MX2014008936A

MX2014008936A - Offsetting shielding and enhancing coupling in metallized smart cards.

Info

Publication number: MX2014008936A
Application number: MX2014008936A
Authority: MX
Inventors: David Finn
Original assignee: Feinics Amatech Teoranta
Priority date: 2012-01-23
Filing date: 2013-01-23
Publication date: 2015-06-02
Also published as: CA2860909A1; JP2015513712A; BR112014018042A8; WO2013110625A1; CN104471791A; BR112014018042A2; AU2013211649A1; CA2860909C; KR20140117614A; EP2807700A1

Abstract

A dual-interface smart card having a booster antenna (BA) with coupler coil (CC) in its card body (CB), and a metallized face plate (202, 302) having a window opening (220, 320) for the antenna module (AM). Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads (CP) on the antenna module (AM), disposing a compensating loop (CL) under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna (MA) with capacitive stubs, and disposing a ferrite element (FE) in the antenna module between the module antenna and the contact pads.

Description

PROTECTION OF COMPENSATION AND IMPROVED COUPLING IN METALLIC INTELLIGENT CARDS Field of the Invention The invention (in some aspects) is related to "secure documents" such as electronic passports, electronic ID cards and smart cards (data carriers) that have RFID chips (radio frequency identification) or chip modules (CM) and operate in a non-contact mode (ISO 14443) including dual interface cards (DI or DIF) that can also operate within the smart card, such as between a module antenna (MA) connected to the RFID chip (CM) and an antenna reinforcement (BA) in the card body (CB) of the smart card and coupled in an inductive way with the module antenna (MA) and with the consequent improvements in the RFID chip that interacts with external RFID readers.

The invention (in some aspects) is related to passive RFID smart cards that have a metallic or conductive metal layer that protects the electro-magnetic field generated by the reader. In particular, double interface cards that operate under the principle of reactive coupling.

Background of the Invention For the purposes of this description, an RFID transponder usually comprises a substrate, an RFID chip (or chip module) disposed on the substrate, and an antenna disposed on the substrate. He Transponder can form the basis of a secure document, such as an electronic passport, smart card or national ID card.

The chip module can operate only in a non-contact mode (such as ISO 14443) or it can be a double interface module (DIF) that can also operate in contact mode (such as ISO 7816-2) and a non-contact mode. Contact. The chip module can take advantage of the energy from the RF signal supplied by an external RFID reader device with which it communicates.

The substrate, which may be referred to as an "embedded substrate" (for the electronic passport) or "the card body" (for the smart card) may comprise one or more layers of material such as polyvinyl chloride (PVC), polycarbonate (PC); polyethylene (PE), PET (PE doped), PET-G (derived from PE), Teslin ™, paper or cotton / blot and the like. When an "embedded substrate" is referred to herein, it must be considered to include the "card body" and vice versa, unless explicitly stated otherwise.

The chip module can be a lead frame type chip module or any epoxy-glass chip module. The epoxy-glass module can be metallized on one side (contact side) or on both sides with a through-hole planking to facilitate interconnection with the antenna. When referring to "chip module" here, it should be considered that it includes "chip" and vice versa, unless explicitly stated otherwise.

The antenna can be a self-bonding (or self-adhesive) wire. A conventional method for mounting an antenna wire with a Substrate is using a sonotrode tool (ultrasonic) which vibrates, feeds the wire out of a capillary and incorporates it inside or adheres it to a substrate surface. A typical pattern for an antenna is generally rectangular, in the form of a flat (spiral) coil that has several turns. The two ends of the antenna wire can be connected, such as by thermocompression (TC) bonding to the terminals (or terminal areas, or contact bearings) of the chip module. See, for example, documents US 6,698,089 and US 6,233,818 incorporated herein by reference in their entirety.

One problem with such a configuration that the antenna incorporates within the chip module (antenna module) is that the total area of the antenna is too small (such as approximately 15 mm x 15 mm), unlike a conventional antenna that is it can form by embedding several (such as 4 or 5) turns of wire around the periphery of the embedded substrate or the card body of the secure document, in which case the total area of the antenna will be approximately 80 mm x 50 mm (approximately 20 times larger). When an antenna is incorporated with the chip module, the resulting entity can be called as "antenna module".

Some documents of the previous technique US 8,261, 997 (NXP) discloses a carrier assembly for receiving an RFID transponder chip having a coupling side to be coupled with a consumer device and an operating side for receiving an RF signal during the operational use of the RFID transponder chip . ... an electrically conductive protective layer is provided on the coupling side. The effect of this layer is that it effectively protects the transponder from the material on the surface on which the transponder is provided. The protection layer has some de-tuning effect on the resonant frequency, but once this de-tuning effect has been taken into consideration in the antenna design, there is hardly any de-tuning effect due to the surface in which the RFID transponder is provided, that is, the transponder comprises the carrier assembly of the invention is suitable for virtually any surface. ... the magnetic layer comprises a ferrite sheet or a ferrite sheet, ... the electrically conductive protective layer comprises a material selected from the group comprising: copper, aluminum, silver, gold, platinum, conductive paste and silver ink .

Document EP1854222 A2 (NXP) describes a mobile communication device (1, 10) comprising protection components that provide electro-magnetic protection or attenuation between a first area (A) and a second area (B, B1, B2 ) inside or outside the communication device (1, 10). In the first area (A), an antenna (4) and at least one ferrite (6) are arranged, wherein the ferrite (6) is provided to interact with the antenna (4) and to guide the magnetic flux between the first area (A) and the second area (B, B1, B2).

US 20120055013 (Finn; 2012; "S32") describes microstructures, such as connection areas, contact bearings, antennas, coils, plates for capacitors and the like, which are they can form with the use of nanostructures such as nanoparticles, nanowires and nanotubes. A laser can be used to assist in the process of forming the microstructure, and can also be used to form other features on a substrate, such as recesses or channels for receiving the microstructures. A smart mobile phone (MPS) tag is mounted on a cell phone with a self-adhering protection element comprising a core layer having ferrite particles.

EP 02063489 A1 (Tyco) describes an antenna element and a method for manufacturing the same. An easier manufacturing antenna device used in a composite tag of an RFID (Radio Frequency Identification) system is provided. The antenna device (10) has (A) a laminated magnetic element formed of a magnetic composition containing a magnetic material and a polymer material and (B) an antenna wiring provided on one of the surfaces of the laminated magnetic element.

Composite sheet card US 2009/0169776 (2009, Herslow) discloses composite cards that include a security layer comprising a hologram or a diffraction grating formed in the center or core layer of the card. The hologram can be formed by embedding a designated area of the core layer with a diffraction pattern and by depositing a thin layer of metal on the embedded layer. They can be coupled, in a selective and symmetrical, additional layers on the upper surfaces and bottom of the core layer. A laser can be used to remove selected portions of the metal formed in the embedded layer, at selected stages of card formation, in order to impart the selected pattern or information to the holographic region. The cards can be "laser engraved" when the cards are processed and coupled with a large sheet of material, whereby "laser engraving" of all the cards on the sheet can be done at the same time and relatively Alternatively, each card can be "laser engraved" individually to produce the desired alphanumeric information, barcode information or a graphic image, after the sheets are cut with die on cards.

Metal card US 2011/0189620 (2011; Herslow) discloses a method and apparatus for treating a selected region of a metal layer, used to form the metal card, by quenching the selected metal region so that the selected region becomes soft and ductile, while the rest of the metal layer remains rigid. The selected, ductile, smoothed metal region can be embedded with reduced energy and reduced wear and tear on the embedding equipment. Alternatively, the hardened metal layer may undergo additional process steps to form a mounting that can then be embedded. The method can include the use of an accessory to hold the metal layer, the accessory has a window region that allows to apply heat to soften the region of the layer of metal inside the window region. The accessory includes an apparatus for cooling the portion of the metal layer outside the window region and for preventing the temperature of the metal layer from outside the window region from rising above the predetermined limits.

Ferrite US 8, 158,018 (2012; TDK) discloses a sintered ferrite body of the present invention, which contains the major components consisting of 52 to 54 mole% of Fe.sub.203.35 to 42 mole% of MnO and to 11 moles% of ZnO as oxide equivalents and additives that include Co, Ti, Si and Ca in specific amounts, and has a temperature at which the energy loss is a minimum value (lower temperature) greater than 120 degrees C in a field magnetic field with an excitation magnetic flux density of 200 mT and a frequency of 100 kHz, and an energy loss of 350 kW / m.sup.3 or less at the lower temperature.

US 7,948,057 (2011, TDK) discloses a ferrite substrate, a layer of ferrite resin encrusted by winding and a layer of ferrite resin embedded with IC, which are laminated, the ferrite substrate has a first part of ferrite protruding inside the ferrite resin layer from the ferrite resin layer, the winding within the ferrite resin layer is a winding arranged around the first protruding part and the IC overlaps the first protruding portion in the ferrite resin layer. resin layer. In accordance with this configuration, a high integration and the IC is arranged in a place where the first protruding part of ferrite, whose height fluctuates little as a result of thermal expansion, overlaps in the ferrite resin layer, its thickness is thinned by the first protruding part and varies little as a result of thermal expansion, which minimizes variations in the gap between the winding and the IC as a result of thermal expansion, and greater stability of the electrical characteristics is achieved.

