CN107979714A - Camera module and its manufacture method and electronic equipment - Google Patents
Camera module and its manufacture method and electronic equipment Download PDFInfo
- Publication number
- CN107979714A CN107979714A CN201610939282.0A CN201610939282A CN107979714A CN 107979714 A CN107979714 A CN 107979714A CN 201610939282 A CN201610939282 A CN 201610939282A CN 107979714 A CN107979714 A CN 107979714A
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- Prior art keywords
- plate
- camera module
- base
- rigid plate
- acf
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The present invention provides a camera module and its manufacture method and electronic equipment, including：An at least optical lens, an at least photo-sensitive cell, an and at least circuit board substrate, each optical lens is arranged at the photosensitive path of each photo-sensitive cell, each photo-sensitive cell is mounted on the circuit board substrate, wherein described circuit board substrate includes at least one rigid plate and an at least soft board, and the hardness plate and the soft board form an at least ACF connecting portions by an at least ACF gemel connections and at the position of connection.The camera module and its manufacture method and electronic equipment can reduce integral thickness, and improve flatness.
Description
Technical field
The present invention relates to optical imaging field, more particularly to the camera module based on ACF techniques and its manufacture method with
And electronic equipment.
Background technology
With the high pixel of mobile phone camera module, double development taken the photograph with the performance such as large aperture, flatness to camera module and
Appearance and size requirement is higher and higher, while in order to adapt to the development of ultra thin handset, camera module is to highly also being constrained.
In the manufacturing process of camera module, the size of the wiring board of camera module contains hardboard and soft board, traditional ACF techniques be by
Hardboard and soft board press together.The full name of ACF is Anisotropic Conductive Film, i.e. anisotropy conductiving glue
Film, its feature is only conductive in z-direction, and X and Y-direction are non-conductive, and ACF glue mainly includes conducting particles and insulating cement
Material part（Predominantly thermoplastic resin）, in addition also layer protecting film prevents to contact with the external world to protect.At present using tradition
ACF techniques formed traditional camera module 100P primary structure have it is following two：
The traditional camera module 100P of as shown in Figure 1 one, uses traditional reverse side ACF schemes.It is that is, described
The soft board 42P of the wiring board 40P of camera module 100P is contacted with monoblock hardboard 41P.What this traditional reverse side ACF schemes were formed
The total height of the camera module 100P is often higher by a part than customer demand, and the camera module 100P is arranged on mobile phone
When, to the height-limited larger of handset structure, flatness can not control well.If use elder generation COB（chip on
board）The technological process of ACF is carried out after technique again, the photosensory assembly attachment glue needs just hold using high-temp glue
Temperature in by traditional ACF techniques, but high-temp glue can cause plastic part to deform since hot environment itself expands.
Another traditional camera module 100P is illustrated in figure 2, uses front surface A CF schemes, that is to say, that in this side
In case, the soft board 42P of the camera module 100P is contacted with part hardboard 41P, and ACF pads（Not shown in Fig. 2）Dew completely
Region 412P is lengthened in hardboard, such scheme causes the base 30P's of camera module 100P described in the size ratio of hardboard 41P
Size will be grown, so as to cause the camera module 100P to be formed when being arranged on mobile phone, handset structure is without empty enough
Between.
The content of the invention
It is an object of the invention to provide a camera module and its manufacture method and electronic equipment, and tradition ACF techniques
The camera module of formation is compared, and can reduce integral thickness, and improve flatness.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, institute can be reduced
State the stain fraction defective in camera module assembling process.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, in the shooting
In the forming process of module, the versatility of each element of the camera module is enhanced.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, the shooting mould
The rigid plate of at least the one of an at least circuit board substrate for group and an at least soft board are by an at least ACF gemel connections and in connection
Position forms an at least ACF connecting portions, and the ACF connecting portions are partly or entirely embedded in the camera module, the shooting
The integral thickness of module is lowered.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, the wiring board
The rigid plate of substrate also has at least one rigid plate groove, and the ACF connecting portions are arranged in the rigid plate groove,
The ACF connecting portions are non-bulging in the rigid plate, reduce the thickness of the flex plate, improve flatness.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, the ACF connects
Socket part is arranged in the rigid plate groove, and the circuit board substrate of the camera module can be set versatile
Various bases.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, the shooting mould
Group further comprises an at least base, and the base is arranged on the circuit board substrate, and the base has an at least bottom
Seat groove, the base groove accommodate the ACF connecting portions, and the ACF connecting portions do not protrude the base, so that described take the photograph
As the external dimensions of module is not affected.
Another object of the present invention is to provide a camera module and its manufacture method and electronic equipment, in the shooting
In the packaging technology of module, the lower embedded ACF connecting portions are formed using first ACF techniques, carry out COB techniques again afterwards, can
Reduce stain fraction defective.
In order to realize above-mentioned at least one purpose, the present invention provides a camera module, including：
An at least optical lens,
An at least photo-sensitive cell, each optical lens are arranged at the photosensitive path of each photo-sensitive cell,
And
An at least circuit board substrate, each photo-sensitive cell are mounted on the circuit board substrate,
Wherein described circuit board substrate includes at least one rigid plate and an at least soft board, the rigid plate and described soft
Plate forms an at least ACF connecting portions by an at least ACF gemel connections and at the position of connection.
