CN107969093A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN107969093A CN107969093A CN201710734307.8A CN201710734307A CN107969093A CN 107969093 A CN107969093 A CN 107969093A CN 201710734307 A CN201710734307 A CN 201710734307A CN 107969093 A CN107969093 A CN 107969093A
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- CN
- China
- Prior art keywords
- water
- heat
- water supply
- pipe
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiator, it includes water supply container, water circulating pump, water inlet pipe, return pipe and termal conductor module, termal conductor module includes heat-conducting silica gel sheet, heat conducting pipe, it is connected to water supply connector and the water out adapter at heat conducting pipe both ends, heat-conducting silica gel sheet is internally provided with multiple thermal holes, heat conducting pipe passed through from the thermal hole of heat conductive silica gel on piece and with heat conduction hole wall thermal contact conductance, interface corresponding with each heat conducting pipe is designed with water supply connector and water out adapter, water supply connector is equipped with a water inlet, water out adapter is equipped with a water outlet, water inlet is connected by water inlet pipe with water supply container, water outlet is connected by return pipe with water supply container, realize that the water between water supply container and heat conducting pipe is circulated by water circulating pump.The heat spreader structures of the present invention are simple, and pyroconductivity is high, can avoid influence of the dust to circuit, manufacture cost is low, and termal conductor module is small, and scalability is strong, and application range is more wide.
Description
Technical field
The present invention relates to field of radiating, the radiator of particularly a kind of heater element heat dissipation on circuit board.
Background technology
In the prior art, the heat dissipation of the heater element on circuit board mainly has three kinds of modes, and one kind is air-cooled radiator, and one
Kind is water-filled radiator, also has the two hybrid heat sink combined, and wind-cooling heat dissipating is by fan rotation, by the heat of heater element
The shortcomings that amount transports to external environment condition by hearsay, air-cooled radiator is that noise is big, and dust is easily covered on radiator, causes circuit
Failure, and he it is poor for high-power heater element, heat dissipation effect；Water-filled radiator is will fever member by way of water circulation
The heat of part is delivered to water tank, but water-filled radiator work is after a certain period of time, and coolant water temperature can rise, heat dissipation effect can under
Drop；Hybrid heat sink is that air-cooled radiator is set by water-filled radiator, comes improving heat radiation efficiency, such as CN203706117U public affairs
The disclosed radiator of air-cooled the water cooling integrated radiator and CN105700652 opened, its is complicated, and volume is excessive, can not
Suitable for the heat dissipation of the less circuit element of assembly space, manufacturing process is cumbersome, and manufacture is of high cost, is typically chasing after for enthusiast
Ask, although and the relatively pervious radiator of this radiating mode heat dissipation effect lifted, heat dissipation effect is still undesirable,
Poor expandability, at the same time can not radiate multiple heater elements.Such as desktop computer, heater element includes CUP, shows
Multiple components such as card, hard disk, memory, and above-mentioned radiator is simply possible to use in the heat dissipation of CPU, can not extend to dissipating for all component
Heat, for laptop, above-mentioned radiator can not almost be applied, thus, its popularization and application has larger limitation.
The content of the invention
The goal of the invention of the present invention is, extension undesirable for the existing radiator heat-dissipation effect described in background technology
Property it is poor, manufacture it is of high cost, it is big to space requirement the problems such as, there is provided a kind of radiator that can solve foregoing problems.
It is as follows to achieve the object of the present invention technical solution：
A kind of radiator, it includes water supply container, water circulating pump, water inlet pipe, return pipe and termal conductor module, heat transfer group
Part includes heat-conducting silica gel sheet, heat conducting pipe, the water supply connector for being connected to heat conducting pipe both ends and water out adapter, in heat-conducting silica gel sheet
Portion is provided with multiple thermal holes, and heat conducting pipe includes the more piece heat conducting pipes identical with the heat conduction hole number in heat-conducting silica gel sheet, leads
Heat pipe passed through from the thermal hole of heat conductive silica gel on piece and with heat conduction hole wall thermal contact conductance, all set on water supply connector and water out adapter
There is interface corresponding with each heat conducting pipe, water supply connector is equipped with a water inlet, and water out adapter is equipped with a water outlet, into
The mouth of a river is connected by water inlet pipe with water supply container, and water outlet is connected by return pipe with water supply container, and water circulating pump persistently will be for
Water in water container, which is delivered to heat conducting pipe and circulates, returns the circulation that water supply container realizes water.