Document 6,817,085 (2004; TDK) discloses a method for manufacturing a multi-layer ferrite chip inductor arrangement that includes a composite main body element by laminating a ferrite layer and a conductive layer, such that the laminated face of the ferrite it remains vertical with an element mounting surface. The method also includes adapting a plurality of coil-shaped internal conductors within the main body member, n where the coiling direction of the coil-shaped inner conductor is in parallel with the mounting surface of the element, which forms the sheets of ferrite with through holes and prints the ferrite sheets with a plurality of internal conductors in the form of a coil and conductor patterns with an electrically conductive material.

US 6,329,958 (2001; TDK) describes an antenna structure that can be formed by configuring a current restriction structure on a conductive surface. The current restriction structure can be formed of a ferrite material, and can have various shapes, including bells, mosaics or a patterned layer. The conductive surface can be associated with a vehicle or other structure. The current restriction structure alters the paths taken by the current at or below the conductive surface when voltage is applied between the portions of the surface.

Brief Description of the Invention An object of the invention for improving the coupling between an RFID reader and a chip module in a smart card has a metal or metallized layer. In general, several modifications and / or additions can be made to the structure of the smart cards to displace the protective effects with the substrates of the metal or metallized card body during the electro-magnetic coupling, in order to improve the coupling between the smart card and the external RFID reader (electro-magnetic). A double interface smart card (DI) has contact bearings (CP) extended through an opening in the metal layer to interface with an external (electrical) contact reader.

In general, a dual-interface smart card comprises a reinforcing antenna (BA) with a coupling coil (CC) on its card body (CB) and a metallized front plate (202, 302) having an aperture (220, 320). ) of window for the antenna module (AM) that has a module antenna (MA). The attenuation caused by the metallized faceplate can be reduced (the overall performance can be improved) with one or more of: forming the window opening substantially larger than the antenna module (AM); provide perforations through the front plate, arrange the ferrite material between the front plate and the reinforcement antenna; modify the contact bearings (CP) on the antenna module (A.M); arranging a compensation loop (CL) under the reinforcement antenna (BA); move the antenna module (AM) with respect to the coupling coil (CC); arranging the reinforcement antenna as a quasi-dipole; provide the module antenna (MA) with capacitive stump; and arranging the ferrite element (FE) in the antenna module (AM) between the module antenna (MA) and the contact bearings (CP).

According to one embodiment of the invention, a smart card having a metallized front plate with a window opening for accepting the antenna module and a card body with a reinforcing antenna including the coupling coil, wherein the aperture The window has a baseline size approximately equal to the size of the antenna module, which can be characterized in that the window opening is essentially larger than the antenna module. The window opening can be at least 10% larger than the antenna module, which results in a gap between the inner edges of the window opening and the antenna module. A ferrite layer may be disposed between the front plate and the reinforcement antenna. A plurality of perforations may be formed in the faceplate extended around at least one of the window opening and the periphery of the front plate. At least some of these perforations can reduce the amount of material of the faceplate in an area surrounding the window opening or around the periphery of the faceplate by 20-50%. A compensation loop can be arranged behind the reinforcement antenna. The compensation loop may have a gap, and two free ends, and may comprise a conductive material such as copper and may comprise ferrite.

One or more of the following features may be included in the smart card: the reinforcement antenna can be configured as a quasi-dipole, with or without a coupling coil; the reinforcement antenna may be provided with an extension; the reinforcing antenna may comprise two overlapping reinforcement antenna; the reinforcement antenna can be provided mainly in the upper portion of the smart card; the antenna of the module can be displaced from the coupling coil.

The smart card may also comprise at least one of the following characteristics: a ferrite element may be disposed between the antenna and the contact bearings of the antenna module; capacitive trunnions can be added to the module antenna; the module antenna may comprise two separate coils; the module antenna can comprise two windings connected in a quasi-dipole configuration; holes in the contact bearing of the antenna module.

According to one embodiment of the invention, a method for minimizing the attenuation of the coupling by the front plate of a metallized smart card has a reinforcing antenna with a coupling coil in its card body, the method can comprise one or more from: forming the window opening in the faceplate larger than the antenna module; provide perforations through the faceplate; provide ferrite material between the front plate and the reinforcement antenna; arrange a compensation loop under the reinforcement antenna.

The antenna module can be offset with respect to the coupling coil. The reinforcing antenna can be arranged as a quasi-dipole, the module antenna can be provided with capacitive trunnions, the ferrite can be provided in the antenna module between the antenna of the module and the contact bearings. The contact bearings can be cut or punched.

Brief Description of the Drawings Reference is now made in detail to the embodiments of the invention, non-limiting examples that can be illustrated in the accompanying Figures (Figures). In general, the Figures are in the form of a diagram. Some elements in the Figures can be amplified, others can be omitted to avoid confusion. Some Figures may be in the form of a diagram. Although the invention is generally described within the context of several exemplary embodiments, it should be understood that it is not intended to limit the invention to those particular embodiments and the individual characteristics of such embodiments may be combined with each other. Any text (lcyenda, notes, reference numbers and the like) that appear in the drawings are incorporated herein by reference.

Figure 1 is a cross sectional view of a double interface smart card (DI) and the readers.

Figure 1A is a diagrammatic top view of a reinforcement antenna (BA) with a coupling coil (CC).

Figure 2 is a cross-sectional, diagrammatic view of a smart card with metallization.

Figure 2A is a perspective view, in partial diagram of a smart card with metallization.

Figures 3A; B, C are diagrammatic top views of the modes of a faceplate (ML) for a smart card.

Figure 4A is a diagram of a layer with a compensation loop having a gap.

Figure 4B is a diagram of a layer with a compensation loop, without a gap.

Figure 5 is a plan view of a typical configuration of the contact bearings (CP) in a module tape (MT).

Figure 5A is a diagram showing a bearing pattern of exemplary contact and their assignments.

Figure 6A is a plan view illustrating the extended outer edges of the contact bearings (CP).

Figure 6B is a plan view illustrating the cut outer edges of the contact bearings (CP).

Figure 6C is a plan view illustrating the gap increase between the contact bearings (CP).

Figure 6D is a plan view illustrating the modification of the gap between the contact bearings (CP).

Figure 7A is a plan view illustrating the perforation of the contact bearings (CP).

Figure 7B is a cross-sectional view illustrating the thinning of the contact bearings (CP).

Figure 8A is a plan view illustrating the underside of a module tape (MT).

Figure 8B is a plan view illustrating the perforation of the contact bearings (CP).

Figure 9A is a plan view illustrating the perforation of the contact bearings (CP).

Figure 9B is a plan view illustrating the perforation of the contact bearings (CP).

Figure 10A is a plan view of the bottom side of a module tape (MT) for an antenna module (AM), showing an antenna structure (AS) having two antenna segments (MA1, MA2).

Figure 10B is a diagrammatic view of an antenna structure (ACE).

Detailed description of the invention The different modalities will be described to illustrate the teachings of the invention and should be considered as illustrative, rather than limiting. Any dimension, material or processes established here should be considered as exemplary and approximate, unless otherwise indicated.

In the following, transponders in the form of a secure document, which can be a smart card or national ID cards, are described as exemplary of several features and embodiments of the invention. As will be evident, many features and modalities can be applied (easily incorporated into) other forms of secure documents, such as electronic passports. As used herein, any of the terms "transponder", "smart card", "data carrier" and their like should be construed as referring to any other device similar to them, which operates under ISO 14443 or RFID Similary.

A typical data carrier described herein may comprise (i) an antenna module (AM) having a chip or an RFID chip module (CM) and a module antenna (MA); (I) a card body (CB) and (ii) a reinforcing antenna (BA) arranged on the card body (CB) to improve the coupling between the module antenna (MA) and the antenna of a " Reader "External RFID. The term "chip module" is referred to herein as including a "chip" and vice versa, unless otherwise stated.

The module antenna (MA) can comprise a wire coil, conductive traces recorded or printed on a module tape substrate (MT) for the antenna module (AM) or can be incorporated directly into the chip itself.

The reinforcement antenna (BA) can be formed by embedding wire in a substrate for embedding or card body (CB). However, it should be understood that the antenna can be formed with the use of processes other than wire embedding in the substrate, such as additive or subtractive processes, such as printed coil winding antenna structures (such as described in US 6,295,720), antenna structures formed on a separate antenna substrate and transferred to the embedding substrate (or layer thereof), etched antenna structures (including laser engraving) of a conductive layer on the substrate, a conductive material deposited on the substrate or channels formed on the substrate or its like. When referring here to an "embedding substrate" it should be understood that it includes the "card body" and vice versa, as well as any other substrate for a secure document, unless explicitly stated otherwise.

The following descriptions are in the context of dual interface smart cards (DI, DIF) and are related to the contactless operation of the same. Many of the teachings described here can be applied to electronic passports and their counterparts that have only the non-contact mode of operation. In general, any dimension proposed here are approximate and the materials here mentioned are intended to be exemplary.