In certain embodiments, the rigid plate of the circuit board substrate also has at least one rigid plate groove, described
ACF connecting portions are arranged in the rigid plate groove.
In certain embodiments, the rigid plate groove is arranged at the tip position of the rigid plate, the ACF connections
The non-bulging at least top surface in the rigid plate of an at least top surface in portion.
In certain embodiments, the rigid plate further includes at least one rigid plate linkage section and at least one rigid plate main body
Section, the hardness plate linkage section extend the rigid plate main paragraph, and at least one side of the hardness plate main paragraph is from described
An at least top surface for rigid plate main paragraph extends to an at least top surface for the rigid plate linkage section, the hardness with bending downward
The rigid plate that the top surface of the side of plate main paragraph and the rigid plate linkage section forms the rigid plate is recessed
Groove, to accommodate the ACF connecting portions.
In certain embodiments, the rigid plate groove is arranged at the bottom of the rigid plate, the ACF connecting portions
An at least bottom surface is non-bulging in an at least bottom surface for the rigid plate.
In certain embodiments, the rigid plate further includes at least one rigid plate linkage section and at least one rigid plate main body
Section, the hardness plate linkage section extend the rigid plate main paragraph, and at least one side of the hardness plate main paragraph is from described
An at least bottom surface for rigid plate main paragraph extends to an at least bottom surface for the rigid plate linkage section, the hardness with being folded upward at
The rigid plate that the side of plate main paragraph and the bottom surface of the rigid plate linkage section form the rigid plate is recessed
Groove, to accommodate the ACF connecting portions.
In certain embodiments, the camera module further comprises an at least base, and the base is arranged at described
On circuit board substrate, the base has an at least base groove, and the base groove accommodates the ACF connecting portions.
In certain embodiments, the base groove is formed on the bottom of the base, and the ACF connecting portions are housed inside institute
State base groove.
In certain embodiments, the base body includes an at least base linkage section and an at least base body section,
The base linkage section extends the base body section, and at least one side of the base body section is from the base body section
The bending of an at least bottom surface extend at least bottom surface of the base linkage section, the side of the base linkage section and institute
The side for stating base body section forms the base groove, to accommodate the ACF connecting portions.
In certain embodiments, the ACF connecting portions are bonded at least base groove wall to form the base groove.
In certain embodiments, between an at least base groove wall for the ACF connecting portions and the formation base groove
There are gap or the ACF connecting portions to be completely filled between the base groove wall of the formation base groove.
In certain embodiments, the rigid plate has one group of hardness plate connector, and the flex plate has one group of flexibility
Each rigid plate connector of the rigid plate, is connected to and the flexibility by plate connector by the ACF glue
Each flex plate connector of plate, so that the hardness plate and the flex plate are connected to form the ACF connecting portions.
In certain embodiments, each rigid plate connector of the rigid plate and the flex plate is each described
Flex plate connector is pad.
In certain embodiments, the flex plate further includes a flex plate linkage section and a flex plate main paragraph, described
Flex plate linkage section extends the flex plate main paragraph, and the flex plate connector is arranged at the flex plate linkage section,
The hardness plate connector is arranged at the rigid plate linkage section.
In certain embodiments, the ACF connecting portions are contained in the rigid plate groove by some or all of.
In certain embodiments, the ACF connecting portions are contained in the base groove by some or all of.
According to another aspect of the present invention, an electronic equipment, including an at least camera module and at least one are additionally provided
Apparatus body, wherein each camera module be used to obtain image and be arranged at the apparatus body.
In certain embodiments, the electronic equipment, which is selected from mobile phone, computer, television set, intelligence, can screw on equipment, traffic work
Tool, camera and monitoring device.
According to another aspect of the present invention, the production method for additionally providing a camera module with ACF connecting portions, it is described
Production method comprises the following steps：
Form at least one rigid plate groove of at least one rigid plate of an at least circuit board substrate for the camera module；With
And
Rigid plate and an at least flex plate described in an offer at least ACF gemel connections, the hardness plate and the flex plate
Connecting portion forms an at least ACF connecting portions and the ACF connecting portions are contained in the rigid plate groove by some or all of.
In certain embodiments, the production method of the camera module with ACF connecting portions, further includes following step
Suddenly：The rigid plate groove is formed at least one top of the rigid plate.
In certain embodiments, the production method of the camera module with ACF connecting portions, further includes following step
Suddenly：The rigid plate groove is formed in an at least bottom for the rigid plate.
According to another aspect of the present invention, the production method for additionally providing a camera module with ACF connecting portions, it is described
Production method comprises the following steps：
Form an at least base groove for an at least base for the camera module；And
At least one rigid plate and at least of an at least circuit board substrate for camera module at least described in an ACF gemel connections is provided
The connecting portion of one flex plate, the hardness plate and the flex plate forms an at least ACF connecting portions and the ACF connecting portions quilt
It is some or all of to be contained in the base groove.
In certain embodiments, the production method of the camera module with ACF connecting portions, further includes following step
Suddenly：The base groove is formed in an at least bottom for the base.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the camera module formed based on traditional ACF techniques.
Fig. 2 is the schematic perspective view of another camera module formed based on traditional ACF techniques.
Fig. 3 is the schematic perspective view of a base of the camera module formed based on traditional ACF techniques
Fig. 4 is the schematic diagram of a camera module according to a preferred embodiment of the present invention.
