CN107946278B - 用于自动车辆的球栅阵列射频集成电路印刷电路板组件 - Google Patents

用于自动车辆的球栅阵列射频集成电路印刷电路板组件 Download PDF

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CN107946278B
CN107946278B CN201710947219.6A CN201710947219A CN107946278B CN 107946278 B CN107946278 B CN 107946278B CN 201710947219 A CN201710947219 A CN 201710947219A CN 107946278 B CN107946278 B CN 107946278B
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metal layer
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CN107946278A (zh
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G·J·泊登
S·施
D·W·齐默曼
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Aptiv Technologies Ltd
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Abstract

公开了一种用于自动车辆的球栅阵列射频集成电路印刷电路板组件。一种球栅阵列印刷电路板组件包括管芯、多个焊球、基片、顶部金属层和底部金属层。管芯包括信号输出焊盘和在信号输出焊盘周围布置的多个接地焊盘。顶部金属层、在基片中的多个通孔和底部金属层协作以形成基片集成波导。顶部金属层被配置为限定在与信号输出焊盘和基片集成波导对齐的顶部金属层的信号部分以及与多个接地焊盘对齐的顶部金属层的接地部分之间的U型槽。U形槽由基于信号的频率而选择的槽长度和基于通孔高度而选择的槽宽度表征，使得信号产生跨U形槽引导的电场，由此信号从顶部金属层的信号部分传播到基片集成波导中。

