CN207719189U - A kind of CPU high fevers radiator - Google Patents
A kind of CPU high fevers radiator Download PDFInfo
- Publication number
- CN207719189U CN207719189U CN201820014997.XU CN201820014997U CN207719189U CN 207719189 U CN207719189 U CN 207719189U CN 201820014997 U CN201820014997 U CN 201820014997U CN 207719189 U CN207719189 U CN 207719189U
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- Prior art keywords
- heat
- fan
- cpu
- radiating
- water tank
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Abstract
The utility model is related to dissipation from electronic devices fields, espespecially a kind of CPU high fevers radiator, heat conducting pipe by heat transfer by the heat absorption of CPU onto itself, and it flows through on radiating fin, it is connected by heat-conducting plate between several radiating fins and forms guiding region, thermal property is passed using convection current, and fan heat is carried out out of guiding region, and temperature can be uniformly distributed by heat-conducting plate by each radiating fin surface, increase the area of heat dissipation, air-flow is guided by the first fan to radiate, cooling liquid can make radiating fin cool down in fluid line, accelerate the radiating efficiency to radiating fin.
Description
Technical field
The utility model is related to dissipation from electronic devices field, espespecially a kind of CPU high fevers radiator.
Background technology
With the increase of the number of transistors of semiconductor integrated circuit, the calorific value open country of device is with increase.Current computer
At the obstacle during development of computer, simple aluminum fin-stock adds fan structure for the fever of cpu chip and heat dissipation problem
The radiator being combined into can not meet current cooling requirements, and heat-pipe type radiator is all generally by desktop cpu radiator
Using.
At present there are bulky dimensions in the basic problem of desktop cpu radiator, and heavy and heat dissipation capacity is not high, and price is high
The problem of, these problems seriously hinder heat-pipe type radiator and are widely applied in desktop computer, since what is be related to can not manage
Analogy, is easy to keep heat transfer theory unintelligible, causes processing technology, process that can not more manage, so that it is inefficient, it is of high cost.
In all diabatic processes of radiator, the thermal resistance of cross-ventilation heat transfer is maximum, and existing radiator increases heat dissipation simply
The size and number of fin, it is desirable to improve heat dissipation capacity by increasing radiating surface, this not only increases the volumes of radiator, also
It increases manufacturing cost, and therefore heat dissipation capacity does not effectively improve, with the increase of heat dissipation area, corresponding air
The resistance for flowing through radiating fin also increases, and declines so as to cause air mass flow so that and the air themperature for flowing through radiating fin increases,
Affect the convection current heat-transfer effect of air.
Invention content
To solve the above problems, the utility model provides a kind of CPU high fevers radiator, have the function of high efficiency and heat radiation,
It is simple in structure, solve the problems, such as that the air themperature for flowing through radiating fin increases, low manufacture cost, good heat dissipation effect.
To achieve the above object, the technical solution adopted in the utility model is：A kind of CPU high fevers radiator includes
Heat absorption component and radiating subassembly, the heat sink include several radiating fins, the first fan, cooling fin, Yi Jiyong
The heat conducting pipe of heat transfer is carried out in carrying radiating fin and CPU, the heat conducting pipe is fitted in the surface of CPU, the radiating fin
It is looped around the surface of heat conducting pipe, the fin surface is equipped with location hole corresponding with the first fan, and cooling fin is arranged several
The first fan is set to fix on a heat sink on the side of a radiating fin and by location hole, wherein several described heat radiating fins
Be equipped with heat-conducting plate between piece, and connected by heat-conducting plate, the radiating subassembly include fluid line, water tank, water pump and
Second fan, the water tank are arranged in host, and the both ends of the fluid line are connected to water tank, and the second fan setting exists
The side of water tank, the water pump are arranged in the water inlet of fluid line, and the fluid line setting is fitted in several heat dissipations
On the another side of fin.
Further, also include lid, the water tank, which is equipped with, to be open, and the cover cap is located at the surface of opening, and opens
The edge of mouth is equipped with waterproof coating.
Further, the thickness of the radiating fin is less than the heat conduction plate thickness of cooling fin.