In such scheme, in order to quickly distribute the heat in cooling water to external environment condition, make cooling water temperature, it is described
Return pipe is equipped with distal end radiator, which is arranged far from the position of heat source, and the heat in backwater is directly dissipated
It is sent in external environment condition.
Further, the distal end radiator is metalwork, and the concaveconvex structure of increase heat dissipation area is equipped with its surface,
Aquaporin is equipped with inside it, and the water inlet end of aquaporin and water outlet are connected with the return pipe of both sides respectively.
Further, the distal end radiator is equipped with air-cooled radiator.
In such scheme, for the ease of the heat sinking function of radiator is extended to multiple heat sources, the termal conductor module
Including multigroup, the water inlet of each group termal conductor module is connected by distribution joint of intaking with water inlet pipe, each group termal conductor module
Water outlet is connected by water outlet distribution joint with return pipe.
In such scheme, for the ease of the replacement of cooling water in water supply container, the water supply container is equipped with filler
And discharge outlet.
In such scheme, in order to accelerate the heat dissipation of water supply container internal cooling water, the water supply container is canister,
Radiator fan is housed on water supply container.
In such scheme, water pump controller is further included, cooling-water temperature sensor, water pump controller are equipped with the water supply container
The water pumping speed that the temperature-controlled circulation water detected by cooling-water temperature sensor pumps.
Beneficial effects of the present invention are as follows：The heat spreader structures of the present invention are simple, and pyroconductivity is high, can avoid dust pair
The influence of circuit, manufacture cost is low, and termal conductor module is small, can be fit directly into all heater element surfaces, expansible
Property is strong, it both can be applied to the heat dissipation of desktop computer, can also be applied to laptop radiating, and application range is wider
It is wealthy.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is the structure diagram of termal conductor module；
In figure, 1 is water supply container, and 2 be water circulating pump, and 3 be water inlet pipe, and 4 be return pipe, and 5 be heat-conducting silica gel sheet, and 6 be to lead
Heat pipe, 7 be water supply connector, and 8 be water out adapter, and 9 be distal end radiator, and 10 be air-cooled radiator, and 11 be filler, and 12 be draining
Mouthful, 13 be radiator fan, and 14 be cooling-water temperature sensor.
Embodiment
It is below the embodiment of the present invention：
Embodiment 1
A kind of radiator as depicted in figs. 1 and 2, it includes water supply container 1, water circulating pump 2, water inlet pipe 3, return pipe 4
And termal conductor module, termal conductor module includes heat-conducting silica gel sheet 5, heat conducting pipe 6, the water inlet that is connected to 6 both ends of heat conducting pipe connect
First 7 and water out adapter 8, heat-conducting silica gel sheet 5 is internally provided with multiple thermal holes, and heat conducting pipe 6 includes and leading in heat-conducting silica gel sheet
More identical heat conducting pipes of hot hole quantity, heat conducting pipe 6 are passed through from the thermal hole on heat-conducting silica gel sheet 5 and connect with heat conduction hole wall
Heat conduction is touched, interface corresponding with each heat conducting pipe is designed with water supply connector 7 and water out adapter 8, water supply connector 7 is equipped with one
Water inlet, water out adapter 8 are equipped with a water outlet, and water inlet is connected by water inlet pipe 3 with water supply container 1, and water outlet passes through
Return pipe 4 is connected with water supply container 1, and water circulating pump 2 continues that the water in water supply container is delivered to heat conducting pipe 6 and circulates recurrence to supply
Water container 1 realizes the circulation of water.
In such scheme, heat conducting pipe 6 is aluminum pipe, copper pipe or aluminium-alloy pipe.Heat-conducting silica gel sheet 5 both has good heat conduction
Property, heat conductivility is higher than the thermally conductive sheet of aluminium material, while has insulating properties again, can play a protective role to heater element, prevents
It is only short-circuit.
Embodiment 2
In such scheme, in order to quickly distribute the heat in cooling water to external environment condition, make cooling water temperature, it is described
Return pipe 4 is equipped with distal end radiator 9, which is arranged far from the position of heat source, and the heat in backwater is direct
Distribute into external environment condition.Such as in computer, distal end radiator 9 is arranged on the outside of computer, is arranged on the machine of desktop computer
Outside case, or the outside of laptop being arranged on, distal end radiator can be contacted directly with external environment condition, be radiated faster,
And user can dissipate distal end with the temperature of visual sense computer internal heating element, if distal end radiator temperature is high
Hot device implements certain heat sink conception, such as the scheme such as water cooling, air-conditioning or fan, these scheme works are obvious, and will not be right
Circuit causes any harmful effect.
Embodiment 3
A kind of specific scheme, the distal end radiator 9 are metalwork, and the recessed of increase heat dissipation area is equipped with its surface
Male structure, which can be surface bulge and groove or radiating fin, inside it equipped with aquaporin, water
Passage can be set to multiple straight channels, may be set to be a curved passage, have cooling water and metalwork and sufficiently connect
Touch, can be by the heat transfer in cooling water to metalwork.Cooling water is delivered to confession after metalwork radiates by return pipe 4
Water container 1.
Embodiment 4
Further scheme, the distal end radiator 9 are equipped with air-cooled radiator 10.By directly in distal end radiator
Upper setting fan, can accelerate to radiate.
Embodiment 5
For the ease of the heat sinking function of radiator is extended to multiple heat sources, the termal conductor module is including multigroup, respectively
The water inlet of group termal conductor module is connected by distribution joint of intaking with water inlet pipe, and the water outlet of each group termal conductor module is by going out
Moisture connector is connected with return pipe.Such as in the scheme of desktop computer or notebook, because termal conductor module is sheet, volume
The heat-conducting silica gel sheet of termal conductor module, can be separately fixed at several fevers such as CPU, video card, memory, hard disk, power supply by very little
On big device, then with water inlet distribution joint and water outlet distribution joint cooling water is distributed to each termal conductor module.By following
Ring water pump is unified to supply water to each termal conductor module.
In such scheme, for the ease of the replacement of cooling water in water supply container, the water supply container 1 is equipped with filler
11 and discharge outlet 12.
In such scheme, in order to accelerate the heat dissipation of water supply container internal cooling water, the water supply container 1 holds for metal
Device, is equipped with radiator fan 13 on water supply container 1.
In such scheme, water pump controller is further included, cooling-water temperature sensor 14, water pump control are equipped with the water supply container
The water pumping speed that the temperature-controlled circulation water that device is detected by cooling-water temperature sensor 14 pumps.
It should be noted that the foregoing is merely several preferred embodiments of the present invention, this hair is not limited to
Bright, although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it is still
It can modify to the technical solution described in foregoing embodiments, or which part technical characteristic is equally replaced
Change.Within the spirit and principles of the invention, any modification, equivalent replacement, improvement and so on, should be included in the present invention
Protection domain within.
Claims (8)
- A kind of 1. radiator, it is characterised in that：It includes water supply container, water circulating pump, water inlet pipe, return pipe and heat transfer group Part, termal conductor module include heat-conducting silica gel sheet, heat conducting pipe, the water supply connector for being connected to heat conducting pipe both ends and water out adapter, Heat-conducting silica gel sheet is internally provided with multiple thermal holes, and heat conducting pipe includes identical with the heat conduction hole number in heat-conducting silica gel sheet more Root heat conducting pipe, heat conducting pipe passed through from the thermal hole of heat conductive silica gel on piece and with heat conduction hole wall thermal contact conductance, water supply connector and go out Interface corresponding with each heat conducting pipe is designed with water swivel, water supply connector is equipped with a water inlet, and water out adapter is equipped with One water outlet, water inlet are connected by water inlet pipe with water supply container, and water outlet is connected by return pipe with water supply container, circulation Water pump continues the water in water supply container being delivered to heat conducting pipe and circulates the circulation for returning water supply container and realizing water.
- 2. radiator according to claim 1, it is characterised in that：The return pipe is equipped with distal end radiator, this is remote End radiator is arranged far from the position of heat source, and the heat in backwater is directly distributed into external environment condition.
- 3. radiator according to claim 2, it is characterised in that：The distal end radiator is metalwork, on its surface Concaveconvex structure equipped with increase heat dissipation area, inside it equipped with aquaporin, the water inlet end of aquaporin and water outlet are respectively with two The return pipe connection of side.
