate, it becomes possible to increase
Add its magnetic conductivity, increase the inductance value of induction coil, the efficiency of transmission in galvanization can be improved, accelerate charging process.
5th kind of embedded inductor coil provided by the embodiments of the present application, is in above-mentioned 4th kind of embedded inductor coil
On the basis of, further include following technical characteristic：
The magnetic material is feeromagnetic metal micro Nano material, iron-base amorphous alloy material, iron-nickel-based amorphous alloy, iron cobalt
Base noncrystal alloy, iron-base nanometer crystal alloy and at least one of rare earth material containing iron-cobalt-nickel at the same time.
Specifically, the magnetic material can be iron, cobalt, the material that three kinds of ferromagnetic elements of nickel are basic constituent element, can with but
It is not limited to feeromagnetic metal micro Nano material, iron-base amorphous alloy material Fe2O3, iron-nickel-based amorphous alloy, that is, NiFe2O4, iron cobalt
Base noncrystal alloy, that is, CoFe2O4, iron-base nanometer crystal alloy etc., or be made containing three kinds of basic constituent elements doped with rare earth material
Magnetic material etc., " at least one " mentioned in the program means that the magnetic material can be above-mentioned various specific materials
In one kind or there are two kinds in these materials at the same time.Three kinds or more, these situations are all in the guarantor of the program
Within the scope of shield.
The production method of the first embedded inductor coil provided by the embodiments of the present application is as shown in figure 5, Fig. 5 is the application
The schematic diagram of the production method for the first embedded inductor coil that embodiment provides, this method comprises the following steps：
S1：At least one side in the front and back of dielectric material thin plate opens up a circle line slot and a through hole；
Exemplified by the form of the first, with reference to figure 6, Fig. 6 is the first embedded inductor coil provided by the embodiments of the present application
Production method first step schematic diagram, it is seen then that opened up and line slot 9 and passed through at the same time in the front and back of dielectric material thin plate
Through hole 10.
S2：Metal is filled in the coil groove and the through hole, forms coil and its connecting path；
Specifically, carry out surface metal in the line slot and the connecting path of circuit beginning and end that can be held successfully on two sides
Change is handled, and forms metal seed layer, then carries out acid copper coil, this is to have the copper speed of growth in coil groove
Uniformity, can use and be carried out the methods of ternary copper facing, then the copper layer of surface covering is etched, and copper wire is kept after etching
Circle mutually maintains an equal level with dielectric material thin sheet surface, forms structure as shown in Figure 7 after filling metal, Fig. 7 is the embodiment of the present application
The second step schematic diagram of the production method of the first the embedded inductor coil provided, after filling metal, forms 2 He of coil
Connecting path 3.
S3：Dielectric layer is covered in the dielectric material thin plate front and back, and in the dielectric layer front and back point
Weight cloth metallic circuit is not provided with and external metallization circuit, the coil are exported to outside by the heavy cloth metallic circuit；
Specifically, dielectric layer can be covered in front and back, with laser beginning and end lead to the hole site upper table
Face is punched, and exposes copper wire, is needing the part that is rerouted to lay metal seed layer, by acid copper circuit by line
Enclose interface to draw, and external metallization circuit can be set in dielectric layer surface, as shown in figure 8, Fig. 8 is provided by the embodiments of the present application
3rd step schematic diagram of the production method of the first embedded inductor coil, it is seen that after the 3rd step, form dielectric layer
4th, weight cloth metallic circuit 5 and external metallization circuit 6.
S4：Ink protective layer is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit, and in institute
State and external connection mouth is opened up in ink protective layer.
Specifically, the external connection mouth is by rerouting layer by the energy input of the generation in coil or extraction, can be real
The application of present transmitting terminal and receiving terminal, this protective layer can also be good flame resistance and can play machinery in addition to ink
The material of protective effect, such as PET polyester films, FR-4 or epoxy resin.After the step, it is formed such as Fig. 1 institutes
The final structure shown, details are not described herein again, is in addition only the formation of the embedded inductor coil in the form of the first here
Journey is illustrated, and the forming process of the coil of second of form is similar, and details are not described herein again.