Fig. 5 is the schematic perspective view of the camera module of above preferred embodiment according to the present invention.
Fig. 6 is the schematic perspective view of a base of the camera module of above preferred embodiment according to the present invention.
Fig. 7 is the three-dimensional signal of a camera module of a variant embodiment of above preferred embodiment according to the present invention
Figure.
Fig. 8 is the three-dimensional signal of the camera module of above-mentioned variant embodiment according to a preferred embodiment of the invention
Figure.
Fig. 9 is the schematic perspective view of a camera module of another variant embodiment according to a preferred embodiment of the invention.
Figure 10 is the three-dimensional signal of the camera module of another variant embodiment according to a preferred embodiment of the invention
Figure.
Figure 11 is the schematic perspective view of a camera module of another variant embodiment according to a preferred embodiment of the invention.
Figure 12 is the three-dimensional signal of the camera module of another variant embodiment according to a preferred embodiment of the invention
Figure.
Figure 13 is the module diagram of the electronic equipment with a camera module according to the abovementioned embodiments of the present invention.
Embodiment
It is described below for disclosing the present invention so that those skilled in the art can realize the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Define in the following description
Basic principle of the invention can be applied to other embodiments, deformation program, improvement project, equivalent and do not carry on the back
From the other technologies scheme of the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ",
" under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close
System is to be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, without referring to
Show or imply that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, therefore above-mentioned art
Language is not considered as limiting the invention.
It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no
It is understood that as the limitation to quantity.
It is as shown in Figures 4 to 6 a preferred embodiment of the camera module 100 of the invention based on new A CF techniques.Institute
State camera module 100 and use new ACF techniques, pass through anisotropic conductive film 50（Hereinafter referred to as ACF glue）Taken the photograph described
As rigid a plate 41 and flex plate 42 of a circuit board substrate 40 of module 100 presses and link together.
Specifically, as shown in figure 5, the camera module 100 includes an optical lens 10, a photo-sensitive cell（Do not show in Fig. 5
Go out）, a base 30 and the circuit board substrate 40, wherein the optical lens 10 is arranged at the sense of the photo-sensitive cell 50
Light path.It is noted that the type of the optical lens 10 can be unrestricted, such as the optical lens 10 can be
Wide-angle lens, standard lens and telephoto lens.The photo-sensitive cell is mounted on the rigid plate of the circuit board substrate 40
41, the base 30 is assembled in the circuit board substrate 40, and the optical lens 10 is assembled in the driver 20, described
Driver 20 is assembled in the base 30, to form the camera module 100.It is noted that the base 30 is one
Can be the molded base that the circuit board substrate 40 is shaped in by moulding technology in a little embodiments.It is worth mentioning
Be, in other embodiments, the base 30 for first one it is molded after, be mounted on the circuit board substrate 40.
It is noted that in other embodiments, the base 30 is to be mounted on the circuit board substrate 40 after being molded.This area
Technical staff it is understood that the present invention in this regard as just citing, be not limited thereto.It is worth mentioning
It is that the type of the driver 20 is unrestricted, such as to may be implemented as voice coil motor etc. any for the driver 20
The driver that the photosensitive path of the optical lens 10 along the photo-sensitive cell can be driven to move back and forth.Certainly, this area
Technical staff it is understood that in other embodiments of the invention, when the camera module 100 is implemented as focusing mould
During group, the driver 20 is not set in the camera module 100.
Further, as shown in figure 4, the hardness plate 41 has one group of hardness plate connector 411, the flex plate 42
With one group of flex plate connector 421, the ACF glue 50 divides each rigid plate connector 411 of the rigid plate 41
Each flex plate connector 421 with the flex plate 42 is not connected to, is made by above-mentioned such mode described hard
Property plate 41 and the flex plate 42 be connected.In one embodiment of the invention, each hardness of the rigid plate 41
Each flex plate connector 421 of plate connector 411 and the flex plate 42 can be terminal pad, i.e. the hardness plate
Each flex plate connector 421 of the 41 each rigid plate connector 411 and the flex plate 42 can be in respectively
Plate-like, for making each rigid plate connector 411 of the rigid plate 41 be connected to the every of the flex plate 42
A flex plate connector 421.In other embodiments of the present invention, each rigid plate of the hardness plate 41 connects
Each flex plate connector 421 of fitting 411 and the flex plate 42 can be spherical, such as by tin cream or others
Welding material point is connected in the rigid plate 41 with the flex plate 42 with forming the rigid plate of the rigid plate 41 respectively
The flex plate connector 421 of part 411 and the flex plate 42.Nevertheless, the rigid plate of the hardness plate 41 connects
The shape of the flex plate connector 421 of fitting 411 and the flex plate 42 is not intended to limit present disclosure and scope.
In the present invention, rigid plate connector 411 and corresponding each flex plate connector 421 are described described in each group
After the pressing connection of ACF glue 50, the position of hardness plate 41 and the flex plate 42 the connection overlapping is defined as the wiring board
One ACF connecting portions 400 of substrate 40.That is, the ACF connecting portions 400 of the present invention in new ACF techniques, lead to
The ACF glue 50 is crossed by each flexibility of each rigid plate connector 411 and the flex plate 42 of the rigid plate 41
Corresponding each flex plate connector 421 of plate 42 connects, so that the hardness plate 41 and the flex plate 42 are connected
Pick up and.The position that the hardness plate 41 and the flex plate 42 are joined together forms the described of the circuit board substrate 40
ACF connecting portions 400.