In general, the coupling between the module antenna (MA) and the antenna of an external RFID reader can be improved by incorporating a reinforcing antenna (BA) in the card body (CB). In many aspects, the reinforcement antenna (BA) is similar to a card antenna (CA). However, unlike a card antenna (CA) that is directly connected in electrical form to the chip or RFID chip module (such as in US 7,980,477), the reinforcement antenna (BA) is inductively coupled to the Module antenna (MA) on the antenna module (AM), which can be connected to the RFID chip (CM). Such inductive (electro-magnetic) coupling may be more difficult to achieve than a direct electrical connection. The reinforcement antenna (BA) can be referred to as a card antenna (CA). The reinforcement antenna (BA) may have a coupling coil (CC) associated therewith, which is arranged to be in close proximity and coupled with the module antenna (MA).

As used herein, the term "coupling" (and variations thereof) refers to an inductive, magnetic, capacitive or reactive coupling (among which are included combinations thereof, any of which will be referred to as "inductive coupling"). ") Between two elements that are based on the generation of an electromagnetic field by a determined element and the reaction with (interaction with) the field by another element. Contrary to this, the term "connect" (and variations thereof) refers to two elements that go away. to connect electrically with each other, where the interaction between the two elements results from the flow of electrons between the two elements. Typically, two elements, which are coupled inductively to each other, are not electrically coupled together. The elements, which are wire coils, such as a module AM antenna and a DC coupling coil are arranged close to each other, and are inductively coupled to each other, without any electrical connection between the two elements. Contrary to this, the MA module antenna is generally electrically connected to the RFID chip element (CM). The windings and coils of the reinforcement antenna BA, such as the external winding elements OW, the internal winding IW and the DC coupling coil, are generally electrically connected to each other, but can also exhibit an inductive coupling between yes. The MA module antenna and the coupling coil (DC are not electrically connected to each other, rather, they are coupled inductively (or "are coupled by transformer") to each other.

The booster antenna BA (and other features) described herein can increase the effective ("read") operating distance between the AM antenna module and the reader without external contact with the capacitive and inductive coupling. While the distances are typically read in the order of a few centimeters, an increase of 1 cm may represent a significant improvement.

Various embodiments will be described in order to illustrate the teachings of the invention, and should be considered as illustrative rather than limiting. Henceforth, transponders in the form of secure documents that can be smart cards or national ID cards are describe as exemplars of various features and embodiments of the invention. As will be evident, many features and modalities can be applied (easily incorporated into) other forms of secure documents, such as electronic passports. As used herein, any of the terms "transponder", "smart card", "data carrier" and their like should be construed as referring to any other device similar to them, which operates under ISO 14443 or RFID Similary.

A typical data carrier described herein may comprise (i) an antenna module (AM) having a chip or an RFID chip module (CM) and a module antenna (MA); (ii) a card body (CB) and (iii) a reinforcing antenna (BA) disposed on the card body (CB) to improve the coupling between the module antenna (MA) and the antenna of a "reader" External RFID The term "chip module" is referred to herein as including a "chip" and vice versa, unless otherwise stated.The module antenna (MA) may comprise a coil of wire, conductive traces recorded or printed on a module tape substrate (MT) for the antenna module (AM) or can be incorporated directly into the chip itself.

The reinforcement antenna (BA) can be formed by embedding wire in a substrate for embedding or card body (CB). However, it should be understood that the antenna may be formed with the use of processes other than wire embedding in the substrate, such as additive or subtractive processes, such as printed coil winding antenna structures (such as described in US 6,295,720), antenna structures formed on a separate antenna substrate and transferred to the embedding substrate (or layer thereof), etched antenna structures (including laser engraving) of a conductive layer on the substrate, a conductive material deposited in the substrate or in the channels formed in the substrate or its similar. When referring here to an "embedding substrate" it should be understood that it includes the "card body" and vice versa, as well as any other substrate for a secure document, unless explicitly stated otherwise.

The following descriptions are in the context of dual interface smart cards (DI, DIF) and are related to the contactless operation of the same. Many of the teachings described here can be applied to electronic passports and their counterparts that have only the non-contact mode of operation. In general, any dimension proposed here is approximate and the materials mentioned here are intended to be exemplary.

In general, the coupling between the module antenna (MA) and the antenna of an external RFID reader can be improved by incorporating a reinforcing antenna (BA) in the card body (CB). In many aspects, the reinforcement antenna (BA) is similar to a card antenna (CA). However, unlike a card antenna (CA) which is directly electrically connected to the chip or RFID chip module (such as in US 7,980,477), the reinforcement antenna (BA) is inductively coupled to the Module antenna (MA) on the antenna module (AM), which can be connected to the RFID chip (CM). Such Inductive coupling can be more difficult to achieve than a direct electrical connection.

As used herein, the term "coupling" (and variations thereof) refers to an inductive, magnetic, capacitive or reactive coupling (among which are included combinations thereof, any of which will be referred to as "inductive coupling"). ") Between two elements that are based on the generation of an electromagnetic field by a determined element and the reaction with (interaction with) the field by another element. Contrary to this, the term "connect" (and the variations thereof) refers to two elements that are going to be connected in an electrical way to each other, where the interaction between the two elements results from the flow of electrons between the two elements . Typically, two elements, which are coupled inductively to each other, are not electrically coupled together. The elements, which are wire coils, such as a module AM antenna and a DC coupling coil are arranged close to each other, and are inductively coupled to each other, without any electrical connection between the two elements. Contrary to this, the MA module antenna is generally electrically connected to the RFID chip element (CM). The windings and coils of the reinforcement antenna BA, such as the external winding elements OW, the internal winding IW and the DC coupling coil, are generally electrically connected to each other, but can also exhibit an inductive coupling between yes. The MA module antenna and the coupling coil (DC are not electrically connected to each other, rather, they are coupled in an inductive way (or "are coupled by transformer") each other.

The reinforcement antenna BA (and other features) described herein can increase the effective ("read") operating distance between the AM antenna module and the reader without external contact with the capacitive and inductive coupling. When reading distances typically in the order of a few centimeters, an increase of 1 cm can represent a significant improvement.

Figure 1 is a cross-sectional view of a portion of an exemplary smart card having an AM antenna module disposed in a recess in the CB card body. The AM antenna module has a CM chip module. The AM antenna module has CP contact bearings for the contact interface with an external contact reader (ISO 7816). The AM antenna module has a MA module antenna for a contactless interface with the reader without external contact (ISO 14443). The reinforcing antenna BA is arranged around the periphery of the card body CG, and has a coupling coil CC arranged around the recess in the card body CB. With the antenna module AM disposed in the recess, the module AM antenna is closely coupled with the DC coupling coil of the reinforcement antenna BA. The DC coupling coil can be arranged on the AM module antenna, rather than surrounding it.

As shown in US 2012/0074233, for example, in Figures 3A and 4A, the booster antenna BA (or the CA card antenna) may comprise an external winding OW (or D) and an internal winding IW ( or E) connected in an inverted phase to each other, as a quasi-dipole. The coupling coil (CC) is not shown.

As shown in US 13 / 600,140 for example, Figures 3 and 4 therein, the quasi-dipole booster antenna BA may also comprise an internal DC coupler coil. The DC coupler coil is shown if detail, represented only by a few lines. (Some details of the construction of the DC coupler and the manner in which it is arranged in various orientations (to the right, or to the left) and connected to the external winding OW and the internal winding IW are shown in Figures 3A- 3D).

Figure 1A is a diagrammatic top view of a CB smart card body with a booster antenna BA and an AM antenna module. The booster antenna BA has a DC coupler coil incorporated therewith. The following abbreviations may appear in the Figures: CB - body card or inlay substrate BA - booster antenna or card antenna (CA) OW - external BA winding - approximately 2 to 3 turns IW - BA internal winding - approximately 2 to 3 turns CC - coupling coil - approximately 10 turns IE - internal end of OW, IW or CC OE- external end of OW; IW or CC.

The following should be observed: The internal end (IE, a) of the external winding (OW) is "Free end".

The outer end (OE, f) of the internal winding (IW) is "free end".

The outer end (OE, b) of the OW is connected to a DC end.

The internal end (IE, e) of the IW is connected to another end of DC.

The external winding OW can be extended to the right (CW) from IE (a) to OE (b).

The internal winding IW can be laid to the right (CW) from IE (e) to OE (f).

The reinforcement antenna BA comprises an outer winding OW and an internal winding IW, both essentially extending around the periphery of the card body CB. Each of the inner and outer windings has an inner end IE and an outer end OE. The external end OE (b) of the external winding OW is connected to the internal end IE (e) of the internal winding IW, ugh the coupling coil CC. The internal end IE (a) of the external winding OW and the external end OE (f) of the internal winding IW can remain unconnected, as "free ends". The reinforcing antenna BA generally comprises an external winding OW, a coupling coil CC and an internal winding IE is an open circuit and can be referred to as "a quasi-dipole", the outer winding OW constitutes a pole of the dipole, the winding internal IW constitutes the other pole of the dipole, fed by the center by the coupling coil CC.

The reinforcement antenna BA can be formed with the use of a Isolated discontinuous copper wire, disposed (such as ultrasonically bonded) around (inside the) perimeter (periphery) of the CB card body (or the embedding substrate, or the data carrier substrate such as formed of a thermoplastic). The reinforcement antenna BA comprises an external winding OW (or coil, D) and an internal winding IW (or coil, E) and also comprises a DC coupling coil, all of which are described as "ends", of several coil elements, and can be formed of a continuous length of wire (such as a self-adhesive 80 mm wire) which may be laid or embedded in the CB card body. More in particular: The outer winding OW can be formed as a spiral having a number (such as 2-3) turns and having an inner end IE at a point "a" and an outer end OE at point "b". The outer winding OW is near (essentially in) the periphery (perimeter) of the CB card body. The internal end IE ("a") of the external winding OW is a free end.