Further, guiding region is formed between several radiating fins, the heat-conducting plate is arranged in guiding region.
Further, further include having fixed plate and pedestal, the pedestal is equipped with preformed hole corresponding with fixed plate and sets
It sets in the lower section of CPU, the fixed mount setting is fixed in the lower end of heat conducting pipe, the geometrical clamp by screw and pedestal.
Further, the radiating fin passes through heat-conducting plate laid out in parallel.
Further, second fan is equipped with buckle, and the side of the water tank is equipped with groove corresponding with buckle, described
Second fan is fixed by buckling with groove and water tank.
Further, the side of first fan is equipped with LED light and controller, and the LED light is connect with controller.
Further, further include having temperature detector and being used for temperature indicator, fluid is arranged in the temperature detector
It is connect in pipeline and with temperature indicator, the outer wall in fluid line is arranged in the temperature indicator.
The beneficial effects of the utility model are：The utility model is equipped with several radiating fins, several radiating fins
Between connected by heat-conducting plate, and radiating fin is being arranged by the way of circular on the surface of heat conducting pipe, increases and heat conduction
The contact area of pipe, while making heat that can effectively increase the effect of heat dissipation with uniform conductive on radiating fin using heat-conducting plate
The both sides of rate, radiating fin are connect with the first fan, fluid line respectively, and radiating fin has been further speeded up by the first fan
Radiating efficiency, coolant liquid body is stored in fluid line, the heat of heat conducting pipe, which passes through the cooling liquid in fluid line, to carry out
Heat dissipation, and radiated by the cooling liquid in the second fan fluid pipe road, drive coolant liquid flowing always by water pump
Constant flow in body pipeline, wherein fluid line is arranged using setting mode on the surface of radiating fin, increases and fluid hose
The heating surface area in road solves traditional heat sinks by said effect and flows through radiating fin to accelerate the heat dissipation to heat conducting pipe
Air themperature increase the problem of, simple in structure, low manufacture cost, good heat dissipation effect.
Description of the drawings
Fig. 1 is the structure chart of the utility model.
Fig. 2 is the side view of the utility model.
Drawing reference numeral explanation：1. radiating fin；2. the first fan；3. cooling fin；4. heat conducting pipe；5. heat-conducting plate；6. fluid
Pipeline；7. water tank；8. water pump；9. the second fan.
Specific implementation mode
It please refers to Fig.1 shown in -2, the utility model includes heat absorption group about a kind of radiator applied to CPU heat dissipations
Part and radiating subassembly, the heat sink include several radiating fins 1, the first fan 2, cooling fin 3 and for holding
It carries radiating fin 1 and CPU carries out the heat conducting pipe 4 of heat transfer, the heat conducting pipe 4 is fitted in the surface of CPU, the radiating fin 1
It is looped around the surface of heat conducting pipe 4,3 surface of the cooling fin is equipped with location hole corresponding with the first fan 2, and the setting of cooling fin 3 exists
So that the first fan 2 is fixed on cooling fin 3 on the side of several radiating fins 1 and by location hole, wherein it is described several
It is equipped with heat-conducting plate 5 between radiating fin 1, and is connected by heat-conducting plate 5, the radiating subassembly includes fluid line 6, water tank
7, water pump 8 and the second fan 9, the water tank 7 are arranged in host, and the both ends of the fluid line 6 are connected to water tank 7, institute
It states the second fan 9 to be arranged in the side of water tank 7, the water pump 8 is arranged in the water inlet of fluid line 6, the fluid line 6
Setting is fitted on the another side of several radiating fins 1.
Further, also include lid, the water tank 7, which is equipped with, to be open, and the cover cap is located at the surface of opening, and opens
The edge of mouth is equipped with waterproof coating, and the loss of moisture content is reduced by waterproof coating, and makes moisture content that can not cause from opening outflow
Damage device.
Further, the thickness of the radiating fin 1 is less than 5 thickness of heat-conducting plate of cooling fin 3, by increasing heat-conducting plate 5
Thickness be used to accelerate contact area between radiating fin 1, make radiating efficiency faster.