As shown in Figure 5 and Figure 6, the base 30 includes 32 and one base holes 32 of base body of an annular, the annular
Base body 32 form the base holes 32, light is perceived after can passing through the base holes 32 by the photo-sensitive cell.Institute
Stating the bottom of base body 32 has a base groove 320, and the base groove 320 is the rigid plate 41 and the flex plate
42 connecting portion i.e. the ACF connecting portions 400 provide space.Shown in this preferred embodiment and Fig. 2 of the present invention
The camera module 100P of traditional ACF techniques compare, rigid the plate 41P and flex plate of camera module 100P in the embodiment of Fig. 2
The rigid plate that the connecting portion of 42P is arranged on rigid plate 41P lengthens region 412P, causes the sidepiece of rigid plate 41P Fig. 2's
Base 30P is extended on horizontal direction, that is to say, that the size of the size ratio base 30P of rigid plate 41P is longer.Taken the photograph in this way, working as
, it is necessary to meet that the electronics of thin design is set when being arranged at an electronic equipment 200 for example on cell phone apparatus as module 100P
This rigid plate of standby 200 not enough spaces lengthens region 412P, that is to say, that if tradition ACF works will be based on
The camera module 100P of skill is assembled in the electronic equipment 200, can cause the increase of 200 size of electronic equipment, it is impossible to full
The lightening demand of foot.And the camera module 100 in the preferred embodiment of the present invention utilizes new ACF techniques, make institute
State ACF connecting portions 400 to be completely encased in the base 30, that is to say, that the ACF connecting portions of the circuit board substrate 40
400 do not protrude the base 30, the exterior overall ruler for the camera module 100 that assembling is formed after will not influencing
It is very little., can when the camera module 100 in this preferred embodiment of the present invention is arranged at the electronic equipment 200
Meet the structure and the camera module 100 technique of itself of such as phone housing of electronic equipment 200.
More specifically, as shown in Figure 5 and Figure 6, the base body 32 includes a base linkage section 321 and a base master
Body section 322, the base linkage section 321 extend the base body section 322.The base linkage section 321 has a base
3212 and one base linkage section bottom surface 3213 of linkage section side, the base body section 322 have a base body section side
3222 and a base body section bottom surface 3223, the base body section side 3222 it is curved from the base body section bottom surface 3223
Folding extends to the base linkage section bottom surface 3213, it is preferable that the base body section side 3222 is vertically from the base
Main paragraph bottom surface 3223 extends to the base linkage section bottom surface 3213, and the 3223 place plane of base body section bottom surface is parallel
In the base linkage section side 3212, the base linkage section side 3212 of the base linkage section 321 and the base
The base body section side 3222 of main paragraph 322 forms the base groove 320, and the base groove 320 accommodates described
ACF connecting portions 400.In this embodiment in accordance with the invention, the base linkage section 321 of the base groove 320 is formed
The base linkage section side 3212 and the base body section side 3222 of the base body section 322 are defined as being formed
One base groove wall of the base groove 320, that is to say, that in this embodiment in accordance with the invention, the ACF connecting portions
400 fittings form the base groove wall of the base groove 320.
Further, the rigid plate 41 further includes a rigid 412 and one rigid plate main paragraph 413 of plate linkage section,
The hardness plate linkage section 412 extends the rigid plate main paragraph 413.The hardness plate connector 411 is arranged at described
Rigid plate linkage section 412, the hardness plate linkage section 412 have a rigid 4121 and one rigid plate connection of plate linkage section top surface
Section bottom surface 4123, the hardness plate main paragraph 413 have a rigid 4131, one rigid plate main paragraph side of plate main paragraph top surface
4132 and a rigid plate main paragraph bottom surface 4133.It is flexible that the flex plate 42 further includes a flex plate linkage section 422 and one
Plate main paragraph 423, the flex plate linkage section 422 extend the flex plate main paragraph 423.The flex plate connector 421
The flex plate linkage section 422 is arranged at, the flex plate linkage section 422 has a flex plate linkage section top surface 4221, one
Flex plate linkage section side 4222 and a flex plate linkage section bottom surface 4223.The ACF glue 50 connects the rigid connection part
411 and the flexible connector 421 form the ACF connecting portions 400.It is described in this preferred embodiment of the present invention
Rigid plate connector 411 is arranged at the rigid plate linkage section top surface 4121 of the rigid plate linkage section 412, the flexibility
Plate connector 421 is arranged at the flex plate linkage section bottom surface 4223 of the flex plate linkage section 422, so that the hardness
Plate linkage section top surface 4121 is bonded the flex plate linkage section bottom surface 4223.The 3223 place plane of base body section bottom surface and
The 4223 place plane of flex plate linkage section bottom surface is same plane, so as to ensure the base 30 and the circuit board substrate
The flatness of 40 connections.In this preferred embodiment of the present invention, the base 30 is directly pressed together on the flex plate 42
On, the ACF connecting portions 400 are bonded the base groove 320.That is, the base linkage section bottom surface 3213 is bonded institute
4231 are stated, the base body section side 3222 is bonded the flex plate linkage section side 4222, so that the ACF connecting portions
400 are snugly contained in the base groove 320 completely.In this way, the ACF connecting portions 400 of the circuit board substrate 40
The base 30 is not protruded, the exterior overall dimensions for the camera module 100 that assembling is formed after will not influencing.