The coupling coil CC can be formed as a spiral having a number (such as about 10) turns and having two ends "c" and "d". The "c" end may be an external end OE or an internal end IE, the end "d" may be an internal end IE or an external end OE.

The inner winding IE can be formed as a spiral having a number (such as 2-3) turns and has an inner end IE "e" and an outer end OE "f". The internal winding IW is near (essentially on) the periphery of the CB card body; inward OW external winding.

The outer winding OE ("f") of the inner winding IW is a free end. In Figure 3, the internal winding IW is shown with dotted lines, for reasons of clarity.

The internal end IE of the external winding OW is a "free end" since it is left unconnected. Similarly, the outer end OE of the internal winding IW is a "free end" that is left unconnected.

The external winding OW, the DC coupling coil and the internal winding IW can be formed as a continuous structure, with the use of conventional wire inlay techniques. It should be understood that references to the DC coupler as connected to the ends of the external winding (OW) and the internal winding (IW) should not be considered as implying that the DC linkage is a separate entity having ends. Rather, within the context of forming a continuous structure of the external winding OW; the DC coupling coil and the internal winding IW, the "ends" should be interpreted as mean positions corresponding to what would be the real ends, the term "connected with" should be interpreted as "contiguous to" in this context.

The dimensions of the CB card body can be approximately 54mm x 86mm. The external dimension of the outer winding OW of the reinforcement antenna BA can be approximately 80 x 50 mm. The wire for forming the reinforcement antenna BA can have a diameter (d) of about 100 mm (including, without limitation to 80) mGP, 112 mh ?, 125 m? h).

The internal winding IW can be arranged inside the external winding OW, as illustrated on a given surface of the CB card body (or a layer of the multi-layer inlay substrate). Alternatively, these two windings of the reinforcement antenna BA may be arranged on the opposite surfaces of the CB card body, in sequence aligned with each other (in which case, they may be "upper" or "lower" windings, rather than windings ". internal "and" external "). The two windings of the reinforcement antenna BA can be coupled in close proximity, so that the voltages induced in them have an opposite phase to each other. The DC coupler can be on the same surface of the card body CB as the internal and external windings.

The windings of the external winding OW and of the internal winding IW of the reinforcement antenna BA can have a shrinkage of 0.2 mm (200 mhh), resulting in a space of approximately one wire diameter between the adjacent turns of the external winding OW or the internal winding IW. The contraction of the turns of the DC coupling coil can be essentially the same or less than (in other words, not greater than) the contraction of turns of at least one of the external winding OW and of the internal winding IW, for example 0.15 mm (150 mhh), which results in a space smaller than a wire diameter between the adjacent turns of the coupling coil (CC). The self-adhesive copper wire can be used for the BBA reinforcement antenna. The contraction of both, the windings Internal / external IW / OW and the DC coupler coil can be approximately 2x (double) the diameter of the wire (or the width of the traces or conductive traces), resulting in a space between the adjacent turns of the spirals inside of the order of a wire diameter (or the width of the trace). The contractions of the external winding OW and of the internal winding IW can be essentially the same as each other or can be different from each other.

More turns of wire for the DC coupler can be adapted in a ain area, for example, by laying two "series" of wire, one on top of the other (with an insulating film between them, if necessary) in a trench of laser ablation that defines the area for the turns of the DC coupler.

A substrate or CB card body with the reinforcement antenna BA formed therein can be prepared by a first manufacturer and constitute an integrated product (which without the AM antenna module, can be referred to as "a data carrier component") . Then, a second manufacturer can mill (or otherwise form) a recess in the CBG card body, inside the DC coupler coil (see Figure 1) and install the AM antenna module (with its MA module antenna) ) in the recess. (Of course, the data carrier component can be provided by the first manufacturer, with the recess already formed).

More reference is now made to the drawings and descriptions in the following applications related to the DIF smart cards (double interface - contact and contactless), incorporated herein by reference in their entirety. 13 / 730,811 on 12/28/2012 or number of publication 2012/0074233 Figure 1A - CA card antenna in the CB card body, contact and non-contact readers.

Figure 1 B - CA card antenna in the CB card body, ferrite in the CB card body.

Figure 1 D - FE ferrite element in AM between the MA module antenna and the CP contact bearings.

Figures 3A, 4A - Brace antenna BA quasi-dipole, without DC coupling coil.

Figure 4I, J - Ferrite in CB card body Figure 6A - Adhesive MPS mobile phone with ferrite.

Figure 6B - Element 670 protective ferrite, adhesive on both sides.

Figure 8 - (13 / 730,81 1) CA card antenna mainly in the upper half of the CB card body. 13/600, 140, filed on 8/30/2012 Figure 2A - reinforcement antenna BA, without DC coupling coil.

Figure 3 - reinforcement antenna BA with DC coupling coil.

Figures 3A-3D - various configurations for the DC coupler.

Figure 4 - BA with DC, AM antenna module with module antenna MA.

Figure 5H - reinforcement antenna with extension.

Figure 51-K - two reinforcement antennas Figures 6A-C-BA arranged in the upper half of the CB card body.

Metallic Card Construction Some smart cards, including the double interface smart cards (DI), have a metal (or metallized) top layer or "face plate", essentially the size of the card body. Having a metal layer is technically inappropriate because it can greatly reduce the coupling between the card and the external reader without contact. However, the feature may be important for aesthetic reasons.

Figure 2 is a cross-sectional view, in diagram, simplified, generalized, which illustrates some exemplary layers of the "metal" (metallized) smart card. The layers are numbered only for the purpose of indicating a particular sequence. The layers can be reordered. Some layers can be omitted. Some layers can be applied to smart non-metal cards or smart cards. Some of the layers may comprise more than one layer. Some layers can be combined with other layers.

Layer 1 printed sheet, anti-scratch embedded, etc.

Layer 2 separate metal layer or metallized sheet.

Layer 3 BA booster antenna with DC coupler coil Layer 4 CB card body Layer 5 compensation frame (back side of the card body) in metallic or non-metallic.

Layer 6 printed sheet, anti-scratch embedded below, magnetic tape, etc.

A chip module (CM) is shown arranged in a window "W" (opening) extended inside the smart card, from the front surface (upper, as observed) from it through the foil (Layer 2) and inside the card body (Layer 4). The chip module (CM) has contact bearings (CP) on its front surface to interface with the external contact reader. The chip module can be a dual interface (AM) antenna module (DI) having a module antenna (MA) for interfacing, through the reinforcement antenna (BA) with the coupling coil (CC); with an external reader without contact. The antenna module (AM) can be adjusted within the internal area of the coupling coil (CC). Compare Figure 1.

Figure 2A shows an exemplary stack (layered sequence) for a metallized smart card 200, having the following layers, structures and components. The exemplary dimensions can be described. All dimensions are approximate. The thickness refers to the vertical dimension in the Figure.

An upper layer 202 may be a metal (or metallized) layer 202, such as 250 μm thick stainless steel, and may be referred to as a "faceplate". Compare "Layer 1." This upper layer 202 can be as large as the total smart card, such as approximately 50 mm x 80 mm.

A layer 203 of adhesive, such as 40 μm thick polyurethane.

A layer 204 of ferrite material, such as a 60 mhh thick sheet of soft (flexible) ferrite.

A layer 205 of adhesive, such as 40 μm thick polyurethane.

A layer 208 of plastic material, such as PVC 50-100 μm thick, which can function as a separator (separates the layers and the components below them).

A layer 210 of plastic material, such as 150-200 pm thick PVC, which can function as a card body (CB). Compare "Layer 4" The wire 212, such as a wire of 112 μm in diameter, which forms the reinforcing antenna (BA) with the coupling coil (CC). Compare Figure 1. Only a cross section of the wire is shown, for reasons of clarity.

A layer 214 of plastic material, such as PVC of 150 μm thickness, which may include a magnetic tape, printed, etc.

A layer 216 of plastic material, such as PVC 50 μm thick, which can function as an inlay.

The overall thickness of the smart card 200 (layers 202, 203, 204, 208, 210, 214, 216), can be approximately 810 pm (0.81 mm).

A window opening 220 ("W") may extend inside the smart card from the faceplate 202 through the layers intermediate, within the layer 210 of the card body. A double interface (AM) antenna module (AM) with the module antenna (MA) can be arranged in the window opening 220. Compare Figure 1. The window opening 220 can be fully extended through the layer 210, in which case, the antenna module (AM) will be supported by the underlying layer 214.

The coupler coil (CC) of the reinforcement antenna (BA) can surround the window opening 220 to be coupled close to the module antenna (MA) of the antenna module (AM). Compare Figure 1. Alternatively, the coupler coil (CC) can be arranged on the card body (CB) to be below the module antenna (MA) of the antenna module (AM).

