CN101286520A - Image sensing wafer packaging structure and encapsulation method thereof - Google Patents
Image sensing wafer packaging structure and encapsulation method thereof Download PDFInfo
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- CN101286520A CN101286520A CNA2007102004172A CN200710200417A CN101286520A CN 101286520 A CN101286520 A CN 101286520A CN A2007102004172 A CNA2007102004172 A CN A2007102004172A CN 200710200417 A CN200710200417 A CN 200710200417A CN 101286520 A CN101286520 A CN 101286520A
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- image sensing
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- sensing wafer
- viscose glue
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005538 encapsulation Methods 0.000 title claims description 30
- 238000004806 packaging method and process Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 48
- 229920000297 Rayon Polymers 0.000 claims description 45
- 238000012856 packing Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 5
- 238000003384 imaging method Methods 0.000 abstract description 2
- 229920000715 Mucilage Polymers 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention provides an encapsulating structure of an image sensing chip, which comprises a substrate, a piece of image sensing chip, a cover body and mucilage glue, wherein, the substrate is used for loading the image sensing chip which is provided with a sensing area and a non-sensing area which surrounds the sensing area; the cover body is a curved imaging lens used for leading image signal light to forming image in the sensing area of the image sensing chip; the cover body is fixedly arranged on the image sensing chip by the mucilage glue arranged on the non-sensing area of the image sensing chip. The image sensing chip of the invention not only has small encapsulating structure volume which can save encapsulating cost, but also can effectively reduce the pollution of dust to the image sensing chip, thus enhancing the yield of the product. Moreover, the invention also relates to an encapsulating method of the image sensing chip.
Description
Technical field
The present invention relates to the encapsulation of image sensing wafer, relate in particular to a kind of small size encapsulation structure of image sensing chip and method for packing thereof.
Background technology
Along with the continuous development of science and technology, portable electronic equipment such as mobile phone are used increasingly extensively, also day by day trend towards simultaneously light and handy, attractive in appearance and multifunction, and wherein camera function is the additional function of popular in recent years mobile phone.The camera module that is applied to mobile phone not only will have higher photographic property, and it also must satisfy compact requirement.And the image sensing wafer encapsulation volume is one of principal element of decision camera module size, therefore, the encapsulating structure that improves image sensing wafer with and method for packing will help miniaturization of camera module and lightweight.
The encapsulating structure of a camera module 100 as shown in Figure 1, this camera module 100 comprise a substrate 13, image sensing wafer 15, clear glass 18, a camera lens module 10 and an a plurality of leads 123.Wherein, this substrate 13 has a base plate 131, and these base plate 131 top edge vertical base plate are extended a flange 132.These base plate 131 tops, image sensing wafer 15 lateral walls and flange 132 madial walls form a space 133.In this space 133, be provided with a plurality of substrate weld pads 134.Described image sensing wafer 15 is fixedly arranged on the crown center part of this base plate 131 by viscose glue 17.These image sensing wafer 15 tops have a sensing area 151 and non-sensing area 152, and its non-sensing area 152 is provided with a plurality of chip bonding pads 153, and these a plurality of chip bonding pads 153 electrically connect with substrate weld pad 134 mutually by a plurality of leads 123.The underrun viscose glue 17 of this clear glass 18 is fixed on flange 132 tops to seal described image sensing wafer 15.
Described camera lens module 10 comprises lens barrel 12, microscope base 14 and set of lenses 16.Described set of lenses 16 is fixed in the lens barrel 12, and lens barrel 12 lateral walls and microscope base 14 madial walls are provided with screw thread, and lens barrel 12 is located in the microscope base 14 by thread bush.Camera lens module 10 is fixed on clear glass 18 tops by viscose glue 17.
Above-mentioned camera module 100 transfers to through clear glass 18 on the sensing area 151 of image sensing wafer 15 after adopting the set of lenses 16 that is fixed in the camera lens module 10 with the signal of video signal optical convergence.So just can obtain bigger imaging scope.Yet, also need add a clear glass 18 in addition when need adopt the set of lenses 16 of camera lens module 10 to come converging ray in this camera module 100 and seal image sensing wafer 15.So, will cause the encapsulation volume of camera module 100 bigger.Because camera lens module 10 need expend more raw materials, increased the packaging cost of camera module 100 simultaneously.
In addition, because the residing space of being sealed by substrate 13 and clear glass 18 of this image sensing wafer 15 is bigger, the surface of the dust of its generation is also bigger, 151 easier pollutions that are subjected to dust of sensing area, thus cause the production yield of this image sensing wafer to reduce.
Summary of the invention
In view of this, be necessary to provide a kind of encapsulation volume that can reduce image sensing wafer, the encapsulation structure of image sensing chip of improve producing yield and saving cost with and method for packing.