- 4. the radiator according to Claims 2 or 3, it is characterised in that：The distal end radiator is equipped with wind-cooling heat dissipating Device.
- 5. radiator according to claim 1, it is characterised in that：The termal conductor module includes multigroup, each group heat biography The water inlet of guide assembly is connected by distribution joint of intaking with water inlet pipe, and the water outlet of each group termal conductor module is distributed by water outlet Connector is connected with return pipe.
- 6. radiator according to claim 1, it is characterised in that：The water supply container is equipped with filler and draining Mouthful.
- 7. radiator according to claim 1, it is characterised in that：The water supply container is canister, for the water capacity Radiator fan is housed on device.
- 8. radiator according to claim 1, it is characterised in that：Water pump controller is further included, in the water supply container Equipped with cooling-water temperature sensor, the water pumping speed for the temperature-controlled circulation water pump that water pump controller is detected by cooling-water temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710734307.8A CN107969093B (en) | 2017-08-24 | 2017-08-24 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710734307.8A CN107969093B (en) | 2017-08-24 | 2017-08-24 | Radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107969093A true CN107969093A (en) | 2018-04-27 |
| CN107969093B CN107969093B (en) | 2019-10-29 |
Family
ID=61997544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710734307.8A Active CN107969093B (en) | 2017-08-24 | 2017-08-24 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107969093B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617145A (en) * | 2018-05-15 | 2018-10-02 | 重庆医药高等专科学校 | Library's noise monitoring system |
| CN110649811A (en) * | 2019-08-29 | 2020-01-03 | 合肥博雷电气有限公司 | High-power microwave power supply capable of efficiently dissipating heat |
| CN111091954A (en) * | 2020-01-15 | 2020-05-01 | 苏州海森电器有限公司 | Elevator control transformer |
| CN112503750A (en) * | 2020-12-03 | 2021-03-16 | 苏州市朗吉科技有限公司 | Auxiliary heat dissipation device for precise air conditioner of machine room |
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| JP2007107734A (en) * | 2005-10-11 | 2007-04-26 | Tokuden Co Ltd | Heat medium conduction heating plate |
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| CN203103334U (en) * | 2012-12-30 | 2013-07-31 | 西宁天谷农牧科技有限公司 | Water-cooling heat radiation device applied to photovoltaic array |
| CN204178306U (en) * | 2014-11-18 | 2015-02-25 | 西安邮电大学 | A kind of radiator for chip of computer |
| CN205194688U (en) * | 2015-12-15 | 2016-04-27 | 江苏迪昊特电子科技有限公司 | High -efficiency water cooling radiator |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060144566A1 (en) * | 2004-12-30 | 2006-07-06 | Jensen Kip B | System and method for cooling an integrated circuit device by electromagnetically pumping a fluid |
| JP2007107734A (en) * | 2005-10-11 | 2007-04-26 | Tokuden Co Ltd | Heat medium conduction heating plate |
| CN202720557U (en) * | 2012-06-25 | 2013-02-06 | 北京视博云科技有限公司 | Heat dissipation system |
| CN203103334U (en) * | 2012-12-30 | 2013-07-31 | 西宁天谷农牧科技有限公司 | Water-cooling heat radiation device applied to photovoltaic array |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617145A (en) * | 2018-05-15 | 2018-10-02 | 重庆医药高等专科学校 | Library's noise monitoring system |
| CN110649811A (en) * | 2019-08-29 | 2020-01-03 | 合肥博雷电气有限公司 | High-power microwave power supply capable of efficiently dissipating heat |
| CN111091954A (en) * | 2020-01-15 | 2020-05-01 | 苏州海森电器有限公司 | Elevator control transformer |
| CN112503750A (en) * | 2020-12-03 | 2021-03-16 | 苏州市朗吉科技有限公司 | Auxiliary heat dissipation device for precise air conditioner of machine room |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107969093B (en) | 2019-10-29 |
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Effective date of registration: 20230214 Address after: 518132 102, 211, Building 1, Jusheng Pharmaceutical Joint Workshop, east of Songbai Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, Guangdong Patentee after: Shenzhen Simps Technologies Co.,Ltd. Address before: 213164 No. 22, Ming Xin Road, Wujin District, Changzhou, Jiangsu. Patentee before: CHANGZHOU College OF INFORMATION TECHNOLOGY |