The antenna module (AM) can measure approximately 12 x 13 mm (and approximately 0.6 mm thick). The window opening ("W") in the faceplate 202 may have approximately the same size as the antenna module (AM) - i.e., approximately 12 x 13 mm. In this "baseline" configuration, the chip activation distance may be approximately 15 mm. (The activation distance is similar to the reading distance and represents a maximum distance at which the chip module can be activated (for reading) by an external reader. As a general principle, "more is better", therefore, 15 mm is not very good, 20 mm or 25 mm will be better. The chip activation distance in the metallized smart card is limited by the attenuation of the magnetic field associated with the reinforcement antenna, which can be attributed to the metal faceplate 202 (Layer 1).

In accordance with a feature of the invention, the window opening 220 in the front plate 202 is made to be significantly larger than the antenna module (AM) in order to displace the protection and improve the coupling, which increases the distance of activation. For example, because an antenna module (AM) measures approximately 12 x 13 mm: the window opening 220 can be extended approximately 1 mm all around, so that there is a gap of 1 mm (GAP) around the antenna module (AM). This results in the window opening measuring 14 x 15 mm and having a 30% greater area (which is the area of the gap). The gap (1 mm) is approximately 10% of the transverse dimension of a non-enlarged window opening (12 x 13 mm). The resulting chip activation distance can be about 20 mm (an increase of 33% over the 15 mm baseline).

The window opening 220 can be extended approximately 2 mm all around, so that there is a gap of 1 mm (GAP) around the antenna module (AM). This results in a window opening that measures 16 x 17 mm and has a 75% larger area (which is the area of the gap). The gap (2 mm) is approximately 20% of the transverse dimension of the non-enlarged window opening (12 x 13 mm). The resulting chip activation distance can be about 22 mm (an increase of 50% over the 15 mm baseline).

The results of providing a gap and expanding the window opening are summarized in the following Table 1 (all numbers are approximations) More generally, the window opening 220 may be increased in size (as opposed to its nominal size approximately equal to that of the AM antenna module) by at least 10%, up to at least 100%, including values of approximately 30% and 75% in the previous examples.

The gap (GAP) between the antenna module (AM) and the inner edges of the window opening 220 can allow a better coupling between the coupling coil (CC) of the reinforcing antenna (BA) and the module antenna (MA). ) of the antenna module (AM). The improvements are presented in. the activation distance of up to 50%. Hollow sizes of 1 mm and 2 mm have been described, which represent the expansion of the window opening by 10% and 20%, respectively. More generally, the gap can be at least 5 mm, including at least 3 mm.

The ferrite layer 204 can also improve the coupling to reducing the attenuation of the coupling by the faceplate 202, which helps to concentrate the electro-magnetic field between the booster antenna BA and the MA module antenna of the AM antenna module. It may be convenient for the ferrite layer 204 to be as close as possible to the lower side of the faceplate 202. Better than having a separate ferrite layer 204 (and the adhesive layer 203), the ferrite particles or powder can be mixed with the adhesive and sprayed or coated on the underside of the front plate 202, which eliminates the layer 203 of intermediate adhesive. Alternatively, rather than being in the form of a separate layer 204, the ferrite material may be in ferrite particles (including nanoparticles) incorporated in an underlying layer, such as a spacer layer 208 or layer 210 of the card body ( in some configurations, the separating layer 208 may be omitted).

The spacer layer 208 can also improve the coupling by reducing the attenuation of the coupling by the faceplate 202, simply by keeping the faceplate 202 as far as practical (within the confines of the form factor for the smart cards) from the antenna Reinforcement 212 In addition to the features of the enlarged window ope 220 in the front plate 202, the ferrite 204 between the front plate and the lower layers / components, and the separating layer 208, several additional features can be incorporated to improve the coupling of the card. smart and / or the antenna module, such as without limitation to: For metal cards Pierce the faceplate, as described in more detail with respect to Figures 3A; B, C, which provides a compensation framework under the reinforcement antenna (BA). Compare Layer 5 (Figure 2 above) and Figures 4A; 4B (below).

For tarieta body layers Place ferrite at strategic locations on the card body (CB), as described in Figures 1 B, 4I, J of US 20120074233.

Set the booster antenna (BA) or card antenna (CA) as a quasi-dipole without a coupler coil (CC) and place the AM antenna module so that the MA module antenna overlaps only on the internal IW winding of the reinforcement antenna, as described in Figure 2C of document US 20120038445 and in Figures 3A, 4A of document US 20120074233, and in Figure 2A of 13/600, 140.

Configure the booster antenna (BA) as a quasi-dipole with a coupling coil (CC); as described in Figures 3, 3A-D, 4 of 13/600, 140. Compare Figures 1, 1 A (above).

Provide the reinforcement antenna (BA) with an "extension", as described in Figure 5H of 13 / 600,140.

Provide overlapping reinforcement (BA) antenna, as described in Figures 5I, J, K of 13/600, 140.

Provide the reinforcement antenna (BA) mainly in the upper portion of the smart card, which leaves a lower portion of "inlay" free, as described in Figures 6A, B, C of 13/600/140, Figure 8 of 13 / 730,811 and Figure 6D of 61 / 697,825.

Move the antenna module (MA) from the coupling coil (CC) so that they are not concentric, as described in Figures 7A; B, C of 61 / 737,746, filed on 12/15/2012.

Form and connect the windings of the reinforcement antenna (BA) and the coupling coil (CC) in a different way to that shown in Figure 1A (above), as described in Figures 8A-C of 61 / 737,746, presented on 12/15/2012.

For the antenna module (AM) Place a ferrite element between the module antenna (MA) and the contact bearings (CP) of the antenna module (AM), as described in Figures 1 D and 7C, D, E of US 20120074233.

Add capacitive trunnions to the module antenna (MA), as described in Figures 2A, GB of US 20120038445 and US 20120074233.

Cut and / or drill the contact bearings (CP) of the antenna module (AM), as described in Figures 2-5 of 61 / 693,262.

Form the module antenna (MA) as two separate coils, as described in Figure 6A of 61 / 693,262.

Connect two windings of a module antenna (MA) in a quasi-dipole configuration, as described in Figure 6B of 61 / 693,262.

With the use of various combinations of these characteristics, the baseline activation distance of 15 mm can be increased to approximately 28 mm or more, an improvement of approximately 100% and the corresponding improvements in communication reliability between the chip module (CM) and an external contactless reader. Within the scope of the invention are the features described above, and can be incorporated into a non-metallized smart card (without metal face plate) to significantly improve activation and reading distances.

Manufacturing A temporary product may comprise ferrite 204, adhered with adhesive 205 with underlying separating layer 208, and layer 210 of the card body with reinforcing antenna 212 embedded therein. This provisional product can be called as a pre-laminated or "pre-laminated" stack and can have a thickness of approximately 450 mmhh.

The pre-laminate can be delivered to a second manufacturer who will apply the faceplate 202, the lower PVC sheet 214 and the lower cover 216. The faceplate 202 may be pre-perforated (or otherwise shaped) with the aperture 220. The resulting stack may have a pre-laminated thickness pf of approximately 940 mm (0.94 mm) and after lamination (heat and pressure) have a final thickness of approximately 890 pm (0.89 mm).

In the lamination process, a plug of material is first inserted into the window opening 220 to prevent the underlying material (ferrite 204, PVC 208 separator, PVC 210 of card body, etc.) from expanding upwardly into the interior. the window opening 220 (and cause a resultant ndentation on the underside of the smart card). The material for the plug can be PVC or a metal "chip" that is removed from the front plate to form the opening or the like.

Typically, after rolling, the plug (when it is made of metal) is removed. When the cap is PVC; it can be left in its place. The recess for the antenna module can then be machined in layers (ferrite 204, PVC 208 separator, PVC 210 of the card body) of the smart card, carefully (of course) so as not to damage the coupling coil (CC).

Pierce the faceplate (202) The faceplate (202) which can be called "metallized layer" ("ML") can be perforated to improve the coupling and this is generally done before adding the faceplate to the stack for lamination, such as together with forming the window (220). In other words, to displace the protection caused by the metallized layer on the smart card, the metallized layer can be punctured, removing the material in locations such as around the window (220) which is approximately direct on the coupling coil (CC) and / or around the periphery of the metallized layer ML; which is approximately direct on the outer winding OW and the internal winding IW of the reinforcement antenna BA. Drilling the ML metallic layer; such as with slots and holes, in these locations, it can allow the electro-magnetic field to operate better, such as by facilitating the radiation of the magnetic flow lines. The design of the perforations can add certain aesthetic characteristics to the smart card, and can provide an optical (visible) security feature.

Figure 3A shows that a pattern of perforations (or openings) in the form of elongated slots 322 can be formed with laser engraving, around the periphery of the faceplate 302 (compare 202). The slits 322 can be aligned on (or below) the reinforcing antenna BA (Figure 1) to improve the coupling between the booster antenna BA and the non-contact external reader antenna (Figure 1).

Figure 3A that a pattern of perforations (or openings) in the form of holes 324 can be formed, such as with laser engraving around the periphery of the opening 320 (compare 220) on the front plate 302 (compare 202, also "Layer"). 2"). These perforations can be aligned on (or below) the DC coupler (Figure 1), to improve the coupling between the coupler coil (212) and the AM module antenna of the AM antenna module.

Figure 3B shows an alternative pattern of perforations (or openings) 322 and 324 in a metallized layer 302 (face plate). Here, the perforations 322 around the periphery of the front plate A are in the form of holes, and the perforations 324 around the window opening 320 are in the form of slits.