A kind of encapsulation structure of image sensing chip, it comprises: substrate, image sensing wafer, lid and viscose glue.Described substrate is used to carry image sensing wafer.Described image sensing wafer has a sensing area and around the non-sensing area of sensing area.Described lid is a curved planar reformation eyeglass, is used for the sensing area of signal of video signal photoimaging in image sensing wafer, and this lid is fixedly arranged on the image sensing wafer by the viscose glue that is arranged on the non-sensing area of image sensing wafer.
A kind of image sensing wafer method for packing, it may further comprise the steps:
A substrate is provided, and it has a base plate;
An image sensing wafer is assembled on the base plate of substrate;
One viscose glue is coated on the non-sensing area of image sensing wafer, and around the periphery of non-sensing area;
One lid is provided, described lid periphery is placed on the viscose glue, push this lid then;
Solidify viscose glue, lid is fixedly adhered on the viscose glue, with the sensing area of sealing image sensing wafer.
With respect to prior art, lid in the described encapsulation structure of image sensing chip is the curved planar reformation eyeglass of spherical mirror or aspherical mirror, can image in the image light signal sensing area of image sensing wafer, it directly is adhered to the non-sensing area of image sensing wafer by viscose glue.Therefore, both described lid can be used for sealing image sensing wafer, the curved planar reformation eyeglass that can be used as again in the camera module is used.Thus, not only described encapsulating structure takes up room little, can effectively reduce the pollution of dust to image sensing wafer simultaneously, improves and produces yield.And described image sensing wafer can not need add lens barrel and microscope base and constitutes a simple camera module, thereby reduces cost, and reduces the height of whole camera modular structure.
Description of drawings
Fig. 1 is a kind of cutaway view of existing encapsulation structure of image sensing chip;
Fig. 2 is the encapsulation structure of image sensing chip cutaway view of first embodiment of the invention;
Fig. 3 is the encapsulation structure of image sensing chip cutaway view of second embodiment of the invention;
Fig. 4 is the cutaway view of another execution mode of encapsulation structure of image sensing chip of second embodiment of the invention.
Embodiment
Below with reference to the drawings, the present invention is described in further detail.
See also Fig. 2, be the encapsulation structure of image sensing chip of first embodiment of the invention, it comprises a substrate 20, image sensing wafer 22, first viscose glue 23, second viscose glue 29 and a lid 26.
Described substrate 20 can be made by materials such as glass fibre, reinforced plastics or potteries, and it has a base plate 210, and described base plate 210 perimeter are provided with a plurality of substrate weld pads 201.Described image sensing wafer 22 is adhered on the described base plate 210 by second viscose glue 29.
Described image sensing wafer 22 has a sensing area 223 and around the non-sensing area 224 of sensing area, described non-sensing area 224 edges are provided with a plurality of chip bonding pads 221.
Described encapsulation structure of image sensing chip also comprises a plurality of leads 24, described a plurality of leads 24 is that, conduction good material anti-oxidant by gold etc. made, the one end is fixedlyed connected with the chip bonding pads 221 of image sensing wafer 22, the other end then with base plate 210 on substrate weld pad 201 electrically connect so that the signal of image sensing wafer 22 is passed on the substrate 20 by a plurality of leads 24.
The non-sensing area 224 that described first viscose glue 23 is coated on image sensing wafer 22 also covers lead-in wire 24, chip bonding pads 221, substrate weld pad 201 all around, and the height of first viscose glue 23 is greater than the height of a plurality of leads 24.
Described lid 26 is the curved planar reformation eyeglass of a spherical mirror or aspherical mirror, the periphery 261 of described lid 26 is fixedly arranged on the non-sensing area 224 of image sensing wafer 22 by first viscose glue 23, and the bottom surface of described lid periphery 261 and described first viscose glue 23 are conflicted, thereby the sensing area 223 of image sensing wafer 22 is sealed.
The method for packing of this image sensing wafer 22 may further comprise the steps:
A substrate 20 is provided, and it has a base plate 210;
One lid 26 is provided, the periphery 261 of described lid 26 is placed on first viscose glue 23, push this lid 26 then;
Solidify first viscose glue 23, lid 26 is fixedly adhered on first viscose glue 23, with the sensing area 223 of sealing image sensing wafer 22.
The assembling of described image sensing wafer 22 on the base plate 210 of substrate 20 is adhered to image sensing wafer 22 on the base plate 210 by second viscose glue 29 earlier, more a plurality of chip bonding pads 221 passed through a plurality of leads 24 corresponding electric connections with a plurality of substrate weld pads 201 on the substrate 20.
Present embodiment is adhered on the base plate 210 of substrate 20 image sensing wafer 22 by second viscose glue 29 earlier, by a plurality of leads 24 image sensing wafer 22 and substrate 20 is electrically connected again.In the practical application, also can crystalline form, interior pin be fitted, carrier band is fitted, lost money instead of making money encapsulation or hot pressing connected mode and makes image sensing wafer 22 structural and be electrically connected at substrate 20 automatically with covering.