Further, guiding region is formed between several radiating fins 1, the heat-conducting plate 5 is arranged in guiding region, air
Air-flow drives the heat on 1 surface of radiating fin to be transmitted in air by guiding region, realizes the effect of convection current heat transfer.
Further, further include having fixed plate and pedestal, the pedestal is equipped with preformed hole corresponding with fixed plate and sets
It sets in the lower section of CPU, the fixed mount setting is fixed by screw and pedestal, passed through in the lower end of heat conducting pipe 4, the geometrical clamp
Fixed plate and pedestal make heat conducting pipe 4 steadily be fitted on the surface of CPU, are not in cause CPU to burn because fitting is unstable
Bad phenomenon.
Further, the radiating fin 1 is by 5 laid out in parallel of heat-conducting plate, can with the heat of uniform pickup heat conducting pipe 4,
And provide ornamental value.
Further, second fan 9 is equipped with buckle, and the side of the water tank 7 is equipped with groove corresponding with buckle, institute
The second fan 9 is stated to be fixed with groove and water tank 7 by buckling, for fixing the connection between water tank 7 and the second fan 9,
Strengthen the connection effect of the second fan 9 and water tank 7.
Further, the side of first fan 2 is equipped with LED light and controller, and the LED light connects with controller
It connects, the replacement of also color can carry out LED light by controller, and control the switch of LED light, there is ornamental value.
Further, further include having temperature detector and being used for temperature indicator, fluid is arranged in the temperature detector
It is connect in pipeline 6 and with temperature indicator, the outer wall in fluid line 6 is arranged in the temperature indicator, passes through temperature indicator
Water temperature degree Celsius can be monitored in real time, whether observation water temperature belongs in normal range (NR).
Compared with prior art, the utility model is equipped with several radiating fins 1, passes through between several radiating fins 1
Heat-conducting plate 5 connects, and radiating fin 1 is being arranged by the way of circular on the surface of heat conducting pipe 4, increases and heat conducting pipe 4
Contact area, while making heat that can effectively increase the efficiency of heat dissipation with uniform conductive on radiating fin 1 using heat-conducting plate 5,
The both sides of radiating fin 1 are connect with the first fan 2, fluid line 6 respectively, and heat radiating fin has been further speeded up by the first fan 2
The radiating efficiency of piece 1 is stored with coolant liquid body in fluid line 6, and the heat of heat conducting pipe 4 passes through the coolant liquid in fluid line 6
Body radiates, and is radiated by the cooling liquid in 9 fluid pipe road 6 of the second fan, and coolant liquid is driven by water pump 8
The constant flow in fluid line 6 always, wherein fluid line 6 is arranged using setting mode on the surface of radiating fin 1, increases
Add the heating surface area with fluid line 6, to accelerate the heat dissipation to heat conducting pipe 4, solves traditional heat-dissipating by said effect
The problem of air themperature that device flows through radiating fin 1 increases, simple in structure, low manufacture cost, good heat dissipation effect.
The utility model use principle：Heat conducting pipe 4 by heat transfer by the heat absorption of CPU onto itself, and flow through
On radiating fin 1, guiding region is connected and formed by heat-conducting plate 5 between several radiating fins 1, the spy conducted heat using convection current
Property fan heat is carried out out of guiding region, and temperature can be uniformly distributed by heat-conducting plate 5 by 1 surface of each radiating fin, increased
The area of heat dissipation guides air-flow by the first fan 2 and radiates, and cooling liquid can make radiating fin 1 in fluid line 6
Cooling, accelerates the radiating efficiency to radiating fin 1.
In this specific embodiment, the heat conducting pipe 4 of the utility model includes four equal-sized heat conducting pipes 4 and uses double
The mode of row staggeredly is composed, and accelerates to transmit the heat of CPU；First fan 2 and the second fan 9 are quiet fan and lead to
Speed governing can be carried out by crossing host computer.
In this specific embodiment, cooling liquid is all made of aqueous solution.
Embodiment of above is only that preferred embodiments of the present invention are described, not to the utility model
Range be defined, under the premise of not departing from the spirit of the design of the utility model, this field ordinary engineering and technical personnel to this
The various modifications and improvement that the technical solution of utility model is made should all fall into the guarantor that claims of the utility model determine
It protects in range.