Figure 3C shows an alternative pattern of perforations (or openings) 324 in a metallized layer 302 (metallized). Here, the openings 324 are several arc segments of increased radius, distributed (centered) around the window opening 320.

The perforations (or openings) 322 and 324, whether slits or holes or other shapes may be arranged in an aesthetically pleasing pattern, and may also function as a security measure (anti-theft). The perforations (or openings) 322 and 324 in the faceplate 302 can be filled with a visually contrasting, preferably non-metallic, material such as artificial pearl mother (plastic).

The dimensions of the card body (CB) can be (approximately 50 mm x 80 mm).

Width 85.47 mm - 85.72 mm Height 53.92 mm - 54.03 mm Thickness 0.76 mm + 0.08 mm The front plate 302 (or ML metallic layer) can measure approx. 86 x 54 mm. The opening 320 or "W" in the front plate 302 can measure approximately 8 mm x 10 mm. (In the description of Figure 2A, other exemplary dimensions for the AM antenna module and the window opening 220 in the faceplate 202 are presented and calculated. The peripheral area of the CB card body (or metallic layer ML) may extend 5-10 mm from the edge of the CB card body (or metallized layer) - in other words, not completely at the periphery of the entire card body.

As shown in Figures 3A and 3B, there may be a plurality (such as 20-60 or more) openings 322 disposed around the peripheral area of the faceplate 302. The openings 322 may reduce the amount of metal material in the area peripheral by approximately 25% -50%, which allows a better coupling between the booster antenna BA and the external reader without contact.

Similarly, there may be a plurality (such as 10-30 or more) of openings 324 disposed around the window opening 320 in the faceplate 302. The openings B can reduce the amount of metal material in this area by approximately 25. % -50%, which allows a better coupling between the DC coupler and the MA module antenna of the AM antenna module.

Additional and alternative modifications in card body layers Compensation loop Figure 4A shows that a conductor "compensation loop" CL can be arranged (such as in Layer 5, Figure 2) behind the reinforcement antenna (BA) (Layer 3), extended around the periphery of the card body CB. The compensation loop CL may be an open loop having two free ends, and a gap ("gap") between them. The compensation loop CL can be made of copper cladding, it can be printed on the backing layer, etc.

Figure 4B shows that the compensation loop CL can comprise a ferrite material, in which case, because the ferrite is not an electrical conductor (unlike copper) the loop can be closed without hollow and without free ends.

The compensation loop can be called as "frame". The compensation frame on the reverse side of the reinforcement antenna BA (Figure 1) can help in the stabilization of the resonant frequency.

The compensation loop CL can be used in addition to the reinforcement antenna BA. The reinforcement antenna BA can be embedded on one side of the inlay substrate while the compensation frame can be inkjet printed or coupled with adhesive on the opposite side of the inlay substrate. The CL compensation loop can be mounted with the use of a subtraction process (engraving away from the material) or additive (depositing material).

Ferrite The ferrite layers can be laminated together, and in combination with a copper CL compensation loop on the reverse side of the reinforcement antenna BA, which can stabilize the resonant frequency of the reinforcement antenna BA. The trace can be broken (have a gap) in some positions.

The lamination and the temperature can be used to sinter the ferrite particles together to be in a continuous path. Laminating the ferrite particles under temperature and at very high pressure to produce a thin film of the card material such as PC PVC PETG to produce a ferrite inlay with the antenna. The inlay may consist of several layers of ferrite. The temperature and pressure applied can cause the particles to sinter and form an insulating layer of ferrite.

Depositing the ferrite nanoparticles or the ferrite powder on the inlay substrate to flex the magnetic flux lines and to compensate for the protective effect caused by metallization of the printed layers on a smart card body or on any metal layer in close proximity to an RFID antenna on the card body and forming a pre-laminated inlay with the antenna reinforcement or transponder with one or several underlying ferrite layers, which have been laminated together with the RFID components to form a composite inlay layer.

The ferrite or powder nanoparticles can be applied to a substrate layer by means of a dry or wet spray. In the case of wet spraying, the ferrite is suspended in a liquid phase dispersion which is prepared by ultrasound treatments on the particles in a solvent or in an aqueous liquid / surfactant (surfactant). The particles may also have a steric shell to support the suspension of the particles in the liquid. The average crystal particle size of the ferrite spheres can be determined by filtration and by the degree of sonication over time. (Sonication (ultrasound treatment) is the act of applying sound, usually ultrasound energy on the agitated particles in a sample).

The sintering of nano-size ferrite particles occurs during the hot rolling of the synthetic layers that form the scale. The rolling process includes heating and cooling under high pressure. Several layers of substrates or sheets coated with ferrite can be used to improve the ferromagnetic properties. Unlike ferrite mass granules, nanoparticles have a lower sintering temperature, which equals the glass transition temperature of the synthetic substrate. Additional heat treatment may be required after lamination.

Additional features incorporated into the card body As mentioned above, several additional features can be incorporated in various combinations within the body of a smart card (either a metallic or non-metallic variety (typical) to improve the electro-magnetic coupling of the module antenna, through the reinforcement antenna, with an external contactless reader, which increases the activation and reading distances to an "acceptable" level.These improvements can serve to displace the negative effects created by other components of the smart card, such as the faceplate (202, 302) of metal, as described above, or contact bearings (CP) of metal in the antenna module (AM), which can also be modified to improve the coupling described later in detail. related to the card may include: Place ferrite at strategic locations on the card body (CB), as described in Figures 1 B, 4I, J of US 20120074233; and various configurations for the reinforcement antenna (BA), variations that have been mentioned previously.

Laser engraving and modifications to the antenna module It should be mentioned, albeit briefly, the use of a laser engraving instead of the chemical etching to remove material, such as metal from the layers, such as in forming the MA module antenna of the module.

AM antenna. A more complete description of this process can be found at 61 / 589,434, filed on 1/23/2012; 61 / 619,951, filed on 4/4/2012 and 61 / 693,262, filed on 8/25/2012.

Chemically etched antennas with 10 to 12 turns within the confinement dimensions of an ISO standard chip card module are described in Patent Application No. US 2010/0176205. Such an antenna module with a contactless contact interface is implanted in the card body for inductive coupling with a booster antenna to communicate with a reader in a non-contact mode.

Due to the restrictions in the size of the smart card module (for example, 13 mm x 11.8 mm), the number of turns forming the antenna is limited to the space surrounding the central position of the silicon matrix, which is coupled and attached to the substrate of the module. This substrate is usually made of epoxy glass with a contact metallization layer on the facing side facing upwards and a bonding metallization layer on the face facing downwards of the module. The chemically etched antenna is usually formed on the side facing down.

Another limitation when creating an inductive antenna through chemical etching is the minimal contraction (or separation) between the rails, which can be achieved with the use of a lithographic process. The optimum contraction (or separation) between the (adjacent) rails of an antenna recorded on a 35 mm super tape is approximately 100 mhh. (As used herein, the term "contraction" refers to the separation between the adjacent conductor lanes, better than its conventional meaning, which is the center-to-center dimension between the center lines of the lanes or the number of lanes per unit of length).

An antenna structure, such as a module antenna can be formed by the laser engraving of a copper-coated laminate, which forms an integral part of the chip module of the RFID smart card. The use of laser engraving can solve the limiting factor of contraction, which can be achieved with conventional chemical etching, with the result that the number of turns that make up the antenna can be greatly reduced, with benefits in its performance. The use of laser engraving against chemical etching can also result in a significant reduction in the space of the laser engraved antenna that has essentially the same electrical characteristics as a chemically etched antenna, which requires a larger area and allows easy placement and Adhesion of the module with antenna chip in a recess provided in the card body, with the use of standard adhesive tapes.

The material to be laser engraved can comprise a standard pre-processed laminate (110 pm) formed of epoxy glass and cured halogen free of epoxy resin with both sides coated with a copper foil (17 pm + 17 pm) can be used to produce double-contact and non-contact smart card modules in rows and columns on a 35mm super carrier tape. The carrier tape can be provided with cogwheels and indicator holes for the transport and drilling of holes of the vertical interconnections for the electrical connection with the upper and lower metallization layers, which can be implemented before laser processing.

The structure of the antenna at each module site is laser engraved (insulation technique) inside the copper-coated "seed" layer (face facing down from the pre-impregnated) that has a thickness of 17 pm, with the use of a UV or nanosecond Green or picosecond laser with a distance between the rails dimensionally equal to the width of the laser beam, approximately 25 pm On the side facing up, the contact areas can also be laser engraved to prepare them for the ironing without electricity of the copper and the electro-ironing of nickel and gold After the laser engraving of the copper seed coat, the tape with the antenna sites on the side facing down is also processed, by sand blasting to remove the residual laser ablation particles and to prepare the plate adhesion, deposit charcoal to support the plate of through holes. vertical interconnections, dry application of film or photo-masking process, copper-free deposition (Cu ~ 6pm) to increase the thickness of the rails on both sides of the tape, electro-ironing with nickel and phosphorus of nickel (Ni / Nip ~ 9mhti) or nickel (Ni ~ 9 mm) and palladium / gold or gold (Pd / Au or All - 0.1 mGh / 0.03 miti or 0.2 mhi) to avoid oxidation.ere With the use of a standard pre-impregnated laminate with a copper seed coat on both sides, it is possible to laser engrave the contact bearings on the facing side upwards and an antenna structure on the side facing down, before the tape is electro-ironed with copper and electro-ironed with nickel and gold. The advantages The main ones of this technique are the reduction in the size of characteristic contraction (separation) between the rails and the consequent increase in the allowable number of turns inside the confinement area of the chip module of the standard smart card.