Description

用于自动车辆的球栅阵列射频集成电路印刷电路板组件
技术领域
本公开总体上涉及BGA电路组件，且更具体地涉及在顶部金属层中使用U形槽以产生跨U形槽引导的电场，由此信号从U形槽直接地传播进入基片集成波导(SIW)。
背景技术
用各种各样的感测***配备自动车辆是公知的。各种传感器配置已经被开发以向驾驶员或自主控制器提供与车辆周围的环境有关的辅助或者信息。射频信号技术的进步已使复杂的片上***集成电路得以发展。环境感测或者通信所需的功能可以被实现在集成电路部件中。这种设备的示例用途包括机动车雷达检测***、机器人引导***和Wi-Fi数据传输。
用于射频(RF)信号传输的天线可依据特定的感兴趣的感测或者通信而改变。例如，较小的低增益宽带天线被用于Wi-Fi通信，以及较大的高增益天线通常被用于点对点的数据通信。用于机动车雷达***的天线通常落在这两个极端之间。可被用于在车载雷达***中传播RF信号的一种类型的天线部件被称为基片集成波导(SIW)。SIW因高效率而合乎期望且其相对低成本。
与将SIW用于车载感测或通信***相关的一个挑战是与集成电路和SIW之间的连接相关联的。例如，微带或者共面波导微波传输线可以提供集成电路和SIW之间的接口。然而，此类连接包含诸如需要与对每条传输线而言是独特的场配置相匹配的微波部件之类的缺点。与此类微波部件相关联的转换增加了微波损失并且引入了微波反射，这可能会限制带宽并且影响产生此类***的能力。当使用微带时，带宽可能会受到从集成电路部件连接器穿过SIW基片到该基片上的金属层的接地连接的要求的限制。此外，此类连接通常利用相对较贵的盲孔工艺制造。
发明内容
本文所述的是高频电路板组件，其包括形成将附接球栅阵列的射频集成电路输出直接地连接到由印刷电路板(PCB)上的特征物形成的基片集成波导(SIW)的装置。该组件通过消除诸如微带之类的各种互连转换克服了上文所描述的问题，这使***性能最大化的同时复杂度最小化。该直接连接允许射频(RF)能量由或经过蚀刻在PCB顶部电阻层中的U形槽从集成电路被直接地辐射进入SIW。U形槽的谐振频率由U的槽长度确定或影响，其中该长度是U的周长的总数也就是说，当在这页上浏览该U时，该长度是在该U的上下方向所测量的距离的两倍加上在U的左右方向上所测量的距离之和。来自U形槽的RF能量的耦合效率由与U形槽的基座的宽度相对应的形状宽度确定或影响。也就是说，该形状宽度在这页上的跨U的左右方向上被测量。用于形成SIW的通孔中的一些也用于形成有助于向期望的SIW的传播方向引导或反射RF能量的背部短路(back-short)。
根据一个实施例，提供了一种附接球栅阵列的射频集成电路印刷电路板组件。该组件包括管芯、多个焊球、基片、顶部金属层和底部金属层。该管芯包括信号输出焊盘和在信号输出焊盘周围布置的多个接地焊盘。该管芯可操作用于经由信号输出焊盘输出信号。该信号由频率表征。多个焊球用于附接管芯。该基片限定一平面且包括垂直于该平面取向的且从基片的顶侧延伸到基片的底侧的多个通孔。多个通孔由对应于基片厚度的通孔高度表征。顶部金属层附接到基片的顶侧。顶部金属层配置为给多个焊球提供焊垫以将管芯附接到顶部金属层。顶部金属层被附接到基片的底侧。顶部金属层、基片中的多个通孔和底部金属层协作以形成适合于在平行于基片平面的方向上传播信号的基片集成波导。顶部金属层配置为限定在与信号输出焊盘和基片集成波导对齐的顶部金属层的信号部分以及与多个接地焊盘对齐的顶部金属层的接地部分之间的U型槽。该U形槽由基于信号的频率而选择的槽长度和基于通孔高度而选择的槽宽度表征，使得信号产生跨U形槽引导的电场，由此信号从顶部金属层的信号部分传播到基片集成波导中。
在阅读优选实施例的下列详细描述并参考各个附图，进一步的特征和优点将更加显而易见，优选实施例只是作为非限制性示例给出的。
附图说明
现在将参考各个附图作为示例来描述本发明，附图中：
图1是根据一个实施例的配备有感测设备的自动车辆；
图2是根据一个实施例的在图1的感测设备中使用的电路组件的等距视图；
图3是根据一个实施例的在图2的电路组件中使用的印刷电路板的俯视图；以及，
图4是根据一个实施例的图2的电路组件的部分组件的侧视图。
具体实施方式
本发明的实施例提供一种具有在附接球栅阵列的集成电路管芯和基片集成波导(SIW)之间的改进连接的信号设备。本发明的实施例有利地消除了管芯和SIW之间的互连转换，这使***性能最大化的同时使复杂度最小化。
图1示出了配备有多个信号设备122的自动车辆120的非限制性示例。如本文所使用的，术语“自动车辆”覆盖较宽范围的自动程度或自动等级，包括当自动车辆120正在处于完全自动或自主模式***作时的实例，其中自动车辆120的操作人员(未示出)可以仅仅指定目的地以便操作该自动车辆120。还预期到，当自动车辆120处于自动程度或自动等级可能仅激活告警指示(可视的和/或可听的)以帮助所需的操作人员改变道路和/或避免与例如其他车辆的干扰和/或碰撞的手动模式操作时，本文所展示的教导是有用的。
作为示例，信号设备122可能配置为雷达传感器，其对于基于由信号设备122传送的雷达信号124来检测在自动车辆120附近的物体而言是有用的。这类信号设备122对于停车辅助、碰撞避免以及其他物体检测功能也可能是有用的。
图2示出了附接球栅阵列的射频集成电路印刷电路板组件10(下文称为组件10)的非限制性示例，其可能是信号设备122的一个或多个实例的部分。通常而言，该组件10配置为从管芯14(即，集成电路)向天线(未示出)传播射频信号(下文称为信号12)。组件10的设计提供足够的可靠性，使得组件10将适合于在自动车辆120上使用。
该管芯14包括信号输出焊盘16和在信号输出焊盘16周围布置的多个接地焊盘18。尽管这个非线性示例具有除了被标识为接地焊盘的信号输出焊盘16之外的所有焊盘，本领域技术人员将认识到将存在用于其他信号和功率的额外的焊盘。事实上，在复杂的附接球栅阵列(BGA)的集成电路上可能存在几百个焊盘以及相对应的焊球。例如，只有与微波操作有关的小部分、限制数量的焊盘和焊球被示出，仅为了简化该附图。该管芯14通常可操作用于经由信号输出焊盘16输出信号，其中，例如如果信号设备122是雷达传感器，信号可以由例如七十七千兆赫兹(77GHz)的频率表征。