It will be appreciated by those skilled in the art that the hardness plate 41 include the rigid plate connector 411 and
One rigid plate plate body, being integrated of the hardness plate plate body formation, but in order to illustrate more clearly of the present invention, the hardness plate
Plate body further comprises the rigid plate linkage section 412 and the rigid plate main paragraph 413.The hardness plate connector 411
It is arranged at the rigid plate linkage section 412.The each rigid plate connector 411 and the flex plate of the hardness plate 41
42 each flex plate connector 421 may be implemented as pad in an embodiment of the present invention, similar chip bonding pad, so
The pad between the rigid plate 41 and the flex plate 42 is turned on the ACF glue 50 afterwards.Certainly, in other embodiments
In can also there are other reasonably to deform, the present invention be not limited thereto in this regard.
Be the variant embodiment based on the preferred embodiment of the present invention as shown in Figure 7 and Figure 8, and the present invention be preferable to carry out
Unlike example, the base 30 of Fig. 7 and the camera module 100 in variant embodiment described in Fig. 8 does not directly bear against institute
State on flex plate 42, but the base groove 320 of the base 30 is non-snugly accommodates the ACF connecting portions 400.Also
It is to say, the base linkage section 321 of the base 30 does not have the flex plate linkage section for pressing the flex plate 42
422, the base body section 322 of only described base 30 is pressed in the described hard of the rigid plate 41 of the circuit board substrate 40
On property plate main paragraph 413.That is, in this embodiment in accordance with the invention, the ACF connecting portions 400 and the formation bottom
There are gap, this existing gap between the base groove wall of seat groove 320 to be pressed onto institute to avoid the base 30
State the lead, the photo-sensitive cell and other elements of circuit board substrate 40.More specifically, it is preferable to carry out with Fig. 4 to Fig. 6
Example the difference is that in variant embodiment shown in Fig. 7 and Fig. 8, without described in fitting scratch by the base linkage section bottom surface 3213
Property plate linkage section top surface 4221, the base body section side 3222 is without being bonded the flex plate linkage section side 4222.
In this variant embodiment, although the ACF connecting portions 400 are also enclosed in the base groove 320 of the base 30,
The base linkage section 321 of the base 30 avoids the flex plate 42, not and the flex plate 42 surface into
Row contact, so that the base 30 will not be pressed onto the lead of the circuit board substrate 40 or the photo-sensitive cell.This area
Technical staff it is understood that the present invention this variant embodiment other variant embodiments in, the base master
Body section side 3222 can also be bonded the flex plate linkage section side 4222 or the base linkage section bottom surface 3213 and be bonded
The flex plate linkage section top surface 4221, as long as not interfering with the connection or described of the circuit board substrate 40 and other elements
The function of photo-sensitive cell, the present invention are not limited thereto in this regard.
In two embodiments shown in Fig. 4 to Fig. 8, the ACF connecting portions 400 are housed inside in the base 30, because
This, before new A CF techniques, the base 30 needs to be molded, to form the bottom for accommodating the ACF connecting portions 400
Seat groove 320.And in two embodiments shown in Fig. 9 to Figure 12 in the present invention, shape can not be molded on the base 30
Into the base groove 320 to accommodate the ACF connecting portions 400, but by forming a rigid plate of the rigid plate 410
Groove 410 is to accommodate the ACF connecting portions 400, so as to simplify the packaging technology of the camera module 100, strengthens versatility.Value
One be mentioned that the base groove 320 can not also be formed by way of die sinking, the present invention is as just citing, not
It is so limited.
Specifically, it is as shown in Figure 9 and Figure 10 the shooting of another variant embodiment based on the preferred embodiment of the present invention
Module 100.In the variant embodiment shown in Fig. 9 and Figure 10, the ACF connecting portions 400 are snugly contained in the hardness
In the rigid plate groove 410 of plate 41.More specifically, as shown in Figure 9 and Figure 10, the hardness plate main paragraph 413 it is described
Rigid plate main paragraph side 4132 bends downward ground from the rigid plate main paragraph top surface 4131 of the rigid plate main paragraph 413
Extend to the rigid plate linkage section top surface 4121 of the rigid plate linkage section 412, it is preferable that the hardness plate main paragraph
The rigid plate main paragraph top surface 4131 of the 413 rigid plate main paragraph side 4132 from the rigid plate main paragraph 413
Extend vertically downward to the rigid plate linkage section top surface 4121 of the rigid plate linkage section 412.The hardness plate main body
The rigid plate main paragraph side 4132 of section 413 and the rigid plate linkage section top surface of the rigid plate linkage section 412
4121 form the rigid plate groove 410 of the rigid plate 41, to accommodate the ACF connecting portions 400.The hardness plate main body
The rigid plate main paragraph side 4132 of section 413 is bonded the flex plate linkage section side of the flex plate linkage section 422
4222.It is noted that plane and the flex plate linkage section top surface where the hardness plate main paragraph top surface 4131
Plane where 4221 is same plane, so as to ensure that the base 30 is bonded the flatness of the circuit board substrate 40.It is worth
One is mentioned that, the whole top surface due to can so make the circuit board substrate 40 has good flatness, so that after convenient
It is smooth fixed and positioned in continuous moulding technology.It will be appreciated by those skilled in the art that based on the present invention this
In other variant embodiments of variant embodiment, the base 30 can also only be pressed together on the described hard of the rigid plate 41
On property plate main paragraph 413.In other variant embodiments, plane where the hardness plate main paragraph top surface 4131 and described scratch
Property plate linkage section top surface 4221 where plane for can not also be in same plane, but be parallel to each other.In other deformation implementations
In example, the rigid plate main paragraph side 4132 of the hardness plate main paragraph 413 can also not be bonded the flex plate
The flex plate linkage section side 4222 of linkage section 422.The present invention is not limited thereto in this regard.