Described lid 26 is curved planar reformation eyeglasses of a spherical mirror or aspherical mirror, its with the signal of video signal photoimaging on the sensing area 223 of image sensing wafer 22 and the sealing image sensing wafer 22 sensing area 223.Described first viscose glue 23 sticks into one with described image sensing wafer 22, substrate 20, lid 26, epi mirror head mould group and constitute a simple camera module not like this, thus can reduce production costs.And, sealing described image sensing wafer 22 spaces is to be surrounded jointly by inwall that is arranged at first viscose glue 23 on the image sensing wafer 22 and lid 26, thus, not only described space is little, and can effectively reduce the pollution of dust to image sensing wafer 22, produce yield thereby improve, more can reduce the height of whole image sensing wafer structure, and reach miniaturization of camera module and light-weighted purpose.
See also Fig. 3 and Fig. 4, the encapsulation structure of image sensing chip of second embodiment of the invention comprises a substrate 31, image sensing wafer 32, first viscose glue 33, second viscose glue 39 and a lid 36.
Wherein, described substrate 31 has a plurality of flanges 312 of a base plate 310 and vertical base plate 310 extensions all around of described base plate 310 edges.Described a plurality of flange 312 is close to identical with the height of image sensing wafer 32.
The described encapsulation structure of image sensing chip of present embodiment is identical substantially with the structure of first embodiment, its difference mainly is: described base plate 310, a plurality of flange 312 and image sensing wafer 32 one sidewalls relative with a plurality of flange 312 form a space 38, and described substrate weld pad 301 is positioned at described space 38.Preferably, for convenience of the marking device routing, described substrate weld pad 301 also can be arranged at the top of flange 312.Described first viscose glue 33 is coated on around non-sensing area 324 edges of image sensing wafer 32 and covers the space 38 of described formation.
Similarly, described image sensing wafer 32 is adhered on the base plate 310 by second viscose glue 39.Described encapsulation structure of image sensing chip also comprises a plurality of leads 34, described a plurality of leads 34 one ends are fixedlyed connected with chip bonding pads 321, the other end then is electrically connected with substrate weld pad 301, so that the signal of image sensing wafer 32 is passed to substrate 31 by a plurality of leads 34.The height of described first viscose glue 33 is greater than the height of described a plurality of leads 34, and described lid 36 is adhered on first viscose glue 33, thereby the sensing area 323 of image sensing wafer 32 is sealed.Described first viscose glue 33 makes described image sensing wafer 32, substrate 31, a plurality of leads 34 and lid 36 stick into one.
A plurality of flanges 312 that vertical base plate is extended around base plate 310 edges both can prevent that the glue phenomenon of overflowing from appearring in first viscose glue 33, also can increase the contact area of lid 36 peripheries 361 and first viscose glue 33, made lid 36 adhesions more firm, further improved and produced yield.Simultaneously can make things convenient for the marking device routing, improve throughput rate.
The method for packing of the method for packing of the image sensing wafer of present embodiment and first embodiment is similar, and difference mainly is coating first viscose glue 33 in the space that base plate 310, flange 312 and image sensing wafer 32 one sidewalls relative with flange 312 form.Other step is basic identical, here repeats no more.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (11)
1. encapsulation structure of image sensing chip, it comprises: substrate, image sensing wafer, lid and viscose glue, described substrate is used to carry image sensing wafer, described image sensing wafer has a sensing area and around the non-sensing area of sensing area, it is characterized in that: described lid is a curved planar reformation eyeglass, be used for the sensing area of signal of video signal photoimaging in image sensing wafer, this lid is fixedly arranged on the image sensing wafer by the viscose glue that is arranged on the non-sensing area of image sensing wafer.
2. encapsulation structure of image sensing chip as claimed in claim 1 is characterized in that: described lid is spherical mirror or aspherical mirror.
3. encapsulation structure of image sensing chip as claimed in claim 1, it is characterized in that: described encapsulation structure of image sensing chip also comprises a plurality of leads, the non-sensing area of described image sensing wafer is provided with a plurality of chip bonding pads, corresponding a plurality of chip bonding pads are provided with a plurality of substrate weld pads around the bottom edge of described substrate, and described a plurality of chip bonding pads are passed through the corresponding electric connection of described a plurality of leads with a plurality of substrate weld pads.