该组件10包括用于将管芯附接到印刷电路板22(下文称为PCB 22)的多个焊球20。商业可用的焊球的多个构想对于本领域技术人员是公知的。通常地，在将带有焊球的管芯14与PCB 22上的焊垫24(图3)的相对应示例对齐且将带有焊球的管芯14放置在PCB 22上的焊垫24的相对应示例上之前，焊球被附接到管芯14，且接着该组件10被足够地加热以熔化或回流多个焊球20并由此将管芯14焊接到PCB 22。
该PCB 22包括图2所示的限定平行于x轴和y轴的平面30的基片26。该基片26由任何许多合适的商业可用的材料形成，如本领域技术人员将认识到。基片26包括垂直于平面30(即，平行于z轴)取向的且从基片26的顶侧32(图4)延伸到基片26的底侧34的多个通孔28。多个通孔28由对应于(即，等于或基本上等于)基片26的厚度的通孔高度36表征。多个通孔28的每一个优选地是与镀穿孔(plated-through-hole)或镀孔(plated-via)可比较的导电元件，这对于PCB领域的技术人员是公知的。如果需要，多个通孔28可以填充有导电材料或非导电材料。
图3和图4显示了包括附接到基片26的顶侧32的顶部金属层38的PCB 22的额外的非限制细节。与覆盖顶部金属层38的部分的焊料掩膜48协作的顶部金属层38被配置为提供用于多个焊球20的焊垫24以将管芯14附接到顶部金属层38。PCB 22还包括附接到基片26的底侧34的底部金属层44。能被购买到的具有已经被附接到基片26的顶部金属层38和底部金属层44的层压件(laminate)或预浸件(prepreg)的合适示例是来自
Figure GDA0002440397400000041
的型号IT-150DA，其厚度为0.5mm、介电常数(Dk)为3.5且损耗正切(tand)为0.005
穿过购买的层压件钻出多个通孔28，并接着利用随后的电镀工艺以电镀多个通孔28中的各个通孔且由此将顶部金属层38电连接到(直流式)底部金属层44。如本领域技术人员将认识到的，顶部金属层38、穿过基片26的多个通孔28和底部金属层44接着协作以形成适合于在平行于基片26的平面30的方向46上传播信号12的基片集成波导50(下文称为SIW50)。如果信号12具有77GHz的频率，多个通孔28的合适的尺寸包括0.25mm的通孔直径和0.45mm的通孔间距或通孔节距。
为了在回流期间约束焊球20的焊料，并帮助管芯14与PCB 22对齐，PCB 22可以有利地包括覆盖至少管芯14下面的顶部金属层38的部分的焊料掩膜48。也就是说，焊料掩膜48可以用于限定在顶部金属层38的邻接或连续区域的顶部的焊垫24的位置。虽然焊料掩膜48被示出为仅延伸至管芯14的边界，但这不是必要。焊料掩膜48可被延伸至覆盖顶部金属层38的全部且对性能几乎不产生影响。如果需要，焊料掩膜也可以被涂覆在底部金属层上面，这可以对形成底部金属层44的金属提供一些环境保护，如果顶部金属层38也被焊料掩膜48完全覆盖，那么焊料掩膜潜在地在温度循环期间减少PCB 22的自身弯曲。
为了将信号12从管芯14的信号输出焊盘16直接地耦合到SIW 50中，顶部金属层38被配置为在与信号输出焊盘16和SIW 50对齐的顶部金属层38的信号部分54以及与多个接地焊盘18对齐的顶部金属层38的接地部分56之间限定U形槽52。该U形槽52可利用公知的光蚀刻工艺形成在顶部金属层38中。U形槽52被提供使得相对于多个接地焊盘18波动的在信号输出焊盘16处的电压将引起交替电场跨U形槽52形成且由此将RF能量投射入或发射到SIW 50中。U形槽52由基于信号12的频率而选择的槽长度58(例如对于77GHz的3.2mm)和形状宽度60来表征。U形槽52也由至少部分基于通孔高度36而选择的槽宽度64表征。形状宽度60影响来自跨U形槽52引导的电场的能量如何良好地或如何有效地从顶部金属层38的信号部分54传播到基片集成波导(即，SIW50)中。认识到，使槽宽度64尽可能小是有利的，但是最小尺寸由光蚀刻工艺的能力决定。还认识到，由通孔高度36除以槽宽度64而限定的比值越大，进入SIW 50的射频能量的耦合越好。作为示例但不限制，如果槽宽64是0.1mm，那么相对低廉的光蚀刻工艺被预期以提供U形槽52的可靠和限定清楚的实例。还相信，上文限定的最小值应该大于三，所以通孔高度36的最小推荐值是0.3mm。因为具有0.5mm厚度的基片容易获得且相当耐用，0.5mm是通孔高度36的建议值。
作为进一步的示例但不限制，信号部分54和接地部分56被认为协作以形成将信号12从管芯14直接地传送进到基片集成波导(SIW 50)中的平面波导。如本文所用，使用“直接地”意味着没有中间微波组分存在于附接到信号部分54的焊球和SIW 50之间的信号路径上。
多个接地焊盘18被布置在信号输出焊盘16的周围，信号输出焊盘被布置为使得附接到多个接地焊盘18的焊球20形成用于减少从附接到信号输出焊盘16的焊球20所辐射的信号12的泄露的屏蔽件62。在该示例中，由于信号输出焊盘16紧邻于管芯14的边缘，屏蔽件62的U形被选择。如果管芯14被示出为基本上更大且具有许多更多的焊垫和焊球，则预期到如果泄露是特别的问题，那么接地焊盘和相关的焊球可以被布置为多个同心环。
因此，提供了一种附接球栅阵列的射频集成电路印刷电路板组件(组件10)。本文所描述的设计配置通过测量验证。创新特征包括：信号输出焊盘16直接连接到SIW 50；消除诸如微带之类的从管芯14到中间部件的转换以及从中间部件到SIW 50的转换；利用标准平面印刷电路板技术实现U形槽52的辐射结构；不需要外部部件或特殊工艺；以及通过调整U形槽尺寸和位置来提供管芯输出阻抗或电路不连续性(匹配)的补偿。
尽管根据本发明的优选实施例已经描述了本发明，但是并不限制于此，而是仅在所附的权利要求书所阐述的范围内为限。