Modify the contact bearings (CP) Document 61 / 693,262, filed on 8/25/2012 describes various forms (referred to in Figures 2A-D, 3A-B, 4A-D, 5A-B thf) to modify the contact bearings (CP) of a double interface (AM) antenna module (DI) to remove the attenuation of the electromagnetic coupling that can be caused by metal contact bearings (CP). In an example shown h(Figure 3A), at least some of the contact bearings (CP) may be perforated, such as with holes or slits to reduce what is called as "coverage" of the DC coupler coil, to achieve a positive effect (increase) in the reading distance. The boreholes in the contact bearings (CP) serve a similar purpose as the openings 324 in the faceplate 302. Both features can be implemented (punched contact bearings, perforated faceplate).

As used hn, the term "coverage area" (or "coverage") refers to the amount that the contact bearings (CP), which are located on an opposite side of the module tape from the module antenna ( MA), they overlap on the module antenna (MA), the coverage area can be between 0% (without overlap, such as when the MA is completely outside the perimeter of the CP), and almost 100% (a essentially full overlap, such as when the MA module is completely located within the perimeter of the contact bearings (CP), but the gaps between the bearings reduce to a little less than 100%). Related to this, the term "exposure to the coil" refers to the amount to which the antenna of the module (A) that is located within the area of the contact bearings (CP) is exposed, such as through the gaps between the contact bearings. The coil exposure can be between almost 0% (the only exposure is through the gaps between the bearings), at 100% (such as when the MA module antenna is completely located outside the perimeter of the bearings Contact).

Figure 5 (comparable with Figure 1A of 61 / 693,262) illustrates a typical scheme for contact bearings (CP) on the face up face of the module tape (MT). The contact bearings (CP) may comprise a layer of conductive material, such as copper (typically with other conductive layers for protection) that are etched, either chemically or with a laser (ablation) to exhibit the desired pattern of bearings. . The overall dimensions of the antenna module (AM) can be approximately 15 mm x 15 mm. The overall dimensions of the card body (CB) can be approximately 50 mm x 80 mm. The general dimensions and the pattern of the contact bearings (CP) can be specified by ISO 7816. For example, the contact bearings (CP) of the pattern can occupy an area measuring approximately 10 mm by 13 mm on the face facing towards above the module tape (MT) and can have a thickness of approximately 30 mm. Figure 5 shows seven contact bearings (CP); exposed through an opening in the module tape (MT).

In Figure 5, the module antenna (MA) arranged on an opposite side of the tape of the MT module from the contact bearings (CP) is shown with dotted lines. In this example, the coverage area is "Essentially 100% (the MA module antenna is completely covered by the contact bearings (CP), except for the small gaps between the bearings), and the coil exposure is essentially 0% (only a minimum exposure of coil in the small gaps between the adjacent bearings). Therefore, the CP contact bearings can protect (attenuate) the signals between the booster antenna BA (or CA card antenna) and the module antenna (MA) on the antenna module (AM).

US 8, 100,337 (2012, SPS) discloses an electronic module (11) with the double communication interface, in particular, for a chip card, the module comprises, first of all, a substrate (27) provided with a block (17) electrical contact terminal that allows operation by contact with the contacts of the reader, and secondly, comprises an antenna comprising at least one turn (13) and whose terminals are connected to the terminals of a microelectronic chip located on one side of the module (11). This module (11) is characterized in that the turns (13) of the antenna are located essentially outside the area covered by the electrical contacts (17), so that the electrical contacts of the terminal block do not constitute the electro-magnetic protection for the signals proposals for the antenna.

This applies in particular to the production of chip cards with double communication interface with the contact and without contact.

Claim 1. An electronic module with double communication interface, for a chip card, the module comprises: a substrate including an electrical contact terminal block that allows operation by contact with the contacts of a reader; Y an antenna that includes at least one turn on a surface of the electronic module and whose terminals are connected to the terminals of a micro-electronic chip located on one face of the module; wherein at least one turn of the antenna is located on a first area of the surface of the electronic module essentially outside a second area covered by the electrical contacts, the module has a plurality of protuberances located outside the area of the electrical contacts of the terminal block, on one side of the substrate opposite to what the antenna turns.

As can be seen, the document US 8, 100,337 and with the use of a language more consistent with the present and co-pending requests of the applicant, when the antenna module (AM) is in communication in a non-contact mode with the reader Externally, contact bearings (CP) can cause the "protection" (or attenuation) of the signal, which limits the reading distance. Although it has a limited reading distance, such as a few centimeters, for security reasons it may be desirable that such protection may limit the reading distance to a small amount, such as 3 cm. With more advantage, a reading distance of 5 cm may be convenient, which provides appropriate security and improved communication between the external reader and the antenna module (AM), which includes a smart card (SC) incorporating the module of antenna (AM).

US 6,778,384 (2002, Toppan) shows examples of antenna modules having a module antenna (8) and contact bearings (7), wherein: the coverage area is essentially 100%; The coil exposure is essentially 0%.

US 8, 100,337 (2012, THICKNESS) shows examples of antenna modules having a module antenna (13) and contact bearings (17), wherein: the coverage area is essentially 0%; The exposure of the coil is essentially 100%.

US 8,100,337 discloses that problems may arise when the antenna is completely outside the contact area, and the following solution is proposed: Because the turns 13 of the antenna are located outside the area of the contacts 17, there is no direct pressure action in the area located on the turns 13 of the antenna and consequently, there is the potential risk of bending of the substrate 27 or at least one joint of improved quality between the turns 13 and the adhesive 31, which can alter the reliability of the bond and the longevity of the card. To remedy this risk, the invention provides in a more advantageous variant, a plurality of protrusions 33 located on the same side as the electrical contacts 17 but in the area protruding the turns 13 of the antenna (column 5, lines 7-18).

Solution to the protection problem The techniques described in each of the following modalities (examples) can be mixed with others, as appropriate, to conclude an effective solution. The overall goal is to increase the reading distance, which may (or may not) result from decreasing the "coverage area" and increasing the "exposure of the coil".

Figure 6 (comparable with Figure 2A of 61 / 693,262) illustrates a set of contact bearings CP, wherein the outer edges of at least some of the CP contact bearings are extended beyond their original perimeter (outer edges) , shown in dotted lines). The coil coverage in this example can be characterized as having increased, such as from an initial 100% to more than 100%, such as 110%. The coil exposure in this example remains essentially at 0%. It is believed that extending the edges can have an adverse effect on the reading distance (reduced).

Extending the edges to increase the area of the individual bearing can be useful when the bearings are used as interconnections for the elements, such as the antenna of the MA module on the underside of the tape of the MT module, the capacitive elements and the like.

Consider, for example, the following bearing pattern of contact shown in Figure 5A. It should be noted that contacts C4 and C8 can be connected with two ends (LA, LB) of the antenna of the MA module.

Figure 6B (comparable with Figure 2B of 61 / 693,262) illustrates a set of CP contact bearings, wherein the outer edges of at least some of the CP contact bearings are cut to be within their original perimeter (edges external, shown in dotted lines). The coil coverage in this example is decreased, such as from an initial 100% to a 90%. The exposure of the coil in this example is increased, such as initially from essentially 0% to 5%. It is believed that cutting the edges may have a slight positive effect (increase) on the reading distance.

Figure 6C (comparable with Figure 2C of 61 / 693,262) illustrates a set of contact bearings CP where the internal edges of at least some adjacent of the contact bearings CP are cut, in order to obtain the effect of increasing the gap between the selected contact bearings. The coil coverage in this example is decreased, such as from an initial 100% to 90%. The coil exposure in this example is increased, such as initially from essentially 0% to 5%. It is believed that increasing the gap can have a positive effect (increase) on reading distance. * original hole = ~ 150 mm * modified hollow = ~ 300 pm.

Figure 6D (comparable with Figure 2D of 61 / 693,262) illustrates an alternative of Figure 6C, where better than increasing the gap complete between the adjacent contact bearings, their internal edges are modified in an irregular manner. The coil coverage in this example is decreased, such as from an initial 100% to 95%. The coil exposure in this example is increased, such as from initially 0% to 3%. It is believed that increasing the gap may have a slight positive effect (increase) on the reading distance.

In the preceding examples set forth in Figures 6A, B, C, D above, some of the outer or inner edges of some of the contact bearings move from their "original position". Compare Figure 5 as an example of the "original position".

In the following examples, the edges of the contact bearings generally remain intact, in their original position, which essentially maintains the central design.

Figure 7A, (comparable with Figure 3A of 61 / 693,262) shows an example of drilling, such as with holes or slits, at least some of the contact bearings. The coil coverage in this example is decreased, such as from an initial 100% to 90%. The exposure of the coil in this example is increased, such as from an initial 0% to 5%. It is believed that drilling contact bearings can have a positive effect (increase) on the reading distance.