The production method of second of embedded inductor coil provided by the embodiments of the present application, is that the first is embedded above-mentioned
On the basis of the production method of inductance coil, following technical characteristic is further included：
The shape of the line slot is spiral rectangle, spiral circular or spiral oval.
It should be noted that only listing three kinds of preferable circuit groove shapes here, actually it is not limited in these,
It can also be set as other circuit groove shapes according to actual needs, be not intended to limit herein.
The production method of the third embedded inductor coil provided by the embodiments of the present application, is that the first is embedded above-mentioned
On the basis of the production method of inductance coil, following technical characteristic is further included：
The line width and line-spacing scope of the coil are 0.1 micron to 10 millimeters.
Further, the line width of coil and line-spacing can be arranged to less than 10 microns, the transmission effect so for energy
Rate higher, the coil turn made after all under equal area is more, can more improve the electricity that such as mobile phone homalographic is more nervous
The efficiency of sub- product wireless charging, certainly this also can not unconfined reduction spacing, after all will consider material factors and into
This factor, obtained after being weighed in all factors the program preferably by.
The production method of 4th kind of embedded inductor coil provided by the embodiments of the present application, is that the first is embedded above-mentioned
On the basis of the production method of inductance coil, following technical characteristic is further included：
At least one side in the front and back of dielectric material thin plate opens up a circle line slot and a through hole
For：
Utilize at least one side of laser grooving mode or etching mode in the front and back of the dielectric material thin plate
Open up a circle line slot and a through hole.
Wherein, the laser class shape for grooving, can be divided into continuous-wave laser and pulse laser by the continuity point of ripple
Device, can be divided into gas laser, liquid laser, fixed laser, semiconductor laser by the operation material of composition laser
With chemical laser etc..Specifically, and can be optical-fiber laser, krypton/hernia lamp pumping YAG laser, He-Ne lasers, CO2Swash
Light device, argon ion laser, KrF lasers etc., are not intended to limit herein.
When opening up line slot and through hole using etching mode, following scheme can be, but not limited to：First above and below thin plate
Copper coating, is exposed coil groove development, then removes excess stock with etching method and use laser grooving, the figure of grooving
The as distribution pattern of coil, intermediate coil part are the wire casing for not punching plate, and starting point and destination county, which are punched, makes copper wire up and down
Circle connection, increases its total number of coils.
The production method of 5th kind of embedded inductor coil provided by the embodiments of the present application, be it is above-mentioned the first to the 4th
In kind embedded inductor coil on the basis of any production method, following technical characteristic is further included：
The dielectric material thin plate be doped with 0.1% to 99% magnetic material dielectric material thin plate.
Ccf layer of the doped magnetic material as intermediate arrangement coil among in the dielectric material thin plate, it becomes possible to increase
Add its magnetic conductivity, increase the inductance value of induction coil, the efficiency of transmission in galvanization can be improved, accelerate charging process.Institute
It can be iron, cobalt, the material that three kinds of ferromagnetic elements of nickel are basic constituent element to state magnetic material, be can be, but not limited to as feeromagnetic metal
Micro Nano material, iron-base amorphous alloy material Fe2O3, iron-nickel-based amorphous alloy, that is, NiFe2O4, iron cobalt base amorphous alloy be
CoFe2O4, iron-base nanometer crystal alloy etc., or containing three kinds of basic constituent elements doped with magnetic material made of rare earth material etc.,
" at least one " mentioned in the program means that the magnetic material can be one kind in above-mentioned various specific materials, also may be used
To be two kinds had at the same time in these materials.Three kinds or more, these situations are all within the protection domain of the program.
In conclusion the adjacent turn distance controlling for the above-mentioned embedded inductor coil that the application provides obtain it is smaller, it is same
The coil turn that can reach in area is more, and the inductance intensity produced in unit area is higher, can be by adding magnetic material
Increase its magnetic conductivity, and thickness is controllable, can integrally be made frivolous；Embedded inductor coil making is relatively simple, and seals
Dress up controllable, possess very high actual possibility of going into operation.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
- A kind of 1. embedded inductor coil, it is characterised in that including dielectric material thin plate, the dielectric material thin plate front and the back of the body At least one side offers a circle line slot and a through hole in face, and metal is filled with the coil groove and the through hole Coil and its connecting path are formed, the dielectric material thin plate front and back is respectively provided with dielectric layer, positioned at front and back The surface of the dielectric layer is respectively arranged with weight cloth metallic circuit and external metallization circuit, the coil pass through the heavy cloth metal Circuit is exported to outside, and ink protective layer is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit, and External connection mouth is offered in the ink protective layer.