It is the camera module 100 of the variant embodiment based on above-mentioned variant embodiment as is illustrated by figs. 11 and 12.Scheming
In variant embodiment shown in 11 and Figure 12, the ACF connecting portions 400 are snugly contained in the described hard of the rigid plate 41
In property plate groove 410.Unlike in the embodiment shown in Fig. 9 and Figure 10, the hardness plate groove 410 is arranged at described hard
Property plate 41 bottom, rather than the top of the rigid plate 41 in Fig. 9 and Figure 10 the embodiment described.More specifically, as schemed
Shown in 11 and Figure 12, the rigid plate main paragraph side 4132 of the hardness plate main paragraph 413 is from the rigid plate main paragraph
The 413 rigid plate main paragraph bottom surface 4133 extends to the rigid plate of the rigid plate linkage section 412 with being folded upward at
Linkage section bottom surface 4123, it is preferable that the rigid plate main paragraph bottom surface 4133 of the hardness plate main paragraph 413 is from the hardness
The rigid plate main paragraph bottom surface 4133 of plate main paragraph 413 is extended vertically upward to the institute of the rigid plate linkage section 412
State rigid plate linkage section bottom surface 4123.The rigid plate main paragraph side 4132 of the hardness plate main paragraph 413 and described
The rigid plate linkage section bottom surface 4123 of rigid plate linkage section 412 forms the rigid plate groove 410 of the rigid plate 41,
To accommodate the ACF connecting portions 400.The rigid plate main paragraph side 4132 of the hardness plate main paragraph 413 is bonded described
The flex plate linkage section side 4222 of flex plate linkage section 422.It is noted that the hardness plate main paragraph bottom surface
The plane where plane and the flex plate linkage section bottom surface 4223 where 4133 is same plane, so as to ensure the circuit
The flatness of 40 bottom of plate substrate.It will be appreciated by those skilled in the art that in this deformation implementation based on the present invention
In other variant embodiments of example, plane and the flex plate linkage section bottom where the hardness plate main paragraph bottom surface 4133
Plane where face 4223 is can not also be in same plane, but is parallel to each other.In other variant embodiments, the hardness
The rigid plate main paragraph side 4132 of plate main paragraph 413 can also be the institute for not being bonded the flex plate linkage section 422
State flex plate linkage section side 4222.The present invention is not limited thereto in this regard.
It is noted that compared with the camera module 100P for using tradition ACF techniques to be formed in Fig. 1, although described scratch
Property plate 42 be all the bottom for being arranged on the rigid plate 41, but the ruler of the camera module 100P of formation is assembled in Fig. 1
It is very little thicker, and in the embodiment shown in Figure 11 and Figure 12 of the present invention, the ACF connecting portions 400 are wrapped in the rigid plate 41,
It can ensure the flatness of the circuit board substrate 40, meanwhile, the base 30 can be unrestricted using various structures, subtracts
The packaging technology of the camera module 100 is lacked, has reduced the expense of die sinking, reduce production cost.
It is noted that can be by the rigid plate 41 and flexibility of the camera module 100 by new A CF techniques
The connecting portion of plate 42, that is, ACF connecting portions 400 are wrapped among the base 30 or the rigid plate 41, and the ACF connects
Socket part 400 does not interfere with the overall dimensions of the camera module 100 after assembling is formed.
In the various embodiments of the invention, the chamber and the circuit that the base groove 320 of the base 30 is formed
The chamber that the rigid plate groove 410 of the rigid plate 41 of plate pedestal 40 is formed is defined as the one of the photography module 100
Embedded chamber.That is, the ACF connecting portions are contained in the embedded intracavitary by some or all of, so as to not influence to assemble
The external dimensions of the camera module 100 formed, also improves flatness.
It is noted that in the manufacture craft of the camera module 100, when the base 30 is molds base
Wait, i.e., form the base 30 using moulding technology, the technique that COB is carried out using first ACF techniques again.That is, first pass through
Surface mount process attaches electronic component, carries out ACF techniques afterwards and forms the circuit for including the ACF connecting portions 400
Plate substrate 40, and then the photo-sensitive cell is attached with the circuit board substrate 40, carrying out W/A afterwards（wire bonding）Tie up
Line, then molds or attaches the base 30, finally installs shape after optical lens 10 and the driver 20 the grade element
Into the camera module 100, stain fraction defective can be reduced, it is ensured that the height and broad-ruler of the camera module 100
It is very little to will not change, increase the versatility of the camera module 100.
It is noted that in other embodiments, it is necessary to it is described hardness plate 41 lengthen the camera module 100 in,
The ACF connecting portions 400 are wrapped in the base 30, compares with the size of traditional camera module, can also reduce entirety
Size.