4. encapsulation structure of image sensing chip as claimed in claim 3 is characterized in that: described viscose glue covers described a plurality of leads, described chip bonding pads and described substrate weld pad, and the height of viscose glue is greater than the height of a plurality of leads
5. encapsulation structure of image sensing chip as claimed in claim 1, it is characterized in that: described substrate has a base plate, vertical base plate is extended with a plurality of flanges around the bottom edge, the height of described a plurality of flanges is suitable with the height of described image sensing wafer, the base plate of described substrate, the sidewall of a plurality of flanges and the image sensing wafer relative with a plurality of flanges forms a space, and described viscose glue covers the space of described formation.
6. encapsulation structure of image sensing chip as claimed in claim 5 is characterized in that: the corresponding a plurality of chip bonding pads of described flange top are provided with a plurality of substrate weld pads.
7. encapsulation structure of image sensing chip as claimed in claim 5 is characterized in that: corresponding a plurality of chip bonding pads are provided with a plurality of substrate weld pads in the space of described formation.
8. as each described encapsulation structure of image sensing chip of claim 1 to 7, it is characterized in that: described viscose glue is bonded as one with described substrate, image sensing wafer, a plurality of leads, lid.
9. image sensing wafer method for packing, it may further comprise the steps:
A substrate is provided, and it has a base plate;
An image sensing wafer is assembled on the base plate of substrate;
One viscose glue is coated on the non-sensing area of image sensing wafer, and around the periphery of non-sensing area;
One lid is provided, described lid periphery is placed on the viscose glue, push this lid then;
Solidify viscose glue, lid is fixedly adhered on the viscose glue, with the sensing area of sealing image sensing wafer.
10. require 9 described image sensing wafer method for packing as claim, it is characterized in that: may further comprise the steps on the described base plate that image sensing wafer is assembled in substrate: at first image sensing wafer is adhered on the base plate, a plurality of leads is provided again, one end of a plurality of leads is connected with chip bonding pads, and the other end then electrically connects mutually with a corresponding substrate weld pad.
11. require 9 described image sensing wafer method for packing as claim, it is characterized in that: can use on the described base plate that image sensing wafer is assembled in substrate and cover that crystalline form, interior pin are fitted, carrier band is fitted, lost money instead of making money encapsulation or hot pressing connected mode and makes image sensing wafer structural and be electrically connected at substrate automatically.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007102004172A CN101286520A (en) | 2007-04-10 | 2007-04-10 | Image sensing wafer packaging structure and encapsulation method thereof |
| US11/871,925 US7796188B2 (en) | 2007-04-10 | 2007-10-12 | Compact image sensor package and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007102004172A CN101286520A (en) | 2007-04-10 | 2007-04-10 | Image sensing wafer packaging structure and encapsulation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101286520A true CN101286520A (en) | 2008-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007102004172A Pending CN101286520A (en) | 2007-04-10 | 2007-04-10 | Image sensing wafer packaging structure and encapsulation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7796188B2 (en) |
| CN (1) | CN101286520A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103780805A (en) * | 2012-10-26 | 2014-05-07 | 深圳欧菲光科技股份有限公司 | Camera module group support and camera module group |
| CN103928481A (en) * | 2014-03-26 | 2014-07-16 | 清华大学 | Image sensor packaging structure and packaging method |
| CN105140255A (en) * | 2015-09-25 | 2015-12-09 | 江西芯创光电有限公司 | Flip-chip camera head encapsulating sheet and manufacturing method thereof |
| CN105531829A (en) * | 2013-09-10 | 2016-04-27 | 赫普塔冈微光有限公司 | Compact opto-electronic modules and fabrication methods for such modules |
| CN108155197A (en) * | 2016-11-28 | 2018-06-12 | 豪威科技股份有限公司 | System in package imaging sensor |
| US10943938B2 (en) | 2018-12-06 | 2021-03-09 | Industrial Technology Research Institute | Image sensor and manufacturing method thereof |
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| CN101285921A (en) * | 2007-04-13 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image-forming module group |
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| KR20180132684A (en) * | 2016-03-12 | 2018-12-12 | 닝보 써니 오포테크 코., 엘티디. | Camera module, its photosensitive part and method of manufacturing the same |
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| CN103928481A (en) * | 2014-03-26 | 2014-07-16 | 清华大学 | Image sensor packaging structure and packaging method |
| CN105140255A (en) * | 2015-09-25 | 2015-12-09 | 江西芯创光电有限公司 | Flip-chip camera head encapsulating sheet and manufacturing method thereof |
| CN105140255B (en) * | 2015-09-25 | 2017-11-17 | 江西芯创光电有限公司 | A kind of flip camera case chip and preparation method thereof |
| CN108155197A (en) * | 2016-11-28 | 2018-06-12 | 豪威科技股份有限公司 | System in package imaging sensor |
| US10943938B2 (en) | 2018-12-06 | 2021-03-09 | Industrial Technology Research Institute | Image sensor and manufacturing method thereof |
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| US7796188B2 (en) | 2010-09-14 |
| US20080252760A1 (en) | 2008-10-16 |
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