Claims (4)

1.一种附接球栅阵列的射频集成电路印刷电路板组件(10)，其配置为传播射频信号(12)且在自动车辆(120)中使用，所述组件(10)包括：
管芯(14)，其包括信号输出焊盘(16)和在所述信号输出焊盘(16)周围布置的多个接地焊盘(18)，所述管芯(14)能操作用于经由所述信号输出焊盘(16)输出信号(12)，所述信号(12)由频率表征；
用于附接所述管芯(14)的多个焊球(20)；
基片(26)，其限定平面(30)且包括垂直于所述平面(30)取向的且从所述基片(26)的顶侧(32)延伸到所述基片(26)的底侧(34)的多个通孔(28)，其中所述多个通孔(28)由对应于所述基片(26)的厚度的通孔高度(36)来表征；
顶部金属层(38)，其附接到所述基片(26)的所述顶侧(32)，所述顶部金属层(38)配置为给所述多个焊球(20)提供焊垫(24)以将所述管芯(14)附接到所述顶部金属层(38)；以及
底部金属层(44)，其附接到所述基片(26)的所述底侧(34)，其中所述顶部金属层(38)、穿过所述基片(26)的所述多个通孔(28)和所述底部金属层(44)协作以形成用于在平行于所述基片(26)的所述平面(30)的方向(46)上传播所述信号(12)的基片集成波导(50)，
其中所述顶部金属层(38)被配置为限定所述顶部金属层(38)的信号部分(54)与所述顶部金属层(38)的接地部分(56)之间的U形槽(52)，所述信号部分(54)与所述信号输出焊盘(16)和所述基片集成波导(50)对齐，所述接地部分(56)与所述多个接地焊盘(18)对齐，所述U形槽(52)由基于所述信号(12)的频率而选择的槽长度(58)和基于所述通孔高度(36)而选择的槽宽度(64)表征，使得所述信号(12)产生跨所述U形槽(52)引导的电场，由此所述信号(12)从所述顶部金属层(38)的所述信号部分(54)传播到所述基片集成波导(50)中。
2.根据权利要求1所述的组件(10)，其中所述信号部分(54)和所述接地部分(56)协作以形成将所述信号(12)从管芯(14)直接地传送到所述基片集成波导(50)中的平面波导。
3.根据权利要求1所述的组件(10)，其中被布置在所述信号输出焊盘(16)周围的所述多个接地焊盘(18)被布置为使得附接到所述多个接地焊盘(18)的焊球(20)形成用于减少从附接到所述信号输出焊盘(16)的焊球(20)所辐射的所述信号(12)的泄露的屏蔽件(62)。
4.根据权利要求1所述的组件(10)，其中由所述通孔高度(36)除以所述槽宽度(64)所限定的比率大于三。
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