It is noted that in other embodiments, it is necessary to it is described hardness plate 41 lengthen the camera module 100 in,
The ACF connecting portions 400 can partly be wrapped in the base groove 320 of the base 30 or all be wrapped in
The base groove 320 of the base 30, the present invention are not limited in this regard.
It is noted that the ACF connecting portions 400 of the present invention are wrapped in the base 30 or the rigid plate 41
It is interior, the thickness of the flex plate 42 can be further reduced, flatness there has also been larger lifting.
It is noted that need to rupture opening after conducting particles is pressurized in the ACF technical process, described in conducting
ACF connecting portions 400 are vertically connected with face, and for evaluating pressure size, whether suitable and compression mode is feasible.In addition,
Need to test peeling force after ACF technical process, mainly test the antistripping ability after the ACF glue 50 reacts, it is in addition golden
The clean surface degree of finger also influences whether the size of peeling force.
According to another aspect of the present invention, the electronic equipment 200 such as Figure 13 with the camera module 100 is also provided
It is shown, the present invention further provides the electronic equipment 200, wherein the electronic equipment 200 includes at least one shooting mould
Group 100, and an at least apparatus body 210, wherein each camera module 100 be used to obtain image and be arranged at described
Apparatus body 210.
According to another aspect of the present invention, the making side of a camera module 100 with ACF connecting portions 400 is additionally provided
Method, the production method comprise the following steps：
Form at least one rigid plate of at least one rigid plate 41 of an at least circuit board substrate 40 for the camera module 100
Groove 410；And
An at least ACF glue 50 is provided and connects the rigid plate 41 and an at least flex plate 42, the rigid plate 41 and described
The connecting portion of flex plate 42 forms an at least ACF connecting portions 400 and the ACF connecting portions 400 are by some or all of receiving
In the rigid plate groove 410.
It is further comprising the steps of wherein in above-mentioned production method：Institute is formed at least one top of the rigid plate 41
State rigid plate groove 410.
It is further comprising the steps of wherein in above-mentioned production method：Institute is formed in an at least bottom for the rigid plate 41
State rigid plate groove 410.
According to another aspect of the present invention, the making side of a camera module 100 with ACF connecting portions 400 is additionally provided
Method, the production method comprise the following steps：
Form an at least base groove 320 for an at least base 30 for the camera module 100；And
At least one hardness of at least circuit board substrate 40 that an at least ACF glue 50 connects the camera module 100 is provided
Plate 41 and at least a flex plate 42, the connecting portion of the hardness plate 41 and the flex plate 42 form an at least ACF connecting portions
400 and the ACF connecting portions 400 be contained in the base groove 320 by some or all of.
It is further comprising the steps of wherein in above-mentioned production method：Mold to be formed in an at least bottom for the base 30
The base groove 320.
It should be understood by those skilled in the art that the embodiment of the present invention shown in foregoing description and attached drawing is only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.The function and structural principle of the present invention exists
Show and illustrate in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (23)
- A 1. camera module, it is characterised in that including：An at least optical lens,An at least photo-sensitive cell, each optical lens are arranged at the photosensitive path of each photo-sensitive cell, andAn at least circuit board substrate, each photo-sensitive cell are mounted on the circuit board substrate,Wherein described circuit board substrate includes at least one rigid plate and an at least soft board, and the hardness plate and the soft board lead to Cross an at least ACF gemel connections and form an at least ACF connecting portions at the position of connection.
- 2. camera module as claimed in claim 1, wherein the rigid plate of the circuit board substrate is also hard with least one Property plate groove, the ACF connecting portions are arranged in the rigid plate groove.
- 3. camera module as claimed in claim 2, wherein the hardness plate groove is arranged at the top position of the rigid plate Put, the non-bulging at least top surface in the rigid plate of an at least top surface of the ACF connecting portions.
- 4. camera module as claimed in claim 3, wherein the hardness plate further includes at least one rigid plate linkage section and extremely A few rigid plate main paragraph, the hardness plate linkage section extend the rigid plate main paragraph, and the hardness plate main paragraph is extremely An at least top surface for few one side from the rigid plate main paragraph extends to the rigid plate linkage section at least with bending downward The top surface of one top surface, the side of the hardness plate main paragraph and the rigid plate linkage section forms the rigid plate The rigid plate groove, to accommodate the ACF connecting portions.
- 5. camera module as claimed in claim 2, wherein the hardness plate groove is arranged at the bottom of the rigid plate, institute At least bottom surface for stating ACF connecting portions is non-bulging in an at least bottom surface for the rigid plate.
- 6. camera module as claimed in claim 5, wherein the hardness plate further includes at least one rigid plate linkage section and extremely A few rigid plate main paragraph, the hardness plate linkage section extend the rigid plate main paragraph, and the hardness plate main paragraph is extremely Few one side extends to the rigid plate linkage section at least with being folded upward at from an at least bottom surface for the rigid plate main paragraph The bottom surface of one bottom surface, the side of the hardness plate main paragraph and the rigid plate linkage section forms the rigid plate The rigid plate groove, to accommodate the ACF connecting portions.
- 7. camera module as claimed in claim 1, wherein the camera module further comprises an at least base, the base It is arranged on the circuit board substrate, the base has an at least base groove, and the base groove accommodates the ACF and connects Socket part.