- 2. embedded inductor coil according to claim 1, it is characterised in that the dielectric material thin plate for PET thin plates, PI thin plates, LCP thin plates, FR-4 thin plates or BT thin plates, the line width and line-spacing scope of the coil are 1 micron to 10 millimeters.
- 3. embedded inductor coil according to claim 1, it is characterised in that the heavy cloth metallic circuit and the outside Metallic circuit is copper wire, silver wire or gold thread.
- 4. according to claim 1-3 any one of them embedded inductor coils, it is characterised in that the dielectric material thin plate is Doped with the dielectric material thin plate of 0.1% to 99% magnetic material.
- 5. embedded inductor coil according to claim 4, it is characterised in that the magnetic material is feeromagnetic metal micro-nano Rice material, iron-base amorphous alloy material, iron-nickel-based amorphous alloy, iron cobalt base amorphous alloy, iron-base nanometer crystal alloy and at the same time At least one of rare earth material containing iron-cobalt-nickel.
- A kind of 6. production method of embedded inductor coil, it is characterised in that including：At least one side in the front and back of dielectric material thin plate opens up a circle line slot and a through hole；Metal is filled in the coil groove and the through hole, forms coil and its connecting path；Dielectric layer is covered in the dielectric material thin plate front and back, and is respectively arranged with the dielectric layer front and back Weight cloth metallic circuit and external metallization circuit, the coil are exported to outside by the heavy cloth metallic circuit；Ink protective layer is also set up in the outer layer of the heavy cloth metallic circuit and the external metallization circuit, and is protected in the ink External connection mouth is opened up in sheath.
- 7. the production method of embedded inductor coil according to claim 6, it is characterised in that the shape of the line slot For spiral rectangle, spiral circular or spiral oval.
- 8. the production method of embedded inductor coil according to claim 6, it is characterised in that the line width of the coil and Line-spacing scope is 0.1 micron to 10 millimeters.
- 9. the production method of embedded inductor coil according to claim 6, it is characterised in that described thin in dielectric material At least one side in the front and back of plate opens up a circle line slot and a through hole is：Opened up using at least one side of laser grooving mode or etching mode in the front and back of the dielectric material thin plate One circle line slot and a through hole.
- 10. according to the production method of claim 6-9 any one of them embedded inductor coils, it is characterised in that given an account of Electric material thin plate be doped with 0.1% to 99% magnetic material dielectric material thin plate.
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| CN201711434659.8A CN107993820A (en) | 2017-12-26 | 2017-12-26 | A kind of embedded inductor coil and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110961795A (en) * | 2018-09-28 | 2020-04-07 | 雷科股份有限公司 | UV laser processing method and structure of copper coil |
| US20230208175A1 (en) * | 2021-12-23 | 2023-06-29 | Advanced Semiconductor Engineering, Inc. | Electronic device with electromagnet |
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| CN103606450A (en) * | 2013-11-26 | 2014-02-26 | 深圳顺络电子股份有限公司 | Laminated-coil-type device manufacturing method |
| CN103764592A (en) * | 2011-09-02 | 2014-04-30 | 株式会社村田制作所 | Ferrite ceramic composition, ceramic electronic component, and production method for ceramic electronic component |
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| CN110961795A (en) * | 2018-09-28 | 2020-04-07 | 雷科股份有限公司 | UV laser processing method and structure of copper coil |
| CN110961795B (en) * | 2018-09-28 | 2022-05-31 | 雷科股份有限公司 | UV laser processing method and structure of copper coil |
| US20230208175A1 (en) * | 2021-12-23 | 2023-06-29 | Advanced Semiconductor Engineering, Inc. | Electronic device with electromagnet |
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