Claims (9)
1. a kind of CPU high fevers radiator includes heat absorption component and radiating subassembly, which is characterized in that the heat sink
Include several radiating fins, the first fan, cooling fin and carries out leading for heat transfer for carrying radiating fin and CPU
Heat pipe, the heat conducting pipe are fitted in the surface of CPU, and the radiating fin is looped around the surface of heat conducting pipe, the fin surface
Equipped with location hole corresponding with the first fan, cooling fin is arranged on the side of several radiating fins and makes by location hole
One fan is fixed on a heat sink, wherein is equipped with heat-conducting plate between several described radiating fins, and is connected by heat-conducting plate
It connects, the radiating subassembly includes fluid line, water tank, water pump and the second fan, the both ends of the fluid line and water tank
Connection, the water tank are arranged in host, and second fan is arranged in the side of water tank, and the water pump is arranged in fluid nozzle
Water inlet in, fluid line setting is fitted on the another side of several radiating fins.
2. a kind of CPU high fevers radiator according to claim 1, which is characterized in that also include lid, the water tank
Equipped with opening, the cover cap is located at the surface of opening, and the edge being open is equipped with waterproof coating.
3. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the thickness of the radiating fin is small
In the heat conduction plate thickness of cooling fin.
4. a kind of CPU high fevers radiator according to claim 1, which is characterized in that shape between several radiating fins
At guiding region, the heat-conducting plate is arranged in guiding region.
5. a kind of CPU high fevers radiator according to claim 1, which is characterized in that further include having fixed plate and bottom
Seat, the pedestal are equipped with preformed hole corresponding with fixed plate and are arranged in the lower section of CPU, and the fixed mount setting is in heat conducting pipe
Lower end, the geometrical clamp are fixed by screw and pedestal.
6. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the radiating fin passes through heat conduction
Plate laid out in parallel.
7. a kind of CPU high fevers radiator according to claim 1, which is characterized in that second fan is equipped with buckle,
The side of the water tank is equipped with groove corresponding with buckle, and second fan is fixed by buckling with groove and water tank.
8. a kind of CPU high fevers radiator according to claim 1, which is characterized in that the side of first fan is set
There are LED light and controller, the LED light to be connect with controller.
9. a kind of CPU high fevers radiator according to claim 1, which is characterized in that further include have temperature detector with
And it is used for temperature indicator, it is connect in the temperature detector setting fluid line and with temperature indicator, the temperature display
The outer wall in fluid line is arranged in device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820014997.XU CN207719189U (en) | 2018-01-04 | 2018-01-04 | A kind of CPU high fevers radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820014997.XU CN207719189U (en) | 2018-01-04 | 2018-01-04 | A kind of CPU high fevers radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719189U true CN207719189U (en) | 2018-08-10 |
Family
ID=63054906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820014997.XU Expired - Fee Related CN207719189U (en) | 2018-01-04 | 2018-01-04 | A kind of CPU high fevers radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719189U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110430738A (en) * | 2019-08-28 | 2019-11-08 | 福建晋江热电有限公司 | Cooling device |
| CN112286322A (en) * | 2020-11-05 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for actively radiating heat of server memory |
| CN112605145A (en) * | 2020-12-01 | 2021-04-06 | 浙江富丽华铝业有限公司 | High-efficient cooling device is used in aluminium alloy hot extrusion moulding |
-
2018
- 2018-01-04 CN CN201820014997.XU patent/CN207719189U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110430738A (en) * | 2019-08-28 | 2019-11-08 | 福建晋江热电有限公司 | Cooling device |
| CN110430738B (en) * | 2019-08-28 | 2024-04-12 | 国能神福(晋江)热电有限公司 | Cooling device |
| CN112286322A (en) * | 2020-11-05 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for actively radiating heat of server memory |
| CN112605145A (en) * | 2020-12-01 | 2021-04-06 | 浙江富丽华铝业有限公司 | High-efficient cooling device is used in aluminium alloy hot extrusion moulding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180810 Termination date: 20200104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |