CN107940563B - Machine and air conditioner in air conditioning - Google Patents

Machine and air conditioner in air conditioning Download PDF

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Publication number
CN107940563B
CN107940563B CN201711125847.2A CN201711125847A CN107940563B CN 107940563 B CN107940563 B CN 107940563B CN 201711125847 A CN201711125847 A CN 201711125847A CN 107940563 B CN107940563 B CN 107940563B
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China
Prior art keywords
refrigerant
air conditioner
indoor unit
semiconductor
inlet pipe
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CN201711125847.2A
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CN107940563A (en
Inventor
刘通
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Hisense Shandong Air Conditioning Co Ltd
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Hisense Shandong Air Conditioning Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/0007—Indoor units, e.g. fan coil units
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/0007—Indoor units, e.g. fan coil units
    • F24F1/0059—Indoor units, e.g. fan coil units characterised by heat exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/30—Arrangement or mounting of heat-exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

The embodiment of the invention provides an air conditioner indoor unit and an air conditioner, relates to the technical field of air conditioners, and can reduce energy loss and improve the efficiency of the air conditioner. The air-conditioning indoor unit comprises a shell and an evaporator arranged in the shell, wherein an inlet of the evaporator is connected with a refrigerant inlet pipe, an outlet of the evaporator is connected with a refrigerant outlet pipe, and when the air-conditioning indoor unit performs refrigeration cycle, a refrigerant flows into the evaporator from the refrigerant inlet pipe and then flows into the refrigerant outlet pipe from the outlet of the evaporator; further comprising: the semiconductor refrigeration device and the controller are used for controlling the semiconductor refrigeration device to be electrified; the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe. The invention is used for the indoor unit of the air conditioner.

Description

Machine and air conditioner in air conditioning
Technical Field
The invention relates to the technical field of air conditioners, in particular to an air conditioner indoor unit and an air conditioner.
Background
At present, an auxiliary electric heater is generally arranged in an air conditioner indoor unit of a household air conditioner, and the auxiliary electric heater is started to improve indoor heating capacity under an extremely cold weather condition, so that the user demand is met. However, the efficiency of the current electric heater is not more than 1, namely, the generated heat is not more than the input electric energy. This causes a reduction in air conditioning efficiency in a heating state and an increase in power consumption. In addition, the design of the refrigerating system of the current household air conditioner is relatively mature, the indoor evaporators are all designed in such a way that the inlets of the evaporators are connected with a refrigerant inlet pipe, and the outlets of the evaporators are connected with a refrigerant outlet pipe. The heat exchange amount in the room mainly comes from the tube-fin heat exchanger of the evaporator, and the cold and heat losses on the refrigerant inlet pipe and the refrigerant outlet pipe are not considered. This also causes energy loss, further causing a reduction in air conditioning efficiency.
Disclosure of Invention
The embodiment of the invention provides an air conditioner indoor unit and an air conditioner, which can reduce energy loss and improve the efficiency of the air conditioner.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
on one hand, the embodiment of the invention provides an air-conditioning indoor unit, which comprises a shell and an evaporator arranged in the shell, wherein an inlet of the evaporator is connected with a refrigerant inlet pipe, an outlet of the evaporator is connected with a refrigerant outlet pipe, and when the air-conditioning indoor unit performs refrigeration cycle, refrigerant flows into the evaporator from the refrigerant inlet pipe and then flows into the refrigerant outlet pipe from the outlet of the evaporator; further comprising:
the semiconductor refrigeration device comprises a semiconductor refrigeration device and a controller for controlling the semiconductor refrigeration device to be electrified;
the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe.
On the other hand, an embodiment of the present invention provides an air conditioner, including an outdoor unit of an air conditioner, and any one of the above indoor units of an air conditioner.
The air-conditioning indoor unit comprises a shell and an evaporator arranged in the shell, wherein an inlet of the evaporator is connected with a refrigerant inlet pipe, an outlet of the evaporator is connected with a refrigerant outlet pipe, and when the air-conditioning indoor unit performs refrigeration cycle, refrigerant flows into the evaporator from the refrigerant inlet pipe and then flows into the refrigerant outlet pipe from the outlet of the evaporator; further comprising: the semiconductor refrigeration device and the controller are used for controlling the semiconductor refrigeration device to be electrified; the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe. Compared with the prior art, the semiconductor refrigerating device is additionally arranged in the air-conditioning indoor unit, and when a heating cycle is carried out, the heat generated by the hot end of the semiconductor refrigerating device is far greater than the input electric power of the semiconductor refrigerating device, so that compared with an auxiliary electric heater in the prior art, the efficiency of auxiliary heating by using the semiconductor refrigerating device is higher, and the efficiency of the air conditioner is improved. Meanwhile, the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe, so that when the indoor unit of the air conditioner works, the cold end of the semiconductor refrigerating device and the refrigerant in the refrigerant inlet pipe can exchange heat, and/or the hot end of the semiconductor refrigerating device and the refrigerant in the refrigerant outlet pipe can exchange heat, so that the cold or heat to be wasted in part of the refrigerant inlet pipe and/or the refrigerant outlet pipe is recovered, the energy loss is reduced, and the efficiency of the air conditioner is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of an air conditioner indoor unit according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of an air conditioner indoor unit according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of an air conditioner indoor unit according to an embodiment of the present invention;
fig. 4 is a fourth schematic structural diagram of an air conditioning indoor unit according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an air conditioning indoor unit, as shown in fig. 1 to 4, including a casing and an evaporator 11 disposed in the casing, an inlet of the evaporator 11 is connected to a refrigerant inlet pipe 12, an outlet of the evaporator 11 is connected to a refrigerant outlet pipe 13, when the air conditioning indoor unit performs a refrigeration cycle, a refrigerant flows into the evaporator 11 from the refrigerant inlet pipe 12, and then flows into the refrigerant outlet pipe 13 from the outlet of the evaporator 11; the air-conditioning indoor unit further comprises: the semiconductor refrigeration device 14 and a controller for controlling the energization of the semiconductor refrigeration device 14; the cold end 141 of the semiconductor refrigerating device 14 is attached to the refrigerant inlet pipe 12; and/or the hot end 142 of the semiconductor refrigeration device 14 is attached to the refrigerant outlet pipe 13.
The embodiment of the present invention does not limit the specific cross-sectional shapes of the refrigerant inlet pipe 12 and the refrigerant outlet pipe 13, and in practical applications, the refrigerant inlet pipe 12 and the refrigerant outlet pipe 13 generally adopt circular pipes. The specific shapes of cold end 141 and hot end 142 of semiconductor refrigeration device 14 are not limited in the embodiments of the present invention. Preferably, in order to make the heat transfer between the cold end 141 of the semiconductor refrigeration device 14 and the refrigerant inlet pipe 12 more efficient, and/or the heat transfer between the hot end 142 of the semiconductor refrigeration device 14 and the refrigerant outlet pipe 13 more efficient, the cold end 141 of the semiconductor refrigeration device 14 is generally configured to be adapted to the shape of the refrigerant inlet pipe 12, so that the joint surface between the cold end 141 of the semiconductor refrigeration device 14 and the refrigerant inlet pipe 12 is larger, and the heat transfer is more efficient; and/or the hot end 142 of the semiconductor refrigeration device 14 is arranged to be adaptive to the shape of the refrigerant outlet pipe 13, so that the joint surface between the hot end 142 of the semiconductor refrigeration device 14 and the refrigerant outlet pipe 13 is large, and the heat transfer is more efficient.
Therefore, compared with the prior art, the semiconductor refrigerating device is additionally arranged in the air-conditioning indoor unit, and when a heating cycle is carried out, the heat generated by the hot end of the semiconductor refrigerating device is far greater than the input electric power of the semiconductor refrigerating device, so that compared with an auxiliary electric heater in the prior art, the efficiency of auxiliary heating by using the semiconductor refrigerating device is higher, and the efficiency of the air conditioner is improved. Meanwhile, the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe, so that when the indoor unit of the air conditioner works, the cold end of the semiconductor refrigerating device and the refrigerant in the refrigerant inlet pipe can exchange heat, and/or the hot end of the semiconductor refrigerating device and the refrigerant in the refrigerant outlet pipe can exchange heat, so that the cold or heat to be wasted in part of the refrigerant inlet pipe and/or the refrigerant outlet pipe is recovered, the energy loss is reduced, and the efficiency of the air conditioner is further improved.
Optionally, referring to fig. 1, when the hot end 142 of the semiconductor refrigeration device 14 is not attached to the refrigerant outlet pipe 13, the surface of the cold end 141 of the semiconductor refrigeration device 14, which is not attached to the refrigerant inlet pipe 12, is coated with a heat insulating material; the controller is used for controlling the semiconductor refrigerating device 14 to be electrified when the air-conditioning indoor unit performs heating circulation. The cold energy generated by the cold end 141 of the semiconductor refrigeration device 14 does not enter the indoor air by wrapping the surface of the cold end 141 of the semiconductor refrigeration device 14, which is not attached to the refrigerant inlet pipe 12, with a heat insulating material.
An arrow in fig. 1 shows a refrigerant flow direction of the air conditioning indoor unit during a heating cycle; when the air conditioner operates in heating, high-temperature and high-pressure gas is sprayed out from the outlet of the compressor of the outdoor unit of the air conditioner, passes through the thick connecting pipe, enters the refrigerant outlet pipe 13 of the indoor evaporator 11, exchanges heat with indoor air in the evaporator 11, passes through the refrigerant inlet pipe 12 of the evaporator 11, enters the outdoor unit through the thin connecting pipe, passes through the throttling device, enters the condenser, and enters the compressor through the air suction pipe, so that a cycle is completed. In an air conditioner without the semiconductor cooler 14, the temperature of the refrigerant entering the indoor refrigerant inlet pipe 12 to the outdoor unit of the air conditioner is generally about 30 ℃, and the temperature is higher than the indoor environment temperature in the general heating season, which causes a part of heat loss.
Referring to fig. 1, when the air-conditioning indoor unit according to the embodiment of the present invention performs a heating cycle, the semiconductor refrigeration device 14 in the air-conditioning indoor unit is powered on, the cold end 141 generates cold, and the hot end 142 generates heat. The cold end 141 is attached to the refrigerant inlet pipe 12, the cold end 141 exchanges heat with the refrigerant flowing in the refrigerant inlet pipe 12, and the cold energy of the cold end 141 reduces the temperature of the refrigerant, namely the cold energy generated by the cold end 141 of the semiconductor refrigerating device 14 is taken away by the refrigerant; the hot end 142 of the semiconductor refrigeration device 14 is driven by a fan in the indoor unit of the air conditioner to exchange heat with the indoor air, that is, the heat generated by the hot end 142 of the semiconductor refrigeration device 14 is taken away by the indoor air, so that the heat is output. In the process, the heat generated by the hot end 142 of the semiconductor refrigeration device 14 is far greater than the input electric power of the semiconductor refrigeration device 14, so that the defect that the output heat of the auxiliary electric heater cannot be greater than the input electric power in the prior art is overcome. Meanwhile, as the cold end 141 of the semiconductor refrigeration device 14 exchanges heat with the refrigerant inlet pipe 12, the temperature of the refrigerant flowing out of the refrigerant inlet pipe 12 is further reduced, thus recovering part of the lost heat, and further increasing the heat emitted from the hot end 142, thereby increasing the heating capacity of the air conditioner.
Optionally, referring to fig. 2, when the cold end 141 of the semiconductor refrigeration device 14 is not attached to the refrigerant inlet pipe 12, the surface of the hot end 142 of the semiconductor refrigeration device 14, which is not attached to the refrigerant outlet pipe 13, is coated with a heat insulating material; the controller is used for controlling the semiconductor refrigerating device 14 to be electrified when the indoor unit of the air conditioner performs refrigerating circulation. This may allow heat generated by hot side 141 of semiconductor refrigeration unit 14 to be kept from entering the room air.
An arrow in fig. 2 shows a refrigerant flow direction of the indoor unit of the air conditioner when the air conditioner performs a refrigeration cycle; when the air conditioner operates in a refrigerating mode, high-temperature and high-pressure gas is sprayed out from an outlet of a compressor of an outdoor unit of the air conditioner, is condensed by an outdoor condenser, enters a refrigerant inlet pipe 12 of an indoor unit of the air conditioner through a throttling device and a thin connecting pipe, exchanges heat with indoor air in an evaporator 11, enters the outdoor through a refrigerant outlet pipe 13 and a thick connecting pipe, enters the compressor and completes a cycle. In an air conditioning indoor unit without the semiconductor refrigeration unit 14, when a refrigeration cycle is performed, the temperature of the refrigerant at the refrigerant outlet pipe 13 in the room is about 10 ℃, which is much lower than the temperature of the indoor air during the refrigeration season, thus causing a part of the refrigeration loss.
Referring to fig. 2, when the indoor unit of an air conditioner according to the embodiment of the present invention performs a refrigeration cycle, the semiconductor refrigeration device 14 in the indoor unit of an air conditioner is powered on, the cold end 141 generates cold, and the hot end 142 generates heat. The hot end 142 is attached to the refrigerant outlet pipe 13, the hot end 142 exchanges heat with the refrigerant flowing in the refrigerant outlet pipe 13, and the temperature of the refrigerant is raised by the heat of the hot end 142, namely the refrigerant takes away the heat generated by the hot end 142 of the semiconductor refrigeration device 14; the cold end 141 of the semiconductor refrigeration device 14 is driven by a fan in the indoor unit of the air conditioner to exchange heat with the indoor air, that is, the cold energy generated by the cold end 141 of the semiconductor refrigeration device 14 is taken away by the indoor air, so that the cold energy is output. In the process, the hot end 142 of the semiconductor refrigerating device 14 exchanges heat with the refrigerant outlet pipe 13, so that the temperature of the refrigerant flowing out of the refrigerant outlet pipe 13 is further increased, part of lost cold energy is recovered, and the cold energy emitted by the cold end 141 is further increased, so that the refrigerating capacity of the air conditioner is increased.
Further, referring to fig. 3 and 4, when the cold end 141 of the semiconductor refrigeration device 14 is attached to the refrigerant inlet pipe 12 and the hot end 142 of the semiconductor refrigeration device 14 is attached to the refrigerant outlet pipe 13; the cold end 141 of the semiconductor refrigeration device 14 is coated with a heat insulating material on the surface not attached to the refrigerant inlet pipe 12, and the hot end 142 of the semiconductor refrigeration device 14 is coated with a heat insulating material on the surface not attached to the refrigerant outlet pipe 13.
The arrows in fig. 3 show the refrigerant flow direction of the air conditioning indoor unit during the heating cycle; when the air conditioner is in heating operation, the semiconductor refrigerating device 14 in the indoor unit of the air conditioner is electrified, the cold end 141 generates cold, the hot end 142 generates heat, one end attached to the refrigerant inlet pipe 12 is the cold end 141, and the other end attached to the refrigerant outlet pipe 13 is the hot end 142. The cold end 141 and the refrigerant flowing out of the evaporator 11 in the refrigerant inlet pipe 12 exchange heat to reduce the temperature of the refrigerant, and the hot end 142 and the refrigerant outlet pipe 13 exchange heat to further raise the temperature of the refrigerant flowing into the evaporator 11 in the refrigerant outlet pipe 13, which is equivalent to recovering the residual heat at the inlet of the evaporator 11, so that the residual heat enters the evaporator 11 again to release heat, and the indoor air is heated, thus increasing the heating capacity of the indoor unit of the air conditioner.
Arrows in fig. 4 show the refrigerant flow direction of the indoor unit of the air conditioner during the refrigeration cycle; when the air conditioner operates in a refrigerating mode, the semiconductor refrigerating device 14 in the indoor unit of the air conditioner is electrified, the cold end 141 generates cold, the hot end 142 generates heat, one end attached to the refrigerant inlet pipe 12 is the cold end 141, and the other end attached to the refrigerant outlet pipe 13 is the hot end 142. The hot end 142 exchanges heat with the refrigerant in the refrigerant outlet pipe 13 to raise the temperature of the refrigerant, and the cold end 141 exchanges heat with the refrigerant in the refrigerant inlet pipe 12 to further lower the temperature of the refrigerant in the refrigerant inlet pipe 12, which is equivalent to recovering the cold energy remained at the outlet of the evaporator 11, so that the cold energy enters the evaporator 11 again to discharge the cold energy, and the indoor air is cooled, thereby increasing the refrigerating capacity of the indoor unit of the air conditioner.
In practical applications, when the cold end 141 of the semiconductor refrigeration device 14 is attached to the refrigerant inlet pipe 12, the cold end 141 of the semiconductor refrigeration device 14 is generally welded or bonded to the refrigerant inlet pipe 12 to fix the semiconductor refrigeration device 14. Preferably, the cold end 141 of the semiconductor refrigeration device 14 is bonded to the refrigerant inlet pipe 12 by a heat-conducting adhesive. This allows for more efficient heat exchange between the cold end 141 of the semiconductor refrigeration unit 14 and the refrigerant inlet line 12.
In practical applications, when the hot end 142 of the semiconductor refrigeration device 14 is attached to the refrigerant outlet pipe 13, the hot end 142 of the semiconductor refrigeration device 14 is generally welded or bonded to the refrigerant outlet pipe 13 to fix the semiconductor refrigeration device 14. Preferably, the hot end 142 of the semiconductor refrigeration device 14 is bonded to the refrigerant outlet pipe 13 by a heat conducting adhesive. This makes it possible to make the heat exchange between the hot end 142 of the semiconductor refrigeration unit 14 and the refrigerant outlet pipe 13 more efficient.
Another embodiment of the present invention provides an air conditioner, including an outdoor unit of an air conditioner, and any one of the above indoor units of an air conditioner. According to the air conditioner indoor unit provided by the embodiment of the invention, the semiconductor refrigerating device is additionally arranged in the air conditioner indoor unit, and when a heating cycle is carried out, the heat generated by the hot end of the semiconductor refrigerating device is far greater than the input electric power of the semiconductor refrigerating device, so that compared with an auxiliary electric heater in the prior art, the efficiency of auxiliary heating by using the semiconductor refrigerating device is higher, and the efficiency of an air conditioner is improved. Meanwhile, the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe; and/or the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe, so that when the indoor unit of the air conditioner works, the cold end of the semiconductor refrigerating device and the refrigerant in the refrigerant inlet pipe can exchange heat, and/or the hot end of the semiconductor refrigerating device and the refrigerant in the refrigerant outlet pipe can exchange heat, so that the cold or heat to be wasted in part of the refrigerant inlet pipe and/or the refrigerant outlet pipe is recovered, the energy loss is reduced, and the efficiency of the air conditioner is further improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (9)

1. An air-conditioning indoor unit comprises a shell and an evaporator arranged in the shell, wherein an inlet of the evaporator is connected with a refrigerant inlet pipe, an outlet of the evaporator is connected with a refrigerant outlet pipe, and when the air-conditioning indoor unit performs refrigeration cycle, refrigerant flows into the evaporator from the refrigerant inlet pipe and then flows into the refrigerant outlet pipe from an outlet of the evaporator; it is characterized by also comprising:
the semiconductor refrigeration device comprises a semiconductor refrigeration device and a controller for controlling the semiconductor refrigeration device to be electrified;
when the cold end of the semiconductor refrigerating device is attached to the refrigerant inlet pipe, the hot end of the semiconductor refrigerating device can exchange heat with indoor air under the driving of a fan in the indoor unit of the air conditioner;
when the hot end of the semiconductor refrigerating device is attached to the refrigerant outlet pipe, the cold end of the semiconductor refrigerating device can exchange heat with indoor air under the driving of a fan in the indoor unit of the air conditioner.
2. An indoor unit of an air conditioner as claimed in claim 1, wherein when the hot end of the semiconductor refrigerating device is not attached to the refrigerant outlet pipe, the surface of the cold end of the semiconductor refrigerating device, which is not attached to the refrigerant inlet pipe, is coated with a heat insulating material;
the controller is used for controlling the semiconductor refrigerating device to be electrified when the air conditioner indoor unit performs heating circulation.
3. The indoor unit of claim 1, wherein when the cold end of the semiconductor refrigeration device is not attached to the refrigerant inlet pipe, a surface of the hot end of the semiconductor refrigeration device, which is not attached to the refrigerant outlet pipe, is coated with a heat insulating material;
the controller is used for controlling the semiconductor refrigerating device to be electrified when the indoor unit of the air conditioner performs refrigerating circulation.
4. An indoor unit of an air conditioner as claimed in claim 1, wherein when the cold end of the semiconductor refrigeration device is attached to the refrigerant inlet pipe and the hot end of the semiconductor refrigeration device is attached to the refrigerant outlet pipe; the surface, which is not attached to the refrigerant inlet pipe, of the cold end of the semiconductor refrigerating device is wrapped with a heat insulating material, and the surface, which is not attached to the refrigerant outlet pipe, of the hot end of the semiconductor refrigerating device is wrapped with a heat insulating material.
5. An indoor unit of an air conditioner according to claim 1, wherein when the cold end of the semiconductor refrigeration device is attached to the refrigerant inlet pipe, the cold end of the semiconductor refrigeration device is welded or bonded to the refrigerant inlet pipe.
6. An indoor unit of an air conditioner as claimed in claim 5, wherein the cold end of the semiconductor refrigeration device is bonded to the refrigerant inlet pipe by a heat conductive adhesive.
7. An indoor unit of an air conditioner according to claim 1 or 5, wherein the hot end of the semiconductor cooling device is welded or bonded to the refrigerant outlet pipe when the hot end of the semiconductor cooling device is bonded to the refrigerant outlet pipe.
8. An indoor unit of an air conditioner as claimed in claim 7, wherein the hot end of the semiconductor cooling device is bonded to the refrigerant outlet pipe by a heat conductive adhesive.
9. An air conditioner characterized by comprising an outdoor unit of the air conditioner and the indoor unit of the air conditioner as claimed in any one of claims 1 to 8.
CN201711125847.2A 2017-11-14 2017-11-14 Machine and air conditioner in air conditioning Active CN107940563B (en)

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Application Number Priority Date Filing Date Title
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CN107940563B true CN107940563B (en) 2020-05-12

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Publication number Priority date Publication date Assignee Title
CN111447809B (en) * 2020-05-13 2023-10-24 珠海格力电器股份有限公司 Photovoltaic air conditioner, cooling assembly and control method of cooling assembly
CN113531829B (en) * 2021-07-09 2023-02-17 青岛海尔空调器有限总公司 Method and device for controlling air conditioner and air conditioner
CN113531705B (en) * 2021-07-09 2022-12-23 青岛海尔空调器有限总公司 Air conditioner and method and device for controlling air conditioner

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JP2004144399A (en) * 2002-10-25 2004-05-20 Matsushita Electric Ind Co Ltd Refrigeration cycle device
DE102009036898A1 (en) * 2008-10-13 2010-06-17 Dirk Schneider Cooling system for dissipating heat from e.g. electrical devices, of portable computer in clean room, has housing wall provided with heat exchanger, where cooling medium in heat exchanger is guided through channel-like structure
CN202229361U (en) * 2011-09-19 2012-05-23 珠海格力电器股份有限公司 Air-conditioning system
CN203298524U (en) * 2013-05-02 2013-11-20 广东美的电器股份有限公司 Indoor heat exchanger for variable frequency air conditioner and variable frequency air conditioner
CN105371523A (en) * 2014-08-29 2016-03-02 青岛海尔空调器有限总公司 Air conditioner refrigerating loop and air conditioner

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