- 8. camera module as claimed in claim 7, wherein the base groove is formed on the bottom of the base, the ACF connects Socket part is housed inside the base groove.
- 9. camera module as claimed in claim 8, wherein the base body is including an at least base linkage section and at least One base body section, the base linkage section extend the base body section, at least one side of the base body section from At least bottom surface bending of the base body section extends to an at least bottom surface for the base linkage section, the base linkage section The side and the side of the base body section form the base groove, to accommodate the ACF connecting portions.
- 10. camera module as claimed in claim 8, wherein the ACF connecting portions are bonded to form the base groove at least One base groove wall.
- 11. camera module as claimed in claim 8, wherein the ACF connecting portions and at least the one of the formation base groove There are gap or the ACF connecting portions between base groove wall to be completely filled in the base for forming the base groove Between groove walls.
- 12. the camera module as described in any in claim 1 to 11, wherein there is the hardness plate one group of hardness plate to connect Part, the flex plate have one group of flex plate connector, are connected each rigid plate of the rigid plate by the ACF glue Fitting is connected to each flex plate connector with the flex plate, so that the hardness plate and the flex plate quilt Connect to form the ACF connecting portions.
- 13. camera module as claimed in claim 12, wherein each rigid plate connector of the hardness plate and described Each flex plate connector of flex plate is pad.
- 14. camera module as claimed in claim 12, wherein the flex plate further includes a flex plate linkage section and one scratches Property plate main paragraph, the flex plate linkage section extend the flex plate main paragraph, and the flex plate connector is arranged at institute Flex plate linkage section is stated, the hardness plate connector is arranged at the rigid plate linkage section.
- 15. the camera module as described in any in claim 2 to 6, wherein the ACF connecting portions are by some or all of receiving In the rigid plate groove.
- 16. the camera module as described in any in claim 7 to 11, wherein the ACF connecting portions are by some or all of appearance It is contained in the base groove.
- A 17. electronic equipment, it is characterised in that including at least just like any camera module in claim 1-16 and An at least apparatus body, wherein each camera module be used to obtain image and be arranged at the apparatus body.
- 18. electronic equipment according to claim 17, it is characterised in that the electronic equipment is selected from mobile phone, computer, TV Machine, intelligence can screw on equipment, the vehicles, camera and monitoring device.
- 19. the production method of a camera module with ACF connecting portions, it is characterised in that the production method includes following step Suddenly：Form at least one rigid plate groove of at least one rigid plate of an at least circuit board substrate for the camera module；AndRigid plate and an at least flex plate, the connection of the hardness plate and the flex plate described in an at least ACF gemel connections are provided Position forms an at least ACF connecting portions and the ACF connecting portions are contained in the rigid plate groove by some or all of.
- 20. the production method of the camera module with ACF connecting portions as claimed in claim 19, further comprising the steps of： The rigid plate groove is formed at least one top of the hardness plate.
- 21. the production method of the camera module with ACF connecting portions as claimed in claim 19, further comprising the steps of： The rigid plate groove is formed on an at least bottom for the hardness plate.
- 22. the production method of a camera module with ACF connecting portions, it is characterised in that the production method includes following step Suddenly：Form an at least base groove for an at least base for the camera module；AndAt least one rigid plate and at least one for providing an at least circuit board substrate for camera module at least described in an ACF gemel connections is scratched Property plate, the connecting portion of the hardness plate and the flex plate forms an at least ACF connecting portions and the ACF connecting portions by part Or all it is contained in the base groove.
- 23. the production method of the camera module with ACF connecting portions as claimed in claim 22, further comprising the steps of： The base groove is formed on an at least bottom for the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939282.0A CN107979714A (en) | 2016-10-25 | 2016-10-25 | Camera module and its manufacture method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939282.0A CN107979714A (en) | 2016-10-25 | 2016-10-25 | Camera module and its manufacture method and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN107979714A true CN107979714A (en) | 2018-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610939282.0A Pending CN107979714A (en) | 2016-10-25 | 2016-10-25 | Camera module and its manufacture method and electronic equipment |
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| CN105262936A (en) * | 2014-07-17 | 2016-01-20 | 宁波舜宇光电信息有限公司 | Manufacturing method of camera module and module semi-finished product thereof |
| CN105472885A (en) * | 2015-12-14 | 2016-04-06 | 广东欧珀移动通信有限公司 | PCB and FPC press-fit connection structure and manufacturing method therefor |
| CN105763780A (en) * | 2016-04-07 | 2016-07-13 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof |
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| US20090224670A1 (en) * | 2008-03-07 | 2009-09-10 | Kang Tae-Kyoung | Plasma display device |
| CN103595899A (en) * | 2012-08-15 | 2014-02-19 | 鸿富锦精密工业（深圳）有限公司 | Camera module assembly carrier tool |
| CN105262936A (en) * | 2014-07-17 | 2016-01-20 | 宁波舜宇光电信息有限公司 | Manufacturing method of camera module and module semi-finished product thereof |
| CN104980638A (en) * | 2015-08-07 | 2015-10-14 | 信利光电股份有限公司 | Camera shooting module |
| CN105472885A (en) * | 2015-12-14 | 2016-04-06 | 广东欧珀移动通信有限公司 | PCB and FPC press-fit connection structure and manufacturing method therefor |
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