In Figure 7A; a regular arrangement of a plurality of circular perforations (or holes) arranged in a row and column configuration in one of the contact bearings is shown. The perforations may be irregularly arranged, stacked, almost random, and the like. Circular perforations may have an exemplary diameter of 35 mm, and can be arranged at an exemplary contraction of 70 miti or 140 mhti, or 40 mhh (rows displaced from holes of 35 mhh). Some of the perforations can be slits or elongated holes, as shown in other contact bearings. The holes have other shapes, such as rectangular, irregular, elongated, etc., and can be formed in some of the contact bearings.

Figure 7B (comparable with Figure 3B of 61 / 692,262) shows an example of thinned selected areas of at least some of the contact bearings. The coil coverage in this example is "effectively" decreased, such as from an initial 100% to 90%. The coil exposure in this example increases "effectively", such as from essentially 0% to 2". It is believed that the thinning of the contact bearings can have a positive effect (increase) on the reading distance.

In Figure 7B, the antenna of the MA module is shown as being recorded, with conductive lines (rails) better than an antenna of the rolled wire MA module, shown in Figure 1.

Figure 8A (comparable with Figure 4A of 61 / 693,262) shows an AM module antenna and a CM chip disposed on the underside of an MT module ribbon. In this example, the module AM antenna is a coiled wire coil, having two ends a, b joined together with their respective BP coupling bearings.

Figure 8B (comparable to Figure 4B of 61 / 693,262) shows the upward facing side of the module tape MT shown in the FIG.

Figure 8A. Here, the pattern of holes or holes is formed in the contact bearings CP (compare Figure 3A). The perforation pattern is arranged in concentric circles. This pattern will be visible to the user (of the SC smart card). The coil coverage in this example is "effectively" decreased such as from an initial 100% to 95%. The coil exposure in this example increases "effectively" such as from essentially 0% to 2%. It is believed that drilling the contact bearings in this way can have a positive effect (increase) on the reading distance.

Figure 9A (comparable with Figure 5A of 61/693, 262) shows another example of drilling the contact bearings CP. In this example, the perforations are visible, and are arranged in the pattern of a logo, such as the Chase Bank logo.

Figure 9B (comparable with Figure 5B of 61 / 693,262) shows another example of drilling the contact bearings CP. In this example, the perforations are visible, and are arranged in the pattern of a logo, such as the Deutsche Bank logo.

The patterns of perforations in the contact bearings may be visible to the user and in metallized cards may be formed to be similar or complementary (such as smaller versions or continuations of, their like) of the perforations 324 surrounding the opening 320 of window on the front plate 302.

In the examples described here, the contact bearings CP of an AM antenna module have been modified with the aim of increasing the reading distance (by reducing the attenuation in the coupling between the antenna of the MA module and the reinforcement antenna BA, which can be attributed to the contact bearings CP). In some cases, the coil coverage (or effective coil coverage) is decreased, and the coil exposure (or effective coil exposure) is increased. In some examples, the contact bearings, including the inner and outer edges thereof, maintain their original position. In some examples, the central design of the contact bearings is maintained. The larger gaps between the contact bearings and the perforations in the CP contact bearings result in a greater coil exposure, which improves the reading distance.

Other aspects of the AM antenna module Figure 10A (comparable with Figure 6A of 61 / 693,262) illustrates the lower side of a module tape MT for an AM antenna module. An AS antenna structure for a module AM antenna is shown, which comprises two module antenna segments MA1 and MA2. Two module antenna segments MA1 and MA2 are shown. These two module antenna segments MA1, MA2 can be arranged concentrically with each other, as internal and external antenna structures. Both antenna segments of module MA1, MA2 can be coiled coils, or rails with pattern, or can be a coil wound and the other of the pattern of rails. The two module antenna segments MA1, MA2 can be interconnected with each other in any appropriate manner to achieve an effective result. For example, the two module antenna segments MA1, MA2 can be connected in any form appropriate to each other.

Figure 10B (comparable with Figure 5A of 61 / 693,262) illustrates an exemplary antenna structure AS that can be used with the antenna module AM, which has two segments (compare MA1, MA2) that are interconnected with each other's structure. antenna comprises: An external segment OS having an external end 7 and an internal end 8.

An internal segment IS having an external end 9 and an internal end 10.

An external end 7 of the external segment OS is connected to the internal end 10 of the internal segment IS.

An internal end 8 of the external segment OS and the external end 9 of the internal segment IS are left unconnected.

This forms what can be referred to as a "quasi-dipole" AS antenna structure. Compare Figure 1A.

Such a configuration is shown at 13 / 205,600, filed on 8/8/2011 (Pub. 2012/0038445, 2/16/2012) to be used as a booster antenna BA on the CB card body of an SC smart card.

Such a configuration is shown at 13 / 310,718 filed on 12/3/2011 (Pub. 2012/0074233, 3/29/2012) to be used as a booster antenna BA on the CB card body of a smart card SC.

The CP contact bearings and the AS antenna structures described herein can be formed with the use of laser engraving (insulation technique) of copper-coated "seed" layers on an MT module belt with the use of a nanosecond laser or PS. A Seed layer can have a thickness of approximately 17 mhi. For antenna structures AS; the space between the rails can be dimensionally equal to the width of the laser beam, approximately 30 mhi, the rails themselves can have a width of 30-50pm. The perforations, such as those described above, can be formed by laser percussion drilling.

After the laser engraving of the copper seed layer for the pattern and / or for boring the CP contact bearings or the AS antenna structure, the tape of the MT module can also be processed as follows: Polishing with sand to remove the residual ablation particles and to prepare for the adhesion of the ironing.

Deposit carbon to support the through hole planking of the vertical interconnections.

Application of dry film and photo-masking process.

Electro-deposit copper (Cu - 6 pm) to increase the thickness of the patterned seed coat (for CP or AS) on both sides of the belt.

Ironing without nickel and nickel phosphorus electricity (Ni / Nip ~ 9 mGh) and palladium / gold (Pd / Au -0-1 mGh / 0.03 m or 0.2 mhi) to avoid oxidation.

Although the invention has been described with respect to a limited number of embodiments, they should not be considered as limiting the scope of the invention, but rather, they are examples of the embodiments. Those skilled in the art will be able to contemplate other variations, modifications, and possible implementations that are also within the scope of the invention, based on the description.

Claims

1. A smart card having a front plate (202, 302) metallized with a window opening (220, 320) for accepting an antenna module (AM), and a card body (CB) with a reinforcement antenna (BA) which includes a coupling coil (CC), wherein the window opening has a baseline size approximately equal to the size of the antenna module, characterized in that: the window opening is essentially larger than the antenna module.

2. The smart card according to claim 1, wherein: The window opening is at least 10% larger than the antenna module.

3. The smart card according to claim 1, which also comprises: a gap (GAP) between the inner edges of the window opening and the antenna module.

4. The smart card according to claim 1, which also comprises: a ferrite layer (204) disposed between the front plate and the reinforcement antenna.

5. The smart card according to claim 1, which also comprises: a plurality of perforations (322, 324) in the front plate (320) extended around at least one window opening (320) and the periphery of the faceplate.

6. The smart card according to claim 5, wherein: at least some of the perforations reduce the amount of the faceplate material in an area surrounding the window opening or around the periphery of the faceplate by 25-50%.

7. The smart card according to claim 1, which also comprises: a compensation loop (CL) disposed behind the reinforcement antenna (BA).

8. The smart card according to claim 7, wherein the compensation loop (CL) has at least one of the following characteristics: the compensation loop (CL) has a gap and two free ends; the compensation loop (CL) comprises a conductive material, such as copper; Y the compensation loop (CL) comprises ferrite.

9. The smart card according to claim 1, which also comprises one of the following characteristics: a reinforcement antenna (BA) is configured as a quasi-dipole without the coupling coil (CC); a reinforcement antenna (BA) is configured as a quasi-dipole with a coupling coil (CC); a reinforcing antenna (BA) is provided with an extension; a reinforcing antenna (BA) comprises two overlapping reinforcement antenna; a reinforcing antenna (BA) is provided primarily on an upper portion of the smart card; Y A module antenna (MA) is displaced from the coupling coil.

10. The smart card according to claim 1, which also comprises at least one of the following characteristics; a ferrite element (FE) disposed between the module antenna (MA) and the contact bearings (CP) of the antenna module (AM); capacitive stumps added to the module antenna (MA); the module antenna (MA) comprises two separate coils; the module antenna (MA) comprises two windings connected in a quasi-dipole configuration.

11. The smart card according to claim 1, which also comprises: holes in the contact bearings (CP) of the antenna module (MA).

12. A method for minimizing the attenuation of the coupling by the faceplate (202, 302) of a metallized smart card having a booster antenna (BA) with a coupler coil (CC) on its card body (CB), which comprises one or more of: forming a window opening (220) in the front plate larger than the antenna module (AM); provide perforations through the faceplate; provide ferrite material between the front plate and the reinforcement antenna (BA); Y Place a compensation loop (CL) under the reinforcement antenna (BA).

13. The method according to claim 12, which also comprises: move the antenna module (AM) with respect to the coupling coil (CC).

14. The method according to claim 12, further comprising one or more of: arranging the reinforcement antenna (BA) as a quasi-dipole; provide the module antenna (MA) with capacitive trunnions; and providing ferrite in the antenna module (AM) between the module antenna (MA) and the contact bearings (CP).

15. The smart card according to claim 12, which also comprises: Cutting or drilling contact bearings (CP) of the antenna module (A.M).